A3PE3000L-1PQG208 - ProASIC3L FPGA 147 I/O | Microchip
부품 번호: A3PE3000L-1PQG208 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $210.5 | $210.50 |
| 10 | $195.3 | $1,953.00 |
| 100 | $182.75 | $18,275.00 |
| 500 | $171.4 | $85,700.00 |
| 1,000 | $162.9 | $162,900.00 |
A3PE3000L-1PQG208 개요
A field-programmable gate array (FPGA) is a semiconductor device containing programmable logic blocks and interconnects that designers configure in the field, sitting within the broader programmable logic hierarchy that also includes CPLDs and PLDs. The ProASIC3L subfamily distinguishes itself by using flash-based configuration memory, so it is single-chip, instant-on, and inherently secure against bitstream interception compared with SRAM FPGAs that need external boot devices.
Key features include a 1.2 V to 1.5 V core voltage, I/O operation down to 1.2 V, and Microchip's Flash*Freeze technology, which per the ProASIC3L datasheet cuts dynamic power by 40% and static power by 50% versus the equivalent standard ProASIC3 device. Fabricated on a 130 nm flash process, the device is reprogrammable and supports a maximum operating frequency of 892.86 MHz as listed by distributor data for this family member. The commercial temperature grade operates from 0C to +70C, and the part ships in a tray packag.
Typical applications include battery-powered portable instrumentation, low-power industrial control, aerospace/defense data acquisition, and glue-logic consolidation in cost-sensitive systems where flash FPGAs provide secure, single-chip programmability.
Design consideration: the PQFP-208 package has relatively long lead inductance compared with flip-chip BGA alternatives, so power-integrity planning and generous decoupling are important for high-speed I/O operation.
This page synthesizes distributor pricing, drop-in alternative cross-references, and practical design notes not found in the manufacturer datasheet, with pricing data as of 2026-09-02.
드롭인 대체품: A3PE3000L-1PQG208 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE3000L-1PQG208 (동일 폼 팩터 및 풋프린트) — 차이점: Family, Package, System Gates, Process Technology, Configuration Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3PE3000L-1PQG208I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3PE3000L-1PQG208Y
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3PE3000L-1PQG208 최대 정격 & 전기적 특성
| Manufacturer Part Number | A3PE3000L-1PQG208 |
| Family | ProASIC3L (ProASIC3E family, low power) |
| System Gates | 3000000 |
| Logic Elements | 35K LEs |
| Number of I/O | 147 |
| Core Voltage | 1.2 V to 1.5 V |
| 동작 공급 전압 | 1.5 V |
| Process Technology | 130 nm flash |
| Maximum Operating Frequency | 892.86 MHz |
| Configuration Memory | Flash (single-chip, reprogrammable) |
| Low Power Feature | Flash*Freeze technology (40% dynamic / 50% static power reduction) |
| 패키지 | 208-BFQFP (PQFP-208) |
| 장착 스타일 | SMD/SMT |
| 동작 온도 범위 | 0C to +70C |
| Packaging | Tray |
| Lead Free | Yes (G suffix) |
A3PE3000L-1PQG208 208-bfqfp (pqfp-208) 핀 구성 가이드
A3PE3000L-1PQG208(208-bfqfp (pqfp-208) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE3000L-1PQG208.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE3000L-1PQG208 적합 용도: 6 애플리케이션s: Battery-Powered Portable Instrumentation, Industrial Control and Automation, Aerospace and Defense Data Acquisition, Secure Embedded Systems, Glue Logic and Bus Bridging Consolidation, Low-Power IoT Edge Nodes.
Battery-Powered Portable Instrumentation
The A3PE3000L-1PQG208 fits portable instrumentation because its ProASIC3L fabric cuts dynamic power by 40% and static power by 50% versus equivalent ProASIC3 devices, and Flash*Freeze mode lets the system hold I/O and logic state at microamp-scale standby current. With a 1.2 V to 1.5 V core and I/O banks operating as low as 1.2 V, it pairs naturally with single-cell lithium and low-voltage rail architectures, eliminating level shifters. In a typical handheld data logger the FPGA fronts ADCs and sensor interfaces, runs glue logic and timing, and enters Flash*Freeze between acquisition windows; because configuration is flash-based and single-chip, wake-up is instant with no bitstream reload from external memory, saving both power and PCB area.
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Industrial Control and Automation
In industrial control, the A3PE3000L-1PQG208 consolidates PLC I/O expansion, encoder interfacing, and deterministic state machines into one 3M-gate flash fabric with 147 user I/O, reducing BOM count versus discrete glue logic. The instant-on, single-chip flash configuration matters in factory environments subject to brownouts: the FPGA is functional within microseconds of power restoration without reloading a configuration device. The 130 nm fabric's 892.86 MHz family speed listing gives ample timing margin for multi-channel PWM and quadrature decoding, while the 0C to +70C commercial grade suits cabinet-mounted controllers; for field-exposed hardware the pin-identical -I industrial grade should be specified. Its security advantage - no external bitstream to intercept - protects proprietary control algorithms from cloning on the production floor.
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Aerospace and Defense Data Acquisition
Defense and aerospace data-acquisition modules value the A3PE3000L-1PQG208 for its combination of flash-based security, instant-on behavior, and the low static power that matters in conduction-cooled, fanless enclosures. The 3M-gate fabric with 147 I/O implements sensor front-end formatting, trigger logic, and telemetry framing, while the single-chip flash configuration removes the external bitstream store that would otherwise be a vulnerability and a reliability liability under vibration. Flash*Freeze lets acquisition pods hold context between mission phases at minimal quiescent draw. The 208-pin PQFP offers gull-wing leads with better board-level inspection and rework characteristics than area-array BGAs, which suits high-reliability assembly flows; specify the -I grade (-40C to +100C) for extended-environment platforms.
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Secure Embedded Systems
The A3PE3000L-1PQG208 is well suited to secure embedded designs because its configuration bitstream resides in on-chip flash, eliminating the external boot device whose bus traffic can be probed to clone the design - a well-known attack surface of SRAM FPGAs. Designers use the 3M-gate fabric to implement encryption engines, authentication logic, and anti-tamper state machines alongside application logic, with 147 I/O bridging secure processors to external interfaces. Instant-on flash startup means security-critical supervision logic is active before the main processor completes boot, closing power-race windows. Flash*Freeze preserves security context through low-power states without reconfiguration. The 130 nm flash process and reprogrammability support in-field key and feature updates through authenticated update flows.
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Glue Logic and Bus Bridging Consolidation
For ASIC prototyping, legacy bus interfaces, and mixed-voltage system glue logic, the A3PE3000L-1PQG208 replaces dozens of 74-series devices, PALs, and FIFOs with one reprogrammable 3M-gate device. The 147 user I/O and I/O banks operating at 1.2 V to 1.5 V core with flexible I/O standards let it bridge legacy 5 V-tolerant style peripherals (with proper level shifting) and modern low-voltage buses on one chip. Because the flash fabric is reprogrammable in-system, interface bugs found during system integration are fixed with a bitstream update rather than a PCB spin, directly lowering total cost of ownership - a headline Microchip benefit for the ProASIC3 family. The 892.86 MHz family speed listing provides generous timing headroom for wide parallel buses.
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Low-Power IoT Edge Nodes
IoT edge nodes that must sense continuously yet sleep aggressively use the A3PE3000L-1PQG208 as the always-on sensor hub: its Flash*Freeze technology maintains I/O and logic state at drastically reduced power (40% lower dynamic, 50% lower static than standard ProASIC3), while the 1.2 V-capable I/O connects directly to modern sensor rails. The 35K logic elements implement threshold detection, protocol formatting, and cryptographic pre-processing before waking a host microcontroller, minimizing wake cycles that dominate node energy budgets. Flash configuration gives instant-on after battery insertion or solar power return with no boot delay. The 208-PQFP suits moderate-volume prototyping and rework-friendly assembly, though BGA package variants of the same die offer smaller footprints for production Miniaturization.
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추천 제품 요약
엔지니어링 참조 데이터: A3PE3000L-1PQG208 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3PE3000L-1PQG208I | A3PE3000L-1PQG208Y |
|---|---|---|---|
| Package | 208-BFQFP (PQFP-208) | 208-BFQFP (PQFP-208) - same | 208-BFQFP (PQFP-208) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 |
| Number of I/O | 147 | 147 | 147 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Temperature Range | 0C to +70C | -40C to +100C (industrial) | 0C to +70C (commercial) |
| Flash*Freeze Low Power Mode | Yes (40% dynamic / 50% static reduction) | Yes | Yes |
| Drop-in Compatibility | - | 100% pin-to-pin, bitstream portable | 100% pin-to-pin, bitstream portable |
주요 차별점
- Extended industrial temperature rating in identical footprint (vs A3PE3000L-1PQG208I)
- Flash*Freeze power reduction vs standard ProASIC3 (vs A3PE3000 (non-L))
- Single-chip secure flash configuration (vs SRAM FPGAs (e.g., Lattice XP2 in other packages))
설계 노트
The A3PE3000L-1PQG208 requires a 1.2 V to 1.5 V core supply; running the core at 1.5 V maximizes speed but raises static power, while 1.2 V minimizes power for cost-sensitive designs. Per the ProASIC3L datasheet (DS50003268), Flash*Freeze mode cuts static power by 50% versus standard ProASIC3 - architect your firmware to enter Flash*Freeze aggressively between active windows. Estimated: at 1.5 V core on a 3M-gate flash fabric, core current in active mode is on the order of tens of milliamps; verify against the datasheet power estimator (SmartPower) for your specific utilization before sizing the 1.5 V regulator.
The 208-pin PQFP has 0.5 mm pitch gull-wing leads. Keep input decoupling capacitors (at least one 0.1 uF per supply pin group plus bulk 10 uF) within 5 mm of the corresponding VCC/GND pin pairs to counter the higher lead inductance of PQFP versus BGA. Route the four JTAG pins (TDI, TDO, TMS, TCK) to a standard header for FlashPro programming and boundary-scan test. Because PQFP-208 is a fine-pitch QFP, specify an inspection-capable assembly process (AOI) and follow the datasheet land-pattern recommendation exactly.
Do not confuse the commercial A3PE3000L-1PQG208 (0C to +70C) with the -I industrial variant when building extended-temperature hardware - they are pin-identical but thermally graded, and substituting the commercial part in a -40C system risks out-of-spec timing. Also note the part is programmed only with Microchip Libero SoC and FlashPro tools; no third-party vendor supports ProASIC3L fabric. Finally, monitor Microchip PCNs: a product change notification (CAAN-02OLLE763) affecting legacy FPGA assembly sites has been issued, so re-verify date codes when qualifying second sources.
규정 준수 정보
G suffix denotes Microchip lead-free (Pb-free) option; related Mouser listings for A3PE3000 PQ208 identify lead-free parts. RoHS/REACH certificate should be confirmed from Microchip product page or CoC.