M1AFS1500-FG256K - 1.5M-Gate Fusion Mixed-Signal FPGA | Microchip
부품 번호: M1AFS1500-FG256K ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $426.82 | $426.82 |
| 10 | $405.48 | $4,054.80 |
| 100 | $384.14 | $38,414.00 |
| 500 | $362.8 | $181,400.00 |
| 1,000 | $341.46 | $341,460.00 |
M1AFS1500-FG256K 개요
A mixed-signal FPGA is a field-programmable gate array that combines digital programmable fabric with configurable analog blocks, flash memory, and clock management circuitry on a single monolithic die. Within the power-management hierarchy of system design, such devices can replace discrete MCU-plus-analog-FPGA two-chip solutions, consolidating voltage monitoring, fan control, and digital sequencing logic into one programmable device.
Key features include flash-based programmable logic (276480 flash cells per DigiKey data), the ARM Cortex-M1 embedded processor running soft/hard IP workloads, integrated configurable analog peripherals, and comprehensive on-chip clock generation and management. The FG256 256-LBGA package exposes 119 user I/O, and the K temperature grade supports -55C to +100C junction operation per distributor data, targeting defense and industrial platforms.
The Fusion architecture is built on 130nm flash technology operating from a nominal 1.5V core supply (1.425V to 1.575V range per distributor listings). Because configuration data is stored in on-chip flash, the device is live-at-power-up, requires no external configuration PROM, and offers inherent resistance to configuration tampering compared with SRAM FPGAs. The M1 prefix denotes Fusion devices pre-integrated with the ARM Cortex-M1 processor, allowing C-code firmware and Verilog/VHDL logic to coexist in one die.
Typical applications include system power sequencing and board management, industrial automation control, military and avionics subsystems requiring extended temperature grades, and embedded control systems that benefit from combining an ARM processor with analog monitoring and programmable logic.
Designers should plan power rails around the 1.5V core and appropriate I/O bank voltages, and verify I/O bank assignment early since the FG256 package provides 119 I/O distributed across banks.
This page synthesizes distributor pricing, drop-in same-family alternatives, package data, and practical design notes not found in a single manufacturer source.
드롭인 대체품: M1AFS1500-FG256K — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: M1AFS1500-FG256K (동일 폼 팩터 및 풋프린트) — 차이점: Family, System Gates, Package, Clock Management, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
M1AFS1500-1FGG256
✅ 드롭인✓ 재고 있음
$172.23 / 개
데이터시트 보기 →M1AFS1500-2FGG256
✅ 드롭인✓ 재고 있음
$124.5 / 개
데이터시트 보기 →AFS1500-FG256K
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
M1AFS1500-FGG256K
✅ 드롭인✓ 재고 있음
$60.2 / 개
데이터시트 보기 →M1AFS1500-FGG256K
✅ 드롭인✓ 재고 있음
$60.2 / 개
데이터시트 보기 →M1AFS1500-FG256K 최대 정격 & 전기적 특성
| Family | Fusion (M1 - ARM Cortex-M1 enabled) |
| System Gates | 1500000 |
| Flash Memory Cells | 276480 |
| User I/O | 119 |
| Embedded Processor | ARM Cortex-M1 |
| 공급 전압 | 1.425 V to 1.575 V |
| Core Process Technology | 130 nm flash |
| 패키지 | 256-LBGA (FBGA/FG256) |
| 실장 유형 | Surface Mount |
| Packaging | Tray |
| Configuration Memory | On-chip flash (live at power-up) |
| Analog Peripherals | Integrated configurable analog blocks |
| Clock Management | Integrated clock generation and management circuitry |
| Speed Grade | Standard (no dash letter suffix) |
M1AFS1500-FG256K 256-lbga (fbga/fg256) 핀 구성 가이드
M1AFS1500-FG256K(256-lbga (fbga/fg256) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: M1AFS1500-FG256K.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
M1AFS1500-FG256K 적합 용도: 6 애플리케이션s: Board Power Management and Sequencing, Industrial Automation Control, Military and Avionics Subsystems, Embedded System Control Coprocessing, Sensor Data Acquisition Interfaces, Test and Measurement Instrumentation.
Board Power Management and Sequencing
The M1AFS1500-FG256K is a strong fit for board-level power management because Fusion FPGAs integrate configurable analog monitoring blocks with flash-based logic and an ARM Cortex-M1 processor on one die, per Microchip product documentation. A single device can monitor multiple voltage rails through its analog inputs, execute sequencing and fault-response firmware on the Cortex-M1, and implement glitch-free digital control logic in the fabric. Because configuration resides in on-chip flash, the manager is active within milliseconds of power application, which is essential for backplanes and line cards that must gate power to downstream loads. Operating from a nominal 1.5V core supply with 119 user I/O, it can drive enable pins, fault LEDs, and telemetry interfaces without a companion microcontroller.
추천
Industrial Automation Control
In industrial automation, the M1AFS1500-FG256K combines deterministic programmable logic with an embedded ARM Cortex-M1 running control firmware, consolidating PLC-style I/O handling, sensor interfacing, and analog monitoring into a single 256-LBGA device. Microchip positions Fusion mixed-signal FPGAs for industrial control because the configurable analog blocks interface directly with temperature, current, and voltage sensors, while the 1.5M-gate fabric implements motor-control state machines, encoders, and communication bridges. Flash configuration makes the controller instantly available at power-up, reducing startup latency in factory equipment, and the extended-temperature K grade tolerates hot electrical cabinets. With 119 user I/O, one device can replace an MCU plus discrete glue logic, cutting BOM complexity in drive and motion-control boards.
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Military and Avionics Subsystems
The K temperature grade of the M1AFS1500-FG256K targets defense and avionics platforms where extended operating ranges are mandatory; related distributor listings specify -55C to +100C junction operation. Flash-based configuration provides live-at-power-up behavior and inherent bitstream security compared with SRAM FPGAs, an advantage Microchip emphasizes for defense designs. The monolithic integration of ARM Cortex-M1 processing, configurable analog monitoring, and 1.5M gates of programmable logic suits condition-based maintenance systems, sensor interfaces, and spacecraft housekeeping modules where board area and reliability dominate. Designers should still verify program-level qualification requirements, since Microchip also offers RTAX radiation-tolerant families for radiation environments beyond standard military temperature grades.
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Embedded System Control Coprocessing
As an embedded control coprocessor, the M1AFS1500-FG256K lets engineers offload deterministic tasks from a host CPU: the ARM Cortex-M1 core handles firmware such as communication stacks and housekeeping loops, while the flash-based fabric implements cycle-accurate interfaces, custom peripherals, and safety interlocks. The Cortex-M1 toolchain uses standard ARM C development flows, so firmware teams and FPGA teams can work in parallel on the same die. Because the device is live at power-up from on-chip flash, it can initialize and manage the host processor's power and reset domain, then remain available as a monitoring watchdog. The 256-LBGA footprint fits dense compute boards that cannot accommodate multi-chip management solutions.
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Sensor Data Acquisition Interfaces
Fusion mixed-signal FPGAs are designed for direct sensor interfacing: the M1AFS1500-FG256K's configurable analog blocks digitize temperature and voltage inputs on-chip, while the digital fabric implements custom serial protocols, filtering, and timestamping at hardware speed. Per the Microchip Fusion datasheet, the family integrates these analog peripherals, large flash memory blocks, and clock generation circuitry monolithically, reducing external component count in data acquisition front ends. The ARM Cortex-M1 processes digitized data or packages it for a host over standard interfaces, and the extended-temperature K grade supports outdoor and industrial sensing environments. Designs requiring higher channel counts benefit from the 119 user I/O distributed across the FG256 package's I/O banks.
추천
Test and Measurement Instrumentation
Bench and rack instruments benefit from the M1AFS1500-FG256K's ability to generate precise clocking, timing triggers, and digital test patterns in the 1.5M-gate fabric while the ARM Cortex-M1 runs instrument control firmware. Microchip's integrated clock generation and management circuitry simplifies the timing architecture of measurement modules, and the configurable analog blocks provide onboard monitoring of supply and thermal conditions critical for metrology stability. Live-at-power-up flash configuration lets an instrument present a functional front panel before a host PC loads anything, improving perceived startup time. The extended-temperature K grade and long-life Microchip FPGA product strategy suit instrument platforms designed for decade-long service and calibration cycles.
추천
추천 제품 요약
엔지니어링 참조 데이터: M1AFS1500-FG256K — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | M1AFS1500-1FGG256 | M1AFS1500-2FGG256 | AFS1500-FG256K | M1AFS1500-FGG256K |
|---|---|---|---|---|---|
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 256-LBGA (FG256) | 256-LBGA - same | 256-LBGA - same | 256-LBGA - same | 256-LBGA - same |
| System Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M |
| ARM Cortex-M1 Core | Yes | Yes | Yes | No | Yes |
| User I/O | 119 | 119 | 119 | 119 | 119 |
| Supply Voltage | 1.425 V - 1.575 V | 1.425 V - 1.575 V | 1.425 V - 1.575 V | 1.425 V - 1.575 V | 1.425 V - 1.575 V |
| Speed Grade | Standard | -1 (standard) | -2 (faster) | Standard | Standard |
주요 차별점
- Embedded ARM Cortex-M1 hard processor (vs AFS1500-FG256K)
- Extended-temperature K grade with full processing capability (vs M1AFS1500-1FGG256)
- Monolithic mixed-signal integration (vs Cross-brand SRAM FPGAs)
설계 노트
Plan the power tree around the 1.5V nominal core supply (1.425V-1.575V range per distributor data) plus I/O bank supplies determined by the interface standards used on each of the 119 user I/O. Because the device is live at power-up from on-chip flash, core rail ramp quality directly affects configuration reliability - use a supervisor or the Fusion analog monitors themselves to verify rail sequencing. Estimate: with 119 I/O at modest toggling rates, I/O supply current often dominates core current in I/O-heavy board management designs.
The 256-LBGA requires controlled-impedance fanout and via-in-pad or doghouse fanout under the ball field. Allocate the 119 user I/O to banks early in schematic capture, since bank voltage constraints limit which standards (single-ended versus differential) can share a bank. Follow Microchip's Fusion PCB layout guidelines for ball assignment of analog monitoring inputs: keep analog sense traces short, guarded, and away from switching-regulator nodes to preserve measurement accuracy.
Do not confuse FG256 variants: the M1 prefix (Cortex-M1 enabled), the G in FGG (lead-free ball finish), the speed-grade digit (-1/-2), and the K temperature suffix all change procurement and qualification status even though the footprint is identical. A bitstream compiled for an AFS1500 (no Cortex-M1) will not exercise the hard processor on an M1AFS1500. Verify the exact suffix against your Microchip Libero design project settings before release to production.
규정 준수 정보
Compliance data not stated in provided web data; FGG (lead-free ball) suffix variants exist within the family. Verify RoHS/REACH status on the Microchip product page for the exact suffix before procurement.
