MC7448HX1000ND - PowerPC G4 MPU 1GHz 1MB L2 AltiVec | NXP
부품 번호: MC7448HX1000ND ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $349.44 | $349.44 |
| 10 | $315.5 | $3,155.00 |
| 50 | $285.75 | $14,287.50 |
| 100 | $262.1 | $26,210.00 |
| 500 | $235.8 | $117,900.00 |
MC7448HX1000ND 개요
An MPU (Microprocessor Unit) is the central processing subsystem of an embedded system; the MPC74xx Power Architecture line is a superscalar, out-of-order RISC family used in networking, telecom, aerospace, and imaging gear. AltiVec adds 128-bit SIMD lanes per cycle, accelerating DSP-style vector math without offloading to a separate DSP. The MC7448 is NXP's first MPC74xx part manufactured on a 90 nm silicon-on-insulator (SOI) process, delivering higher frequency at lower power than earlier 130 nm MPC7447A parts.
Key features include 32-bit PowerPC superscalar core with 7-stage pipeline, 1 MB on-chip L2 with victim replacement, integrated AltiVec vector unit (VMX), 64-bit MPX/60x bus up to 200 MHz DDR, 1.0 V core with separate I/O supply, and a junction operating range of -40C to +105C. The 360-FCCBGA package is a flip-chip land-grid array optimized for high-speed signal integrity.
Architecturally, the MPC7448 preserves the PowerPC Book E programming model of the MPC7447A while introducing a deeper out-of-order window and improved branch prediction. Software written for the MPC7447/MPC7447A runs unchanged, and the MPC7448 is offered as a pin-for-pin compatible upgrade in many board designs.
Typical applications include high-performance networking line cards, RAID/storage controllers, military/aerospace signal processing, and industrial imaging systems. Designers frequently migrate from MPC7447A to MC7448 for higher throughput on the same board footprint.
When designing with this part, attention must be paid to multi-layer PCB stack-up for the MPX bus, decoupling of the 1.0 V core rail, and thermal dissipation in closed enclosures; the 360-FCCBGA package requires controlled-impedance routing. The part is marked End-of-Life by NXP, so long-life programs should validate last-time-buy windows before committing to a new design.
드롭인 대체품: MC7448HX1000ND — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC7448HX1000ND (동일 폼 팩터 및 풋프린트) — 차이점: L2 Cache, Mounting Type, Package, Process Technology, Core Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC7448HX1000ND-R
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC7448VU1000ND
✅ 드롭인✓ 재고 있음
$92 / 개
데이터시트 보기 →MC7448VU867ND
✅ 드롭인✓ 재고 있음
$178.4 / 개
데이터시트 보기 →MC7447AHX1000LB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC7448HX1000ND
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC7448HX1000ND 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Processor Family | PowerPC G4 / MPC74xx |
| Core Architecture | 32-bit PowerPC (Book E), superscalar, out-of-order |
| Core Frequency | 1.0 GHz |
| System Bus (MPX/60x) | Up to 200 MHz DDR (64-bit) |
| L1 Cache | 32 KB instruction + 32 KB data |
| L2 Cache | 1 MB on-chip, victim-replacement |
| SIMD Engine | AltiVec (VMX), 128-bit |
| Core Voltage | 1.0 V (+/- 50 mV) |
| Process Technology | 90 nm SOI (silicon-on-insulator) |
| Junction Operating Temperature | -40C to +105C |
| 패키지 | 360-FCCBGA (25 x 25 mm) |
| 실장 유형 | Surface Mount (flip-chip BGA) |
| Packaging | Tray |
| Lead-Free Status | Contains Lead (per DigiChip summary) |
| MPN Decode (HX) | H = 1.0 V core, X = tape-and-reel packaging code suffix |
| Lifecycle | End of Life (per NXP product page header) |
MC7448HX1000ND 360-fccbga (25 x 25 mm) 핀 구성 가이드
MC7448HX1000ND(360-fccbga (25 x 25 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MC7448HX1000ND.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MC7448HX1000ND 적합 용도: 6 애플리케이션s: High-Performance Networking Line Cards, RAID and Storage Controllers, Military and Aerospace Signal Processing, Industrial Imaging and Machine Vision, Telecom Base Station Control Plane, Print and Imaging MFP Controllers.
High-Performance Networking Line Cards
The MC7448HX1000ND's 1.0 GHz PowerPC G4 core with AltiVec is ideal for high-performance networking line cards running deep-packet inspection, encryption, and routing-table workloads. The 64-bit MPX/60x bus at up to 200 MHz DDR feeds the core from ASIC/FPGA neighbors without becoming a bottleneck on typical 10G-class packet rates. AltiVec accelerates hash and CRC operations that dominate forwarding-plane code, while the 1 MB on-chip L2 cache absorbs routing-table lookups without off-chip memory traffic. The 360-FCCBGA package supports controlled-impedance routing needed for MPX/60x bus integrity on multi-layer backplanes. Compared to host-CPU solutions, the MPC7448 offers deterministic real-time response at low power.
추천
RAID and Storage Controllers
Storage controllers and RAID HBAs benefit from the MC7448HX1000ND's AltiVec engine for XOR-parity calculation, Reed-Solomon erasure coding, and inline compression. The 1 MB L2 cache holds RAID metadata and stripe-cache state, eliminating off-chip memory latency for small-block writes. The 1.0 GHz superscalar core sustains high IOPS under mixed read/write workloads, while the MPX/60x host bus attaches to SAS/SATA controllers via a bridge ASIC. Industrial storage appliances running ZFS, Btrfs, or custom RAID stacks use the MPC7448 precisely for its deterministic compute and AltiVec acceleration. The part's 105C junction rating supports sealed-array enclosures with limited airflow.
추천
Military and Aerospace Signal Processing
The MC7448HX1000ND is widely deployed in military and aerospace signal-processing subsystems, where the MPC74xx line offers long-term availability of qualified stock and deterministic behavior under vibration and thermal stress. The 1.0 GHz core paired with AltiVec processes radar FFTs, EO/IR image pipelines, and SIGINT demodulation in real time without an external DSP. The -40C to +105C junction range meets Mil-Std-810 environmental profiles on ruggedized boards, and the flip-chip BGA is compatible with hermetic and ruggedized PCB stack-ups. Long-life defense programs typically qualify the part then manage inventory against NXP's EOL notice via last-time-buy commitments.
추천
Industrial Imaging and Machine Vision
Machine vision and industrial imaging systems use the MC7448HX1000ND to run on-the-fly image-processing pipelines including Bayer demosaicing, edge detection, and feature extraction. AltiVec accelerates these SIMD-friendly transforms, sustaining multi-megapixel sensor streams at line rate. The 1 MB L2 absorbs frame-tile buffers and reduces off-chip DDR pressure during burst capture. The MPX/60x bus cleanly bridges to FPGA frame grabbers, and the 1.0 GHz core runs Linux or VxWorks stacks that host OpenCV, HALCON, or proprietary vision libraries. The 105C junction rating tolerates enclosed factory cabinets where ambient air exceeds 60C.
추천
Telecom Base Station Control Plane
The MC7448HX1000ND's deterministic PowerPC G4 core is suited to telecom base-station control-plane tasks such as Layer-2/Layer-3 signalling, OAM messaging, and radio-resource management. AltiVec accelerates the heavy bit-packing operations common in 3G/4G protocol stacks, while the 1 MB L2 keeps routing tables in cache. The MPX/60x bus ties into baseband ASICs and TDM/Ethernet fabrics. The 105C junction rating tolerates outdoor cabinet environments, and the 360-FCCBGA package is compatible with the controlled-impedance stack-ups telecom OEMs prefer. NXP's PowerPC ecosystem offers proven BSPs for VxWorks and Linux.
추천
Print and Imaging MFP Controllers
Multi-function printer (MFP) controllers use the MC7448HX1000ND to host the print pipeline - PDL rasterization, JPEG/PCL/PostScript interpretation, and scan-to-email processing. AltiVec accelerates the vectorizable inner loops in these codecs, while the 1 MB L2 caches raster bands to keep DDR traffic manageable. The MPX/60x bus attaches to scanner and engine-interface glue logic. The 360-FCCBGA package supports the small-form-factor mainboard that fits inside printer chassis. Compared to general-purpose SoCs, the MPC7448 offers better deterministic latency for real-time engine control loops.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC7448HX1000ND — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC7448HX1000ND-R | MC7448VU1000ND | MC7448VU867ND | MC7447AHX1000LB | MPC7448HX1000ND |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 360-FCCBGA (25x25 mm) | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA - same | 360-FCCBGA (25x25 mm) - same |
| Core Frequency | 1.0 GHz | 1.0 GHz | 1.0 GHz | 867 MHz | 1.0 GHz | 1.0 GHz |
| Process Technology | 90 nm SOI | 90 nm SOI | 90 nm SOI | 90 nm SOI | 130 nm | 90 nm SOI |
| L2 Cache | 1 MB | 1 MB | 1 MB | 1 MB | 512 KB | 1 MB |
| Core Voltage | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.0 V |
| SIMD Engine | AltiVec (VMX) | AltiVec (VMX) | AltiVec (VMX) | AltiVec (VMX) | AltiVec (VMX) | AltiVec (VMX) |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL | EOL |
주요 차별점
- 90 nm SOI process upgrade over predecessor (vs MC7447AHX1000LB)
- Pin-for-pin compatible upgrade path (vs MC7447AHX1000LB)
- Extended temperature grade over commercial VU suffix (vs MC7448VU1000ND)
설계 노트
The MC7448HX1000ND at 1.0 GHz with 1.0 V core and typical 90 nm SOI power envelope dissipates on the order of 10-15 W depending on workload and AltiVec utilization. The 360-FCCBGA package relies on the PCB for heat removal; use at least 4 inner ground/power planes and thermal vias under the die shadow to keep junction temperature within the 105C limit. In sealed enclosures, derate by 20-30% or step down to the MC7448VU867ND 867 MHz variant. Estimated: assume PD ~ 12 W at VDD = 1.0 V, IDD ~ 12 A, then compute theta_JA from the PCB layout per IPC-2152.
Route the 64-bit MPX/60x bus with 50 ohm controlled-impedance traces on a multi-layer stack-up, and keep trace lengths matched within 150 mil across the byte lanes to preserve timing margin. Use inner stripline layers for the bus and outer microstrip only for short breakout regions. Place 0.1 uF + 10 uF decoupling clusters within 100 mil of every VDD/GND ball pair. Maintain a continuous ground plane under the BGA and stitch vias around the periphery to suppress VCCI return-current loops.
Do not confuse the 360-FCCBGA (flip-chip) MC7448 package with the 360-CBGA (ceramic) MPC7447A variant - they share ballout but differ in mechanical stack-up, mounting profile, and reliability under thermal cycling. Verify the package code 'FCCBGA' on the NXP product page before placing a reflow or rework profile. Also note that the MPC7448 requires the L2 cache to be configured by the boot ROM; missing the L2 init code results in hangs that look like hardware faults but are actually firmware initialization issues.
The MPX/60x bus runs at up to 200 MHz DDR (400 MT/s effective) with source-synchronous clocking. Maintain differential clock-to-DQS skew within 50 mil and use series damping resistors on heavily-loaded address/control nets. For backplane extensions beyond 6 inches, add a bus-termination strategy per the Freescale AN-2671 application note. Probe with a low-capacitance FET probe at the via stub to avoid loading the bus during validation.
규정 준수 정보
DigiChip summary states 'Contains Lead' for the lead-free status, indicating this part uses Sn/Pb balls. RoHS and REACH compliance status were not present in the verified web data and are marked unknown.
