A3P600-2FG256 - ProASIC3 FPGA 600K Gates 256-FBGA | Microchip
MPN: A3P600-2FG256 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $71.78 | $71.78 |
| 10 | $68.19 | $681.90 |
| 100 | $64.6 | $6,460.00 |
| 500 | $61.02 | $30,510.00 |
| 1,000 | $57.43 | $57,430.00 |
Drop-in alternatives for A3P600-2FG256 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3P600-2FGG256
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View Datasheet →A3P600-FG256
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View Datasheet →A3P600-1FG256
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View Datasheet →A3P600-FGG256I
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View Datasheet →A3P600-2FGG256I
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View Datasheet →A3P600L-FG256I
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View Datasheet →A3P600-FG256I
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View Datasheet →A3P600-1FGG256
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View Datasheet →A3P600-2FG256 Maximum Ratings & Electrical Characteristics
| Logic Family | ProASIC3 |
| System Gates | 600000 gates |
| User I/O Count | 177 |
| Speed Grade | -2 |
| Maximum System Frequency | 310 MHz |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm CMOS flash |
| Configuration Memory | On-chip Flash (non-volatile) |
| I/O Banks | 4 |
| Package | 256-FBGA (LBGA) |
| Mounting Type | Surface Mount |
| Soft CPU Support | Optional soft ARM |
| Instant-On Operation | Yes |
| Programmability | Reprogrammable (flash) |
A3P600-2FG256 256-fbga (lbga) Pin Configuration Guide
Complete pinout information for A3P600-2FG256 (256-fbga (lbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P600-2FG256.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P600-2FG256 is suitable for 6 applications: Industrial Automation and Control, Secure Single-Chip Designs, Portable and Battery-Powered Instruments, Communications Line Cards, Soft ARM Embedded Processing, Aerospace and Defense-Adjacent Migration.
Industrial Automation and Control
The A3P600-2FG256's 600K gates and 177 user I/Os provide the logic density and interface breadth needed for industrial control cards coordinating sensors, actuators, and fieldbus interfaces. ProASIC3's deterministic VersaTile fabric delivers predictable timing for closed-loop control, while the 310 MHz -2 speed grade headroom handles high-rate pulse processing. Because configuration is stored in on-chip flash, the controller boots instantly at power-up without external configuration memory - valuable on factory floors where power cycling is frequent. Place the part on a 1.5V core rail with independent VCCIBx bank rails matching each I/O bank's signalling standard (per the four-bank architecture), and assign only electrically compatible I/O standards to each bank to avoid contention on the fixed 256-FBGA ballout.
Recommended
Secure Single-Chip Designs
For designs where configuration IP must be protected, the A3P600-2FG256 stores its bitstream in on-chip flash cells rather than external SRAM configuration memory. There is no external boot PROM whose contents can be intercepted or duplicated, and no bitstream transmission over a bus during startup. The 600K-gate fabric comfortably hosts encryption engines, secure boot logic, and interface bridges, while 177 I/Os support multi-protocol I/O across four voltage banks. The instant-on flash startup also shortens secure-boot windows in embedded systems. Designers should combine the fabric's flash security with Libero SoC programming-file safeguards and restrict JTAG access in production hardware, since physical debug ports remain the primary attack surface even on flash-based architectures.
Recommended
Portable and Battery-Powered Instruments
ProASIC3 devices suit portable instrumentation because flash configuration removes both the standby cost and the board area of external configuration memories, and family members such as the A3P600L provide a low-power grade option for further battery-life gains. The 1.5V core and 130nm flash process keep dynamic power modest for moderate clock rates, and the 256-FBGA package concentrates 177 I/Os in a compact footprint for handheld enclosures. Instant-on operation lets the instrument respond immediately when the user presses power. For battery designs, place the A3P600-2FG256 behind a well-decoupled 1.5V LDO or buck regulator, and exploit the four independent VCCIBx banks so unused banks can be powered at the minimum required I/O voltage, reducing I/O power further.
Recommended
Communications Line Cards
Line-card designs benefit from the A3P600-2FG256's ability to bridge multiple backplane and line interfaces concurrently. The four independent I/O banks, each with its own VCCIBx rail, allow mixed-voltage signalling on a single device - for example, one bank at a legacy voltage and another at a newer standard - which is a defining ProASIC3 banking feature noted in Microchip's migration application notes. The -2 speed grade's 310 MHz capability supports framing, multiplexing, and packet-processing pipelines at line rates appropriate to 600K-gate designs. Deterministic VersaTile timing simplifies static timing closure across the fabric. Note that the A3P600 provides no high-speed serial transceivers; designs needing SERDES should move to larger families, while glue logic, bridging, and protocol adaptation fit well here.
Recommended
Soft ARM Embedded Processing
ProASIC3 devices support optional soft ARM core implementations, letting the A3P600-2FG256 host a processor alongside custom logic within its 600K-gate fabric - useful for compact embedded systems where a discrete MCU would add a second chip, board routing, and BOM lines. On-chip flash configuration means the design, including the soft CPU firmware loaded into fabric memory, is present at power-up with no external boot device. The 177 I/Os connect the soft-processor subsystem to external memory and peripherals across four independently powered I/O banks. Budget fabric resources carefully: the soft core, its bus fabric, and on-chip memories consume a substantial fraction of the 600K gates, so early utilization reports in Libero SoC are essential before committing peripheral IP to the design.
Recommended
Aerospace and Defense-Adjacent Migration
Many aerospace and defense programmes use ProASIC3 as the commercial development baseline before migrating to Microchip's radiation-tolerant RTAX-series relatives (such as RTAX2000S and RTAX4000S), because design methodology and tool flow carry over. The A3P600-2FG256 serves as a prototyping and lower-criticality deployment device: its flash fabric provides configuration robustness without external memory, and the 256-FBGA footprint supports high I/O-count boards in constrained volumes. Ground test equipment, simulators, and non-flight hardware can share codebases and constraints across ProASIC3 and RTAX targets, cutting development time. Teams should plan bank assignments and I/O standards in Libero SoC so constraints port cleanly to the radiation-tolerant device during the upgrade path.
Recommended
Recommended Products Summary
Engineering reference data for A3P600-2FG256 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P600-2FGG256 | A3P600-FG256 | A3P600-1FG256 | A3P600-2FGG256I | A3P600L-FG256I |
|---|---|---|---|---|---|---|
| Package | 256-FBGA (LBGA) | 256-FBGA - same ballout | 256-FBGA - same ballout | 256-FBGA - same ballout | 256-FBGA - same ballout | 256-FBGA - same ballout |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 gates | 600000 gates | 600000 gates | 600000 gates | 600000 gates | 600000 gates |
| User I/O | 177 | 177 | 177 | 177 | 177 | 177 |
| Speed Grade / Max Frequency | -2 / 310 MHz | -2 / 310 MHz | Std / [DATA_NEEDED] | -1 / [DATA_NEEDED] | -2 / 310 MHz | Std / [DATA_NEEDED] |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V (low-power grade) |
| Termination / Finish | Standard (FG) | Lead-free (FGG) | Standard (FG) | Standard (FG) | Lead-free (FGG) | Standard (FG) |
| Temperature Range | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | Industrial (I suffix) | Industrial (I suffix) |
| Unit Price (qty 1, as of 2026-09-01) | $71.78 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest guaranteed performance in the 600K FG256 family members (vs A3P600-FG256)
- Lead-free variant available in the same footprint (vs A3P600-2FGG256)
- Low-power-grade migration path on the same PCB (vs A3P600L-FG256I)
- Non-volatile flash configuration vs SRAM FPGA alternatives (vs Cross-brand SRAM FPGAs)
Design Notes
The A3P600-2FG256 requires a 1.5V core rail plus four independent I/O bank rails (VCCIBx), each set to the voltage compatible with the I/O standards assigned to that bank. ProASIC3 flash devices draw very low static current because configuration is non-volatile, but dynamic power scales with clock rate and toggle activity. Estimated: sizing the core regulator for the family's rated operating current plus 30% margin, and sequencing core-before-I/O or verifying the datasheet's permitted power-up order, prevents I/O latch-up concerns during hot-swap events.
The 256-FBGA requires a defined BGA fanout strategy: use dog-bone via-in-pad or via-in-hole escape routing on a signal layer pair, and plan power delivery as solid planes rather than routing VCC/VCCIBx as traces. Because VCCIBx pins are bank-dedicated (per Microchip's migration application notes), partition each bank's decoupling network - for example, 0.1uF ceramics at every other ball plus bulk capacitance per rail. Verify land pattern dimensions against the Microchip ProASIC3 packaging document before releasing the footprint; ball pitch and diameter tolerances drive stencil aperture design.
The most common ProASIC3 layout error is assigning I/O standards with incompatible voltages to the same VCCIBx bank - since only compatible standards may share a bank, this is caught in Libero SoC late in design and can force PCB rework on the fixed ballout. Second, do not copy ball maps from other ProASIC3 packages; the A3P600 in 256-FBGA has its own dedicated ball assignment. Third, if substituting a different speed grade (e.g., A3P600-1FG256), re-run place-and-route and static timing analysis in Libero SoC; timing closure at -2 does not guarantee closure at -1.
With 177 user I/Os in a 1.0mm-pitch-class BGA, adjacent-ball crosstalk and simultaneous switching noise deserve attention. Group fast-switching outputs away from sensitive inputs within each bank, add series termination (typically 22-33 ohm) on long single-ended lines, and keep reference planes unbroken under high-speed routing. Use Libero SoC's I/O timing reports combined with your IBIS-based board simulation to validate setup/hold margins at the receiver; the -2 speed grade's 310 MHz capability is only achievable with disciplined edge-rate control.
Compliance Information
Compliance data not present in the retrieved web results. The lead-free FGG-suffixed variants (e.g., A3P600-2FGG256) are available for RoHS-driven designs; verify exact finish and environmental compliance on the Microchip product page before release.
