M29W800FT70ZA3SF - 8Mbit NOR Flash 70ns TFBGA48 | Micron
부품 번호: M29W800FT70ZA3SF ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3.2 | $3.20 |
| 10 | $2.9 | $29.00 |
| 100 | $2.55 | $255.00 |
| 500 | $2.3 | $1,150.00 |
| 1,000 | $2.05 | $2,050.00 |
M29W800FT70ZA3SF 개요
Parallel NOR Flash is a non-volatile memory technology that connects directly to a microprocessor's address and data buses, allowing code to be executed in place (XIP, execute-in-place). Within the memory hierarchy, NOR Flash sits alongside SRAM and DRAM as directly addressable memory, distinguished from NAND Flash and serial SPI Flash by its random-access capability and high read reliability. It remains the standard choice for boot code storage in embedded systems.
Key features of this device include the 70 ns access time suitable for zero-wait-state execution on many embedded processors, a 2.7 V to 3.6 V single supply compatible with 3.3 V logic, and 8 Mbit of density organized for byte or word access. The uniform block architecture with boot-block arrangement supports flexible code and data partitioning.
Architecturally, the M29W800FT family uses floating-gate NOR cell technology with block-based erase and program operations managed through a command interface. Status polling and toggle-bit schemes allow the host processor to monitor program and erase completion without interrupts. The extended -40 C to +125 C temperature rating targets harsh industrial and automotive-adjacent environments.
Typical applications include boot-code storage for embedded microcontrollers and microprocessors, industrial automation controllers, networking equipment firmware, set-top boxes, and telecom line cards where in-place code execution is required.
Designers should ensure the 3.3 V supply rail is decoupled locally and observe the block-erase and program timing requirements of the command interface when writing drivers.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet, as of 2026-09-02.
드롭인 대체품: M29W800FT70ZA3SF — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: M29W800FT70ZA3SF (동일 폼 팩터 및 풋프린트) — 차이점: Package, Density, Interface, Memory Type, Organization.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
M29W800FB70ZA3SF
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2.45 / 개
데이터시트 보기 →M29W800FT70ZA6SF
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
M29W800FT70ZS3F
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
M29W800FT70ZA3SF 최대 정격 & 전기적 특성
| 메모리 유형 | NOR Flash |
| Density | 8 Mbit |
| 인터페이스 | Parallel |
| Access Time | 70 ns |
| 공급 전압 | 2.7 V to 3.6 V |
| 동작 온도 | -40C to +125C |
| 패키지 | 48-TFBGA (6 x 8 mm) |
| 실장 유형 | Surface Mount |
| Boot Block Configuration | Top boot block (FT) |
| Package Body Size | 6 x 8 mm |
| Ball Pitch | 0.80 mm |
M29W800FT70ZA3SF 6 x 8 mm 핀 구성 가이드
M29W800FT70ZA3SF(6 x 8 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: M29W800FT70ZA3SF.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
M29W800FT70ZA3SF 적합 용도: 6 애플리케이션s: Embedded Boot Code Storage, Industrial Automation Controllers, Networking and Telecom Equipment, Set-Top Boxes and Consumer Electronics, Automotive-Adjacent and Transportation Electronics, Test and Measurement Instrumentation.
Embedded Boot Code Storage
The M29W800FT70ZA3SF stores boot and application firmware for microcontroller and microprocessor systems that read code in place over a parallel bus. Its 70 ns access time supports zero-wait-state fetches on many 3.3 V embedded processors, and the 8 Mbit density accommodates bootloader plus application images in a single non-volatile device. The top boot block arrangement places reset-vector code at the top of the array, and the 2.7 V to 3.6 V supply allows direct connection to a standard 3.3 V rail without level shifting.
추천
Industrial Automation Controllers
Industrial PLC and motor-control controllers require firmware storage that survives -40 C to +125 C ambient extremes inside sealed cabinets. The M29W800FT70ZA3SF meets this extended temperature rating while providing reliable parallel random access for in-place code execution after power-up. Block-based erase allows field firmware updates of individual code segments without erasing parameter storage blocks, and the 3 V supply integrates directly with industrial 3.3 V logic domains, reducing component count versus 5 V-only legacy Flash solutions.
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Networking and Telecom Equipment
Routers, switches, and telecom line cards traditionally use parallel NOR Flash for bootloader and firmware images because NOR offers the read reliability and random access that code execution demands. The M29W800FT70ZA3SF's 70 ns access time keeps CPU fetch latency low, while the 48-ball TFBGA (6 x 8 mm) package saves board area versus the TSOP48 alternative on dense line cards. The 8 Mbit capacity suits compact boot images, with the parallel interface remaining compatible with mature network processor reference designs.
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Set-Top Boxes and Consumer Electronics
Set-top box and consumer AV platforms use parallel NOR Flash for the secure boot stage that verifies and loads the main application image. The M29W800FT70ZA3SF provides a dependable 3.3 V parallel boot device whose -40 C to +125 C rating covers poorly ventilated consumer enclosures. Its top boot block lets designers isolate the immutable boot loader in protected blocks above field-updatable application regions, and the small 6 x 8 mm TFBGA footprint fits tightly packed mainboard layouts typical of cost-driven consumer hardware.
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Automotive-Adjacent and Transportation Electronics
Telematics units, gateway modules, and instrumentation clustered near automotive cabins experience wide temperature swings; the M29W800FT70ZA3SF's -40 C to +125 C rating covers these environments. Parallel NOR remains the default boot medium where code must execute immediately from reset without a serial-boot intermediary. The 2.7 V to 3.6 V operating window tolerates supply sag during crank or load-dump-adjacent transients better than tighter-spec devices, and the 70 ns access supports the moderate fetch rates of typical transportation MCUs and gateway processors.
추천
Test and Measurement Instrumentation
Bench instruments, data loggers, and portable testers store calibration constants, FPGA configuration images, and instrument firmware in NOR Flash. The M29W800FT70ZA3SF's block architecture separates protected calibration data from re-writable firmware, and its parallel interface supports direct CPU boot in instruments built around mature 16-bit bus architectures. The 70 ns access time keeps boot and menu-response latency low, while the TFBGA package withstands the vibration and thermal cycling typical of portable field equipment better than fine-pitch leaded packages.
추천
추천 제품 요약
엔지니어링 참조 데이터: M29W800FT70ZA3SF — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | M29W800FB70ZA3SF | M29W800FT70ZA6SF | M29W800FT70ZS3F |
|---|---|---|---|---|
| Package | 48-TFBGA (6 x 8 mm) | 48-TFBGA (6 x 8 mm) - same | 48-TFBGA (6 x 8 mm) - same | 48-TFBGA (6 x 8 mm) - same |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Density | 8 Mbit | 8 Mbit | 8 Mbit | 8 Mbit |
| Access Time | 70 ns | 70 ns | 70 ns | 70 ns |
| Supply Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Boot Block Position | Top boot block (FT) | Bottom boot block (FB) | Top boot block (FT) | Top boot block (FT) |
| Drop-in Compatibility | Reference (48-TFBGA, parallel 8 Mbit) | Yes - verify boot block mapping | Yes - verify grade suffix | Yes - verify packaging suffix |
주요 차별점
- Top boot block placement for top-of-memory reset vectors (vs M29W800FB70ZA3SF)
- Extended -40 C to +125 C temperature rating (vs Commercial-grade 0 C to 70 C NOR Flash)
- 70 ns asynchronous parallel access (vs MT25QL128 Quad SPI Flash)
설계 노트
Supply the M29W800FT70ZA3SF from a regulated 3.3 V rail within the 2.7 V to 3.6 V window. Decouple VCC with at least a 0.1 uF ceramic capacitor placed within a few millimeters of the TFBGA power balls, plus one bulk 4.7 uF to 10 uF capacitor per device. Program and erase operations draw current pulses on VCC, so adequate local decoupling prevents brown-out of neighboring logic during block erase.
The 48-TFBGA (6 x 8 mm, 0.80 mm pitch) requires a standard BGA land pattern with via-in-pad or dog-bone fanout on address and data lines. Keep the parallel address/data bus traces length-matched within reason for a 70 ns asynchronous interface - excessive skew is generally tolerable below 50 MHz bus rates, but stubs should be minimized. Confirm the ball map against the Micron M29W800 family datasheet before routing, since the FB and FT variants differ in code placement, not ballout.
Do not confuse FT (top boot block) with FB (bottom boot block) when ordering - code linked against the wrong block map will fail to boot even though the device is otherwise identical. Also verify suffix codes: temperature grade, package, and packaging (tray vs TR reel) are encoded in the ordering part number. When replacing a legacy ST M29W800 part, confirm the -7 speed grade (70 ns) matches the timing assumptions in your bus controller configuration.
규정 준수 정보
Compliance status not stated in the provided web data; consult the Micron product page and material declarations for the M29W800FT70ZA3SF.