HMCG78AHBWA315N - 16GB DDR5-6400 CSODIMM | SK hynix | Servers
부품 번호: HMCG78AHBWA315N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $138 | $1,380.00 |
| 100 | $129 | $12,900.00 |
| 500 | $122 | $61,000.00 |
| 1,000 | $116 | $116,000.00 |
HMCG78AHBWA315N 개요
A SODIMM (Small Outline Dual In-line Memory Module) is a compact memory module format used where full-size UDIMMs and RDIMMs do not fit, such as laptops, mini-PCs, network appliances, and blade servers. DDR5 is the fifth generation of double data rate synchronous DRAM, doubling the banks and burst length of DDR4 and moving power management onto the module via an on-module PMIC. In the memory hierarchy, this module sits at the system-main-memory level above caches and below storage.
Key features of the HMCG78 series include DDR5-6400 data rate (PC5-51200), 1Rx8 single-rank organization delivering 16GB per module, and 1.1V operation per the JEDEC DDR5 standard. The module integrates on-die ECC (ODECC) at the DRAM device level and an on-module power management IC (PMIC) that regulates the 1.1V VDD rail locally, reducing load on the host board.
Technically, DDR5-6400 provides 51.2 GB/s peak bandwidth per channel in 64-bit configurations, with burst length 16 and two independent 32-bit subchannels per DIMM for improved concurrency. The 2Gx8 configuration reflects eight 16Gb-class DRAM devices per the SK hynix [2Gx8 8C] organization cited in distributor listings.
Typical applications include edge servers, compact network appliances, high-performance laptops and mini workstations that accept clocked SODIMM modules, and embedded industrial systems requiring DDR5 bandwidth in a low-profile footprint.
Design consideration: verify that the host memory controller and BIOS support DDR5-6400 on CSODIMM modules; if the platform tops out at DDR5-5600, the module will downclock, and mixed-module populations typically run at the slowest common speed. Confirm 262-pin slot orientation and M.2-slot mechanical clearance before layout.
This page synthesizes distributor pricing, same-brand drop-in module alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: HMCG78AHBWA315N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: HMCG78AHBWA315N (동일 폼 팩터 및 풋프린트) — 차이점: Form Factor, Data Rate, Error Correction, Module Type, Operating Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
HMCG78AHBRA289N
✅ 드롭인✓ 재고 있음
$68 / 개
데이터시트 보기 →HMCG78AHBRA471N
✅ 드롭인✓ 재고 있음
$649 / 개
데이터시트 보기 →HMCG78AHBVA315N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
HMCG78MEBRA113N
✅ 드롭인✓ 재고 있음
$94 / 개
데이터시트 보기 →HMCG78AEBRA107N
✅ 드롭인✓ 재고 있음
$399 / 개
데이터시트 보기 →HMCG78AEBRA168N
✅ 드롭인✓ 재고 있음
$74 / 개
데이터시트 보기 →HMCG78AHBWA315N 최대 정격 & 전기적 특성
| 메모리 유형 | DDR5 SDRAM CSODIMM |
| Capacity | 16 GB |
| 데이터 속도 | 6400 MT/s (DDR5-6400) |
| Bandwidth | PC5-51200 |
| 메모리 구성 | 2Gx64, 1Rx8 |
| Ranks | Single rank (1R) |
| Configuration | 2Gx8 8C DRAM devices |
| Pins | 262 |
| Form Factor | CSODIMM (Clocked SODIMM) |
| Operating Voltage | 1.1 V (VDD) |
| Error Correction | On-die ECC (ODECC) |
| PMIC | On-module power management IC (DDR5) |
| RoHS 상태 | unknown |
| Manufacturer | SK hynix |
HMCG78AHBWA315N standard 핀 구성 가이드
HMCG78AHBWA315N(standard 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: HMCG78AHBWA315N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
HMCG78AHBWA315N 적합 용도: 6 애플리케이션s: Edge Servers, Network Appliances, High-Performance Laptops and Mobile Workstations, Embedded Industrial Systems, Storage and HCI Nodes, AI Edge Inference Appliances.
Edge Servers
Edge servers process data close to the source in compact, often passively-cooled chassis where full-size RDIMMs do not fit. The HMCG78AHBWA315N fits this role because its 262-pin CSODIMM format delivers 16GB of DDR5-6400 bandwidth (PC5-51200 class, up to 51.2 GB/s per 64-bit channel) in a low-profile module. Its 1.1V operation per JEDEC DDR5 and on-module PMIC simplify host power delivery, reducing thermal load in conduction-cooled enclosures. Populate one or two slots per CPU with these 1Rx8 modules; single-rank organization minimizes command-bus loading and helps sustain 6400 MT/s timing at the memory controller. Verify BIOS support for clocked SODIMMs at DDR5-6400 before mixing with slower modules.
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Network Appliances
High-throughput network appliances such as routers, firewalls, and SD-WAN platforms require large in-flight packet buffers and fast table lookups. The HMCG78AHBWA315N provides 16GB of DDR5-6400 memory in the 262-pin CSODIMM footprint used by many SoC-based appliance boards. Its 1Rx8 single-rank organization keeps the memory bus lightly loaded, preserving signal integrity margins at 6400 MT/s in electrically noisy networking environments, while on-die ECC guards against DRAM bit flips that could corrupt flow-state tables. Because the module is a standard JEDEC-format SODIMM, appliance OEMs can populate 16GB or mix validated capacities per SKU without PCB respins, simplifying the hardware bill of materials across product tiers.
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High-Performance Laptops and Mobile Workstations
Premium laptops and mobile workstations with DDR5-6400 memory controllers benefit directly from the HMCG78AHBWA315N's combination of 16GB capacity and 6400 MT/s bandwidth in the compact 262-pin SODIMM format. The low 1.1V rail, regulated by the module's on-board PMIC, helps extend battery runtime compared to DDR4's 1.2V, and on-die ECC improves reliability for mobile professional workloads such as CAD, video editing, and local AI inference. Single-rank 1Rx8 organization reduces refresh-related latency stalls versus dual-rank equivalents in some workloads. Designers must confirm the platform supports clocked (C) SODIMM modules rather than standard U-SODIMMs, and should check mechanical clearance for module height in thin chassis.
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Embedded Industrial Systems
Industrial controllers, machine-vision systems, and medical instrumentation increasingly adopt DDR5 for its bandwidth and reliability features. The HMCG78AHBWA315N suits these designs because its SODIMM form factor enables field memory upgrades without board redesign, its on-die ECC (ODECC) silently corrects single-bit DRAM errors critical for long-life unattended operation, and its 1.1V operation reduces system power. Machine-vision pipelines moving multi-megapixel frames benefit from the DDR5-6400 bandwidth class (PC5-51200), sustaining sustained sensor-to-processor streaming. For industrial qualification, verify the module's operating temperature rating against the enclosure's worst-case ambient, and lock the BIOS memory training profile so the 6400 MT/s timing remains stable across production units.
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Storage and HCI Nodes
Hyper-converged infrastructure (HCI) and dense storage nodes in compact or blade form factors use SODIMM-based memory subsystems to maximize memory per rack unit. The HMCG78AHBWA315N supplies 16GB DDR5-6400 per module, letting a two-slot platform reach 32GB without full-size DIMMs. Its single-rank 1Rx8 topology eases the memory controller's scheduling burden, which matters for storage workloads with high queue depths and sustained sequential I/O, while the DDR5 two-independent-subchannel architecture improves effective bandwidth for mixed read/write streams. On-die ECC protects against silent data corruption in software-defined storage checksum paths. Confirm the storage SoC's validated memory vendor list includes HMCG78-family CSODIMMs before deployment.
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AI Edge Inference Appliances
Compact AI inference appliances running quantized models at the edge need memory bandwidth more than raw capacity, since model weights stream from DRAM each token or frame. The HMCG78AHBWA315N's DDR5-6400 rate provides up to 51.2 GB/s per 64-bit channel, materially improving tokens-per-second for 7B-class quantized models versus DDR4-3200 SODIMMs, within the same 262-pin mechanical envelope. The 1.1V rail and on-module PMIC keep power predictable in fanless edge enclosures, and on-die ECC protects long-running inference jobs from DRAM bit errors that would degrade output quality. Systems designers should validate thermals under sustained memory-heavy inference, as DDR5-6400 operation raises module self-heating relative to slower bins.
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추천 제품 요약
엔지니어링 참조 데이터: HMCG78AHBWA315N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | HMCG78AHBRA289N | HMCG78AHBRA471N | HMCG78AHBVA315N | HMCG78MEBRA113N |
|---|---|---|---|---|---|
| Package | 262-pin DDR5 CSODIMM | 262-pin DDR5 CSODIMM - same | 262-pin DDR5 CSODIMM - same | 262-pin DDR5 CSODIMM - same | 262-pin DDR5 CSODIMM - same |
| Brand | SK hynix | SK hynix | SK hynix | SK hynix | SK hynix |
| Operating Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| On-die ECC | Yes | Yes | Yes | Yes | Yes |
| Module Type | CSODIMM (clocked) | CSODIMM (clocked) | CSODIMM (clocked) | CSODIMM (clocked) | CSODIMM (clocked) |
주요 차별점
- Top-speed DDR5-6400 bin in compact CSODIMM format (vs HMCG78AEBRA107N)
- V-variant twin available for dual-source supply (vs HMCG78AHBVA315N)
- Single-rank 1Rx8 organization (vs HMCG78MEBRA113N)
설계 노트
Confirm the platform supports clocked (C) SODIMMs before populating the HMCG78AHBWA315N. Clocked SODIMMs buffer clock lines and are not always interchangeable with standard U-SODIMMs on the same 262-pin slot. Also verify BIOS/UEFI memory training support for DDR5-6400: if the controller tops out at a lower JEDEC bin, the module will downclock and the bandwidth advantage is lost. Mixing modules of different speed grades typically forces the entire population to the slowest common speed.
The module operates at 1.1V VDD per JEDEC DDR5 and regulates its own core rail via the on-module PMIC (5V auxiliary rail on DDR5 SODIMMs). The host board must supply the 5V PMIC input with adequate current headroom; do not assume DDR4 SODIMM power budgets. Estimated: a single-rank DDR5-6400 module typically draws on the order of 3-5W under load, so a dual-module design should budget roughly 10W for the memory subsystem - validate against the official SK hynix power specification before finalizing the power tree.
At DDR5-6400, memory-bus timing margins tighten substantially versus DDR4-3200. Use the SODIMM connector layout, length matching, and reference-plane stackup recommended in the host SoC vendor's design guide, and run the BIOS memory-training results on all production boards. Single-rank 1Rx8 organization reduces command/address loading and helps close timing, but avoid stacking high-speed I/O traces directly under the SODIMM connector region on the carrier PCB.
규정 준수 정보
Compliance data was not present in the verified web data. DDR5 modules from tier-1 manufacturers are typically RoHS compliant, but this must be confirmed from the official SK hynix datasheet or product page before design sign-off.
