M1AFS250-PQ208I - Fusion FPGA 250K Gates 208-PQFP | Microsemi
부품 번호: M1AFS250-PQ208I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $62.3 | $623.00 |
| 100 | $55.9 | $5,590.00 |
| 500 | $50.2 | $25,100.00 |
| 1,000 | $45.8 | $45,800.00 |
M1AFS250-PQ208I 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that designers program to implement custom digital circuits. Within the programmable logic hierarchy, FPGAs sit above CPLDs and below full ASICs, offering ASIC-like integration without mask-set costs. The Fusion family from Actel/Microsemi/Microchip is distinctive because it integrates flash-based programming fabric with mixed-signal analog peripherals on a single die.
Key features of the M1AFS250 include its flash-based, non-volatile configuration (no external configuration PROM or boot time required), 130nm technology enabling up to 1098.9 MHz internal performance, and integrated programmable analog blocks. The 36,864-bit embedded SRAM supports FIFOs and dual-port memory structures, while 93 user I/Os accommodate a broad range of interface standards.
Architecturally, Fusion combines the ProASIC3-style flash switch fabric with analog peripherals such as voltage/temperature monitoring and an ADC subsystem, making it a true mixed-signal programmable SoC for its era. The 1.5V core keeps dynamic power low, and instantaneous-on flash configuration improves system reliability versus SRAM FPGAs.
Typical applications include industrial control, power-supply supervision and intelligent power management, military/aerospace subsystems, portable instrumentation, and bridge logic where a small non-volatile FPGA with analog monitoring is advantageous.
When designing with this device, budget I/O carefully: only 93 of the 208 pins are user I/O, and industrial temperature variants should be derated for timing at the hot corner.
This page synthesizes verified distributor data, drop-in alternatives, design guidance, and lifecycle context not found on any single manufacturer or distributor page.
드롭인 대체품: M1AFS250-PQ208I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: M1AFS250-PQ208I (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Family, RoHS Status, Analog Blocks.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
M1AFS250-1PQ208I
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$47.8 / 개
데이터시트 보기 →M1AFS250-2PQ208I
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$45.6 / 개
데이터시트 보기 →M1AFS250-PQ208
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$28.6 / 개
데이터시트 보기 →M1AFS250-PQG208I
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$54.8 / 개
데이터시트 보기 →M1AFS250-2PQG208I
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$49.8 / 개
데이터시트 보기 →AFS250-PQ208I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
AX250-PQ208I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
M1AFS250-PQ208I 최대 정격 & 전기적 특성
| Manufacturer | Microsemi Corporation (Microchip Technology) |
| Family | Fusion (M1AFS) |
| System Gates | 250000 gates |
| User I/O | 93 |
| Embedded SRAM | 36864 bits |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm |
| Maximum Frequency | 1098.9 MHz |
| Configuration Technology | Flash (non-volatile) |
| 패키지 | 208-BFQFP (PQFP-208) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +100C (industrial, I suffix) |
| 카테고리 | Embedded - FPGAs (Field Programmable Gate Array) |
| Total Package Pins | 208 |
M1AFS250-PQ208I 208 핀 구성 가이드
M1AFS250-PQ208I(208 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: M1AFS250-PQ208I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
M1AFS250-PQ208I 적합 용도: 6 애플리케이션s: Industrial Control and Automation, Intelligent Power Management, Bridge Logic and Bus Interface, Portable and Battery-Powered Instrumentation, Aerospace and Defense Subsystems, Test and Measurement Equipment.
Industrial Control and Automation
The M1AFS250-PQ208I fits industrial control cards that need moderate logic density plus reliable instant-on behavior. Its 250K flash-based gates implement state machines, encoder/decoder logic, and motor-control sequencing, while the industrial -40C to +100C rating covers unconditioned factory floors. Because configuration resides in on-chip flash, the FPGA is functional within microseconds of power application - no external configuration PROM to fail or delay boot. The 93 user I/Os handle 3.3V/2.5V interfaces to PLC backplanes and sensors, and the 36,864-bit SRAM supports small FIFOs between subsystems. Place it on a 5V-tolerant-adjacent design carefully; confirm I/O bank voltages against the datasheet before interfacing legacy 5V TTL nodes through level shifters.
추천
Intelligent Power Management
Fusion was explicitly architected for smart power management: the M1AFS250 integrates mixed-signal monitoring with programmable control fabric, letting one chip sequence rails, watch voltage and temperature, and trigger protective shutdowns. In an ATCA or telecom rectifier card, the 250K-gate fabric implements fan and hot-swap control state machines while the analog block supervises multiple supply rails. The 1.5V core keeps quiescent losses low for always-on supervision duties, and the non-volatile flash configuration means protection logic is active from the instant DC arrives - a key advantage over SRAM FPGAs that are blind during configuration. Designers should validate ADC accuracy and rail-monitor thresholds against the Fusion datasheet analog specifications in their end-of-line test plan.
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Bridge Logic and Bus Interface
The M1AFS250-PQ208I is a natural fit for bridge and glue logic between legacy buses and modern processors. With 250K gates, it absorbs address decoders, bus arbiters, wait-state generators, and protocol converters that would otherwise consume many discrete devices. The 208-pin PQFP offers generous ground/power pins for clean I/O signaling, and 93 user I/Os cover typical 16/32-bit parallel buses with control signals. Its 36,864-bit SRAM implements dual-port staging buffers between asynchronous clock domains. Flash configuration eliminates a separate configuration device, shrinking BOM cost on cost-sensitive industrial boards. Timing-critical bus interfaces should target the M1AFS250-2PQ208I speed grade to preserve setup/hold margin across the industrial temperature corner.
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Portable and Battery-Powered Instrumentation
Handheld instruments benefit from the M1AFS250's low 1.5V core and non-volatile fabric: the device consumes zero configuration power at startup and requires no boot sequence, so measurements begin immediately when the unit is switched on. The 130nm process keeps dynamic power modest for duty-cycled acquisition logic, and the Fusion analog block can monitor battery voltage to manage low-battery shutdown thresholds in logic. The 208-PQFP, while larger than ball-grid alternatives, is hand-solderable and rework-friendly for low-volume instrument production and field repair. Designers should size the 1.5V core regulator for sleep-active current deltas documented in the Fusion power datasheet and gate unused clock trees to minimize standby drain.
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Aerospace and Defense Subsystems
Microsemi programmable logic has a long heritage in defense and aerospace, and the flash-based Fusion fabric supports that lineage: configuration data is inherently non-volatile and resistant to configuration upsets compared with SRAM FPGAs that must reload from external memory. In satellite payloads, avionics interface cards, and secure communications boxes, the M1AFS250 implements protocol interfaces, telemetry formatting, and voting logic while the industrial -40C to +100C grade covers wide environmental envelopes; space and military screening flows are available through Microsemi channels for programs requiring them. Verify program-specific qualification requirements, as the standard commercial/industrial ordering codes do not themselves carry mil-screen test flows.
추천
Test and Measurement Equipment
Bench instruments and rack modules use the M1AFS250-PQ208I for trigger logic, counter/timer functions, and interface translation between front-end analog circuitry and digital backplanes. The 1098.9 MHz-class internal fabric supports fast counter implementations, while 36,864 bits of SRAM capture short event records. The PQFP package simplifies prototyping - leads are visible for probing and rework is straightforward on engineering builds. Fusion's mixed-signal block can log supply and temperature telemetry for instrument self-test routines. When deterministic trigger latency matters, lock down the design at the -2 speed grade (M1AFS250-2PQG208I) and constrain clocks in Libero SoC to bound routing delays across temperature.
추천
추천 제품 요약
엔지니어링 참조 데이터: M1AFS250-PQ208I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | M1AFS250-1PQ208I | M1AFS250-2PQ208I | M1AFS250-PQG208I | AFS250-PQ208I | AX250-PQ208I |
|---|---|---|---|---|---|---|
| Package | 208-PQFP (BFQFP) | 208-PQFP - same | 208-PQFP - same | 208-PQFP (Pb-free/green) - same footprint | 208-QFP - same | 208-QFP - same |
| Brand | Microsemi (Microchip) | Microsemi (Microchip) | Microsemi (Actel legacy code) | Microsemi (ProASIC3) | ||
| System Gates | 250000 | 250000 | 250000 | 250000 | ||
| User I/O | 93 | 93 | 93 | 115 | ||
| Embedded SRAM | 36864 bits | 36864 bits | 36864 bits | 36864 bits | ||
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | ||
| Temperature Range | -40C to +100C (I) | -40C to +100C (I) | 0C to +70C (commercial) | -40C to +100C (I) | ||
| Analog Peripherals (Fusion) | Yes (voltage/temperature monitoring, ADC block) | Yes | Yes | No (digital-only ProASIC3) | ||
| Speed Grade | Standard | -1 (slower) | -2 (faster) | ProASIC3 grading |
주요 차별점
- Integrated mixed-signal analog block on an FPGA (vs AX250-PQ208I)
- Non-volatile instant-on flash configuration (vs AFS250-PQ208I)
- Lower lead-count cost vs higher-density Fusion siblings (vs M1AFS600-FG484)
설계 노트
Estimated: the Fusion M1AFS250 requires a 1.5V core rail plus separate analog and I/O bank supplies per the Fusion datasheet. Budget core current from Libero SmartPower estimates rather than worst-case family tables - typical 250K-gate designs at moderate toggle rates draw well under peak ratings. Sequence supplies per the datasheet power-up specification and use a wide-VIN buck such as the LM5164QDDAR followed by an LDO for the analog rail to keep the ADC monitor readings clean. Place 100nF ceramic decoupling at every supply pin pair of the 208-PQFP.
The 208-PQFP has a 0.5mm lead pitch: specify a solder-mask-defined footprint per the datasheet mechanical drawing and use a no-clean or water-wash paste that avoids bridging. Add thermal relief via the center die-attach area if the datasheet exposes one; PQFP heat extraction is lead-limited, so keep sustained I/O switching currents modest. Route JTAG (TCK/TMS/TDI/TDO) as a short daisy chain with series resistors on TCK, and reserve board access to the programming header even for production units to allow field firmware updates through the flash fabric.
Three recurring mistakes: (1) assuming all 208 pins are usable I/O - only 93 are user I/O, so do the I/O budget before layout; (2) substituting AX250-PQ208I without checking pin maps - its 115-I/O ProASIC3 bondout places different functions on shared pins, and it lacks the Fusion analog block entirely; (3) ignoring speed-grade suffixes - timing closure achieved on a -2 part may fail on the standard or -1 grade at the -40C/+100C corners. Always re-run static timing in Libero SoC for the exact ordered MPN.
규정 준수 정보
Compliance data not present in retrieved web data. The PQG208 variant ordering code indicates a Pb-free/green package option within the same family; verify RoHS/REACH declarations via Microchip product pages or the PQG ordering code.