HMCG78AHBWA315N - 16GB DDR5-6400 CSODIMM | SK hynix | Servers
MPN: HMCG78AHBWA315N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $138 | $1,380.00 |
| 100 | $129 | $12,900.00 |
| 500 | $122 | $61,000.00 |
| 1,000 | $116 | $116,000.00 |
Drop-in alternatives for HMCG78AHBWA315N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
HMCG78AHBRA289N
✅ Drop-In✓ In Stock
$68 / Unit
View Datasheet →HMCG78AHBRA471N
✅ Drop-In✓ In Stock
$649 / Unit
View Datasheet →HMCG78AHBVA315N
✅ Drop-In📋 Reference alternative (not in catalog)
HMCG78MEBRA113N
✅ Drop-In✓ In Stock
$94 / Unit
View Datasheet →HMCG78AEBRA107N
✅ Drop-In✓ In Stock
$399 / Unit
View Datasheet →HMCG78AEBRA168N
✅ Drop-In✓ In Stock
$74 / Unit
View Datasheet →HMCG78AHBWA315N Maximum Ratings & Electrical Characteristics
| Memory Type | DDR5 SDRAM CSODIMM |
| Capacity | 16 GB |
| Data Rate | 6400 MT/s (DDR5-6400) |
| Bandwidth | PC5-51200 |
| Organization | 2Gx64, 1Rx8 |
| Ranks | Single rank (1R) |
| Configuration | 2Gx8 8C DRAM devices |
| Pins | 262 |
| Form Factor | CSODIMM (Clocked SODIMM) |
| Operating Voltage | 1.1 V (VDD) |
| Error Correction | On-die ECC (ODECC) |
| PMIC | On-module power management IC (DDR5) |
| RoHS Status | unknown |
| Manufacturer | SK hynix |
HMCG78AHBWA315N standard Pin Configuration Guide
Complete pinout information for HMCG78AHBWA315N (standard package) with 262 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for HMCG78AHBWA315N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 262 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
HMCG78AHBWA315N is suitable for 6 applications: Edge Servers, Network Appliances, High-Performance Laptops and Mobile Workstations, Embedded Industrial Systems, Storage and HCI Nodes, AI Edge Inference Appliances.
Edge Servers
Edge servers process data close to the source in compact, often passively-cooled chassis where full-size RDIMMs do not fit. The HMCG78AHBWA315N fits this role because its 262-pin CSODIMM format delivers 16GB of DDR5-6400 bandwidth (PC5-51200 class, up to 51.2 GB/s per 64-bit channel) in a low-profile module. Its 1.1V operation per JEDEC DDR5 and on-module PMIC simplify host power delivery, reducing thermal load in conduction-cooled enclosures. Populate one or two slots per CPU with these 1Rx8 modules; single-rank organization minimizes command-bus loading and helps sustain 6400 MT/s timing at the memory controller. Verify BIOS support for clocked SODIMMs at DDR5-6400 before mixing with slower modules.
Recommended
Network Appliances
High-throughput network appliances such as routers, firewalls, and SD-WAN platforms require large in-flight packet buffers and fast table lookups. The HMCG78AHBWA315N provides 16GB of DDR5-6400 memory in the 262-pin CSODIMM footprint used by many SoC-based appliance boards. Its 1Rx8 single-rank organization keeps the memory bus lightly loaded, preserving signal integrity margins at 6400 MT/s in electrically noisy networking environments, while on-die ECC guards against DRAM bit flips that could corrupt flow-state tables. Because the module is a standard JEDEC-format SODIMM, appliance OEMs can populate 16GB or mix validated capacities per SKU without PCB respins, simplifying the hardware bill of materials across product tiers.
Recommended
High-Performance Laptops and Mobile Workstations
Premium laptops and mobile workstations with DDR5-6400 memory controllers benefit directly from the HMCG78AHBWA315N's combination of 16GB capacity and 6400 MT/s bandwidth in the compact 262-pin SODIMM format. The low 1.1V rail, regulated by the module's on-board PMIC, helps extend battery runtime compared to DDR4's 1.2V, and on-die ECC improves reliability for mobile professional workloads such as CAD, video editing, and local AI inference. Single-rank 1Rx8 organization reduces refresh-related latency stalls versus dual-rank equivalents in some workloads. Designers must confirm the platform supports clocked (C) SODIMM modules rather than standard U-SODIMMs, and should check mechanical clearance for module height in thin chassis.
Recommended
Embedded Industrial Systems
Industrial controllers, machine-vision systems, and medical instrumentation increasingly adopt DDR5 for its bandwidth and reliability features. The HMCG78AHBWA315N suits these designs because its SODIMM form factor enables field memory upgrades without board redesign, its on-die ECC (ODECC) silently corrects single-bit DRAM errors critical for long-life unattended operation, and its 1.1V operation reduces system power. Machine-vision pipelines moving multi-megapixel frames benefit from the DDR5-6400 bandwidth class (PC5-51200), sustaining sustained sensor-to-processor streaming. For industrial qualification, verify the module's operating temperature rating against the enclosure's worst-case ambient, and lock the BIOS memory training profile so the 6400 MT/s timing remains stable across production units.
Recommended
Storage and HCI Nodes
Hyper-converged infrastructure (HCI) and dense storage nodes in compact or blade form factors use SODIMM-based memory subsystems to maximize memory per rack unit. The HMCG78AHBWA315N supplies 16GB DDR5-6400 per module, letting a two-slot platform reach 32GB without full-size DIMMs. Its single-rank 1Rx8 topology eases the memory controller's scheduling burden, which matters for storage workloads with high queue depths and sustained sequential I/O, while the DDR5 two-independent-subchannel architecture improves effective bandwidth for mixed read/write streams. On-die ECC protects against silent data corruption in software-defined storage checksum paths. Confirm the storage SoC's validated memory vendor list includes HMCG78-family CSODIMMs before deployment.
Recommended
AI Edge Inference Appliances
Compact AI inference appliances running quantized models at the edge need memory bandwidth more than raw capacity, since model weights stream from DRAM each token or frame. The HMCG78AHBWA315N's DDR5-6400 rate provides up to 51.2 GB/s per 64-bit channel, materially improving tokens-per-second for 7B-class quantized models versus DDR4-3200 SODIMMs, within the same 262-pin mechanical envelope. The 1.1V rail and on-module PMIC keep power predictable in fanless edge enclosures, and on-die ECC protects long-running inference jobs from DRAM bit errors that would degrade output quality. Systems designers should validate thermals under sustained memory-heavy inference, as DDR5-6400 operation raises module self-heating relative to slower bins.
Recommended
Recommended Products Summary
Engineering reference data for HMCG78AHBWA315N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | HMCG78AHBRA289N | HMCG78AHBRA471N | HMCG78AHBVA315N | HMCG78MEBRA113N |
|---|---|---|---|---|---|
| Package | 262-pin DDR5 CSODIMM | 262-pin DDR5 CSODIMM - same | 262-pin DDR5 CSODIMM - same | 262-pin DDR5 CSODIMM - same | 262-pin DDR5 CSODIMM - same |
| Brand | SK hynix | SK hynix | SK hynix | SK hynix | SK hynix |
| Capacity | 16 GB | 16 GB class | 16 GB class | 16 GB | [DATA_NEEDED] |
| Data Rate | DDR5-6400 | [DATA_NEEDED] | [DATA_NEEDED] | DDR5-6400 | [DATA_NEEDED] |
| Rank / Organization | 1Rx8 (2Gx8 8C) | [DATA_NEEDED] | [DATA_NEEDED] | 1Rx8 (2Gx8 8C) | [DATA_NEEDED] |
| Operating Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| On-die ECC | Yes | Yes | Yes | Yes | Yes |
| Module Type | CSODIMM (clocked) | CSODIMM (clocked) | CSODIMM (clocked) | CSODIMM (clocked) | CSODIMM (clocked) |
Key Differentiators
- Top-speed DDR5-6400 bin in compact CSODIMM format (vs HMCG78AEBRA107N)
- V-variant twin available for dual-source supply (vs HMCG78AHBVA315N)
- Single-rank 1Rx8 organization (vs HMCG78MEBRA113N)
Design Notes
Confirm the platform supports clocked (C) SODIMMs before populating the HMCG78AHBWA315N. Clocked SODIMMs buffer clock lines and are not always interchangeable with standard U-SODIMMs on the same 262-pin slot. Also verify BIOS/UEFI memory training support for DDR5-6400: if the controller tops out at a lower JEDEC bin, the module will downclock and the bandwidth advantage is lost. Mixing modules of different speed grades typically forces the entire population to the slowest common speed.
The module operates at 1.1V VDD per JEDEC DDR5 and regulates its own core rail via the on-module PMIC (5V auxiliary rail on DDR5 SODIMMs). The host board must supply the 5V PMIC input with adequate current headroom; do not assume DDR4 SODIMM power budgets. Estimated: a single-rank DDR5-6400 module typically draws on the order of 3-5W under load, so a dual-module design should budget roughly 10W for the memory subsystem - validate against the official SK hynix power specification before finalizing the power tree.
At DDR5-6400, memory-bus timing margins tighten substantially versus DDR4-3200. Use the SODIMM connector layout, length matching, and reference-plane stackup recommended in the host SoC vendor's design guide, and run the BIOS memory-training results on all production boards. Single-rank 1Rx8 organization reduces command/address loading and helps close timing, but avoid stacking high-speed I/O traces directly under the SODIMM connector region on the carrier PCB.
Compliance Information
Compliance data was not present in the verified web data. DDR5 modules from tier-1 manufacturers are typically RoHS compliant, but this must be confirmed from the official SK hynix datasheet or product page before design sign-off.
