MC68331CFC25 - 32-Bit 25MHz ROMless MCU | NXP
부품 번호: MC68331CFC25 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $16.9121 | $16.91 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
MC68331CFC25 개요
A microcontroller is a semiconductor that integrates a processor core, memory interface, peripherals, and control logic into one device. The MC68331 belongs to the MCU32 embedded-processing hierarchy and uses a common intermodule bus, or IMB, to connect its internal modules. This architecture makes it useful where a system needs deterministic control, serial communication, timer functions, and external memory access without a dedicated host processor.
The verified device identity specifies a 32-bit architecture, 25 MHz operating frequency, ROMless configuration, and 132-PQFP package. The MC68331CFC25 suffix indicates a specific package, temperature, and speed ordering configuration, but detailed electrical limits, memory sizes, peripheral ratings, and operating-temperature values were not included in the supplied verified data. Those parameters are therefore not inferred here. The manufacturer’s product page is the appropriate source for confirming the complete technical configuration before design-in.
Typical application domains include industrial equipment, communications controllers, motion or sequencing systems, and other embedded platforms that benefit from the CPU32 architecture. In a typical design, the CPU32 executes control software from external memory, while the SIM, GPT, and QSM modules support system integration, timing, and serial communication. The 132-pin PQFP package provides a substantial pin count for external bus, memory, peripheral, control, and signal connections.
The primary design consideration is that the MC68331 is ROMless: external memory is required for program storage or data storage according to the system architecture. Engineers should verify memory-interface compatibility, peripheral multiplexing, pin assignments, clock requirements, and electrical constraints against the manufacturer datasheet before layout or firmware deployment.
This page consolidates the verified distributor identity, manufacturer architecture description, package information, sourcing links, and engineering limitations for MC68331CFC25. It intentionally avoids unsupported claims about unprovided electrical specifications and distinguishes confirmed facts from data requiring a datasheet review.
드롭인 대체품: MC68331CFC25 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC68331CFC25 (동일 폼 팩터 및 풋프린트) — 차이점: Intermodule Bus, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC68331CFC25
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →MC68331CAG25
✅ 드롭인✓ 재고 있음
$14.5 / 개
데이터시트 보기 →MC68331CFC25 최대 정격 & 전기적 특성
| Product Type | 32-bit microcontroller IC |
| Processor Core | CPU32 |
| Architecture | 32-bit |
| Operating Frequency | 25 MHz |
| Program Memory | ROMless |
| 패키지 | 132-PQFP |
| Package Body Size | 24.13 mm x 24.13 mm |
| Intermodule Bus | IMB |
| System Integration Module | SIM |
| General Purpose Timer | GPT |
| Queued Serial Module | QSM |
| Data Manipulation | High-performance |
| Manufacturer | Freescale Semiconductor, represented by NXP Semiconductors |
| 실장 유형 | Surface mount |
MC68331CFC25 24.13 mm x 24.13 mm 핀 구성 가이드
MC68331CFC25(24.13 mm x 24.13 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MC68331CFC25.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MC68331CFC25 적합 용도: 6 애플리케이션s: Industrial Embedded Control, Communications Controller, Motor and Motion Sequencing, Data Acquisition and Signal Conditioning, Legacy Equipment Maintenance, Embedded Test and Measurement.
Industrial Embedded Control
The MC68331CFC25 fits legacy industrial embedded-control platforms that need a 32-bit CPU32 processor with dedicated system-integration and timing resources. Its 25 MHz verified operating frequency provides a defined processing target for control loops, sequencing, and supervisory logic, while the 132-PQFP package offers many external connections for memory and peripheral circuitry. Because the device is ROMless, the implementation must provide external program storage and must be checked for the required bus timing. The supplied data does not confirm industrial temperature or EMC qualification, so qualification requirements should remain separate from functional suitability.
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Communications Controller
The MC68331CFC25 is suitable for evaluating communications-controller designs based on the CPU32 and Queued Serial Module architecture. The QSM provides a relevant serial-processing resource, while the SIM and IMB support integration with other internal modules. Its 25 MHz CPU32 core can coordinate message handling and supervisory functions when the system is designed around the documented external-memory arrangement. The supplied data does not identify specific baud rates, protocol modes, electrical interfaces, or transceiver levels, so those parameters must be verified before selecting a physical communications link.
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Motor and Motion Sequencing
The General Purpose Timer and CPU32 processing core make the MC68331CFC25 a candidate for motor sequencing and motion-control supervisory functions where legacy architecture continuity matters. The MCU can coordinate timing events, state machines, interlocks, and external I/O in a system that already depends on the MC68331 platform. The verified 25 MHz frequency is a concrete baseline, but motor-drive performance depends on unprovided PWM resolution, capture features, electrical limits, and timer specifications. Those details must be confirmed in the manufacturer documentation before claiming direct suitability for a new motor drive.
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Data Acquisition and Signal Conditioning
MC68331CFC25 can be evaluated in data-acquisition and signal-conditioning controllers that require a 32-bit processor, timers, serial communications, and external memory. The CPU32 can manage sampling coordination and control sequences, while GPT and QSM resources support timing and data-transfer functions. Its ROMless configuration favors systems already designed around external memory, but it also increases the importance of bus timing and memory-device validation. No ADC, DAC, input-voltage, sampling-rate, or sensor-interface specifications were provided, so analog front-end selection must be handled separately.
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Legacy Equipment Maintenance
The MC68331CFC25 is particularly relevant to maintenance and continuation projects for equipment built around the Freescale CPU32 architecture. A ROMless 132-PQFP device can preserve an existing board architecture when the original MCU, firmware model, and external memory arrangement are already designed in. The verified package dimensions and device identity help identify the correct physical part, but replacement approval still requires pin-level comparison, electrical-limit comparison, and legacy software validation. Engineers should avoid assuming that another 32-bit MCU is interchangeable solely because it has a similar instruction or control-system role.
추천
Embedded Test and Measurement
The MC68331CFC25 can serve as a controller in legacy test and measurement equipment where a CPU32 processor, timers, serial communications, and external memory are needed. Its 25 MHz operating point and integrated SIM, GPT, and QSM modules provide a defined platform for sequencing tests and exchanging results with external equipment. The supplied source does not specify measurement accuracy, instrumentation interfaces, isolation, or temperature range, so those requirements must be implemented outside the MCU and validated at system level. This part is best considered for continuity designs rather than an unqualified replacement for a modern dedicated instrument controller.
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추천 제품 요약
엔지니어링 참조 데이터: MC68331CFC25 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC68331 |
|---|---|---|
| Package | 132-PQFP | 132-PQFP package family identity; exact suffix not verified |
| Brand | NXP Semiconductors | NXP Semiconductors |
| Processor Core | CPU32 | CPU32 |
| Architecture | 32-bit | 32-bit |
| Intermodule Bus | IMB | IMB |
| Peripheral Modules | SIM, GPT, QSM | SIM, GPT, QSM |
| Drop-In Confirmation | Target device | Family identity only; exact suffix compatibility not verified |
주요 차별점
- Confirmed CPU32 identity (vs STM32F103)
- ROMless architecture (vs TMS320F2808)
- Specific 132-PQFP identity (vs MPC5554)
- Integrated module set (vs Generic MCU32 family parts)
설계 노트
Treat the 132-PQFP package and 24.13 mm x 24.13 mm body dimensions as the starting point for mechanical layout, but obtain the official package drawing before defining the land pattern. The complete MC68331CFC25 pinout was not present in the verified data, so do not infer signal names or pin numbers from a generic PQFP library. Check pin clearances, thermal or ground pins, and assembly tolerances against the manufacturer package data.
The MC68331CFC25 is ROMless, so power budgeting must include the external memory and any external interface circuitry rather than treating the MCU as a self-contained flash device. Determine core, I/O, and external supply requirements from the official electrical specifications before selecting regulators or power sequencing. Do not use an inferred voltage range; the supplied data does not contain operating voltage or current limits.
Do not substitute a generic 32-bit MCU based only on CPU word length or broad application similarity. MPC5554, TMS320F2808, and STM32F103 appear in the supplied search results as similar controllers, but the results do not verify a common footprint, pinout, memory map, interrupt architecture, or peripheral compatibility. For MC68331CFC25 replacement, perform a complete datasheet and firmware review and prototype the candidate before production release.
Use the manufacturer’s electrical and package thermal data to evaluate dissipation; no thermal resistance or power-consumption values were supplied in the verified web data. Because the device includes a 32-bit processor and external-memory interface, calculate the complete system thermal path rather than the MCU alone. Use the actual clock, load, supply voltage, package orientation, and board copper area in any later thermal estimate.
규정 준수 정보
Compliance information was not included in the supplied verified web data. Do not infer RoHS, REACH, automotive qualification, lead-free status, or conflict-minerals status.
