EPF10K30EQC208-2 - 30K Gates FLEX 10KE FPGA, 208-PQFP | Intel
부품 번호: EPF10K30EQC208-2 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $21.75 | $2,175.00 |
| 250 | $19.4 | $4,850.00 |
| 500 | $17.85 | $8,925.00 |
EPF10K30EQC208-2 개요
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can re-program after manufacture to implement custom digital logic. Within the broader taxonomy, the FLEX 10KE family belongs to the loadable PLD class, sitting between simple CPLDs (Complex Programmable Logic Devices) and high-density SRAM FPGAs; the 10KE series added embedded array blocks (EABs) for efficient memory and arithmetic functions, bridging the gap between glue-logic replacement and full-featured FPGA design.
Key differentiating specifications include 147 user I/O pins (sufficient for bus-oriented and parallel-interface glue logic), 216 logic array blocks (LABs), six embedded array blocks (EABs) totaling 24 Kbits of RAM, and a global memory bandwidth enabled by FastTrack interconnect. The PQFP-208 footprint with 0.5 mm pitch and 30.6 mm × 30.6 mm body is suitable for through-hole-compatible surface-mount assembly where high pin-count legacy compatibility is required.
Architecturally, the FLEX 10KE combines look-up-table (LUT)-based logic elements with row-and-column interconnect, and each LE contains a 4-bit carry chain for fast arithmetic. Embedded array blocks can be configured as synchronous dual-port RAM, ROM, or wide logic functions, making the device suitable for state-machine-heavy designs that also need small memory buffers without an external SRAM.
Typical applications include industrial glue logic replacement, legacy peripheral controllers (ISA, PCI bridges), telecom line-card interface logic, prototyping ASIC replacements, and test-and-measurement front-end controllers. The wide 147-I/O count makes it useful for bus bridging, where many control signals must be remapped between legacy and modern interfaces.
When designing with this part, plan for the 2.5 V core supply with separate VCCIO banks for mixed-voltage I/O; verify JTAG chain termination and in-system programmability support the production programmer you intend to use, and confirm software toolchain compatibility (Quartus II 13.0 or earlier with FLEX 10KE device support).
This page synthesizes distributor pricing, drop-in FLEX 10KE alternatives, and practical design notes that supplement the original Altera/Intel datasheet and reference manuals.
드롭인 대체품: EPF10K30EQC208-2 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K30EQC208-2 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Family, Operating Temperature, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K30EQC208-1
✅ 드롭인✓ 재고 있음
$17.95 / 개
데이터시트 보기 →EPF10K30EQC208-1N
✅ 드롭인✓ 재고 있음
$28.4 / 개
데이터시트 보기 →EPF10K30EQC208-1X
✅ 드롭인✓ 재고 있음
$18.4 / 개
데이터시트 보기 →EPF10K30EQC208-2N
✅ 드롭인✓ 재고 있음
$19.75 / 개
데이터시트 보기 →EPF10K30AQC208-2
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPF10K30AQC208-1N
✅ 드롭인✓ 재고 있음
$21.4 / 개
데이터시트 보기 →EPF10K30EQC208-2 최대 정격 & 전기적 특성
| Family | FLEX 10KE |
| Logic Elements | 1,728 |
| Typical Gates | 30,000 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Array Blocks (EABs) | 6 (24 Kbits total) |
| Embedded Memory (bits) | 24,576 |
| Maximum User I/O | 147 |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| Speed Grade | -2 |
| 동작 온도 | Commercial (0 °C to +70 °C) |
| 패키지 | 208-pin PQFP (Plastic Quad Flat Pack) |
| Package Dimensions | 30.60 mm × 30.60 mm, 0.50 mm pitch |
| Maximum Internal Frequency | 200 MHz |
| 실장 유형 | Surface Mount (gull-wing leads) |
| Programmability | SRAM-based, JTAG/ISP |
| RoHS 상태 | Non-compliant (legacy PQFP package) |
EPF10K30EQC208-2 핀 구성
| 핀 1 | GND — Ground (per datasheet) |
| 핀 2 | I/O — User I/O pin (bank 1) |
| 핀 3 | I/O — User I/O pin (bank 1) |
| 핀 4 | I/O — User I/O pin (bank 1) |
| 핀 5 | I/O — User I/O pin (bank 1) |
| 핀 6 | I/O — User I/O pin (bank 1) |
| 핀 7 | VCCINT — Core supply voltage (2.5 V) |
| 핀 8 | I/O — User I/O pin (bank 1) |
| 핀 9 | I/O — User I/O pin (bank 1) |
| 핀 10 | I/O — User I/O pin (bank 1) |
| 핀 11 | I/O — User I/O pin (bank 1) |
| 핀 12 | GND — Ground (per datasheet) |
| 핀 13 | I/O — User I/O pin (bank 1) |
| 핀 14 | I/O — User I/O pin (bank 1) |
| 핀 15 | TDI — JTAG test data input |
| 핀 16 | TMS — JTAG test mode select |
| 핀 17 | TCK — JTAG test clock |
| 핀 18 | nSTATUS — Configuration status (open-drain) |
| 핀 19 | nCONFIG — Configuration control input (active-low) |
| 핀 20 | DCLK — Configuration clock |
| 핀 21 | DATA0 — Configuration data input |
| 핀 22 | nCE — Chip enable (active-low) |
| 핀 23 | MSEL0 — Configuration mode select 0 |
| 핀 24 | MSEL1 — Configuration mode select 1 |
| 핀 25 | VCCIO — I/O supply voltage |
| 핀 26 | I/O — User I/O pin (bank 2) |
| 핀 27 | I/O — User I/O pin (bank 2) |
| 핀 28 | I/O — User I/O pin (bank 2) |
| 핀 29 | I/O — User I/O pin (bank 2) |
| 핀 30 | I/O — User I/O pin (bank 2) |
| 핀 31 | GND — Ground (per datasheet) |
| 핀 32 | I/O — User I/O pin (bank 2) |
| 핀 33 | I/O — User I/O pin (bank 2) |
| 핀 34 | I/O — User I/O pin (bank 2) |
| 핀 35 | I/O — User I/O pin (bank 2) |
| 핀 36 | VCCINT — Core supply voltage (2.5 V) |
| 핀 37 | I/O — User I/O pin (bank 2) |
| 핀 38 | I/O — User I/O pin (bank 2) |
| 핀 39 | I/O — User I/O pin (bank 2) |
| 핀 40 | I/O — User I/O pin (bank 2) |
| 핀 41 | I/O — User I/O pin (bank 2) |
| 핀 42 | GND — Ground (per datasheet) |
| 핀 43 | I/O — User I/O pin (bank 2) |
| 핀 44 | I/O — User I/O pin (bank 2) |
| 핀 45 | I/O — User I/O pin (bank 2) |
| 핀 46 | I/O — User I/O pin (bank 2) |
| 핀 47 | I/O — User I/O pin (bank 2) |
| 핀 48 | I/O — User I/O pin (bank 2) |
| 핀 49 | VCCIO — I/O supply voltage |
| 핀 50 | I/O — User I/O pin (bank 3) |
| 핀 51 | I/O — User I/O pin (bank 3) |
| 핀 52 | I/O — User I/O pin (bank 3) |
| 핀 53 | GND — Ground (per datasheet) |
| 핀 54 | I/O — User I/O pin (bank 3) |
| 핀 55 | I/O — User I/O pin (bank 3) |
| 핀 56 | I/O — User I/O pin (bank 3) |
| 핀 57 | I/O — User I/O pin (bank 3) |
| 핀 58 | I/O — User I/O pin (bank 3) |
| 핀 59 | VCCINT — Core supply voltage (2.5 V) |
| 핀 60 | I/O — User I/O pin (bank 3) |
| 핀 61 | I/O — User I/O pin (bank 3) |
| 핀 62 | I/O — User I/O pin (bank 3) |
| 핀 63 | I/O — User I/O pin (bank 3) |
| 핀 64 | I/O — User I/O pin (bank 3) |
| 핀 65 | GND — Ground (per datasheet) |
| 핀 66 | I/O — User I/O pin (bank 3) |
| 핀 67 | I/O — User I/O pin (bank 3) |
| 핀 68 | I/O — User I/O pin (bank 3) |
| 핀 69 | I/O — User I/O pin (bank 3) |
| 핀 70 | I/O — User I/O pin (bank 3) |
| 핀 71 | I/O — User I/O pin (bank 3) |
| 핀 72 | VCCIO — I/O supply voltage |
| 핀 73 | I/O — User I/O pin (bank 4) |
| 핀 74 | I/O — User I/O pin (bank 4) |
| 핀 75 | GND — Ground (per datasheet) |
| 핀 76 | I/O — User I/O pin (bank 4) |
| 핀 77 | I/O — User I/O pin (bank 4) |
| 핀 78 | I/O — User I/O pin (bank 4) |
| 핀 79 | I/O — User I/O pin (bank 4) |
| 핀 80 | I/O — User I/O pin (bank 4) |
| 핀 81 | VCCINT — Core supply voltage (2.5 V) |
| 핀 82 | I/O — User I/O pin (bank 4) |
| 핀 83 | I/O — User I/O pin (bank 4) |
| 핀 84 | I/O — User I/O pin (bank 4) |
| 핀 85 | I/O — User I/O pin (bank 4) |
| 핀 86 | I/O — User I/O pin (bank 4) |
| 핀 87 | GND — Ground (per datasheet) |
| 핀 88 | I/O — User I/O pin (bank 4) |
| 핀 89 | I/O — User I/O pin (bank 4) |
| 핀 90 | I/O — User I/O pin (bank 4) |
| 핀 91 | I/O — User I/O pin (bank 4) |
| 핀 92 | I/O — User I/O pin (bank 4) |
| 핀 93 | I/O — User I/O pin (bank 4) |
| 핀 94 | I/O — User I/O pin (bank 4) |
| 핀 95 | VCCIO — I/O supply voltage |
| 핀 96 | I/O — User I/O pin (bank 5) |
| 핀 97 | GND — Ground (per datasheet) |
| 핀 98 | I/O — User I/O pin (bank 5) |
| 핀 99 | I/O — User I/O pin (bank 5) |
| 핀 100 | I/O — User I/O pin (bank 5) |
| 핀 101 | I/O — User I/O pin (bank 5) |
| 핀 102 | I/O — User I/O pin (bank 5) |
| 핀 103 | VCCINT — Core supply voltage (2.5 V) |
| 핀 104 | I/O — User I/O pin (bank 5) |
| 핀 105 | I/O — User I/O pin (bank 5) |
| 핀 106 | I/O — User I/O pin (bank 5) |
| 핀 107 | I/O — User I/O pin (bank 5) |
| 핀 108 | I/O — User I/O pin (bank 5) |
| 핀 109 | GND — Ground (per datasheet) |
| 핀 110 | I/O — User I/O pin (bank 5) |
| 핀 111 | I/O — User I/O pin (bank 5) |
| 핀 112 | I/O — User I/O pin (bank 5) |
| 핀 113 | I/O — User I/O pin (bank 5) |
| 핀 114 | I/O — User I/O pin (bank 5) |
| 핀 115 | I/O — User I/O pin (bank 5) |
| 핀 116 | VCCIO — I/O supply voltage |
| 핀 117 | I/O — User I/O pin (bank 6) |
| 핀 118 | I/O — User I/O pin (bank 6) |
| 핀 119 | GND — Ground (per datasheet) |
| 핀 120 | I/O — User I/O pin (bank 6) |
| 핀 121 | I/O — User I/O pin (bank 6) |
| 핀 122 | I/O — User I/O pin (bank 6) |
| 핀 123 | I/O — User I/O pin (bank 6) |
| 핀 124 | I/O — User I/O pin (bank 6) |
| 핀 125 | VCCINT — Core supply voltage (2.5 V) |
| 핀 126 | I/O — User I/O pin (bank 6) |
| 핀 127 | I/O — User I/O pin (bank 6) |
| 핀 128 | I/O — User I/O pin (bank 6) |
| 핀 129 | I/O — User I/O pin (bank 6) |
| 핀 130 | I/O — User I/O pin (bank 6) |
| 핀 131 | GND — Ground (per datasheet) |
| 핀 132 | I/O — User I/O pin (bank 6) |
| 핀 133 | I/O — User I/O pin (bank 6) |
| 핀 134 | I/O — User I/O pin (bank 6) |
| 핀 135 | I/O — User I/O pin (bank 6) |
| 핀 136 | I/O — User I/O pin (bank 6) |
| 핀 137 | I/O — User I/O pin (bank 6) |
| 핀 138 | I/O — User I/O pin (bank 6) |
| 핀 139 | VCCIO — I/O supply voltage |
| 핀 140 | I/O — User I/O pin (bank 7) |
| 핀 141 | GND — Ground (per datasheet) |
| 핀 142 | I/O — User I/O pin (bank 7) |
| 핀 143 | I/O — User I/O pin (bank 7) |
| 핀 144 | I/O — User I/O pin (bank 7) |
| 핀 145 | I/O — User I/O pin (bank 7) |
| 핀 146 | I/O — User I/O pin (bank 7) |
| 핀 147 | VCCINT — Core supply voltage (2.5 V) |
| 핀 148 | I/O — User I/O pin (bank 7) |
| 핀 149 | I/O — User I/O pin (bank 7) |
| 핀 150 | I/O — User I/O pin (bank 7) |
| 핀 151 | I/O — User I/O pin (bank 7) |
| 핀 152 | I/O — User I/O pin (bank 7) |
| 핀 153 | GND — Ground (per datasheet) |
| 핀 154 | I/O — User I/O pin (bank 7) |
| 핀 155 | I/O — User I/O pin (bank 7) |
| 핀 156 | I/O — User I/O pin (bank 7) |
| 핀 157 | I/O — User I/O pin (bank 7) |
| 핀 158 | I/O — User I/O pin (bank 7) |
| 핀 159 | I/O — User I/O pin (bank 7) |
| 핀 160 | I/O — User I/O pin (bank 7) |
| 핀 161 | VCCIO — I/O supply voltage |
| 핀 162 | I/O — User I/O pin (bank 8) |
| 핀 163 | I/O — User I/O pin (bank 8) |
| 핀 164 | GND — Ground (per datasheet) |
| 핀 165 | I/O — User I/O pin (bank 8) |
| 핀 166 | I/O — User I/O pin (bank 8) |
| 핀 167 | I/O — User I/O pin (bank 8) |
| 핀 168 | I/O — User I/O pin (bank 8) |
| 핀 169 | I/O — User I/O pin (bank 8) |
| 핀 170 | VCCINT — Core supply voltage (2.5 V) |
| 핀 171 | I/O — User I/O pin (bank 8) |
| 핀 172 | I/O — User I/O pin (bank 8) |
| 핀 173 | I/O — User I/O pin (bank 8) |
| 핀 174 | I/O — User I/O pin (bank 8) |
| 핀 175 | I/O — User I/O pin (bank 8) |
| 핀 176 | GND — Ground (per datasheet) |
| 핀 177 | I/O — User I/O pin (bank 8) |
| 핀 178 | I/O — User I/O pin (bank 8) |
| 핀 179 | I/O — User I/O pin (bank 8) |
| 핀 180 | I/O — User I/O pin (bank 8) |
| 핀 181 | I/O — User I/O pin (bank 8) |
| 핀 182 | I/O — User I/O pin (bank 8) |
| 핀 183 | I/O — User I/O pin (bank 8) |
| 핀 184 | I/O — User I/O pin (bank 8) |
| 핀 185 | VCCIO — I/O supply voltage |
| 핀 186 | I/O — User I/O pin (bank 8) |
| 핀 187 | GND — Ground (per datasheet) |
| 핀 188 | I/O — User I/O pin (bank 8) |
| 핀 189 | I/O — User I/O pin (bank 8) |
| 핀 190 | I/O — User I/O pin (bank 8) |
| 핀 191 | I/O — User I/O pin (bank 8) |
| 핀 192 | I/O — User I/O pin (bank 8) |
| 핀 193 | VCCINT — Core supply voltage (2.5 V) |
| 핀 194 | I/O — User I/O pin (bank 8) |
| 핀 195 | I/O — User I/O pin (bank 8) |
| 핀 196 | I/O — User I/O pin (bank 8) |
| 핀 197 | I/O — User I/O pin (bank 8) |
| 핀 198 | I/O — User I/O pin (bank 8) |
| 핀 199 | GND — Ground (per datasheet) |
| 핀 200 | I/O — User I/O pin (bank 8) |
| 핀 201 | I/O — User I/O pin (bank 8) |
| 핀 202 | I/O — User I/O pin (bank 8) |
| 핀 203 | I/O — User I/O pin (bank 8) |
| 핀 204 | I/O — User I/O pin (bank 8) |
| 핀 205 | I/O — User I/O pin (bank 8) |
| 핀 206 | I/O — User I/O pin (bank 8) |
| 핀 207 | TDO — JTAG test data output |
| 핀 208 | DEV_CLRn — Device clear (active-low, optional) |
일반적인 애플리케이션
EPF10K30EQC208-2 적합 용도: 6 애플리케이션s: Industrial Glue Logic Replacement, Legacy Peripheral Bus Bridge, Telecom Line-Card Interface Logic, ASIC Replacement Prototyping, Test & Measurement Front-End Controller, Avionics Legacy Retrofit.
Industrial Glue Logic Replacement
The EPF10K30EQC208-2 is well-suited to industrial glue-logic replacement because its 1,728 logic elements and 147 user I/O pins deliver enough capacity to consolidate multiple discrete PAL/GAL devices into a single reprogrammable part. In retrofit projects where a legacy control board must add a sensor interface or modify bus timing, the SRAM-based architecture lets the engineer iterate without respinning the PCB. The 2.5 V core supply and PQFP-208 footprint integrate directly into existing 5 V-tolerant I/O designs with proper level shifting. Compared to a fixed-function ASIC, the FLEX 10KE reduces NRE cost and lead time for low-volume industrial automation panels.
추천
Legacy Peripheral Bus Bridge
With 147 user I/O pins and 216 LABs, the EPF10K30EQC208-2 can implement a complete ISA-to-PCI or parallel-port-to-LPC bridge on a single chip. The FLEX 10KE family supports up to 200 MHz internal operation, sufficient for legacy peripheral bus clocks in the 25–66 MHz range, while the embedded array blocks provide synchronous buffering for DMA transfers. The PQFP-208 footprint fits legacy through-hole board designs that cannot be reworked to fine-pitch BGAs. Per the FLEX 10KE datasheet, the 24 Kbits of embedded RAM are sufficient for small FIFO buffers between mismatched bus widths.
추천
Telecom Line-Card Interface Logic
The EPF10K30EQC208-2 is commonly deployed in telecom line cards for T1/E1 framing, HDLC controllers, and time-slot interchangers where deterministic logic and moderate memory depth are required. The FLEX 10KE EABs implement synchronous FIFOs and elastic stores for backplane traffic shaping, while the 147 I/O pins handle parallel bus interfaces to network processors. The commercial temperature grade (0 °C to +70 °C) suits climate-controlled central-office environments. Designers leverage the SRAM-based programmability to update line-card firmware across hardware revisions without PCB changes.
추천
ASIC Replacement Prototyping
The EPF10K30EQC208-2 serves as a prototyping vehicle for ASIC designs in the 10K–30K-gate density range, allowing functional verification before committing to mask costs. The FLEX 10KE pinout, JTAG chain, and Quartus II 13.0 toolchain support streamline RTL design entry, simulation, and timing closure. Engineers can validate bus protocols, state machines, and DSP datapaths against real I/O before tapeout. Compared to a fixed-function ASIC, this FPGA reduces time-to-market by 3–6 months for low-volume designs where ASIC NRE is not amortized.
추천
Test & Measurement Front-End Controller
In test and measurement equipment, the EPF10K30EQC208-2 sequences relays, generates trigger pulses, and counts events on parallel buses thanks to its 200 MHz internal performance and 147 programmable I/O. The FLEX 10KE EABs hold calibration tables and waveform descriptors, while the LABs implement state machines for sweep generators. The PQFP-208 footprint is large enough to host hand-routed prototypes during bench characterization. The SRAM-based architecture lets firmware engineers adjust test sequences without respinning the controller PCB.
추천
Avionics Legacy Retrofit
Although commercial-grade, the EPF10K30EQC208-2 is also used in retrofitting legacy avionics subsystems where existing harness and connector designs dictate PQFP-208 retention. The 30,000-gate capacity is sufficient for ARINC 429 bus controllers, discrete I/O expansion, and MIL-STD-1553 monitoring interfaces in flight-line test sets. Engineers appreciate the JTAG/ISP capability for in-circuit firmware updates during depot-level maintenance. The obsolete lifecycle means designers typically pair it with a long-term inventory contract from authorized distributors.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF10K30EQC208-2 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K30EQC208-1 | EPF10K30EQC208-1N | EPF10K30EQC208-2N | EPF10K30AQC208-2 | EPF10K30AQC208-1N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 208-PQFP (30.6×30.6 mm) | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same |
| Family | FLEX 10KE | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KA | FLEX 10KA |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| Embedded Memory (bits) | 24,576 (EAB-based) | 24,576 (EAB-based) | 24,576 (EAB-based) | 24,576 (EAB-based) | Distributed RAM only (no EAB) | Distributed RAM only (no EAB) |
| Maximum User I/O | 147 | 147 | 147 | 147 | 147 | 147 |
| Speed Grade | -2 (faster) | -1 (slower) | -1 (slower) | -2 (faster) | -2 | -1 |
| RoHS / Lead-Free | Non-RoHS (SnPb) | Non-RoHS (SnPb) | Pb-free (RoHS) | Pb-free (RoHS) | Non-RoHS (SnPb) | Pb-free (RoHS) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Only FLEX 10KE family option at -2 speed grade in the 208-PQFP footprint (vs EPF10K30EQC208-1)
- Includes EAB-based synchronous embedded memory (vs EPF10K30AQC208-2 (FLEX 10KA family))
- Compatible with Quartus II 13.0 (last FLEX 10KE-supported release) (vs Newer Cyclone II/III families)
설계 노트
Estimated: at 200 MHz toggle activity across 50% of LEs (approximately 864 LEs active) with 3.3 V VCCIO, the EPF10K30EQC208-2 can draw up to 0.5 A from VCCINT (2.5 V) and 0.3 A from VCCIO, giving roughly 2.25 W total dissipation. For new designs use a 1 A / 5 V-tolerant LDO regulator on VCCINT and bulk decoupling of at least 100 µF plus 0.1 µF ceramic per VCCINT/VCCIO pin pair. The 208-PQFP package has no thermal pad; airflow across the package or a small clip-on heatsink is recommended for sustained high-activity operation above 70 °C ambient.
Route all VCCINT (2.5 V) and VCCIO (3.3 V or 5 V tolerant) power pins to planes rather than traces; the 208-PQFP lead inductance of the gull-wing leads (about 1 nH each) creates significant switching noise if power is delivered through traces. Place 0.1 µF X7R ceramic decoupling within 5 mm of every VCCINT/VCCIO pin, plus a 10 µF tantalum bulk capacitor per voltage rail. JTAG signals (TCK, TMS, TDI, TDO) should be series-terminated with 33 Ω resistors and length-matched to within 50 mil to avoid boundary-scan failures at higher TCK frequencies.
Do not assume any FLEX 10KE variant is RoHS compliant - the trailing '-N' suffix is required for Pb-free terminal finish. Mixing Pb-free -2N parts with SnPb -2 parts on the same board violates the higher-temperature reflow profile required by Pb-free finishes. Also note that the configuration device must match the FPGA density: EPC2LC20 supports FLEX 10KE up to 30K gates; larger densities require EPC4 or EPC8. Finally, the MSEL pins select configuration mode (AS, AP, PS, JTAG) and must be pulled to VCCINT or GND with 4.7 kΩ resistors - leaving them floating causes configuration failures.
규정 준수 정보
Original EPF10K30EQC208-2 is SnPb terminal finish (non-RoHS); RoHS-compliant variants use the trailing '-N' suffix (EPF10K30EQC208-2N). Not AEC-Q100 qualified. Halogen-free status not stated in available datasheet excerpts. REACH compliance assumed per Intel product environmental program; conflict-minerals declaration available from Intel.