M1AFS1500-2FGG256 - 1.5M Gate Fusion FPGA with Cortex-M1 | Microchip
부품 번호: M1AFS1500-2FGG256 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $168 | $168.00 |
| 10 | $154.5 | $1,545.00 |
| 100 | $142 | $14,200.00 |
| 500 | $132 | $66,000.00 |
| 1,000 | $124.5 | $124,500.00 |
M1AFS1500-2FGG256 개요
A mixed-signal FPGA is a programmable logic device that integrates traditional digital programmable fabric with analog circuitry, memory, and processing blocks on a single monolithic die. Within the semiconductor hierarchy, it sits above a pure FPGA and below a full system-on-chip, functioning as a configurable embedded processing and signal-conditioning platform for power management and instrumentation systems.
Key features include flash-based programmable logic (no configuration PROM required, instant-on at power-up), large embedded flash memory blocks with 276,480 bits reported for this configuration, comprehensive on-chip clock generation and management circuitry, and configurable analog blocks that reduce external component count. The -2 speed grade and 350 MHz maximum clock frequency support demanding control-loop and datapath applications.
Architecturally, the M1AFS1500 is fabricated in CMOS process technology (130nm-class per distributor data) and integrates the ARM Cortex-M1 soft-compatible embedded processor, flash memory fabric, analog conditioning peripherals, and clock management in a monolithic device. The Fusion fabric from Microsemi (now Microchip) was designed specifically for mixed-signal board-level integration, replacing discrete analog monitoring circuits, PLDs, and microcontrollers.
Typical applications include system power supply supervision and control, smart battery management, industrial instrumentation front ends, fan and thermal board management, and embedded control systems that benefit from the integrated ARM Cortex-M1 CPU. The monolithic analog-plus-logic integration makes it a strong fit where board space and BOM consolidation matter.
A key design consideration: the 1.5 V core supply requires a stable, well-decoupled rail, and the 256-ball BGA demands controlled-impedance multilayer PCB layout; verify JTAG programming access early in the layout.
This page synthesizes distributor pricing context, drop-in alternatives, pinout guidance, and practical design notes not found together in the manufacturer datasheet.
드롭인 대체품: M1AFS1500-2FGG256 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: M1AFS1500-2FGG256 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, System Gates, Process Technology, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
M1AFS1500-FGG256I
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$289.9 / 개
데이터시트 보기 →M1AFS600-FG256
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$22 / 개
데이터시트 보기 →M1AFS600-1FG256
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$69.15 / 개
데이터시트 보기 →A3P600-2FG256
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$57.43 / 개
데이터시트 보기 →A3P600-FG256
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$48.9 / 개
데이터시트 보기 →M1AFS1500-2FGG256 최대 정격 & 전기적 특성
| Series | M1AFS1500 (Fusion) |
| System Gates | 1,500,000 |
| Logic Cells | 38,400 |
| Embedded Processor | ARM Cortex-M1 |
| 최대 클록 주파수 | 350 MHz |
| Number of I/O | 119 |
| 동작 공급 전압 | 1.5 V |
| Flash Memory Bits (reported) | 276480 |
| Technology | CMOS, 130nm class |
| Speed Grade | -2 |
| 패키지 / 케이스 | 256-LBGA (FBGA, S-PBGA-B256) |
| Ball Pitch | 1.00 mm |
| 장착 스타일 | SMD/SMT |
| 동작 온도 범위 | 0C to +70C |
| Analog Blocks | Configurable analog (Fusion mixed-signal architecture) |
| Programming Type | Flash-based (in-system programmable) |
| Packaging | Tray |
M1AFS1500-2FGG256 256-lbga (fbga, s-pbga-b256) 핀 구성 가이드
M1AFS1500-2FGG256(256-lbga (fbga, s-pbga-b256) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: M1AFS1500-2FGG256.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
M1AFS1500-2FGG256 적합 용도: 6 애플리케이션s: Power Supply Board Management, Industrial Instrumentation, Smart Battery Management, Fan and Thermal Control Boards, Embedded System Control with ARM Cortex-M1, Test and Measurement Equipment.
Power Supply Board Management
The M1AFS1500-2FGG256 is purpose-built for intelligent power-supply supervision: its Fusion configurable analog blocks monitor multiple voltage rails and on-board temperature, while the ARM Cortex-M1 processor executes sequencing and fault-response firmware at up to 350 MHz. Placed as the board supervisor, it replaces several discrete voltage supervisors, ADCs, and a microcontroller, cutting BOM count and board area. The 119 user I/Os interface directly to DC-DC converter enable, PG, and margining pins, and the 1.5 V core keeps FPGA logic power modest. Flash-based configuration gives instant-on behavior at power-up, so rail sequencing is active before a boot-based controller would be ready - a quantified benefit in hot-swap and brown-out recovery scenarios.
추천
Industrial Instrumentation
In industrial instrumentation front ends, the M1AFS1500-2FGG256 combines 38,400 logic cells of glueless datapath logic with on-chip analog conditioning, letting designers digitize sensor signals and process them in the same device. The embedded ARM Cortex-M1 runs communication stacks and calibration routines, while the 350 MHz-capable clocking fabric handles timestamping and filtering. Its flash fabric is immune to configuration loss from SEU-heavy factory floors compared to SRAM FPGAs, and the 0C to +70C rating covers typical indoor instrumentation enclosures. The 1.5 V core supply reduces device power, easing convection-cooled enclosure thermal budgets, and the 256-ball 1.00 mm-pitch BGA fits standard mid-density PCB processes.
추천
Smart Battery Management
Battery management systems benefit directly from the Fusion architecture: the M1AFS1500-2FGG256's configurable analog inputs monitor cell voltages, pack current-sense amplifier outputs, and thermistors, while the ARM Cortex-M1 executes fuel-gauging and protection algorithms. The 1.5M-gate fabric implements state machines for charger handshake protocols and safety interlocks with deterministic timing, and 276,480 reported flash bits retain calibration and event logs without external memory. Flash-based instant-on logic enforces safe default states the moment power appears - critical in pack insertion and fault events. The 0C to +70C rating suits consumer and commercial battery packs; use the industrial -FGG256I variant for automotive-adjacent environments.
추천
Fan and Thermal Control Boards
Server and telecom fan controllers use the M1AFS1500-2FGG256 to read multiple tachometer inputs into its 119 I/O fabric, run PID loops on the ARM Cortex-M1, and drive PWM outputs - all on one chip with analog temperature-sense inputs handled by Fusion analog blocks. The 350 MHz clock fabric supports precise PWM edge placement at high resolution, and the monolithic integration replaces a microcontroller plus external ADC plus programmable logic, shrinking the thermal-management PCB. Flash configuration ensures fan safety defaults are live instantly at power-up, and deterministic hardware logic continues protection behavior even if firmware is reloading. The 1.5 V core keeps standby power low in always-on chassis applications.
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Embedded System Control with ARM Cortex-M1
General embedded control designs adopt the M1AFS1500-2FGG256 when a microcontroller alone lacks I/O flexibility and an FPGA alone lacks processing: the hard ARM Cortex-M1 core runs application firmware at up to 350 MHz-class clocking while 38,400 logic cells implement custom peripherals, protocol bridges, and accelerators in fabric. Because the fabric is flash-based, the design is single-chip and instant-on - no external configuration flash boot delay. Large embedded flash blocks store parameters and even configuration overlays. The 1.00 mm-pitch 256-ball BGA is reworkable with standard equipment, and Libero SoC provides the Cortex-M1 software toolchain integration, shortening the path from HDL capture to running C firmware.
추천
Test and Measurement Equipment
Bench and modular instruments exploit the M1AFS1500-2FGG256's mix of 350 MHz-class clock management, 38,400 logic cells, and configurable analog inputs for trigger logic, signal monitoring, and housekeeping functions on one die. The CCC clock-generation circuitry conditions external reference clocks for precise timestamping, while flash fabric avoids the configuration-drift and boot-latency concerns of SRAM FPGAs in instruments that must be measurement-ready immediately at power-on. The 119 I/Os connect front-panel controls, relays, and interlock circuits, and the ARM Cortex-M1 manages USB/LAN command parsing. The 0C to +70C commercial rating fits lab environments; derate or choose the I-grade variant for field portable gear.
추천
추천 제품 요약
엔지니어링 참조 데이터: M1AFS1500-2FGG256 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | M1AFS1500-FGG256I | M1AFS600-FG256 | A3P600-2FG256 |
|---|---|---|---|---|
| Package | 256-LBGA (FBGA, FGG256) | 256-FBGA (same footprint) | 256-FBGA (same footprint) | 256-FBGA (same footprint) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,500,000 | 1,500,000 | ~600,000 | ~600,000 |
| Embedded ARM Cortex-M1 | Yes | Yes | Yes (M1 Fusion) | No (ProASIC3) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
주요 차별점
- Embedded ARM Cortex-M1 processor (vs A3P600-2FG256)
- 장점 (vs A3P600-2FG256)
- Largest Fusion fabric in 256-ball footprint (vs M1AFS600-FG256)
- Commercial temperature vs industrial (vs M1AFS1500-FGG256I)
설계 노트
The M1AFS1500-2FGG256 operates from a nominal 1.5 V core supply. Estimated guidance: a 38,400-logic-cell flash fabric at moderate utilization typically draws a few hundred milliwatts; budget the 1.5 V rail converter (e.g., a synchronous buck) for at least 1 A headroom including I/O banks and analog blocks. Follow the Fusion power-up sequencing section of the Microchip datasheet: flash-based parts are instant-on, but rail ramp order between core and I/O banks must still be respected. Verify per-bank VCCI selection for mixed-voltage I/O standards in Libero before layout.
The 256-ball FBGA with 1.00 mm pitch requires at least a 4-layer PCB with dedicated ground plane for ball via escape. Fan out with via-in-pad or dog-bone escapes on 0.2 mm drill; signal traces leaving the BGA field should maintain controlled impedance for any banked high-speed I/O. Place 100 nF ceramic decoupling capacitors within 2 mm of each power ball pair, plus bulk 10 uF per rail. Keep the JTAG programming chain accessible on test points - it is the primary debug path in Libero SoC and costly to retrofit.
Two frequent mistakes with Fusion devices: (1) assuming the 350 MHz headline figure applies to the Cortex-M1 subsystem or arbitrary user logic - actual Fmax must be closed in Libero SoC timing analysis with your design; (2) ignoring the analog block reference configuration - the Fusion analog peripherals require proper reference decoupling and calibration in firmware, not just digital instantiation. Also confirm the commercial 0C to +70C rating covers your environment; for extended temperature use the -FGG256I variant instead of risking field failures.
규정 준수 정보
RoHS/lead-free per Microchip standard production policy for PBGA Fusion devices; REACH and halogen-free status not stated in provided data - verify on Microchip environmental documentation for this ordering code.
