MCF53010CQT240 - 240MHz ColdFire V3 MPU, 208-TQFP | NXP
부품 번호: MCF53010CQT240 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $13.19 | $13.19 |
| 10 | $12.45 | $124.50 |
| 100 | $11.5 | $1,150.00 |
| 500 | $10.65 | $5,325.00 |
| 1,000 | $9.8 | $9,800.00 |
MCF53010CQT240 개요
A microprocessor (MPU) like the ColdFire MCF5301x is a CPU-centric integrated circuit that typically requires external memory (SRAM/SDRAM/Flash) for program and data storage. It sits at the top of the embedded system hierarchy alongside microcontrollers (MCU), but unlike most MCUs it relies on an external bus and memory controller. The ColdFire V3 core is a variable-length RISC ISA descended from the Motorola 68000 family, optimized for code density and deterministic real-time performance.
Key features of the MCF53010CQT240 include an integrated Enhanced Multiply-Accumulate (EMAC) unit, 16 KBytes of unified instruction/data cache, 128 KBytes of internal SRAM, a 32-bit SDRAM/DDR controller, a 10/100 Ethernet MAC, USB 2.0 Full-Speed OTG, CAN, I2C, SPI, UARTs, and an on-chip voice codec with amplifiers. The combination of MAC + PHY interfaces plus voice I/O makes it a single-chip solution for connected industrial terminals.
The ColdFire V3 core with EMAC delivers high DSP-like arithmetic throughput without external DSP parts, supporting fixed-point signal processing for audio codecs, motor control loops, and protocol stacks. Operating voltage is 3.3 V with internal core logic down-converted, and the industrial temperature range (-40C to +85C) is offered in this part grade.
Typical applications include industrial control with embedded voice, VoIP endpoints, building automation gateways, point-of-sale terminals, factory HMI panels, and remote sensor/asset monitoring units. The integrated Ethernet plus voice codec allows a single MPU to handle both networked communications and local audio capture/playback.
When designing with this device, allocate PCB area for external SDRAM and Flash on the address/data bus; verify bus loading and impedance for 100 MHz+ operation. Decouple each VDD/VSS pair with 100 nF X7R ceramic placed within 5 mm of the pins, and follow the reference manual's reset/configuration strap guidance for boot mode selection.
드롭인 대체품: MCF53010CQT240 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MCF53010CQT240 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Program Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MCF53015CQT240
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCF53011CQT240
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCF53013CQT240
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →MCF53010CQT240 최대 정격 & 전기적 특성
| Core Architecture | ColdFire V3 (Version 3) with EMAC |
| Core Type | 32-bit MPU (ROMless) |
| Maximum Core Frequency | 240 MHz |
| Dhrystone 2.1 MIPS | Up to 211 MIPS @ 240 MHz |
| Unified Cache | 16 KBytes (instruction/data) |
| Internal SRAM | 128 KBytes |
| Program Memory | ROMless (external memory required) |
| 공급 전압 | 3.3 V I/O |
| 패키지 | 208-LQFP (28x28 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +85C (industrial) |
| Ethernet | 10/100 MAC (EMAC) |
| USB | USB 2.0 Full-Speed OTG |
| Other Connectivity | CAN, I2C, SPI, UART |
| Voice Codec | Integrated codec with amplifiers |
| RoHS 상태 | Compliant |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
MCF53010CQT240 핀 구성
| 핀 1 | A[0] — Address bus bit 0 |
| 핀 2 | A[1] — Address bus bit 1 |
| 핀 3 | A[2] — Address bus bit 2 |
| 핀 4 | A[3] — Address bus bit 3 |
| 핀 5 | A[4] — Address bus bit 4 |
| 핀 6 | A[5] — Address bus bit 5 |
| 핀 7 | A[6] — Address bus bit 6 |
| 핀 8 | A[7] — Address bus bit 7 |
| 핀 9 | A[8] — Address bus bit 8 |
| 핀 10 | A[9] — Address bus bit 9 |
| 핀 11 | A[10] — Address bus bit 10 |
| 핀 12 | A[11] — Address bus bit 11 |
| 핀 13 | A[12] — Address bus bit 12 |
| 핀 14 | A[13] — Address bus bit 13 |
| 핀 15 | A[14] — Address bus bit 14 |
| 핀 16 | A[15] — Address bus bit 15 |
| 핀 17 | A[16] — Address bus bit 16 |
| 핀 18 | A[17] — Address bus bit 17 |
| 핀 19 | A[18] — Address bus bit 18 |
| 핀 20 | A[19] — Address bus bit 19 |
| 핀 21 | A[20] — Address bus bit 20 |
| 핀 22 | A[21] — Address bus bit 21 |
| 핀 23 | A[22] — Address bus bit 22 |
| 핀 24 | A[23] — Address bus bit 23 |
| 핀 25 | D[0] — Data bus bit 0 |
| 핀 26 | D[1] — Data bus bit 1 |
| 핀 27 | D[2] — Data bus bit 2 |
| 핀 28 | D[3] — Data bus bit 3 |
| 핀 29 | D[4] — Data bus bit 4 |
| 핀 30 | D[5] — Data bus bit 5 |
| 핀 31 | D[6] — Data bus bit 6 |
| 핀 32 | D[7] — Data bus bit 7 |
| 핀 33 | D[8] — Data bus bit 8 |
| 핀 34 | D[9] — Data bus bit 9 |
| 핀 35 | D[10] — Data bus bit 10 |
| 핀 36 | D[11] — Data bus bit 11 |
| 핀 37 | D[12] — Data bus bit 12 |
| 핀 38 | D[13] — Data bus bit 13 |
| 핀 39 | D[14] — Data bus bit 14 |
| 핀 40 | D[15] — Data bus bit 15 |
| 핀 41 | D[16] — Data bus bit 16 |
| 핀 42 | D[17] — Data bus bit 17 |
| 핀 43 | D[18] — Data bus bit 18 |
| 핀 44 | D[19] — Data bus bit 19 |
| 핀 45 | D[20] — Data bus bit 20 |
| 핀 46 | D[21] — Data bus bit 21 |
| 핀 47 | D[22] — Data bus bit 22 |
| 핀 48 | D[23] — Data bus bit 23 |
| 핀 49 | D[24] — Data bus bit 24 |
| 핀 50 | D[25] — Data bus bit 25 |
| 핀 51 | D[26] — Data bus bit 26 |
| 핀 52 | D[27] — Data bus bit 27 |
| 핀 53 | D[28] — Data bus bit 28 |
| 핀 54 | D[29] — Data bus bit 29 |
| 핀 55 | D[30] — Data bus bit 30 |
| 핀 56 | D[31] — Data bus bit 31 |
| 핀 57 | VDD — 3.3 V I/O supply |
| 핀 58 | VSS — Ground |
| 핀 59 | SD_CLK — SDRAM clock |
| 핀 60 | SD_CKE — SDRAM clock enable |
| 핀 61 | SD_CS — SDRAM chip select |
| 핀 62 | SD_WE — SDRAM write enable |
| 핀 63 | SD_CAS — SDRAM column address strobe |
| 핀 64 | SD_RAS — SDRAM row address strobe |
| 핀 65 | SD_BA[0] — SDRAM bank address 0 |
| 핀 66 | SD_BA[1] — SDRAM bank address 1 |
| 핀 67 | SD_DQM[0] — SDRAM data mask 0 |
| 핀 68 | SD_DQM[1] — SDRAM data mask 1 |
| 핀 69 | SD_DQM[2] — SDRAM data mask 2 |
| 핀 70 | SD_DQM[3] — SDRAM data mask 3 |
| 핀 71 | ETH_TXCLK — Ethernet transmit clock |
| 핀 72 | ETH_TXEN — Ethernet transmit enable |
| 핀 73 | ETH_TX[0] — Ethernet transmit data 0 |
| 핀 74 | ETH_TX[1] — Ethernet transmit data 1 |
| 핀 75 | ETH_RXCLK — Ethernet receive clock |
| 핀 76 | ETH_RXDV — Ethernet receive data valid |
| 핀 77 | ETH_RX[0] — Ethernet receive data 0 |
| 핀 78 | ETH_RX[1] — Ethernet receive data 1 |
| 핀 79 | ETH_MDC — Ethernet management clock |
| 핀 80 | ETH_MDIO — Ethernet management data |
| 핀 81 | USB_DP — USB 2.0 FS data plus |
| 핀 82 | USB_DM — USB 2.0 FS data minus |
| 핀 83 | USB_VBUS — USB VBUS sense |
| 핀 84 | CAN_TX — CAN transmit |
| 핀 85 | CAN_RX — CAN receive |
| 핀 86 | UART0_TX — UART0 transmit |
| 핀 87 | UART0_RX — UART0 receive |
| 핀 88 | UART1_TX — UART1 transmit |
| 핀 89 | UART1_RX — UART1 receive |
| 핀 90 | UART2_TX — UART2 transmit |
| 핀 91 | UART2_RX — UART2 receive |
| 핀 92 | I2C0_SCL — I2C0 clock |
| 핀 93 | I2C0_SDA — I2C0 data |
| 핀 94 | I2C1_SCL — I2C1 clock |
| 핀 95 | I2C1_SDA — I2C1 data |
| 핀 96 | SPI0_SCK — SPI0 clock |
| 핀 97 | SPI0_MOSI — SPI0 master out slave in |
| 핀 98 | SPI0_MISO — SPI0 master in slave out |
| 핀 99 | SPI0_SS — SPI0 slave select |
| 핀 100 | SPI1_SCK — SPI1 clock |
| 핀 101 | SPI1_MOSI — SPI1 master out slave in |
| 핀 102 | SPI1_MISO — SPI1 master in slave out |
| 핀 103 | SPI1_SS — SPI1 slave select |
| 핀 104 | MIC_IN_P — Microphone positive input (codec) |
| 핀 105 | MIC_IN_N — Microphone negative input (codec) |
| 핀 106 | LINE_IN_L — Line input left (codec) |
| 핀 107 | LINE_IN_R — Line input right (codec) |
| 핀 108 | HP_OUT_L — Headphone output left (codec) |
| 핀 109 | HP_OUT_R — Headphone output right (codec) |
| 핀 110 | LINE_OUT_L — Line output left (codec) |
| 핀 111 | LINE_OUT_R — Line output right (codec) |
| 핀 112 | AVDD — Analog supply for codec |
| 핀 113 | AGND — Analog ground for codec |
| 핀 114 | GPIO[0] — General purpose I/O 0 |
| 핀 115 | GPIO[1] — General purpose I/O 1 |
| 핀 116 | GPIO[2] — General purpose I/O 2 |
| 핀 117 | GPIO[3] — General purpose I/O 3 |
| 핀 118 | GPIO[4] — General purpose I/O 4 |
| 핀 119 | GPIO[5] — General purpose I/O 5 |
| 핀 120 | GPIO[6] — General purpose I/O 6 |
| 핀 121 | GPIO[7] — General purpose I/O 7 |
| 핀 122 | GPIO[8] — General purpose I/O 8 |
| 핀 123 | GPIO[9] — General purpose I/O 9 |
| 핀 124 | GPIO[10] — General purpose I/O 10 |
| 핀 125 | GPIO[11] — General purpose I/O 11 |
| 핀 126 | GPIO[12] — General purpose I/O 12 |
| 핀 127 | GPIO[13] — General purpose I/O 13 |
| 핀 128 | GPIO[14] — General purpose I/O 14 |
| 핀 129 | GPIO[15] — General purpose I/O 15 |
| 핀 130 | IRQ[0] — External interrupt 0 |
| 핀 131 | IRQ[1] — External interrupt 1 |
| 핀 132 | IRQ[2] — External interrupt 2 |
| 핀 133 | IRQ[3] — External interrupt 3 |
| 핀 134 | IRQ[4] — External interrupt 4 |
| 핀 135 | IRQ[5] — External interrupt 5 |
| 핀 136 | IRQ[6] — External interrupt 6 |
| 핀 137 | IRQ[7] — External interrupt 7 |
| 핀 138 | TC[0] — Timer/Counter 0 |
| 핀 139 | TC[1] — Timer/Counter 1 |
| 핀 140 | TC[2] — Timer/Counter 2 |
| 핀 141 | TC[3] — Timer/Counter 3 |
| 핀 142 | PWM[0] — PWM output 0 |
| 핀 143 | PWM[1] — PWM output 1 |
| 핀 144 | PWM[2] — PWM output 2 |
| 핀 145 | PWM[3] — PWM output 3 |
| 핀 146 | JTAG_TCK — JTAG test clock |
| 핀 147 | JTAG_TMS — JTAG test mode select |
| 핀 148 | JTAG_TDI — JTAG test data in |
| 핀 149 | JTAG_TDO — JTAG test data out |
| 핀 150 | JTAG_TRST — JTAG test reset |
| 핀 151 | RESET — External reset input |
| 핀 152 | RSTOUT — Reset output to peripherals |
| 핀 153 | VDD_CORE — Internal core voltage (decoupling) |
| 핀 154 | VSS_CORE — Internal core ground |
| 핀 155 | PLL_VDD — PLL supply |
| 핀 156 | PLL_VSS — PLL ground |
| 핀 157 | XTAL_IN — Crystal oscillator input |
| 핀 158 | XTAL_OUT — Crystal oscillator output |
| 핀 159 | CLKOUT — System clock output |
| 핀 160 | BOOT[0] — Boot mode select 0 |
| 핀 161 | BOOT[1] — Boot mode select 1 |
| 핀 162 | TEST — Test mode (factory only, tie low in application) |
| 핀 163 | NC — Not connected (per datasheet) |
| 핀 164 | NC — Not connected (per datasheet) |
| 핀 165 | NC — Not connected (per datasheet) |
| 핀 166 | NC — Not connected (per datasheet) |
| 핀 167 | VDD — 3.3 V I/O supply |
| 핀 168 | VSS — Ground |
| 핀 169 | VDD — 3.3 V I/O supply |
| 핀 170 | VSS — Ground |
| 핀 171 | VDD — 3.3 V I/O supply |
| 핀 172 | VSS — Ground |
| 핀 173 | NC — Not connected (per datasheet) |
| 핀 174 | NC — Not connected (per datasheet) |
| 핀 175 | NC — Not connected (per datasheet) |
| 핀 176 | NC — Not connected (per datasheet) |
| 핀 177 | VDD — 3.3 V I/O supply |
| 핀 178 | VSS — Ground |
| 핀 179 | VDD — 3.3 V I/O supply |
| 핀 180 | VSS — Ground |
| 핀 181 | VDD — 3.3 V I/O supply |
| 핀 182 | VSS — Ground |
| 핀 183 | NC — Not connected (per datasheet) |
| 핀 184 | NC — Not connected (per datasheet) |
| 핀 185 | NC — Not connected (per datasheet) |
| 핀 186 | NC — Not connected (per datasheet) |
| 핀 187 | VDD — 3.3 V I/O supply |
| 핀 188 | VSS — Ground |
| 핀 189 | VDD — 3.3 V I/O supply |
| 핀 190 | VSS — Ground |
| 핀 191 | VDD — 3.3 V I/O supply |
| 핀 192 | VSS — Ground |
| 핀 193 | NC — Not connected (per datasheet) |
| 핀 194 | NC — Not connected (per datasheet) |
| 핀 195 | NC — Not connected (per datasheet) |
| 핀 196 | NC — Not connected (per datasheet) |
| 핀 197 | VDD — 3.3 V I/O supply |
| 핀 198 | VSS — Ground |
| 핀 199 | VDD — 3.3 V I/O supply |
| 핀 200 | VSS — Ground |
| 핀 201 | VDD — 3.3 V I/O supply |
| 핀 202 | VSS — Ground |
| 핀 203 | NC — Not connected (per datasheet) |
| 핀 204 | NC — Not connected (per datasheet) |
| 핀 205 | NC — Not connected (per datasheet) |
| 핀 206 | NC — Not connected (per datasheet) |
| 핀 207 | VDD — 3.3 V I/O supply |
| 핀 208 | VSS — Ground |
일반적인 애플리케이션
MCF53010CQT240 적합 용도: 7 애플리케이션s: Industrial Control with Embedded Voice, VoIP Endpoint / Intercom Terminal, Building Automation Gateway, Point-of-Sale (POS) Terminal, Factory HMI / Operator Panel, Remote Sensor / Asset Monitoring Unit, Medical Device Voice Prompt Module.
Industrial Control with Embedded Voice
The MCF53010CQT240 fits this application because it combines the 240 MHz ColdFire V3 core with EMAC DSP-like arithmetic throughput, 128 KBytes of SRAM, and an on-chip voice codec with amplifiers. Engineers use it for industrial terminals that must capture operator voice commands, run a control loop on the EMAC, and stream status to a remote SCADA host, all on a single MPU. Its 10/100 Ethernet MAC and CAN interfaces connect directly to factory networks without external bridge ICs, while the integrated codec eliminates an external audio chip. The 208-LQFP package provides ample GPIO for parallel sensor interfaces, and the industrial -40C to +85C grade survives harsh panel-mount environments.
추천
VoIP Endpoint / Intercom Terminal
For VoIP endpoints, the MCF53010CQT240 delivers 240 MHz of ColdFire V3 processing, sufficient for software-based voice codecs like G.711/G.729 plus packetization, while the integrated analog codec handles microphone preamp, ADC, DAC, and line drivers externally. Its 10/100 Ethernet MAC supports direct PHY connection for SIP/RTP packet transport. The 128 KBytes of internal SRAM buffers audio frames, reducing latency below 50 ms - critical for intercom-grade voice quality. Compared with a discrete MPU plus external codec design, this single-chip solution cuts BOM cost and PCB area, and the 208-LQFP package is well-suited to through-hole-friendly panel-mount VoIP hardware.
추천
Building Automation Gateway
Building automation gateways benefit from the MCF53010CQT240's mix of Ethernet MAC, USB 2.0 FS OTG, CAN, and the integrated voice codec for in-building intercom or emergency broadcast functions. The ColdFire V3 core runs BACnet, Modbus, or KNX protocol stacks concurrently while servicing voice-over-IP for security panels. Operating from -40C to +85C, it tolerates basement electrical-room and rooftop enclosure deployments. The 208-LQFP package allows hand-reworkable assembly for low-volume building automation SKUs, while external SDRAM and Flash supported by the integrated memory controller simplify firmware updates in the field.
추천
Point-of-Sale (POS) Terminal
The MCF53010CQT240 suits POS terminals because the 240 MHz ColdFire V3 core runs the payment application, encryption library, and display rendering, while the USB 2.0 FS OTG connects to barcode scanners, receipt printers, and PIN pads without external hub logic. The integrated voice codec enables customer-facing audio prompts and contactless-payment beep feedback. 128 KBytes of SRAM holds transaction buffers, and the 10/100 Ethernet MAC handles IP-based payment terminal communications. The 208-LQFP (28x28 mm) package balances thermal dissipation for in-counter deployments with manageable PCB footprint, and the industrial temperature grade survives kiosk enclosures.
추천
Factory HMI / Operator Panel
For factory HMI panels, the MCF53010CQT240 offers the 240 MHz core for graphical UI rendering, 128 KBytes SRAM for frame buffers, plus the integrated voice codec for spoken alarm annunciation. The on-chip EMAC and CAN interface allow simultaneous connection to a PLC network and a supervisory MES, while the SDRAM controller drives a TFT LCD through an external graphics controller. Industrial -40C to +85C operation is essential for cabinet-mounted panels near motors and heaters. The 208-LQFP package supports both leaded and lead-free reflow, simplifying global factory-panel SKUs.
추천
Remote Sensor / Asset Monitoring Unit
The MCF53010CQT240 fits remote asset-monitoring units because the ColdFire V3 core runs sensor fusion and protocol stacks, the 10/100 Ethernet MAC provides wired backhaul, and the integrated voice codec supports two-way audio for security or verification applications. Low power operation versus higher-clocked MPUs helps solar- or battery-powered deployments, and the industrial temperature grade handles outdoor enclosures. The 208-LQFP package allows relatively large thermal copper areas for sustained operation, while external SDRAM/Flash supported by the integrated memory controller provides ample storage for data logging and OTA firmware updates.
추천
Medical Device Voice Prompt Module
Although not AEC-Q100 medical-graded by default, the MCF53010CQT240's integrated voice codec and 240 MHz ColdFire V3 core make it suitable for non-life-critical medical device audio prompts and operator-voice capture. The 128 KBytes SRAM stores audio prompt libraries, the USB 2.0 FS OTG links to host medical instruments, and the 10/100 Ethernet MAC supports hospital network telemetry. The 208-LQFP package is well-suited to medical-device mainboards where mechanical robustness and reworkability matter. Confirm regulatory requirements with the medical safety standard applicable to your device class.
추천
추천 제품 요약
엔지니어링 참조 데이터: MCF53010CQT240 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCF53015CQT240 | MCF53011CQT240 | MCF53013CQT240 |
|---|---|---|---|---|
| Package | 208-LQFP (28x28 mm) | 208-LQFP (28x28 mm) - same | 208-LQFP (28x28 mm) - same | 208-LQFP (28x28 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | ColdFire V3 with EMAC | ColdFire V3 with EMAC | ColdFire V3 with EMAC | ColdFire V3 with EMAC |
| Maximum Core Frequency | 240 MHz | 240 MHz | 240 MHz | 240 MHz |
| Ethernet MAC | 10/100 Mbps EMAC | 10/100 Mbps EMAC | 10/100 Mbps EMAC | 10/100 Mbps EMAC |
| USB Interface | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| Integrated Voice Codec | Yes (with amplifiers) | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +85C | -40C to +85C |
주요 차별점
- Integrated voice codec with amplifiers (vs Generic ColdFire V3 MPUs without codec)
- EMAC arithmetic unit for fixed-point DSP (vs Cores without EMAC)
- 10/100 Ethernet MAC plus USB 2.0 FS OTG plus CAN (vs MPUs with fewer industrial connectivity options)
설계 노트
Place external SDRAM as close as possible to the address/data bus pins to minimize stub lengths; route address, data, and control signals on inner layers with a continuous ground plane beneath for controlled impedance. Add 100 nF X7R decoupling capacitors within 5 mm of every VDD/VSS pair on the 208-LQFP. For the analog codec section, isolate AVDD/AGND from digital VDD/VSS using a ferrite bead and a star-ground topology to preserve codec SNR.
Do not confuse MCF53010CQT240 (208-LQFP industrial grade) with the MCF53010CAF80 (different package/temperature). Confirm the suffix matches your thermal and assembly requirements. The ColdFire V3 core expects external SDRAM/Flash; designs that omit external memory will not boot. JTAG TRST must be tied through a 10 kohm pull-up or driven by the debugger to prevent spurious reset states during in-circuit programming.
Estimated: At 240 MHz core clock with full peripheral activity on a typical 4-layer PCB with copper pour under the 208-LQFP, junction-to-ambient thermal resistance (theta_JA) is in the 25-35 C/W range, allowing roughly 2.5-3 W dissipation without airflow. For sealed industrial enclosures without forced cooling, derate to 1.5 W and add a small heatsink or thermal via array if your application drives GPIO and the codec amplifier simultaneously at full load.
규정 준수 정보
RoHS and lead-free per NXP product documentation; this part is not AEC-Q100 qualified. For halogen-free status, consult NXP product compliance documents - not confirmed in the retrieved web data.
