EPF10K50EQC240-2 - 50K FLEX-10KE FPGA, 240-PQFP | Intel
부품 번호: EPF10K50EQC240-2 ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $86.5 | $865.00 |
| 100 | $78.2 | $7,820.00 |
| 500 | $71.5 | $35,750.00 |
| 1,000 | $65 | $65,000.00 |
EPF10K50EQC240-2 개요
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that lets designers implement custom digital circuits by configuring an array of configurable logic blocks (CLBs), interconnect, and I/O cells. The FLEX-10KE family sits in the broader hierarchy of programmable logic: programmable logic device -> CPLD/FPGA -> SRAM-based FPGA -> embedded-block FPGA (FLEX 10KE). EABs provide on-chip dual-port RAM and ROM blocks that accelerate arithmetic, FIFO, and DSP-style datapaths without consuming general-purpose logic.
Key features include 189 user I/O pins, 360 Logic Array Blocks (LABs), 12 embedded array blocks, and a typical standby current under 0.5 mA. The device supports in-system programmability via an IEEE 1149.1 JTAG interface and configuration via a serial EPROM, making it suitable for high-volume production. The PQFP-240 package provides gull-wing leads on a 0.5 mm pitch with body dimensions of 34.6 × 34.6 mm, easing PCB routing on standard 4-layer boards.
Architecturally, the EPF10K50E uses SRAM configuration cells combined with a fine-grained LAB fabric and column-style EAB rows. Each LAB contains 8 logic elements with carry-chain and cascade-chain support, while EABs offer up to 2 Kbits of RAM each with configurable width. Compared with first-generation FLEX 10K, the 'E' revision doubles EAB RAM density, lowers core voltage to 2.5 V, and improves timing margin for 66 MHz PCI designs.
Typical applications include PCI bus interfaces (33/66 MHz), telecommunications glue logic, industrial control state machines, glue logic for ASIC prototyping, and legacy embedded computing. The wide I/O count and generous on-chip memory make it a strong fit for multi-bridge or multi-protocol designs where several bus controllers coexist on one chip.
When designing with this part, attention to decoupling (at least 0.1 µF + 10 µF per VCC pin pair), JTAG chain integrity, and configuration mode selection (PS, AS, JTAG) is critical. Designers migrating to newer Intel Cyclone or MAX families should treat the EPF10K50E as a legacy device and validate software support via the Quartus Prime toolchain.
This page synthesizes distributor pricing, drop-in FLEX-10KE alternatives with the same PQFP-240 footprint, and practical design notes not found in the original manufacturer datasheet, helping engineers and sourcing teams rapidly evaluate longevity and replacement options for legacy designs.
드롭인 대체품: EPF10K50EQC240-2 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K50EQC240-2 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Process Technology, Package, Mounting Type, Series.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K50EQC240-2N
✅ 드롭인✓ 재고 있음
$87.2 / 개
데이터시트 보기 →EPF10K50EQC240-3
✅ 드롭인✓ 재고 있음
$21 / 개
데이터시트 보기 →EPF10K50EQC240-1N
✅ 드롭인✓ 재고 있음
$132.1 / 개
데이터시트 보기 →EPF10K50EQC240-1
✅ 드롭인✓ 재고 있음
$26.8 / 개
데이터시트 보기 →EPF10K50EQC240-3N
✅ 드롭인✓ 재고 있음
$59.5 / 개
데이터시트 보기 →EPF10K100EQC240-2
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →EPF10K50EQC240-2 최대 정격 & 전기적 특성
| Family | FLEX-10KE |
| Logic Elements (Cells) | 2,880 |
| System Gates | 50,000 (40,960 typical) |
| Logic Array Blocks (LABs) | 360 |
| Embedded Array Blocks (EABs) | 12 |
| Total RAM Bits | 20,480 bits |
| User I/O Pins | 189 |
| Maximum Operating Frequency | 200 MHz |
| Core Voltage | 2.5 V |
| Process Technology | 0.22 µm CMOS |
| 패키지 | 240-BFQFP / PQFP-240 (34.6 × 34.6 mm, 0.5 mm pitch) |
| 동작 온도 | 0 °C to +70 °C (Commercial) |
| Programming Interface | IEEE 1149.1 JTAG, Serial EPROM (PS / AS) |
| Configuration Memory | SRAM (volatile) |
| 실장 유형 | Surface Mount (gull-wing leads) |
EPF10K50EQC240-2 240-bfqfp / pqfp-240 (34.6 × 34.6 mm, 0.5 mm pitch) 핀 구성 가이드
EPF10K50EQC240-2(240-bfqfp / pqfp-240 (34.6 × 34.6 mm, 0.5 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF10K50EQC240-2.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF10K50EQC240-2 적합 용도: 6 애플리케이션s: PCI Bus Interface / Bridge, Industrial Control / State Machines, Telecommunications Glue Logic, ASIC Prototyping / Emulation, Legacy Embedded Computing Boards, Image Processing Pre-Processing / Display Controllers.
PCI Bus Interface / Bridge
The EPF10K50EQC240-2 is well-suited for 33/66 MHz PCI bus bridge and peripheral-controller designs because it integrates 189 user I/Os in a PQFP-240 package while meeting PCI 5 V signaling tolerance via the 3.3 V VCCIO bank. Its 12 embedded array blocks (EABs) provide up to 20 Kbits of on-chip dual-port RAM for FIFO buffering of PCI transactions, and the 360 LABs comfortably implement state machines for bus arbitration, target/initiator control, and configuration-space registers. Compared with discrete 74-series glue logic, this FPGA reduces board area by roughly 40 percent while delivering a 200 MHz core frequency that absorbs any PCI clock-domain crossing on-chip.
추천
Industrial Control / State Machines
In industrial PLC and motion-controller applications, the EPF10K50EQC240-2's 2,880 logic elements and 360 LABs deliver ample capacity for complex ladder-logic-to-FPGA conversions, motor-control PWM generators, and encoder quadrature decoders. The 0 °C to +70 °C commercial temperature range covers most factory-floor cabinets, and the wide 189-I/O count supports multi-axis servo interfaces, discrete I/O banks, and fieldbus glue logic. EABs can be configured as ROM look-up tables for sine commutation profiles or as small CAM memories for position comparison, eliminating external memory chips on the board.
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Telecommunications Glue Logic
Telecom backplane applications require wide bus multiplexing, HDLC/framer glue, and clock-domain crossing — exactly the workload the EPF10K50EQC240-2 was designed for. With 189 I/Os and 12 EABs, the device can implement multiple independent T1/E1 framers, MVIP/H.110 bus bridges, and SDH/SONET tributary mappers on a single chip. The 200 MHz internal frequency supports serial bit-clock recovery at up to 100 MHz, and the JTAG interface allows boundary-scan verification of densely populated backplane assemblies during manufacturing test.
추천
ASIC Prototyping / Emulation
The EPF10K50EQC240-2 is widely used as an ASIC prototyping vehicle because its fine-grained LAB fabric maps efficiently to random control logic while the EABs map to register files and small RAMs. Designers partition a target ASIC across one or more FLEX-10KE devices using JTAG daisy-chaining, achieving real-time functional validation before committing to mask costs. The PQFP-240 package supports standard socketed or solder-down prototyping boards, and Quartus II 13.0 retains full FLEX-10KE synthesis support for legacy design reuse.
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Legacy Embedded Computing Boards
VME, cPCI, and PC/104 embedded computers from the late 1990s and early 2000s frequently used the EPF10K50EQC240-2 as a system controller to bridge host CPUs to peripheral buses. Its 189 I/Os accommodate parallel ISA/PCI bus interfaces plus auxiliary serial links, and the 2.5 V core with 3.3 V I/O bank simplifies mixed-voltage integration with PowerPC, MIPS, or ARM host processors of that era. For long-life programs in defense, aerospace, and industrial automation, this FPGA remains a familiar building block that field engineers can support with existing toolchains and design IP libraries.
추천
Image Processing Pre-Processing / Display Controllers
With 12 EABs capable of dual-port RAM configurations up to 16 × 8 each, the EPF10K50EQC240-2 can implement line buffers for video preprocessing pipelines (de-interlacing, color-space conversion) feeding LCD controllers. The 189 I/Os accommodate parallel RGB or LVDS signaling paths and overlay blending logic, while the 200 MHz core frequency handles pixel rates up to 100 MHz easily. Compared with dedicated video controllers of the era, this FPGA offers a programmable upgrade path via JTAG reconfiguration without respinning the PCB.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF10K50EQC240-2 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K50EQC240-2N | EPF10K50EQC240-3 | EPF10K50EQC240-1N | EPF10K50EQC240-3N | EPF10K100EQC240-2 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | PQFP-240 (240-BFQFP) | PQFP-240 (same) | PQFP-240 (same) | PQFP-240 (same) | PQFP-240 (same) | PQFP-240 (same) |
| Logic Elements | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 | 4,992 (100K) |
| System Gates | 50,000 (40,960 typical) | 50,000 | 50,000 | 50,000 | 50,000 | 100,000 |
| User I/O | 189 | 189 | 189 | 189 | 189 | 189 |
| Speed Grade | -2 | -2 | -3 (faster) | -1 (slower) | -3 (faster) | -2 |
| Lead-Free (RoHS) | SnPb (non-N) | Yes (Pb-free) | SnPb | Yes (Pb-free) | Yes (Pb-free) | SnPb |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
주요 차별점
- Highest verified drop-in replacement density available (vs EPF10K50EQC240-3)
- Upward migration path within same package (vs EPF10K100EQC240-2)
- Wide I/O count in PQFP package (vs EPF10K30EQC208-2 (lower-density PQFP-208 sibling))
설계 노트
Estimated: at 200 MHz core frequency with 50 percent toggle rate, the EPF10K50EQC240-2 draws roughly 250-400 mA from VCCINT (2.5 V) and 100-150 mA from VCCIO (3.3 V), for a total of about 1.0-1.4 W. Place at least one 0.1 µF X7R ceramic decoupling capacitor within 5 mm of every VCCINT/VCCIO pin pair, plus a single 47-100 µF tantalum or polymer bulk capacitor per voltage rail. Inadequate decoupling is the most common cause of JTAG configuration failures on FLEX-10KE designs.
Route the 0.5 mm-pitch PQFP-240 leads on a 4-layer PCB with a continuous ground plane on layer 2 and a power plane on layer 3. Keep high-speed I/O traces shorter than 50 mm (3 ns propagation budget at 200 MHz), and isolate clock inputs (CLK0/CLK1/CLK2) from switching I/O to avoid coupling. Recommended land pattern: 0.30 × 1.50 mm rectangular pads with 0.5 mm pitch, matching IPC-7351 nominal density. Maintain at least 0.2 mm clearance between adjacent PQFP leads to prevent solder bridges during reflow.
Configuration memory is volatile (SRAM); without a configuration EPROM (EPC2, EPC4, or EPC8) the device powers up blank and the board appears dead. Always strap MSEL pins to select Passive Serial (PS) mode with a serial configuration EPROM, and pull nCONFIG high through a 10 kΩ resistor. Do not leave JTAG pins (TCK/TMS/TDO/TDI) floating — TCK and TMS must be pulled high through 10 kΩ resistors to prevent spurious boundary-scan entry that can disrupt user-mode operation.
The PQFP-240 package has a θJA of roughly 30-35 °C/W in still air on a standard 4-layer JEDEC test board, so a 1.4 W dissipation produces a junction temperature rise of 45-50 °C above ambient. With a 70 °C commercial upper limit and 25 °C typical ambient, this leaves roughly 5-10 °C of margin; for industrial cabinets running at 50 °C, ensure airflow of at least 100 LFM or add a small heatsink on the PQFP body. Estimated values based on package thermal metrics; datasheet figures should be re-verified if available.
규정 준수 정보
EPF10K50EQC240-2 (without N suffix) uses SnPb lead finish and is NOT RoHS compliant; for RoHS-compliant assembly, choose the EPF10K50EQC240-2N variant. RoHS/REACH compliance status not stated in the provided web data; marked 'unknown'. AEC-Q100 not applicable — this is a commercial-grade FPGA, not an automotive-grade part.
