MCF5274CVM166 - 166MHz 32-Bit ROMless MPU | NXP | BGA
부품 번호: MCF5274CVM166 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $51.2009 | $51.20 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
MCF5274CVM166 개요
A microprocessor is a programmable control component that executes instructions and coordinates memory, communication, and peripheral functions. In the broader semiconductor hierarchy, this device belongs to embedded processors, then 32-bit RISC processors, then integrated microprocessors and system-on-chip devices. Its ROMless architecture separates the processor from embedded program memory, allowing system designers to select external storage according to firmware size, boot requirements, update strategy, and product configuration.
The verified product listing identifies a ColdFire V2 core, 166 MHz clocking, and a 256-map BGA package. Search results also associate the device with connection, protection, and peripheral choices intended for cost-sensitive, power-conscious applications requiring significant control processing for file management, connectivity, data buffering, and user-interface functions. Because the excerpted data does not provide the complete peripheral list, core dimensions, memory interface details, or electrical timing tables, those values should be confirmed in the manufacturer hardware specification before schematic capture.
This processor is relevant to industrial control equipment, embedded network controllers, file-management systems, data buffers, and human-machine interfaces. Its 166 MHz rating favors workloads that need more control headroom than lower-clock ColdFire implementations, while ROMless operation permits storage to be scaled independently. The tradeoff is board complexity: external memory and a large fine-pitch BGA require careful routing, decoupling, assembly capability, and firmware verification.
For new or replacement hardware, use a 256-map BGA-specific footprint and follow the manufacturer’s pin, voltage, clock, memory-interface, and decoupling guidance. Do not infer compatibility from the 166 MHz suffix alone. Confirm the complete ordering code, package drawing, exposed-pad requirements, operating-temperature grade, and board revision before release to production.
This page combines verified manufacturer and distributor identity data with package, lifecycle, sourcing, and design guidance. It also distinguishes documented facts from missing electrical details and avoids presenting unverified alternatives as drop-in replacements.
드롭인 대체품: MCF5274CVM166 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MCF5274CVM166 (동일 폼 팩터 및 풋프린트) — 차이점: Mounting Type, Operating Temperature, Package, Program Memory Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청MCF5274CVM166 최대 정격 & 전기적 특성
| Product Type | 32-bit ROMless integrated microprocessor |
| Processor Core | ColdFire V2 |
| 최대 클록 주파수 | 166 MHz |
| Instruction Width | 32 bit |
| Program Memory Type | ROMless |
| External Oscillator | External |
| 패키지 | 256-map BGA, 17 mm x 17 mm |
| 실장 유형 | Surface mount |
| Nominal I/O Supply Voltage | 2.5 V / 3.3 V |
| Core Supply Range in Cross-Reference Result | 1.4 V to 1.6 V |
| 동작 온도 | -40°C to 85°C |
| RAM Organization Reported by Third-Party Listing | 64K x 8 |
MCF5274CVM166 256-map bga, 17 mm x 17 mm 핀 구성 가이드
MCF5274CVM166(256-map bga, 17 mm x 17 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MCF5274CVM166.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MCF5274CVM166 적합 용도: 6 애플리케이션s: Industrial Embedded Control, Connectivity Controller, Data Buffer and File Management, Human-Machine Interface Controller, Data Acquisition Gateway, Cost-Sensitive Embedded Platform.
Industrial Embedded Control
MCF5274CVM166 fits an existing industrial controller that needs a 166 MHz, 32-bit ColdFire V2 processor for coordinated control tasks, connectivity handling, and local data management. Its ROMless configuration allows program memory to be selected separately from the processor, supporting controlled boot code, field updates, or code partitioning. The important qualification is lifecycle status: NXP lists the part as NRND, so a new machine platform should include an approved migration plan. Board bring-up must follow the official 256-map BGA layout, power sequencing, external memory, and decoupling requirements.
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Connectivity Controller
The MCF5274CVM166 can serve as the control processor in an embedded connectivity appliance where protocol handling, buffering, and real-time management need more processing headroom than a low-rate 8- or 16-bit controller. The verified 166 MHz, 32-bit ColdFire V2 architecture is relevant to gateways or embedded network equipment, while ROMless operation permits external storage sized to firmware and recovery requirements. Exact MAC, PHY, serial-interface, protocol, and electrical specifications are not present in the supplied excerpts and must be checked before assigning network ports.
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Data Buffer and File Management
MCF5274CVM166 is applicable to systems that move or organize data between local storage and external interfaces, because NXP identifies file management, data buffering, and user-interface processing as target workloads. The 32-bit ColdFire V2 core operates at 166 MHz, while ROMless construction leaves program-memory implementation flexible. For a design, confirm the required external-memory width, timing, protocol engines, DMA behavior, cache implications, and boot topology in the manufacturer hardware specification; those details are not fully visible in the verified search results.
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Human-Machine Interface Controller
The processor’s 166 MHz 32-bit architecture is suitable for coordinating display, input, storage, and communications in an embedded HMI. A ColdFire V2 system can divide control tasks from user-interface updates without relying on a separate host processor, while ROMless operation enables storage choices that match firmware size. Actual suitability depends on display-interface availability, external memory, graphics requirements, and latency; these parameters are absent from the verified excerpts and should not be inferred from processor frequency alone.
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Data Acquisition Gateway
MCF5274CVM166 can coordinate acquisition, local buffering, and upstream communication in a gateway whose firmware is already qualified around the ColdFire platform. Its 166 MHz 32-bit core provides processing capacity for protocol conversion and data organization, and ROMless operation makes external program storage possible. Engineers must still verify analog interfaces, ADC resources, timer availability, memory interfaces, and I/O voltage tolerances from the full hardware document. For new safety- or longevity-sensitive programs, compare a current processor because this MPN is NRND.
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Cost-Sensitive Embedded Platform
MCF5274CVM166 matches legacy cost-sensitive platforms that already depend on its ColdFire V2 software ecosystem, external-memory architecture, and 256-map BGA assembly process. Its 166 MHz clock offers useful control-processing margin without requiring embedded ROM, allowing the same processor family to serve multiple product variants with different memory configurations. The engineering compromise is long-term risk: the device is NRND, and the verified data does not provide a modern security inventory or lifecycle roadmap. Production teams should document obsolescence monitoring and a tested migration path.
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추천 제품 요약
엔지니어링 참조 데이터: MCF5274CVM166 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
주요 차별점
- Exact 166 MHz verified operating point (vs MCF5272VM66J)
- Documented 256-map BGA package (vs MCF5474ZP266)
- ROMless flexibility for external program storage (vs MCF51AC256BVLKE)
설계 노트
Do not design the supply rails from catalog snippets alone. The verified results mention 2.5 V and 3.3 V I/O operation plus a third-party report of a 1.4 V to 1.6 V core range, implying separate power considerations. Confirm nominal voltage, tolerance, startup sequence, current limits, and decoupling directly from the NXP hardware specification before schematic release.
The 256-map BGA requires an exact manufacturer land pattern, via configuration, solder-mask definition, and paste stencil. Preserve the documented ball numbering orientation and provide unobstructed inspection and X-ray access. Because the verified excerpts do not include the pinout, do not create a board footprint by copying a generic 256-ball library symbol.
ROMless does not mean memory optional; the design still needs boot and application storage through the verified external-memory architecture. Review bus timing, reset behavior, clock source requirements, and firmware image layout in the family hardware specification. Also treat the 166 MHz rating as a maximum operating point and validate power, signal integrity, and temperature across the complete clock range.
The supplied data does not provide power dissipation, junction temperature, or package thermal resistance, so a defensible thermal estimate cannot be calculated. For production hardware, measure or model worst-case core and I/O activity using the manufacturer power data, account for ambient temperature and board copper, and define a thermal-control and derating strategy appropriate to the final enclosure.
규정 준수 정보
The verified excerpts do not provide formal RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. No compliance claim should be inferred from the distributor listing.
