M7AFS600-2FGG484I - 600K-Gate Fusion FPGA, 172 I/O | Microchip
부품 번호: M7AFS600-2FGG484I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $293.67 | $293.67 |
| 10 | $278.99 | $2,789.90 |
| 100 | $264.31 | $26,431.00 |
| 500 | $252.56 | $126,280.00 |
| 1,000 | $243.75 | $243,750.00 |
M7AFS600-2FGG484I 개요
A Fusion FPGA is a flash-based field programmable gate array that combines programmable logic fabric with mixed-signal peripherals such as analog-to-digital conversion, voltage/temperature monitoring, and RTC functionality on a single die. Within the system hierarchy, FPGAs sit between fixed-function ASICs and general-purpose microcontrollers, offering hardware parallelism with in-field reconfigurability. The Fusion family was originally developed by Actel, later Microsemi, and is now sold under the Microchip Technology brand.
Key differentiating features include nonvolatile flash programming (no external configuration PROM required at power-up, instant-on operation), live probe/debug capability, and integrated analog subsystem blocks that reduce external component count. The -2 speed grade supports system frequencies up to 1470.59 MHz internal equivalent timing as listed by distributors, and the 484-FBGA footprint provides generous routing escape for the 172 I/O.
Technically, the device uses 130nm flash-based fabrication with 110592 bits of distributed resource as reported by DigiKey listing data, plus embedded blocks suitable for soft ARM CoreMP7 processor instantiation. The M7 prefix denotes the military/extended temperature screening variant of the AFS600 Fusion device; the I suffix denotes the industrial -40C to +85C range.
Typical applications include industrial automation controllers, medical instrumentation, communications line cards, avionics interfaces, and test equipment, where single-chip integration of logic, analog monitoring, and processing lowers BOM cost and board area.
When designing with this part, plan power sequencing around the 1.5V core and 3.3V I/O banks, and verify FBGA reflow profiles per the manufacturer packaging data.
This page synthesizes distributor pricing, same-brand drop-in alternatives, and design notes not found in a single manufacturer datasheet.
드롭인 대체품: M7AFS600-2FGG484I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: M7AFS600-2FGG484I (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Process Technology, Speed Grade, Maximum Operating Frequency.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
M7AFS600-2FG484I
✅ 드롭인✓ 재고 있음
$272.01 / 개
데이터시트 보기 →M7AFS600-FGG484I
✅ 드롭인✓ 재고 있음
$219.2 / 개
데이터시트 보기 →M7AFS600-1FGG484I
✅ 드롭인✓ 재고 있음
$228 / 개
데이터시트 보기 →M1AFS600-2FG484I
✅ 드롭인✓ 재고 있음
$97.6 / 개
데이터시트 보기 →M7AFS600-2FGG484I 최대 정격 & 전기적 특성
| Family | Fusion (M7 military/extended screening) |
| System Gates | 600K |
| Number of I/O | 172 |
| Core Supply Voltage | 1.5 V |
| 패키지 | 484-BGA (FBGA) |
| Ball Pitch | 1 mm |
| Speed Grade | -2 |
| Internal Timing Frequency (listed) | 1470.59 MHz |
| Process Technology | 130 nm |
| Configuration Technology | Flash-based, nonvolatile |
| Processor Support | ARM CoreMP7 |
| 동작 온도 | -40C to +85C |
| 장착 스타일 | SMD/SMT |
| Packaging | Tray |
| Series | M7AFS600 |
| Programmable Resource (DigiKey listing) | 110592 |
M7AFS600-2FGG484I 484-bga (fbga) 핀 구성 가이드
M7AFS600-2FGG484I(484-bga (fbga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: M7AFS600-2FGG484I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
M7AFS600-2FGG484I 적합 용도: 6 애플리케이션s: Industrial Automation Controllers, Avionics and Defense Interface Electronics, Medical Instrumentation, Communications Line Cards, Test and Measurement Equipment, Security and Surveillance Systems.
Industrial Automation Controllers
Industrial PLC and motion-control controllers benefit directly from the M7AFS600-2FGG484I's combination of 600K system gates, 172 user I/O, and flash-based instant-on configuration. Because the fabric is nonvolatile, the controller is operational within microseconds of power application - critical for safety interlocks and machine sequencing - and no external configuration flash is required on a noisy factory floor. The integrated mixed-signal monitoring blocks supervise board voltage and temperature, replacing discrete supervisory ICs and reducing BOM count. The 172 I/O support multiple banks of 3.3V-class interfaces such as SPI, UART, and parallel fieldbus glue logic, while the ARM CoreMP7 support enables soft-processor control loops alongside deterministic hardware state machines. The -40C to +85C range covers unconditioned cabinets and outdoor panels.
추천
Avionics and Defense Interface Electronics
The M7 prefix of the M7AFS600-2FGG484I denotes Microsemi's military/extended screening flow, which is exactly why defense and avionics integrators select it over the commercial AFS600. In interface applications - MIL-STD bus glue logic, sensor aggregation, and discrete-to-digital conversion - the 600K-gate flash fabric provides single-chip integration with instant-on behavior and configuration tamper resistance inherent to flash technology. The industrial-to-military extended screening, combined with the -40C to +85C (and better, per program flow) temperature coverage and 484-FBGA mechanical robustness, suits conduction-cooled embedded boards. Designers instantiate the ARM CoreMP7 soft processor for protocol handling while reserving fabric for deterministic timing-critical paths, and the nonvolatile boot eliminates configuration PROMs from high-vibration assemblies.
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Medical Instrumentation
Medical diagnostic devices - patient monitors, imaging front-end controllers, and lab analyzers - use the M7AFS600-2FGG484I to consolidate timing, interface, and supervisory logic in one 600K-gate device. The Fusion family's integrated voltage and temperature monitoring supports the continuous self-test records expected in IEC 60601-class equipment documentation, while flash configuration guarantees deterministic startup without configuration download delays. With 172 I/O the device bridges sensor arrays, communication ports, and display interfaces; the -2 speed grade provides timing headroom for high-rate data paths. Because the fabric is live-probe debug capable, firmware and RTL verification during design validation is simplified. The 484-FBGA with 1 mm pitch assembles on standard medical-grade SMT lines without exotic reflow profiles.
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Communications Line Cards
Telecom and datacom line cards deploy the M7AFS600-2FGG484I as backplane interface glue: framing logic, status aggregation, LED/drivers, and I2C/SMD management-bus arbitration. The 600K-gate capacity absorbs protocol state machines while the 172 I/O terminate card-edge and backplane signals across multiple I/O banks. Flash-based configuration with instant-on lets the card participate in hot-swap bring-up sequencing immediately, and the Fusion analog block reports card voltage/current telemetry to the shelf manager without a separate microcontroller. Distributor timing figures for the -2 grade (1470.59 MHz internal class) leave margin for fast serial interfacing at moderate rates. The -40C to +85C rating accommodates central-office ambient specifications, and the FBGA footprint routes cleanly on controlled-impedance backplane boards.
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Test and Measurement Equipment
Bench and automated test instruments use the M7AFS600-2FGG484I for channel control logic, trigger engines, and host-interface bridging. The nonvolatile flash fabric means the instrument is ready the moment power is applied, and live-probe debug allows engineers to inspect internal nodes during system bring-up - a workflow advantage unique to Actel-lineage flash FPGAs. With 600K gates and 172 I/O, the part implements multichannel pattern generators and acquisition state machines while the ARM CoreMP7 soft processor runs housekeeping and communication stacks (USB/UART/GPIB bridges). The -2 speed grade timing margin supports fast counter/timer paths. Its 1.5V core keeps dynamic power acceptable in fanless instruments, and the 484-FBGA package simplifies signal escape on dense mainboards.
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Security and Surveillance Systems
High-end surveillance and access-control platforms use the M7AFS600-2FGG484I to aggregate camera interfaces, tamper switches, and network PHY glue logic into a single 600K-gate fabric. The 172 I/O terminate parallel sensor buses and discrete alarm inputs across isolated I/O banks, while flash configuration provides instant-on monitoring with no boot window - important for security appliances expected to log from the moment mains power appears. The integrated analog monitoring reports enclosure temperature and rail health to the system controller. The -40C to +85C industrial range supports outdoor camera enclosures, and the ARM CoreMP7 support handles network stack offload. The 484-FBGA footprint also permits thermal-friendly placement across multilayer PCBs in fanless NVR housings.
추천
추천 제품 요약
엔지니어링 참조 데이터: M7AFS600-2FGG484I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | M7AFS600-2FG484I | M7AFS600-FGG484I | M7AFS600-1FGG484I | M1AFS600-2FG484I |
|---|---|---|---|---|---|
| Package | 484-BGA (FBGA) | 484-BGA (FBGA) - same | 484-BGA (FBGA) - same | 484-BGA (FBGA) - same | 484-BGA (FBGA) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600K | 600K | 600K | 600K | 600K |
| User I/O | 172 | 172 | 172 | 172 | 172 |
| Speed Grade | -2 | -2 | Standard | -1 | -2 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Screening Flow | M7 military/extended | M7 military/extended | M7 military/extended | M7 military/extended | Standard commercial |
| Configuration | Flash, nonvolatile | Flash, nonvolatile | Flash, nonvolatile | Flash, nonvolatile | Flash, nonvolatile |
주요 차별점
- Faster -2 speed grade timing (vs M7AFS600-1FGG484I)
- Lead-free FGG ball finish (vs M7AFS600-2FG484I)
- M7 military screening flow (vs M1AFS600-2FG484I)
설계 노트
Plan the power tree around a 1.5V core rail plus per-bank I/O voltages (3.3V-class per distributor listings). Fusion flash FPGAs are instant-on, but confirm inrush and sequencing against the family datasheet DC characteristics before fixing the regulator order. Estimate: at typical mid-density utilization, core current for a 600K-gate 130nm flash fabric is generally in the hundreds of milliamps - validate with Microchip Libero power analysis for your actual RTL rather than assuming. Decouple each supply ball cluster with bulk plus 0.1uF ceramics per Microsemi power application notes.
The 484-ball FBGA at 1 mm pitch requires a via-in-pad or dog-bone escape strategy on at least four signal layers to fan out all 172 user I/O plus power/ground balls. Follow the recommended land pattern in the Microsemi packaging document and use NSMD pads. Because the M7AFS600 is flash-based, no configuration PROM routing is needed, freeing board area - but reserve routing for JTAG/live-probe access headers, which are invaluable for debug on this family.
Do not confuse ordering-code suffixes when procuring: FGG denotes lead-free ball finish while FG denotes standard finish, and -1/-2 denote speed grades with measurably different timing (about 1.28 GHz-class vs 1470.59 MHz-class internal timing per Xecor/distributor comparisons). Mixing grades on one BOM can fail static timing at board test. Also, treat cross-brand FPGAs (Xilinx/AMD, Intel/Altera) as non-drop-in: different pinout, tools, and configuration architecture make replacement a full redesign.
규정 준수 정보
FGG ordering code denotes lead-free ball finish per Microsemi naming convention. Formal RoHS/REACH certificates should be pulled from the Microchip compliance portal for the exact order code; M7 screened parts may carry program-specific documentation.