M7AFS600-1FG256 - Fusion FPGA 600K Gates 256-FBGA | Microchip
MPN: M7AFS600-1FG256 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $398.2 | $398.20 |
| 10 | $372.5 | $3,725.00 |
| 30 | $340 | $10,200.00 |
| 60 | $258.87 | $15,532.20 |
| 90 | $258.87 | $23,298.30 |
| 100 | $251 | $25,100.00 |
Drop-in alternatives for M7AFS600-1FG256 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
M7AFS600-FG256
✅ Drop-In✓ In Stock
$198.75 / Unit
View Datasheet →M7AFS600-FGG256
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$232.4 / Unit
View Datasheet →M7AFS600-FG256I
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Contact for price
View Datasheet →M7AFS600-2FG484
✅ Drop-In✓ In Stock
$276.95 / Unit
View Datasheet →A3P600-1FG256
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$51.28 / Unit
View Datasheet →A3P600-2FG256
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$57.43 / Unit
View Datasheet →M7AFS600-1FG256 Maximum Ratings & Electrical Characteristics
| Logic Family | Microsemi Fusion (M7AFS600) |
| System Gates | 600K |
| Embedded Processor Core | ARM CoreMP7 (32-bit) |
| Embedded Flash Configuration Memory | 110592 bits |
| Number of User I/O | 119 |
| Core Supply Voltage | 1.5 V |
| Core Supply Voltage Range | 1.425 V to 1.575 V |
| Process Technology | 130 nm flash-based |
| Configuration Type | Non-volatile Flash, single-chip, instant-on |
| Maximum Frequency | 1282.05 MHz (per distributor listing) |
| Package | 256-ball FBGA/LBGA (FG256) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C |
| Packaging | Tray |
| Speed Grade | -1 (standard) |
| Total Package Balls | 256 |
M7AFS600-1FG256 256 Pin Configuration Guide
Complete pinout information for M7AFS600-1FG256 (256 package) with 256 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M7AFS600-1FG256.
Refer to the datasheet for full pin configuration.
Estimated pin count: 256 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M7AFS600-1FG256 is suitable for 6 applications: Power Management and Sequencing, Smart Battery Charging Systems, Motor Control Drives, Industrial Embedded Controllers, Clock Generation and Management, Legacy System Maintenance and Obsolescence Bridging.
Power Management and Sequencing
The M7AFS600-1FG256 is purpose-built for intelligent power management. Its Fusion on-chip analog subsystem monitors multiple supply voltages and die temperature while the 600K-gate flash fabric implements sequencing state machines - all controlled from the embedded ARM CoreMP7 processor. Unlike discrete supervisor ICs, the programmable fabric allows sequencing order and threshold changes in firmware rather than hardware. In a typical topology, the FPGA supervises an industrial 24V-derived multi-rail system with 1.5V core logic consuming only 1.425V-1.575V, and its non-volatile flash configuration means supervision logic is active within microseconds of power-up, before an SRAM FPGA would even begin loading its bitstream.
Recommended
Smart Battery Charging Systems
Battery charger designs benefit directly from the Fusion architecture: the analog front end of the M7AFS600-1FG256 reads charge current, pack voltage, and temperature through its on-chip sensing, while the ARM CoreMP7 runs the charging state algorithm and the flash fabric drives PWM charge-control outputs. Distributor data confirms the family targets 'smart battery charging' explicitly. Because the 256-ball FG256 device is single-chip and instant-on, charge-management logic is live before a host microcontroller boots, protecting the pack from unsafe pre-charge conditions. The 130nm flash process also supports secure storage of charge-profile data on-chip, eliminating an external EEPROM.
Recommended
Motor Control Drives
For industrial motor drives, the M7AFS600-1FG256 combines PWM generation, encoder/resolver interface logic, and protection interlocks in the 600K-gate fabric while the ARM CoreMP7 executes field-oriented control firmware - a two-engine architecture that pure MCUs struggle to match for determinism. Fusion's analog monitors provide over-voltage, over-current, and over-temperature trip detection at hardware speed, latching protection states without software latency. The 119 user I/O in the FG256 package accommodate six PWM phases, feedback interfaces, and communication links. The 1.5V core keeps logic power modest, while the -40C to +85C operating range suits factory-floor drive cabinets.
Recommended
Industrial Embedded Controllers
The embedded ARM CoreMP7 in the M7AFS600-1FG256 lets a single 256-ball chip replace an MCU-plus-FPGA two-chip solution in industrial controllers. Custom peripherals - CAN-like interfaces, stepper sequencers, proprietary protocol engines - are built in the flash fabric and memory-mapped to the processor, achieving deterministic hardware acceleration with C-level software flexibility. Instant-on flash configuration removes the external boot flash and configuration controller required by SRAM FPGAs, improving reliability in electrically noisy factory environments. With 110592 bits of on-chip flash, boot code and golden configuration coexist with the logic design on the same die.
Recommended
Clock Generation and Management
Clock trees in telecom, test, and industrial backplane systems use the M7AFS600-1FG256 to implement glitchless clock multiplexing, dividers, and frequency monitoring with programmable logic, while the Fusion analog subsystem watches clock-derived supply and temperature conditions. The fabric's deterministic routing supports sub-nanosecond skew tuning across the 119 I/O of the FG256 package. Because the configuration is flash-resident, clock-management logic is active within microseconds of board power-up - critical for systems that must gate clocks before volatile devices exit reset. This eliminates discrete CPLD or clock-mux components and their associated qualification burden.
Recommended
Legacy System Maintenance and Obsolescence Bridging
Because the Microsemi Fusion family is mature, the M7AFS600-1FG256 is frequently used to keep legacy industrial and defense platforms alive: it replaces discontinued mixed-signal ASICs and multi-chip supervisory circuits, fitting the original 256-ball FG256 footprint when migrating from related Microsemi parts such as A3P600 devices. The 16-week Mouser lead time as of 2026-09-02 demands proactive lifetime-buy planning, and the pin-related M7AFS600-FG256/FGG256/FG256I variants give procurement multiple orderable codes on the same footprint, spreading allocation risk across distributor inventory while preserving the validated PCB layout.
Recommended
Recommended Products Summary
Engineering reference data for M7AFS600-1FG256 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M7AFS600-FG256 | M7AFS600-FGG256 | M7AFS600-FG256I | A3P600-1FG256 | A3P600-2FG256 |
|---|---|---|---|---|---|---|
| Package | 256-FBGA (FG256) | 256-FBGA (FG256) - same | 256-FBGA (FG256) - same | 256-FBGA (FG256) - same | 256-FBGA (FG256) - same | 256-FBGA (FG256) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600K | 600K | 600K | 600K | 600K | 600K |
| Embedded ARM CoreMP7 | Yes | Yes | Yes | Yes | No (digital-only fabric) | No (digital-only fabric) |
| Analog Subsystem (mixed-signal) | Yes (Fusion) | Yes | Yes | Yes | No | No |
| Core Supply Voltage | 1.5 V (1.425-1.575 V) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | -1 | base | base | base, industrial temp | -1 | -2 (faster) |
| Operating Temperature | -40C to +85C | [DATA_NEEDED] | [DATA_NEEDED] | -40C to +100C (industrial) | [DATA_NEEDED] | [DATA_NEEDED] |
| Unit Price (qty 1) | $398.20 (as of 2026-09-02) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Mixed-signal integration with on-chip analog (vs A3P600-1FG256)
- Embedded ARM processor on-chip (vs A3P600-2FG256)
- Industrial temperature screening available in same footprint (vs M7AFS600-FG256I)
Design Notes
Power the M7AFS600-1FG256 core from a regulated 1.5V rail held within 1.425V to 1.575V (per Mouser series data). Because the Fusion flash fabric is non-volatile, sequencing constraints are relaxed versus SRAM FPGAs, but still verify I/O bank rail sequencing against the Fusion datasheet power-up specification. Estimate core current from your design utilization using Microchip's power calculator in Libero before fixing regulator sizing; 119 simultaneously switching outputs can dominate total power in high-fan-out designs.
The FG256 256-ball FBGA (typically 1.0 mm or finer ball pitch for this family) requires via-in-pad or dog-bone fanout with at least one buried via layer for inner-row escape. Follow the Fusion datasheet PCB layout guidelines: solid ground plane directly under the die, short low-inductance vias for core and I/O bank decoupling, and placed 0.1uF plus bulk capacitors per bank. Copy the exact land pattern from the package drawing to guarantee compatibility with the FGG (Pb-free ball) variant later.
Plan for sourcing risk: Mouser lists this part as non-stocked with a 16-week lead time as of 2026-09-02, so a lifetime buy or dual-sourcing decision is needed for production. Do not confuse the FG256 and FG484 package codes during BOM entry - they are not footprint-compatible. Also confirm the analog pin assignments in your Libero I/O constraint file match the datasheet ball map; analog balls on the Fusion die are not freely interchangeable with user I/O.
Compliance Information
The FGG suffix within the Fusion family generally denotes Pb-free/RoHS ball finish, but RoHS status of this specific -1FG256 ordering code was not stated in the provided web data; confirm on the Microchip product page or datasheet.
