A3PE3000L-1PQ208 - ProASIC3L Flash FPGA 208-PQFP | Microchip
부품 번호: A3PE3000L-1PQ208 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
A3PE3000L-1PQ208 개요
A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration device. Within the programmable logic hierarchy, the A3PE3000L belongs to the ProASIC3L family (low-power branch of ProASIC3), which sits under the broader FPGA/PLD category and power-management-aware system-on-chip solutions. Because configuration is nonvolatile, the device is Instant On at power-up and requires no external boot flash.
Key features include Flash*Freeze technology, which dramatically cuts dynamic power while retaining state, a single 1.2V to 1.5V core supply per the Microchip product page, 130nm flash process technology, and reprogrammability with secure single-chip operation. The verified distributor data reports a characteristic performance figure of 892.86 MHz for the family listing.
Architecturally, the ProASIC3L fabric is built from VersaTiles, third-generation three-input LUT-equivalent logic cells that can also act as a D flip-flop or latch with enable, giving efficient mapping of sequential and combinational logic. The low-power flash approach removes the configuration element of SRAM FPGAs and reduces total cost of ownership in high-volume systems.
Typical applications include portable and battery-powered industrial equipment, low-power embedded control and interface bridging, and space- or power-constrained communications hardware where 147 I/Os suffice.
A key design consideration: the PQFP-208 package has larger lead inductance than ball-grid alternatives, so power-integrity and simultaneous-switching noise demand generous ground returns.
This page synthesizes distributor listings, cross-reference data, and drop-in packaging-variant analysis not consolidated in the manufacturer datasheet.
드롭인 대체품: A3PE3000L-1PQ208 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE3000L-1PQ208 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, System Gates, Configuration, Core Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3PE3000L-1PQG208
✅ 드롭인✓ 재고 있음
$162.9 / 개
데이터시트 보기 →A3PE3000L-1PQ208I
✅ 드롭인✓ 재고 있음
$82 / 개
데이터시트 보기 →A3PE3000L-PQG208I
✅ 드롭인✓ 재고 있음
$48.9 / 개
데이터시트 보기 →A3PE3000L-PQ208
✅ 드롭인✓ 재고 있음
$310.69 / 개
데이터시트 보기 →A3PE3000-1PQG208I
✅ 드롭인✓ 재고 있음
$59.9 / 개
데이터시트 보기 →A3PE3000L-1PQ208 최대 정격 & 전기적 특성
| Family | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3M gates |
| Logic Elements | 35K LEs |
| User I/O | 147 |
| Core Voltage | 1.2 V |
| Core Voltage Range | 1.2 V to 1.5 V |
| Process Technology | 130 nm flash |
| Characteristic Frequency | 892.86 MHz |
| Configuration Memory | On-chip nonvolatile flash (Instant On) |
| Low Power Feature | Flash*Freeze technology |
| 패키지 | 208-BFQFP (PQFP-208) |
| 실장 유형 | Surface Mount |
| Packaging | Tray |
| MSL 레벨 | 3 (168 hours) |
| ECCN | 3A001A7A |
| HTSUS | 8542.39.0001 |
A3PE3000L-1PQ208 208-bfqfp (pqfp-208) 핀 구성 가이드
A3PE3000L-1PQ208(208-bfqfp (pqfp-208) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE3000L-1PQ208.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE3000L-1PQ208 적합 용도: 6 애플리케이션s: Battery-Powered Portable Instruments, Industrial Embedded Control and Interface Bridging, Secure Single-Chip Systems, Communications Line Cards and Backplane Glue, Aerospace and Defense Legacy Redesign, Test and Measurement Instrumentation.
Battery-Powered Portable Instruments
The A3PE3000L-1PQ208 fits portable, battery-operated instruments because its nonvolatile flash fabric is Instant On and its Flash*Freeze technology collapses dynamic power while preserving all register and I/O state, allowing the system to idle at micro-power and wake on external events. With a 1.2V core and roughly 35K LEs plus 147 user I/Os, it integrates glue logic, sensor interfaces, and display control that would otherwise require several discrete ICs whose combined quiescent current would exceed the FPGA's own budget. Implemented in the 208-PQFP package, the design gains a large, hand-solderable footprint suited to low-volume portable hardware. The trade-off versus an MCU solution is higher unit cost, repaid by true hardware-parallel datapaths in measurement engines.
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Industrial Embedded Control and Interface Bridging
In industrial controllers the A3PE3000L-1PQ208 serves as a single-chip bridge between legacy parallel buses, industrial field interfaces, and modern MCU or SoC hosts. Its 147 user I/Os support multiple voltage banks, letting one device span 3.3V, 2.5V, and 1.8V logic domains without level shifters, while the flash fabric starts executing instantly at power-up - important in factory equipment that must be productive the moment 24V backplane power is applied. The VersaTile architecture efficiently implements UART/SPI/I2C engines, encoders, and interlock logic with cycle-deterministic timing that software cannot match. Industrial temperature variants (A3PE3000L-1PQ208I) cover -40C to +100C cabinets, and the PQFP leads simplify rework on production lines.
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Secure Single-Chip Systems
ProASIC3L flash FPGAs are suited to designs where bitstream confidentiality matters: the configuration lives in on-chip nonvolatile flash, so there is no external configuration memory to intercept, and Microchip supports design security features against readback. The A3PE3000L-1PQ208's 3M gates implement crypto accelerators, secure boot front-ends, or authentication engines while the Instant On fabric enforces access policy from the first clock. Compared with an SRAM FPGA plus encrypted configuration flash, the single-chip approach removes an entire attack surface and a bill-of-materials line item. Designers should combine the device with Microchip's Libero security toolchain features and verify supply-chain integrity, since the mature 130nm part is also a counterfeit target on broker markets.
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Communications Line Cards and Backplane Glue
On communications line cards, the A3PE3000L-1PQ208 implements backplane glue logic: bus formatting, framing, interrupt aggregation, and LED/alarm handling around higher-assistance PHY and switch silicon. The 892.86MHz family characteristic figure reported by distributor data reflects internal routing performance class, while practical I/O toggling rates are limited by the PQFP package's lead inductance - designers should simulate bus turnaround for edges faster than roughly 1 ns. Instant On behavior means the card's housekeeping logic is alive before slot-level power sequencing completes, simplifying presence detection. With 147 I/Os the device absorbs the point-count that would otherwise sprawl across multiple CPLDs, consolidating timing closure into one constraint set in Libero SoC.
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Aerospace and Defense Legacy Redesign
Microsemi (now Microchip) flash FPGAs have a long heritage in aerospace and defense programs, and the A3PE3000L-1PQ208 is a rational target for redesigning legacy ASIC or antifuse logic into reprogrammable, nonvolatile fabric. The flash cell's inherent immunity to configuration upset (no external config memory) and secure programming suit environments where radiation-tolerant configuration storage is valued, while the commercial PQFP-208 suits ground-based and laboratory equipment. Engineering teams use Libero SoC with timing-constrained flows to port schematics from older MX or ProASIC PLUS families; Microchip migration application notes cover the VersaTile mapping strategy. For flight programs, pair this device with Microchip's qualified packaging and screening flows rather than catalog commercial grading.
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Test and Measurement Instrumentation
Bench and rack instruments use the A3PE3000L-1PQ208 for timing generators, trigger matrices, and probe-interface logic where deterministic hardware latency is essential. The VersaTile fabric builds wide counters and edge-detect comparators that sample trigger events with nanosecond determinism, something an embedded CPU alone cannot guarantee under interrupt load. Its 147 I/Os connect front-end analog boards to the digital core across several voltage banks, and Instant On operation lets calibration constants held in the flash fabric be available the moment power is applied, cutting boot time versus SRAM FPGA designs that wait for configuration. The tray-packed PQFP also suits instrument contract manufacturers doing low-volume, high-mix assembly with inspection-friendly gull-wing leads.
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추천 제품 요약
엔지니어링 참조 데이터: A3PE3000L-1PQ208 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3PE3000L-1PQG208 | A3PE3000L-1PQ208I | A3PE3000L-PQG208I | A3PE3000-1PQG208I |
|---|---|---|---|---|---|
| Package | 208-PQFP (BFQFP) | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Family | ProASIC3L (low power) | ProASIC3L | ProASIC3L | ProASIC3L | ProASIC3E |
| System Gates | 3M | 3M | 3M | 3M | 3M |
| User I/O | 147 | 147 | 147 | 147 | 147 |
| Speed Grade | -1 | -1 | -1 | std | -1 |
| Temperature Grade | Commercial | Commercial | Industrial | Industrial | Industrial |
주요 차별점
- Flash*Freeze ultra-low-power mode (vs A3PE3000-1PQG208I)
- Green/RoHS packaging available in same footprint (vs A3PE3000L-1PQ208I)
- Instant On single-chip configuration (vs SRAM FPGA equivalents (Xilinx/Intel))
- Trade-off: mature 130nm process (vs A3PE3000-1PQG208I)
설계 노트
The 208-PQFP uses 0.5mm lead pitch with gull-wing leads. Design the land pattern per the Microchip PQFP-208 mechanical drawing, with solder-mask-defined pads slightly extended to improve self-alignment during reflow. Route JTAG (TDI/TDO/TMS/TCK) as a short daisy chain with series resistors near the header, since long TCK stubs on PQFP packages cause boundary-scan failures in production programming fixtures.
Provide a dedicated 1.2V core rail and per-bank I/O rails (VCCI). Decouple each VCC/VCCI pin pair with at least one 0.1uF ceramic placed within 3mm of the pin, plus bulk 10uF per rail corner of the package. Estimated: with ~35K LEs active at moderate toggle rates, core current can reach hundreds of milliamps - run Microchip's power estimator (in Libero SoC) with your actual design before sizing the 1.2V converter, rather than sizing from the family headline numbers.
PQFP lead inductance is several times higher than a comparable BGA, so simultaneous switching outputs on a 32-bit bus can generate measurable ground bounce. Stagger output edge rates using the I/O register slew settings in Libero, distribute bus outputs across multiple ground pins/quadrants of the package, and avoid routing clocks on corner pins. For any bank toggling above roughly 100 MHz, run IBIS simulation with the Microchip-supplied PQFP-208 model.
Do not confuse the commercial A3PE3000L-1PQ208 with the industrial A3PE3000L-1PQ208I when generating BOMs for wide-temperature products - the suffix is easily dropped during ECO edits. Also note third-party data marks the non-G version RoHS non-compliant; specify PQG208 for compliant assemblies. Finally, this MPN is a counterfeit target on broker markets: buy from authorized channels and verify date codes against Microchip shipment records.
규정 준수 정보
Third-party data (Quarktwin/Globalspec) lists A3PE3000L-1PQ208I as 'RoHS non-compliant' and 'REACH Unaffected' with MSL 3 (168 hours); use the 'G' suffix (PQG208) variant for RoHS-compliant green packaging. HTSUS 8542.39.0001, ECCN 3A001A7A.