EPF10K50EQC240-2 - 50K FLEX-10KE FPGA, 240-PQFP | Intel
MPN: EPF10K50EQC240-2 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $86.5 | $865.00 |
| 100 | $78.2 | $7,820.00 |
| 500 | $71.5 | $35,750.00 |
| 1,000 | $65 | $65,000.00 |
Drop-in alternatives for EPF10K50EQC240-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPF10K50EQC240-2N
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View Datasheet →EPF10K50EQC240-2 Maximum Ratings & Electrical Characteristics
| Family | FLEX-10KE |
| Logic Elements (Cells) | 2,880 |
| System Gates | 50,000 (40,960 typical) |
| Logic Array Blocks (LABs) | 360 |
| Embedded Array Blocks (EABs) | 12 |
| Total RAM Bits | 20,480 bits |
| User I/O Pins | 189 |
| Maximum Operating Frequency | 200 MHz |
| Core Voltage | 2.5 V |
| Process Technology | 0.22 µm CMOS |
| Package | 240-BFQFP / PQFP-240 (34.6 × 34.6 mm, 0.5 mm pitch) |
| Operating Temperature | 0 °C to +70 °C (Commercial) |
| Programming Interface | IEEE 1149.1 JTAG, Serial EPROM (PS / AS) |
| Configuration Memory | SRAM (volatile) |
| Mounting Type | Surface Mount (gull-wing leads) |
EPF10K50EQC240-2 240-bfqfp / pqfp-240 (34.6 × 34.6 mm, 0.5 mm pitch) Pin Configuration Guide
Complete pinout information for EPF10K50EQC240-2 (240-bfqfp / pqfp-240 (34.6 × 34.6 mm, 0.5 mm pitch) package) with 189 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K50EQC240-2.
Refer to the datasheet for full pin configuration.
Estimated pin count: 189 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPF10K50EQC240-2 is suitable for 6 applications: PCI Bus Interface / Bridge, Industrial Control / State Machines, Telecommunications Glue Logic, ASIC Prototyping / Emulation, Legacy Embedded Computing Boards, Image Processing Pre-Processing / Display Controllers.
PCI Bus Interface / Bridge
The EPF10K50EQC240-2 is well-suited for 33/66 MHz PCI bus bridge and peripheral-controller designs because it integrates 189 user I/Os in a PQFP-240 package while meeting PCI 5 V signaling tolerance via the 3.3 V VCCIO bank. Its 12 embedded array blocks (EABs) provide up to 20 Kbits of on-chip dual-port RAM for FIFO buffering of PCI transactions, and the 360 LABs comfortably implement state machines for bus arbitration, target/initiator control, and configuration-space registers. Compared with discrete 74-series glue logic, this FPGA reduces board area by roughly 40 percent while delivering a 200 MHz core frequency that absorbs any PCI clock-domain crossing on-chip.
Recommended
Industrial Control / State Machines
In industrial PLC and motion-controller applications, the EPF10K50EQC240-2's 2,880 logic elements and 360 LABs deliver ample capacity for complex ladder-logic-to-FPGA conversions, motor-control PWM generators, and encoder quadrature decoders. The 0 °C to +70 °C commercial temperature range covers most factory-floor cabinets, and the wide 189-I/O count supports multi-axis servo interfaces, discrete I/O banks, and fieldbus glue logic. EABs can be configured as ROM look-up tables for sine commutation profiles or as small CAM memories for position comparison, eliminating external memory chips on the board.
Recommended
Telecommunications Glue Logic
Telecom backplane applications require wide bus multiplexing, HDLC/framer glue, and clock-domain crossing — exactly the workload the EPF10K50EQC240-2 was designed for. With 189 I/Os and 12 EABs, the device can implement multiple independent T1/E1 framers, MVIP/H.110 bus bridges, and SDH/SONET tributary mappers on a single chip. The 200 MHz internal frequency supports serial bit-clock recovery at up to 100 MHz, and the JTAG interface allows boundary-scan verification of densely populated backplane assemblies during manufacturing test.
Recommended
ASIC Prototyping / Emulation
The EPF10K50EQC240-2 is widely used as an ASIC prototyping vehicle because its fine-grained LAB fabric maps efficiently to random control logic while the EABs map to register files and small RAMs. Designers partition a target ASIC across one or more FLEX-10KE devices using JTAG daisy-chaining, achieving real-time functional validation before committing to mask costs. The PQFP-240 package supports standard socketed or solder-down prototyping boards, and Quartus II 13.0 retains full FLEX-10KE synthesis support for legacy design reuse.
Recommended
Legacy Embedded Computing Boards
VME, cPCI, and PC/104 embedded computers from the late 1990s and early 2000s frequently used the EPF10K50EQC240-2 as a system controller to bridge host CPUs to peripheral buses. Its 189 I/Os accommodate parallel ISA/PCI bus interfaces plus auxiliary serial links, and the 2.5 V core with 3.3 V I/O bank simplifies mixed-voltage integration with PowerPC, MIPS, or ARM host processors of that era. For long-life programs in defense, aerospace, and industrial automation, this FPGA remains a familiar building block that field engineers can support with existing toolchains and design IP libraries.
Recommended
Image Processing Pre-Processing / Display Controllers
With 12 EABs capable of dual-port RAM configurations up to 16 × 8 each, the EPF10K50EQC240-2 can implement line buffers for video preprocessing pipelines (de-interlacing, color-space conversion) feeding LCD controllers. The 189 I/Os accommodate parallel RGB or LVDS signaling paths and overlay blending logic, while the 200 MHz core frequency handles pixel rates up to 100 MHz easily. Compared with dedicated video controllers of the era, this FPGA offers a programmable upgrade path via JTAG reconfiguration without respinning the PCB.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K50EQC240-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K50EQC240-2N | EPF10K50EQC240-3 | EPF10K50EQC240-1N | EPF10K50EQC240-3N | EPF10K100EQC240-2 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | PQFP-240 (240-BFQFP) | PQFP-240 (same) | PQFP-240 (same) | PQFP-240 (same) | PQFP-240 (same) | PQFP-240 (same) |
| Logic Elements | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 | 4,992 (100K) |
| System Gates | 50,000 (40,960 typical) | 50,000 | 50,000 | 50,000 | 50,000 | 100,000 |
| User I/O | 189 | 189 | 189 | 189 | 189 | 189 |
| Speed Grade | -2 | -2 | -3 (faster) | -1 (slower) | -3 (faster) | -2 |
| Lead-Free (RoHS) | SnPb (non-N) | Yes (Pb-free) | SnPb | Yes (Pb-free) | Yes (Pb-free) | SnPb |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Key Differentiators
- Highest verified drop-in replacement density available (vs EPF10K50EQC240-3)
- Upward migration path within same package (vs EPF10K100EQC240-2)
- Wide I/O count in PQFP package (vs EPF10K30EQC208-2 (lower-density PQFP-208 sibling))
Design Notes
Estimated: at 200 MHz core frequency with 50 percent toggle rate, the EPF10K50EQC240-2 draws roughly 250-400 mA from VCCINT (2.5 V) and 100-150 mA from VCCIO (3.3 V), for a total of about 1.0-1.4 W. Place at least one 0.1 µF X7R ceramic decoupling capacitor within 5 mm of every VCCINT/VCCIO pin pair, plus a single 47-100 µF tantalum or polymer bulk capacitor per voltage rail. Inadequate decoupling is the most common cause of JTAG configuration failures on FLEX-10KE designs.
Route the 0.5 mm-pitch PQFP-240 leads on a 4-layer PCB with a continuous ground plane on layer 2 and a power plane on layer 3. Keep high-speed I/O traces shorter than 50 mm (3 ns propagation budget at 200 MHz), and isolate clock inputs (CLK0/CLK1/CLK2) from switching I/O to avoid coupling. Recommended land pattern: 0.30 × 1.50 mm rectangular pads with 0.5 mm pitch, matching IPC-7351 nominal density. Maintain at least 0.2 mm clearance between adjacent PQFP leads to prevent solder bridges during reflow.
Configuration memory is volatile (SRAM); without a configuration EPROM (EPC2, EPC4, or EPC8) the device powers up blank and the board appears dead. Always strap MSEL pins to select Passive Serial (PS) mode with a serial configuration EPROM, and pull nCONFIG high through a 10 kΩ resistor. Do not leave JTAG pins (TCK/TMS/TDO/TDI) floating — TCK and TMS must be pulled high through 10 kΩ resistors to prevent spurious boundary-scan entry that can disrupt user-mode operation.
The PQFP-240 package has a θJA of roughly 30-35 °C/W in still air on a standard 4-layer JEDEC test board, so a 1.4 W dissipation produces a junction temperature rise of 45-50 °C above ambient. With a 70 °C commercial upper limit and 25 °C typical ambient, this leaves roughly 5-10 °C of margin; for industrial cabinets running at 50 °C, ensure airflow of at least 100 LFM or add a small heatsink on the PQFP body. Estimated values based on package thermal metrics; datasheet figures should be re-verified if available.
Compliance Information
EPF10K50EQC240-2 (without N suffix) uses SnPb lead finish and is NOT RoHS compliant; for RoHS-compliant assembly, choose the EPF10K50EQC240-2N variant. RoHS/REACH compliance status not stated in the provided web data; marked 'unknown'. AEC-Q100 not applicable — this is a commercial-grade FPGA, not an automotive-grade part.
