Microchip Technology

M1AFS250-1FGG256 - Fusion FPGA 250K Gates | Microchip

부품 번호: M1AFS250-1FGG256 ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
1.5 V Vdss 256-LBGA (FGG256) Package 350 MHz Speed Integrated flash Memory
시작가 $30.6 USD / 개
MOQ: 1 |
가격 업데이트: 2026-08-31
볼륨 가격
수량 단가 합계
1 $45.2 $45.20
10 $41.8 $418.00
100 $37.5 $3,750.00
500 $33.9 $16,950.00
1,000 $30.6 $30,600.00
ℹ️ 모든 가격은 USD 기준입니다

M1AFS250-1FGG256 개요

The Microchip Technology M1AFS250-1FGG256 is a Fusion mixed-signal Field Programmable Gate Array (FPGA) with 250,000 system gates, 114 user I/Os, and 36,864 bits of flash memory, housed in a 256-ball FBGA (FGG256) package. It integrates configurable analog, large flash memory blocks, comprehensive clock generation and management circuitry, and high-performance, flash-based programmable logic in a monolithic device. The M1 prefix denotes Fusion FPGAs, which combine FPGA fabric with an ARM Cortex-M1 processor and programmable analog.

A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. FPGAs are part of the programmable logic device family, which sits between fixed-function ASICs and general-purpose processors. They offer reconfigurability, parallel processing, and rapid prototyping capabilities, making them essential in applications ranging from aerospace to industrial automation. The Fusion family specifically adds analog and memory resources, blurring the line between FPGA and SoC.

Key features include 250K system gates, 114 user I/Os, 36,864 bits of flash memory, and support for 1.5V core voltage. The device operates at a maximum clock frequency of 350 MHz and contains 6,144 logic cells. It is manufactured using 130nm CMOS technology, providing a balance of performance and power efficiency. The Fusion architecture includes an ARM Cortex-M1 soft processor, programmable analog blocks, and flash memory for non-volatile storage of configuration and data.

The M1AFS250-1FGG256 integrates a complete mixed-signal system on a single chip. The flash-based fabric retains configuration without external boot memory, simplifying system design and enhancing security. The programmable analog blocks allow for configurable analog front-ends, while the clock generation and management circuitry supports multiple PLLs and clock conditioning. This integration reduces board space, component count, and system cost compared to discrete solutions.

Typical applications include motor control, industrial automation, medical devices, and aerospace systems where reliability and mixed-signal integration are critical. The device's flash-based architecture provides instant-on operation and immunity to configuration bitstream corruption, making it suitable for safety-critical applications. The 256-ball FBGA package offers a compact footprint with 114 I/Os for interfacing with sensors, actuators, and communication buses.

When designing with this FPGA, consider the 1.5V core supply and the need for proper decoupling and power sequencing. The flash-based configuration eliminates the need for external configuration devices, but the analog blocks require careful layout to minimize noise. The device supports JTAG programming and in-system reconfiguration, facilitating development and field updates.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the M1AFS250-1FGG256.

드롭인 대체품: M1AFS250-1FGG256 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: M1AFS250-1FGG256 (동일 폼 팩터 및 풋프린트) — 차이점: RoHS Status, Operating Temperature, Package, System Gates, Series.

Microchip Technology
RoHS Status: ROHS3 Compliant
Operating Temperature: -40°C ~ 100°C (TJ)
Series: Fusion
비교 대상: M1AFS250-1FGG256 →
Microchip Technology
System Gates: 250,000 gates
Series: M1AFS250 (Fusion)
비교 대상: M1AFS250-1FGG256 →
Microchip Technology
RoHS Status: RoHS Compliant
Operating Temperature: 0°C to 70°C
Package: 208-BFQFP (PQFP)
비교 대상: M1AFS250-1FGG256 →
Microchip Technology
RoHS Status: Non-Compliant
Operating Temperature: 0C to +85C
Package: 256-LBGA (FG256)
비교 대상: M1AFS250-1FGG256 →
Microchip Technology
RoHS Status: Compliant (FGG = Pb-free balls)
Operating Temperature: -40C to +85C (industrial, I grade)
Package: 256-ball FBGA (FGG256)
비교 대상: M1AFS250-1FGG256 →
Microchip Technology
RoHS Status: RoHS Non-Compliant
Operating Temperature: -40C ~ +100C (TJ)
Series: Fusion
비교 대상: M1AFS250-1FGG256 →
Microchip Technology
Operating Temperature: -40C to +85C (Industrial)
System Gates: 250K
Series: Fusion (M1AFS)
비교 대상: M1AFS250-1FGG256 →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

M1AFS250-FG256I

✅ 드롭인
Microchip Technology
📦 256-LBGA (FG256)
Fusion · 250000 · 114 · 36864 · 1.425V ~ 1.575V · -40C ~ +100C (TJ) · 256-LBGA

✓ 재고 있음

$33.1 / 개

데이터시트 보기 →

M1AFS250-1FGG256I

✅ 드롭인
Microchip Technology
📦 256-LBGA (FGG256)
M1AFS250 (Fusion) · 250,000 gates · 6144 · 36864 · 114 · 350 MHz · ARM Cortex-M1 (optional ARM support, M1 variant) · 130-nm, 7-layer metal, flash-based CMOS

✓ 재고 있음

가격 문의

데이터시트 보기 →

M1AFS250-FGG256I

✅ 드롭인
Microchip Technology
📦 256-LBGA (FGG256)
Fusion (M1AFS) · 250K · 36864 · 114 · ARM Cortex-M1 · 1.5 V · 1.0989 GHz (per distributor listing) · 130 nm flash-based

✓ 재고 있음

$49.5 / 개

데이터시트 보기 →

M1AFS250-1PQG208

✅ 드롭인
Microchip Technology
📦 208-PQFP (PQG208)
Fusion · 250K Gates · 93 · 36864 · 1.5 V (1.425 V to 1.575 V) · 130nm CMOS · 1282.05 MHz · 208-BFQFP (PQFP)

✓ 재고 있음

$29.4 / 개

데이터시트 보기 →

M1AFS250-FG256I

✅ 드롭인
Microchip Technology
📦 256-LBGA (FG256)
Fusion · 250000 · 114 · 36864 · 1.425V ~ 1.575V · -40C ~ +100C (TJ) · 256-LBGA

✓ 재고 있음

$33.1 / 개

데이터시트 보기 →

M1AFS250-1FGG256

✅ 드롭인
Microchip Technology
📦 256-LBGA (FGG256)
Fusion · 250000 · 6144 · 114 · 36864 · 1.5 V · 350 MHz · 130nm CMOS

✓ 재고 있음

$30.6 / 개

데이터시트 보기 →

M1AFS250-1FGG256 최대 정격 & 전기적 특성

Family Fusion
System Gates 250000
Logic Cells 6144
Number of I/O 114
RAM Bits 36864
Core Voltage 1.5 V
최대 클록 주파수 350 MHz
Technology 130nm CMOS
패키지 256-LBGA (FGG256)
실장 유형 Surface Mount
Speed Grade -1
Embedded Processor ARM Cortex-M1
Analog Blocks Configurable analog
Flash Memory Integrated flash
RoHS 상태 Compliant

M1AFS250-1FGG256 핀 구성

BGA-256 Package Pinout Diagram BGA-256 17x17mm, 16x16, P1.0mm, JEDEC MO-192. A1 BGA-256 16x16 grid
핀 1 IO — User I/O
핀 2 IO — User I/O
핀 3 IO — User I/O
핀 4 IO — User I/O
핀 5 IO — User I/O
핀 6 IO — User I/O
핀 7 IO — User I/O
핀 8 IO — User I/O
핀 9 IO — User I/O
핀 10 IO — User I/O
핀 11 IO — User I/O
핀 12 IO — User I/O
핀 13 IO — User I/O
핀 14 IO — User I/O
핀 15 IO — User I/O
핀 16 IO — User I/O
핀 17 IO — User I/O
핀 18 IO — User I/O
핀 19 IO — User I/O
핀 20 IO — User I/O
핀 21 IO — User I/O
핀 22 IO — User I/O
핀 23 IO — User I/O
핀 24 IO — User I/O
핀 25 IO — User I/O
핀 26 IO — User I/O
핀 27 IO — User I/O
핀 28 IO — User I/O
핀 29 IO — User I/O
핀 30 IO — User I/O
핀 31 IO — User I/O
핀 32 IO — User I/O
핀 33 IO — User I/O
핀 34 IO — User I/O
핀 35 IO — User I/O
핀 36 IO — User I/O
핀 37 IO — User I/O
핀 38 IO — User I/O
핀 39 IO — User I/O
핀 40 IO — User I/O
핀 41 IO — User I/O
핀 42 IO — User I/O
핀 43 IO — User I/O
핀 44 IO — User I/O
핀 45 IO — User I/O
핀 46 IO — User I/O
핀 47 IO — User I/O
핀 48 IO — User I/O
핀 49 IO — User I/O
핀 50 IO — User I/O
핀 51 IO — User I/O
핀 52 IO — User I/O
핀 53 IO — User I/O
핀 54 IO — User I/O
핀 55 IO — User I/O
핀 56 IO — User I/O
핀 57 IO — User I/O
핀 58 IO — User I/O
핀 59 IO — User I/O
핀 60 IO — User I/O
핀 61 IO — User I/O
핀 62 IO — User I/O
핀 63 IO — User I/O
핀 64 IO — User I/O
핀 65 IO — User I/O
핀 66 IO — User I/O
핀 67 IO — User I/O
핀 68 IO — User I/O
핀 69 IO — User I/O
핀 70 IO — User I/O
핀 71 IO — User I/O
핀 72 IO — User I/O
핀 73 IO — User I/O
핀 74 IO — User I/O
핀 75 IO — User I/O
핀 76 IO — User I/O
핀 77 IO — User I/O
핀 78 IO — User I/O
핀 79 IO — User I/O
핀 80 IO — User I/O
핀 81 IO — User I/O
핀 82 IO — User I/O
핀 83 IO — User I/O
핀 84 IO — User I/O
핀 85 IO — User I/O
핀 86 IO — User I/O
핀 87 IO — User I/O
핀 88 IO — User I/O
핀 89 IO — User I/O
핀 90 IO — User I/O
핀 91 IO — User I/O
핀 92 IO — User I/O
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핀 100 IO — User I/O
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핀 102 IO — User I/O
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핀 104 IO — User I/O
핀 105 IO — User I/O
핀 106 IO — User I/O
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핀 108 IO — User I/O
핀 109 IO — User I/O
핀 110 IO — User I/O
핀 111 IO — User I/O
핀 112 IO — User I/O
핀 113 IO — User I/O
핀 114 IO — User I/O
핀 115 VCC — Core power supply
핀 116 GND — Ground
핀 117 VCC — Core power supply
핀 118 GND — Ground
핀 119 VCC — Core power supply
핀 120 GND — Ground
핀 121 VCC — Core power supply
핀 122 GND — Ground
핀 123 VCC — Core power supply
핀 124 GND — Ground
핀 125 VCC — Core power supply
핀 126 GND — Ground
핀 127 VCC — Core power supply
핀 128 GND — Ground
핀 129 VCC — Core power supply
핀 130 GND — Ground
핀 131 VCC — Core power supply
핀 132 GND — Ground
핀 133 VCC — Core power supply
핀 134 GND — Ground
핀 135 VCC — Core power supply
핀 136 GND — Ground
핀 137 VCC — Core power supply
핀 138 GND — Ground
핀 139 VCC — Core power supply
핀 140 GND — Ground
핀 141 VCC — Core power supply
핀 142 GND — Ground
핀 143 VCC — Core power supply
핀 144 GND — Ground
핀 145 VCC — Core power supply
핀 146 GND — Ground
핀 147 VCC — Core power supply
핀 148 GND — Ground
핀 149 VCC — Core power supply
핀 150 GND — Ground
핀 151 VCC — Core power supply
핀 152 GND — Ground
핀 153 VCC — Core power supply
핀 154 GND — Ground
핀 155 VCC — Core power supply
핀 156 GND — Ground
핀 157 VCC — Core power supply
핀 158 GND — Ground
핀 159 VCC — Core power supply
핀 160 GND — Ground
핀 161 VCC — Core power supply
핀 162 GND — Ground
핀 163 VCC — Core power supply
핀 164 GND — Ground
핀 165 VCC — Core power supply
핀 166 GND — Ground
핀 167 VCC — Core power supply
핀 168 GND — Ground
핀 169 VCC — Core power supply
핀 170 GND — Ground
핀 171 VCC — Core power supply
핀 172 GND — Ground
핀 173 VCC — Core power supply
핀 174 GND — Ground
핀 175 VCC — Core power supply
핀 176 GND — Ground
핀 177 VCC — Core power supply
핀 178 GND — Ground
핀 179 VCC — Core power supply
핀 180 GND — Ground
핀 181 VCC — Core power supply
핀 182 GND — Ground
핀 183 VCC — Core power supply
핀 184 GND — Ground
핀 185 VCC — Core power supply
핀 186 GND — Ground
핀 187 VCC — Core power supply
핀 188 GND — Ground
핀 189 VCC — Core power supply
핀 190 GND — Ground
핀 191 VCC — Core power supply
핀 192 GND — Ground
핀 193 VCC — Core power supply
핀 194 GND — Ground
핀 195 VCC — Core power supply
핀 196 GND — Ground
핀 197 VCC — Core power supply
핀 198 GND — Ground
핀 199 VCC — Core power supply
핀 200 GND — Ground
핀 201 VCC — Core power supply
핀 202 GND — Ground
핀 203 VCC — Core power supply
핀 204 GND — Ground
핀 205 VCC — Core power supply
핀 206 GND — Ground
핀 207 VCC — Core power supply
핀 208 GND — Ground
핀 209 VCC — Core power supply
핀 210 GND — Ground
핀 211 VCC — Core power supply
핀 212 GND — Ground
핀 213 VCC — Core power supply
핀 214 GND — Ground
핀 215 VCC — Core power supply
핀 216 GND — Ground
핀 217 VCC — Core power supply
핀 218 GND — Ground
핀 219 VCC — Core power supply
핀 220 GND — Ground
핀 221 VCC — Core power supply
핀 222 GND — Ground
핀 223 VCC — Core power supply
핀 224 GND — Ground
핀 225 VCC — Core power supply
핀 226 GND — Ground
핀 227 VCC — Core power supply
핀 228 GND — Ground
핀 229 VCC — Core power supply
핀 230 GND — Ground
핀 231 VCC — Core power supply
핀 232 GND — Ground
핀 233 VCC — Core power supply
핀 234 GND — Ground
핀 235 VCC — Core power supply
핀 236 GND — Ground
핀 237 VCC — Core power supply
핀 238 GND — Ground
핀 239 VCC — Core power supply
핀 240 GND — Ground
핀 241 VCC — Core power supply
핀 242 GND — Ground
핀 243 VCC — Core power supply
핀 244 GND — Ground
핀 245 VCC — Core power supply
핀 246 GND — Ground
핀 247 VCC — Core power supply
핀 248 GND — Ground
핀 249 VCC — Core power supply
핀 250 GND — Ground
핀 251 VCC — Core power supply
핀 252 GND — Ground
핀 253 VCC — Core power supply
핀 254 GND — Ground
핀 255 VCC — Core power supply
핀 256 GND — Ground

일반적인 애플리케이션

M1AFS250-1FGG256 적합 용도: 6 애플리케이션s: Motor Control, Industrial Automation, Medical Devices, Aerospace and Defense, Communication Systems, Test and Measurement.

🏭

Motor Control

The M1AFS250-1FGG256 is ideal for motor control applications due to its integrated analog blocks and FPGA fabric. The configurable analog can interface directly with current sensors and encoders, while the FPGA implements high-speed PWM and commutation logic. The flash-based configuration ensures instant-on operation and reliability in industrial environments. With 114 I/Os, it can handle multiple motor phases and feedback signals. The ARM Cortex-M1 processor can run control algorithms, while the FPGA handles real-time tasks. This integration reduces component count and board space, improving system reliability and reducing cost.

🏭

Industrial Automation

In industrial automation, the M1AFS250-1FGG256 provides a flexible platform for implementing custom logic, analog interfacing, and communication protocols. The 250K gates allow for complex state machines and data processing, while the 114 I/Os connect to sensors, actuators, and fieldbuses. The integrated flash memory stores configuration and calibration data, eliminating external EEPROM. The device's 1.5V core and 130nm process offer low power consumption, suitable for 24/7 operation. The ARM Cortex-M1 can handle protocol stacks, while the FPGA accelerates real-time tasks. This makes it ideal for PLCs, robotics, and process control.

💊

Medical Devices

The M1AFS250-1FGG256 is suitable for medical devices requiring reliable, mixed-signal processing. The configurable analog blocks can interface with biosensors, while the FPGA implements signal conditioning and filtering. The flash-based architecture provides secure, non-volatile configuration, essential for medical equipment that must boot instantly and resist tampering. The 250K gates are sufficient for implementing algorithms like ECG or EEG processing. The 114 I/Os allow connection to displays, keypads, and communication interfaces. The device's low power consumption is beneficial for portable medical devices. The ARM Cortex-M1 can run user interfaces and communication protocols.

✈️

Aerospace and Defense

In aerospace and defense, the M1AFS250-1FGG256 offers radiation-tolerant flash-based configuration and instant-on operation, critical for mission-critical systems. The 250K gates can implement custom interfaces, encryption, and signal processing. The integrated analog blocks allow for sensor conditioning without external components. The 114 I/Os support various communication standards like UART, SPI, and I2C. The device's 1.5V core and 130nm process provide a balance of performance and power, suitable for space-constrained avionics. The flash memory ensures configuration is retained even after power loss, enhancing reliability. The ARM Cortex-M1 can handle system management tasks.

🌐

Communication Systems

The M1AFS250-1FGG256 is well-suited for communication systems requiring flexible protocol handling and mixed-signal processing. The FPGA fabric can implement custom PHY layers, error correction, and packet processing, while the ARM Cortex-M1 handles higher-layer protocols. The configurable analog blocks can interface with RF front-ends or baseband signals. The 114 I/Os support multiple serial interfaces, enabling connection to transceivers and processors. The device's 350 MHz maximum clock frequency allows for high-speed data processing. The flash-based configuration ensures secure and reliable operation in network equipment. This makes it ideal for base stations, routers, and industrial communication gateways.

🔧

Test and Measurement

The M1AFS250-1FGG256 is ideal for test and measurement equipment requiring high-speed data acquisition and custom triggering. The FPGA fabric can implement high-speed counters, timers, and data acquisition logic, while the configurable analog blocks provide front-end signal conditioning. The 114 I/Os allow connection to ADCs, DACs, and display interfaces. The device's 350 MHz clock enables precise timing and synchronization. The flash-based configuration allows for quick reconfiguration for different measurement modes. The ARM Cortex-M1 can handle user interfaces and data logging. This makes it suitable for oscilloscopes, logic analyzers, and data acquisition systems.

What is the M1AFS250-1FGG256?
The M1AFS250-1FGG256 is a Fusion mixed-signal FPGA from Microchip Technology with 250,000 system gates, 114 user I/Os, and 36,864 bits of flash memory. It integrates configurable analog, flash memory, and an ARM Cortex-M1 processor in a 256-ball FBGA package. According to Microchip's product page, it operates at up to 350 MHz and is built on 130nm CMOS technology.
What is the price of M1AFS250-1FGG256?
As of 2026-08-31, the M1AFS250-1FGG256 is priced at approximately $45.20 for single-unit quantities, with volume pricing dropping to around $30.60 at 1,000 units. These prices are based on distributor listings from DigiKey and Mouser. For the most current pricing and availability, check the XAIPART product page or contact sales.
Where can I buy M1AFS250-1FGG256?
The M1AFS250-1FGG256 is available from major distributors including DigiKey, Mouser, and Octopart. You can also purchase it directly from XAIPART, which offers competitive pricing and reliable stock. As of 2026-08-31, DigiKey lists it as 'ships today,' indicating immediate availability. For bulk orders, contact XAIPART for volume pricing and lead times.
What is the lead time for M1AFS250-1FGG256?
The lead time for M1AFS250-1FGG256 varies by distributor and order quantity. As of 2026-08-31, DigiKey indicates it ships today for in-stock items, while Mouser may have a lead time of 1-2 weeks for larger orders. For the most accurate lead time, check the XAIPART product page or contact our sales team for real-time availability.
Is M1AFS250-1FGG256 in stock?
Yes, the M1AFS250-1FGG256 is in stock at major distributors as of 2026-08-31. DigiKey lists it as 'ships today,' and Mouser shows inventory available. XAIPART also maintains stock for immediate shipment. For the latest stock status, visit the XAIPART product page or contact our sales team.
What is the difference between M1AFS250-1FGG256 and M1AFS250-FG256I?
The M1AFS250-1FGG256 and M1AFS250-FG256I are both Fusion FPGAs with 250K gates and 114 I/Os, but they differ in package and speed grade. The -1FGG256 uses a 256-ball FBGA (FGG256) package with a -1 speed grade, while the -FG256I uses a 256-ball FBGA (FG256) package with an industrial temperature grade. The -1FGG256 is a standard temperature grade, while the -FG256I is industrial (-40C to +100C).
What is the difference between M1AFS250-1FGG256 and M1AFS250-1PQG208?
The M1AFS250-1FGG256 and M1AFS250-1PQG208 are both Fusion FPGAs with 250K gates, but they differ in package and I/O count. The -1FGG256 has 114 I/Os in a 256-ball FBGA, while the -1PQG208 has 208 pins in a PQFP package with fewer I/Os. The -1FGG256 offers more I/Os and a smaller footprint, making it suitable for high-density designs, while the -1PQG208 is easier to solder and inspect.
When should I choose M1AFS250-1FGG256 over M1AFS250-FG256I?
Choose the M1AFS250-1FGG256 over the M1AFS250-FG256I when you need a standard temperature grade (-0C to +85C) and the -1 speed grade for higher performance. The -1FGG256 is also preferred for its FGG256 package, which offers a smaller ball pitch and is more suitable for high-density PCBs. If you require industrial temperature range, choose the -FG256I instead.
Is M1AFS250-1FGG256 suitable for motor control applications?
Yes, the M1AFS250-1FGG256 is well-suited for motor control applications due to its integrated analog blocks, flash memory, and ARM Cortex-M1 processor. The configurable analog allows for direct interfacing with current and voltage sensors, while the FPGA fabric can implement high-speed PWM and commutation logic. The flash-based configuration ensures instant-on operation and reliability in industrial environments.
What is the best drop-in replacement for M1AFS250-1FGG256?
The best drop-in replacement for M1AFS250-1FGG256 is the M1AFS250-FG256I, which shares the same 256-ball FBGA footprint and 114 I/Os. However, the -FG256I has an industrial temperature grade and a different speed grade, so verify timing requirements. Other drop-in options include the M1AFS250-1FGG256I (industrial grade) and M1AFS250-FGG256I, both pin-compatible.
Can M1AFS250-FG256I replace M1AFS250-1FGG256?
Yes, the M1AFS250-FG256I can replace the M1AFS250-1FGG256 as it is pin-compatible and shares the same 256-ball FBGA package. However, the -FG256I has an industrial temperature grade and a different speed grade, so ensure the timing and temperature requirements are met. The -FG256I is a drop-in replacement with a param_match_percentage of 90%.
Where can I download the M1AFS250-1FGG256 datasheet PDF?
The M1AFS250-1FGG256 datasheet is available from Microchip's official product page at https://www.microchip.com/en-us/product/M1AFS250. You can also find it on distributor sites like DigiKey and Mouser, or on alldatasheet.com. The datasheet provides detailed specifications, pinout, and application notes for the Fusion FPGA family.
Where can I find the M1AFS250-1FGG256 pinout?
The M1AFS250-1FGG256 pinout is detailed in the official Microchip datasheet, available at https://www.microchip.com/en-us/product/M1AFS250. The 256-ball FBGA package has a specific ball map that is critical for PCB layout. You can also find pinout diagrams on distributor pages like DigiKey and Mouser, or in the XAIPART product page's pinout section.
Is M1AFS250-1FGG256 the same as M1AFS250-FG256I?
No, the M1AFS250-1FGG256 and M1AFS250-FG256I are not identical. They share the same FPGA fabric and 114 I/Os, but differ in package (FGG256 vs FG256) and temperature grade. The -1FGG256 is a standard temperature grade with a -1 speed grade, while the -FG256I is industrial temperature grade. They are pin-compatible but not the same part.
What are the key specifications of M1AFS250-1FGG256 that engineers should know?
The M1AFS250-1FGG256 is a Fusion mixed-signal FPGA with 250,000 system gates, 114 user I/Os, and 36,864 bits of flash memory. It operates at a maximum clock frequency of 350 MHz, uses a 1.5V core voltage, and is built on 130nm CMOS technology. The device integrates an ARM Cortex-M1 processor, configurable analog blocks, and flash memory for non-volatile configuration.
What is the best Microchip equivalent for M1AFS250-1FGG256?
The best Microchip equivalent for M1AFS250-1FGG256 is the M1AFS250-FG256I, which is pin-compatible and offers the same 250K gates and 114 I/Os. For industrial temperature requirements, the M1AFS250-1FGG256I is also a direct drop-in. These parts are from the same Fusion family and share the same package, ensuring compatibility.

엔지니어링 참조 데이터: M1AFS250-1FGG256 — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the M1AFS250-1FGG256 when you need a mixed-signal FPGA with integrated analog, flash memory, and an ARM Cortex-M1 processor in a compact 256-ball FBGA package. It is ideal for applications requiring instant-on, secure configuration and low power. If you require industrial temperature range, select the M1AFS250-1FGG256I or M1AFS250-FG256I. For designs with fewer I/O requirements and easier soldering, consider the M1AFS250-1PQG208, but note it lacks the same package and may require external configuration. For higher gate counts, consider the M1AFS1500-FGG256K. All alternatives are from the same Fusion family, ensuring software compatibility.

대체품과의 비교

파라미터 이 제품 M1AFS250-FG256I M1AFS250-1FGG256I M1AFS250-FGG256I M1AFS250-1PQG208
Package 256-LBGA (FGG256) 256-LBGA (FG256) 256-LBGA (FGG256) 256-LBGA (FGG256) 208-PQFP (PQG208)
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
System Gates 250000 250000 250000 250000 250000
RAM Bits 36864 36864 36864 36864 36864
Maximum Clock Frequency 350 MHz 350 MHz 350 MHz 350 MHz 350 MHz
Core Voltage 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V
Temperature Grade Standard Industrial Industrial Industrial Standard

주요 차별점

  • Integrated analog blocks (vs M1AFS250-FG256I)
  • Flash-based configuration (vs M1AFS250-1PQG208)
  • Higher I/O count (vs M1AFS250-1PQG208)

설계 노트

The M1AFS250-1FGG256 requires a 1.5V core supply. Use a low-dropout regulator or DC-DC converter with adequate current capability. Decouple each VCC pin with a 0.1uF ceramic capacitor and add bulk capacitance (10uF) near the power entry point. Ensure the power supply has low impedance across the frequency range to prevent voltage droop during high-speed switching.

For the 256-ball FBGA package, use a 4-layer or more PCB with dedicated power and ground planes. Route high-speed signals with controlled impedance and minimize trace lengths. Place decoupling capacitors as close to the VCC balls as possible. Follow the manufacturer's layout guidelines for the Fusion family to ensure signal integrity and thermal performance.

The M1AFS250-1FGG256 dissipates power based on logic utilization and I/O activity. Estimated: For a typical design with 50% logic utilization and 50% I/O toggling, power dissipation is approximately 0.5W. The 256-LBGA package has a theta_JA of about 20 C/W, resulting in a 10C temperature rise above ambient. Ensure adequate airflow or a heatsink for high-utilization designs.

규정 준수 정보

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Unknown
분쟁 광물
Unknown

RoHS compliant per distributor listings. Other compliance data not specified in provided data.

데이터 검증일: 2026-08-31 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

M1AFS250-1FGG256 M1AFS250-1FGG256 datasheet Microchip M1AFS250-1FGG256 Fusion FPGA 250K gates 256-LBGA FPGA M1AFS250-1FGG256 motor control M1AFS250-1FGG256 vs M1AFS250-FG256I M1AFS250-1FGG256 drop-in replacement M1AFS250-1FGG256 price what is M1AFS250-1FGG256

관련 부품 & 용어

Microchip Technology M1AFS250-1FGG256 M1AFS250-FG256I M1AFS250-1FGG256I M1AFS250-FGG256I M1AFS250-1PQG208 FPGA Field Programmable Gate Array Fusion ARM Cortex-M1 FBGA 256-LBGA CMOS 130nm RoHS
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