EPF6024ATC144-19 - FLEX 6000 FPGA 24K Gates 144-LQFP | Intel
부품 번호: EPF6024ATC144-19 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.2 | $382.00 |
| 100 | $32.75 | $3,275.00 |
| 500 | $27.4 | $13,700.00 |
| 1,000 | $23.1 | $23,100.00 |
EPF6024ATC144-19 개요
A field-programmable gate array (FPGA) is a semiconductor integrated circuit containing an array of programmable logic blocks, interconnect resources, and configurable I/O cells that the designer can personalize after manufacture to implement any digital logic function - from simple glue logic to complex state machines, bus bridges, and DSP pipelines. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs) -> logic ICs -> integrated circuits. The FLEX 6000 family was Altera's first-generation look-up table (LUT)-based FPGA architecture, positioned for glue-logic, bus-interface, and high-volume consumer/industrial applications where cost per gate and 5 V I/O tolerance were decisive factors.
Key features of the EPF6024ATC144-19 include four embedded logic elements (LEs) per LAB, fast interconnect with carry and cascade chains for arithmetic and wide-input functions, JTAG (IEEE 1149.1) boundary-scan support, in-system programmability via the Altera ByteBlaster or BitBlaster loaders, and an -19 speed grade (commercial) that trades off maximum toggle rate (typically ~125 MHz internal) for lower cost. The 144-LQFP package is a low-profile plastic quad flat pack with gull-wing leads and a 1.4 mm height, optimized for surface-mount production lines.
Typical applications for the EPF6024ATC144-19 span glue-logic replacement for discrete 74-series TTL/CMOS, custom peripheral bus bridges (PCI, ISA, VME), industrial controller I/O expansion, and legacy-system modernization where 5 V I/O tolerance eliminates level-shifters. Because the FLEX 6000 family is fabricated on a 0.35 µm SRAM process, configuration must be reloaded from external EPROM, Flash, or microcontroller on every power-up.
When designing with this part, allocate the configuration memory interface pins (MSELn, nSTATUS, nCONFIG, CONF_DONE) carefully and ensure the JTAG chain does not conflict with board-level boundary-scan. Designers migrating to a newer family should evaluate the MAX II or Cyclone series as successors with substantially higher density and lower power.
드롭인 대체품: EPF6024ATC144-19 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF6024ATC144-19 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Process Technology, Configuration Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF6024ATC144-10
✅ 드롭인✓ 재고 있음
$11.1 / 개
데이터시트 보기 →EPF6024ATC144-18
✅ 드롭인✓ 재고 있음
$17.8 / 개
데이터시트 보기 →EPF6024ATC144-17
✅ 드롭인✓ 재고 있음
$9.75 / 개
데이터시트 보기 →EPF6024ATC144-15
✅ 드롭인✓ 재고 있음
$9.75 / 개
데이터시트 보기 →EPF6024ATC144-14
✅ 드롭인✓ 재고 있음
$17.8 / 개
데이터시트 보기 →EPF6024ATC144-13
✅ 드롭인✓ 재고 있음
$7.1 / 개
데이터시트 보기 →EPF6024ATC144-19 최대 정격 & 전기적 특성
| Series | FLEX 6000 |
| Logic Elements | 1,960 |
| Logic Array Blocks (LABs) | 196 |
| Typical Gates | 24,000 |
| Maximum User I/O Pins | 117 |
| 패키지 | 144-LQFP (TQF144 / 22x22 mm) |
| Speed Grade | -19 |
| Core Supply Voltage | 3.3 V |
| I/O Supply Voltage | 3.3 V / 5.0 V tolerant |
| 동작 온도 | Commercial (0C to +70C) |
| Configuration Technology | SRAM (volatile) |
| Programming Interface | JTAG (IEEE 1149.1) + serial ByteBlaster |
| 실장 유형 | Surface Mount |
| Lead-Free / RoHS | Depends on date code - check lot |
| Process Technology | 0.35 µm CMOS SRAM |
EPF6024ATC144-19 144-lqfp (tqf144 / 22x22 mm) 핀 구성 가이드
EPF6024ATC144-19(144-lqfp (tqf144 / 22x22 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF6024ATC144-19.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF6024ATC144-19 적합 용도: 6 애플리케이션s: Glue Logic Replacement, Custom Peripheral Bus Bridges, Industrial Controller I/O Expansion, Legacy System Modernization, Telecom Line Card Glue Logic, Test & Measurement Front-Ends.
Glue Logic Replacement
The EPF6024ATC144-19 replaces dozens of discrete 74-series TTL/CMOS logic chips (gates, muxes, counters, latches) on legacy boards with one reconfigurable device. With 1,960 logic elements across 196 LABs and 117 user I/Os in a 144-LQFP, the EPF6024ATC144-19 absorbs an entire board full of glue logic while freeing PCB area, reducing assembly cost, and enabling last-minute design changes via JTAG reprogramming. The 5.0 V-tolerant I/O is critical here because most legacy glue-logic boards run at 5 V - the EPF6024ATC144-19 connects directly without level shifters. Speed grade -19 is acceptable for most glue functions (address decoding, state machines, peripheral selects) where fMAX rarely exceeds 50 MHz.
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Custom Peripheral Bus Bridges
The EPF6024ATC144-19 bridges incompatible buses in industrial control systems - translating ISA-to-PCI, VME-to-local bus, or proprietary protocols in real time. With 1,960 logic elements the device can host multi-state bus-master/slave controllers, FIFO buffers, and address/data steering logic simultaneously. The 117 user I/Os in the 144-LQFP footprint accommodate wide address and data buses (e.g., 32-bit data + 24-bit address + control) without external muxing. Volatile SRAM configuration is acceptable because industrial PCs reconfigure from disk on every boot, and JTAG in-system programmability lets field engineers update bridge firmware without removing boards from service.
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Industrial Controller I/O Expansion
The EPF6024ATC144-19 expands the I/O count of legacy PLCs, motion controllers, and instrumentation front-ends by decoding address lines, generating timing pulses, and multiplexing sensor inputs. Its 3.3 V core with 5.0 V-tolerant I/O integrates seamlessly into industrial 5 V backplanes and 24 V sensor interfaces (with external isolation). With 196 LABs and fast carry/cascade chains, the EPF6024ATC144-19 also implements encoder quadrature decoding, PWM generation, and stepper-motor pulse streams - all on one device. Industrial users value the device's proven long-term reliability in 0C-70C commercial environments and the fact that Intel still supports Altera legacy bitstreams via its Quartus legacy library.
추천
Legacy System Modernization
The EPF6024ATC144-19 replaces obsolete ASICs, gate arrays, and obsolete FPGAs in end-of-life industrial, military, and aerospace systems where the original silicon is no longer available. Its 144-LQFP footprint, 3.3 V core, and 5 V-tolerant I/O match the electrical and mechanical envelope of many late-1990s designs, allowing drop-in substitution without board rework. Field engineers reprogram the FPGA via JTAG to emulate the legacy ASIC's function while maintaining form, fit, and function. Speed grade -19 is generally adequate for control-plane functions (timing, decoding, interrupts), and the obsolete lifecycle status is mitigated by long-term authorized-distributor stocking programs.
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Telecom Line Card Glue Logic
The EPF6024ATC144-19 implements glue logic on telecom line cards - TDM bus steering, HDLC framing, framer-to-switch fabric interfaces, and clock-domain crossing. With 117 user I/Os the device handles parallel TDM buses (e.g., 16-bit data + clock + frame sync) plus overhead GPIO for alarms and status. Speed grade -19 supports TDM clocks up to ~50 MHz, covering E1/T1 and even moderate-rate OC-3 designs. The 5.0 V-tolerant I/O interfaces directly to legacy telecom ASICs operating at 5 V, eliminating level shifters. JTAG in-system programmability allows field upgrades as telecom protocols evolve.
추천
Test & Measurement Front-Ends
The EPF6024ATC144-19 implements timing generators, pattern generators, and stimulus/response selectors in ATE, oscilloscope, and logic-analyzer front-ends. With 1,960 logic elements the device can host complex state machines, programmable delay lines, and parallel stimulus vectors that would otherwise require multiple discrete PALs and gate arrays. The 144-LQFP's 117 user I/Os accommodate parallel test buses, while the 5.0 V tolerance interfaces directly to legacy test fixtures. Engineers reprogram the FPGA via JTAG to add new test patterns, eliminating the need for multiple instrument revisions.
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추천 제품 요약
엔지니어링 참조 데이터: EPF6024ATC144-19 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF6024ATC144-10 | EPF6024ATC144-18 | EPF6024ATC144-17 | EPF6024ATC144-15 |
|---|---|---|---|---|---|
| Package | 144-LQFP (TQF144) | 144-LQFP (TQF144) - same | 144-LQFP (TQF144) - same | 144-LQFP (TQF144) - same | 144-LQFP (TQF144) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Speed Grade | -19 | -10 (faster) | -18 | -17 | -15 |
| Logic Elements | 1,960 | 1,960 - same | 1,960 - same | 1,960 - same | 1,960 - same |
| Logic Array Blocks (LABs) | 196 | 196 - same | 196 - same | 196 - same | 196 - same |
| User I/Os | 117 | 117 - same | 117 - same | 117 - same | 117 - same |
| Typical Gates | 24,000 | 24,000 - same | 24,000 - same | 24,000 - same | 24,000 - same |
| Configuration Technology | SRAM (volatile) | SRAM (volatile) - same | SRAM (volatile) - same | SRAM (volatile) - same | SRAM (volatile) - same |
| Core Voltage | 3.3 V | 3.3 V - same | 3.3 V - same | 3.3 V - same | 3.3 V - same |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Same FLEX 6000 die, faster timing margin (vs EPF6024ATC144-10)
- Mid-density sweet spot in the FLEX 6000 lineup (vs EPF6016ATC144-3)
- 5.0 V-tolerant I/O for legacy interface (vs EPM240T100C5N (MAX II))
설계 노트
The EPF6024ATC144-19 requires three supplies: VCCINT = 3.3 V ±5% for the core logic, VCCIO = 3.3 V or 5.0 V for the I/O banks, and a separate supply for the configuration EPROM (typically 5 V for EPC2). Power sequencing matters - VCCINT must reach 3.0 V before configuration begins, otherwise the nSTATUS pin may stay low and prevent initialization. Decoupling: place one 0.1 µF ceramic per VCCINT/VCCIO pin pair, plus a bulk 33 µF tantalum near the package. Estimated: at 100% utilization and 50 MHz toggle rate, typical VCCINT current is around 100-150 mA and VCCIO current up to 500 mA depending on I/O switching activity - consult the FLEX 6000 family datasheet power estimator for your design.
Route the JTAG signals (TCK, TMS, TDI, TDO, TRST) as a daisy-chain with 33 Ω series termination near the driver to prevent ringing at TCK rates above 10 MHz. The 144-LQFP package has a center thermal pad (DAP) that must be soldered to a 1 square inch copper pour on the top layer and connected to GND for thermal relief - the EPF6024ATC144-19 can dissipate 1-2 W under heavy utilization. Keep configuration signals (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) away from fast-switching I/O to avoid noise-induced configuration failures. Maintain 0.5 mm clearance between LQFP leads and adjacent traces for assembly yield.
Three pitfalls recur in EPF6024ATC144-19 designs: (1) Forgetting the external configuration EPROM - the device is SRAM-based and will not retain its bitstream across power cycles, (2) Driving the 5 V-tolerant I/O pins with signals exceeding 5.5 V absolute maximum, which can latch-up the output structures, and (3) Using the wrong Quartus II device library - older MAX+PLUS II designs targeting the EPF6024ATC144-19 may need migration to the Quartus FLEX 6000 library before compilation succeeds. Also, do not tie the MSEL pins to incompatible states - they select between passive serial and JTAG configuration modes.
규정 준수 정보
The EPF6024ATC144-19 was originally manufactured before RoHS was mandatory; later lead-free revisions may be RoHS compliant depending on date code. Engineers should request specific date-code RoHS documentation from their distributor before assembly.
