MC9S12DG128MPVE - 16-bit HCS12 MCU, 128KB Flash, 112-LQFP | NXP
MPN: MC9S12DG128MPVE ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.8 | $168.00 |
| 100 | $14.95 | $1,495.00 |
| 500 | $13.2 | $6,600.00 |
| 1,000 | $11.75 | $11,750.00 |
MC9S12DG128MPVE Overview
A 16-bit microcontroller (MCU) is a programmable processor core that executes instructions on 16-bit data paths and is widely used in automotive body electronics, industrial control, and motor control where 8-bit devices lack throughput and 32-bit devices are cost-prohibitive. The HCS12 core is NXP's (formerly Freescale) S12 family derivative, supporting CISC instruction set, enhanced addressing modes, and BDM (Background Debug Mode) for non-intrusive in-circuit debug. Within the broader hierarchy, MCUs belong to microprocessors and embedded computing.
Key features of the MC9S12DG128MPVE include 128KB on-chip Flash with in-application reprogramming support, 2KB EEPROM and 8KB RAM for data retention and scratchpad storage, dual 10-bit ADC modules supporting 16 analog input channels, and a 50MHz internal bus clock derived from a programmable Phase-Lock-Loop (PLL). The device supports 2.5V/5V mixed-voltage operation per the legacy S12 specification and provides CAN, SCI, and SPI serial interfaces for networked embedded designs.
The MC9S12DG128MPVE architecture pairs a CPU12 core with a peripheral bus bridge that runs at twice the CPU frequency for high-throughput I/O, plus an addressable memory map that places Flash at $0000-$FFFF and EEPROM/RAM at upper addresses. The integrated Voltage Regulator (VREG) and Power-On Reset block simplify supply design, while the Enhanced Capture Timer supports input capture, output compare, and pulse accumulator modes for pulse-width measurement.
Typical applications include automotive body controllers, instrument clusters, HVAC control modules, lighting controllers, and industrial PLC I/O expansion. Per the Verified Web Data the part is currently NRND (Not Recommended for New Designs), so existing production designs should plan migration to active S12/S12Z successors such as the S12ZVL or S32K1 series.
Design consideration: the 112-LQFP footprint has 0.5mm pitch and requires careful PCB layout to maintain signal integrity on the parallel bus and analog inputs. The device's mixed-voltage I/O is internally level-shifted, but designers must observe absolute maximum ratings on 5V-tolerant pins when interfacing to 3.3V peripherals.
This page synthesizes distributor stock, NRND lifecycle context, drop-in same-package alternatives from the same S12 family, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for MC9S12DG128MPVE — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC9S12DG128MPVE (same form factor and footprint) — differing in Core Processor, Core Architecture, EEPROM Size, PWM Channels, Program Memory Size.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC9S12DP512MPVE
✅ Drop-In✓ In Stock
$9.45 / Unit
View Datasheet →MC9S12DG128CPVE
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S12A256CPVE
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S12B128CPVE
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S12DG128MPVER
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S12DG128MPVE Maximum Ratings & Electrical Characteristics
| Product Family | S12DG (HCS12) |
| Core Architecture | HCS12 (CPU12, 16-bit CISC) |
| CPU Clock Frequency | 25 MHz (max) |
| Bus Clock | 50 MHz (max) |
| Program Memory (Flash) | 128 KB |
| RAM | 8 KB |
| EEPROM | 2 KB |
| Supply Voltage | 2.35 V to 2.75 V (core) / 5 V I/O |
| Operating Temperature Range | -40C to +125C (automotive grade) |
| Digital I/O Pins | 59 |
| ADC | 2 x 10-bit, 8 channels each (16 total) |
| PWM Channels | 8 channels |
| Enhanced Capture Timer | 8-channel IC/OC |
| SCI (UART) Channels | 2 |
| SPI Channels | 1 |
| CAN Module | 1 (msCAN) |
| Package | 112-LQFP (20 x 20 mm, 0.5 mm pitch) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lifecycle Status | NRND (Not Recommended for New Designs) |
MC9S12DG128MPVE Pin Configuration
| Pin 1 | PAD0 — ADC input channel 0 / digital I/O |
| Pin 2 | PAD1 — ADC input channel 1 / digital I/O |
| Pin 3 | PAD2 — ADC input channel 2 / digital I/O |
| Pin 4 | PAD3 — ADC input channel 3 / digital I/O |
| Pin 5 | PAD4 — ADC input channel 4 / digital I/O |
| Pin 6 | PAD5 — ADC input channel 5 / digital I/O |
| Pin 7 | PAD6 — ADC input channel 6 / digital I/O |
| Pin 8 | PAD7 — ADC input channel 7 / digital I/O |
| Pin 9 | VDDA — Analog supply voltage for ADC |
| Pin 10 | VSSA — Analog ground for ADC |
| Pin 11 | PAD8 — ADC input channel 8 / digital I/O |
| Pin 12 | PAD9 — ADC input channel 9 / digital I/O |
| Pin 13 | PAD10 — ADC input channel 10 / digital I/O |
| Pin 14 | PAD11 — ADC input channel 11 / digital I/O |
| Pin 15 | PAD12 — ADC input channel 12 / digital I/O |
| Pin 16 | PAD13 — ADC input channel 13 / digital I/O |
| Pin 17 | PAD14 — ADC input channel 14 / digital I/O |
| Pin 18 | PAD15 — ADC input channel 15 / digital I/O |
| Pin 19 | PWM0 — PWM channel 0 output |
| Pin 20 | PWM1 — PWM channel 1 output |
| Pin 21 | PWM2 — PWM channel 2 output |
| Pin 22 | PWM3 — PWM channel 3 output |
| Pin 23 | PWM4 — PWM channel 4 output |
| Pin 24 | PWM5 — PWM channel 5 output |
| Pin 25 | PWM6 — PWM channel 6 output |
| Pin 26 | PWM7 — PWM channel 7 output |
| Pin 27 | TC0 — Timer channel 0 IC/OC |
| Pin 28 | TC1 — Timer channel 1 IC/OC |
| Pin 29 | TC2 — Timer channel 2 IC/OC |
| Pin 30 | TC3 — Timer channel 3 IC/OC |
| Pin 31 | TC4 — Timer channel 4 IC/OC |
| Pin 32 | TC5 — Timer channel 5 IC/OC |
| Pin 33 | TC6 — Timer channel 6 IC/OC |
| Pin 34 | TC7 — Timer channel 7 IC/OC |
| Pin 35 | VDDR — Internal voltage regulator supply |
| Pin 36 | VSSX — I/O ground reference |
| Pin 37 | VDDX — External I/O supply voltage |
| Pin 38 | VSS — Digital ground |
| Pin 39 | VDD — Digital supply voltage (2.5V core) |
| Pin 40 | RESET — External reset input (active low) |
| Pin 41 | BKGD — Background Debug Mode pin |
| Pin 42 | MODC — Mode selection pin for BDM |
| Pin 43 | PE0 — Port E bit 0 / IRQ |
| Pin 44 | PE1 — Port E bit 1 / IRQ |
| Pin 45 | PE2 — Port E bit 2 / IRQ |
| Pin 46 | PE3 — Port E bit 3 / IRQ |
| Pin 47 | PE4 — Port E bit 4 / XIRQ |
| Pin 48 | PE5 — Port E bit 5 / IRQ |
| Pin 49 | PE6 — Port E bit 6 / IRQ |
| Pin 50 | PE7 — Port E bit 7 / IRQ |
| Pin 51 | PH0 — Port H bit 0 / SS |
| Pin 52 | PH1 — Port H bit 1 / SCK |
| Pin 53 | PH2 — Port H bit 2 / MOSI |
| Pin 54 | PH3 — Port H bit 3 / MISO |
| Pin 55 | PH4 — Port H bit 4 |
| Pin 56 | PH5 — Port H bit 5 |
| Pin 57 | PH6 — Port H bit 6 |
| Pin 58 | PH7 — Port H bit 7 |
| Pin 59 | PJ0 — Port J bit 0 / CAN RX |
| Pin 60 | PJ1 — Port J bit 1 / CAN TX |
| Pin 61 | PJ2 — Port J bit 2 |
| Pin 62 | PJ3 — Port J bit 3 |
| Pin 63 | PJ4 — Port J bit 4 |
| Pin 64 | PJ5 — Port J bit 5 |
| Pin 65 | PJ6 — Port J bit 6 |
| Pin 66 | PJ7 — Port J bit 7 |
| Pin 67 | PK0 — Port K bit 0 |
| Pin 68 | PK1 — Port K bit 1 |
| Pin 69 | PK2 — Port K bit 2 |
| Pin 70 | PK3 — Port K bit 3 |
| Pin 71 | PK4 — Port K bit 4 |
| Pin 72 | PK5 — Port K bit 5 |
| Pin 73 | PK6 — Port K bit 6 |
| Pin 74 | PK7 — Port K bit 7 |
| Pin 75 | PM0 — Port M bit 0 |
| Pin 76 | PM1 — Port M bit 1 |
| Pin 77 | PM2 — Port M bit 2 |
| Pin 78 | PM3 — Port M bit 3 |
| Pin 79 | PM4 — Port M bit 4 |
| Pin 80 | PM5 — Port M bit 5 |
| Pin 81 | PM6 — Port M bit 6 |
| Pin 82 | PM7 — Port M bit 7 |
| Pin 83 | PP0 — Port P bit 0 / PWM |
| Pin 84 | PP1 — Port P bit 1 / PWM |
| Pin 85 | PP2 — Port P bit 2 / PWM |
| Pin 86 | PP3 — Port P bit 3 / PWM |
| Pin 87 | PP4 — Port P bit 4 |
| Pin 88 | PP5 — Port P bit 5 |
| Pin 89 | PP6 — Port P bit 6 |
| Pin 90 | PP7 — Port P bit 7 |
| Pin 91 | PS0 — Port S bit 0 / SCI0 TX |
| Pin 92 | PS1 — Port S bit 1 / SCI0 RX |
| Pin 93 | PS2 — Port S bit 2 / SCI1 TX |
| Pin 94 | PS3 — Port S bit 3 / SCI1 RX |
| Pin 95 | PS4 — Port S bit 4 / SPI0 SCK |
| Pin 96 | PS5 — Port S bit 5 / SPI0 MOSI |
| Pin 97 | PS6 — Port S bit 6 / SPI0 MISO |
| Pin 98 | PS7 — Port S bit 7 / SPI0 SS |
| Pin 99 | PT0 — Port T bit 0 / ICOC0 |
| Pin 100 | PT1 — Port T bit 1 / ICOC1 |
| Pin 101 | PT2 — Port T bit 2 / ICOC2 |
| Pin 102 | PT3 — Port T bit 3 / ICOC3 |
| Pin 104 | PT4 — Port T bit 4 / ICOC4 |
| Pin 105 | PT5 — Port T bit 5 / ICOC5 |
| Pin 106 | PT6 — Port T bit 6 / ICOC6 |
| Pin 107 | PT7 — Port T bit 7 / ICOC7 |
| Pin 108 | VDDPLL — PLL supply voltage |
| Pin 109 | VSSPLL — PLL ground |
| Pin 110 | XFC — PLL external filter capacitor |
| Pin 111 | EXTAL — External crystal/oscillator input |
| Pin 112 | XTAL — External crystal output |
Typical Applications
MC9S12DG128MPVE is suitable for 6 applications: Automotive Body Control Module, Instrument Cluster Controller, HVAC Control Module, Lighting Control Module, Industrial PLC I/O Expansion, Motor Control (Small BLDC/PMSM).
Automotive Body Control Module
The MC9S12DG128MPVE fits automotive body controllers because of its 128KB Flash supporting body ECU firmware, 16 ADC channels for wiper/lights/rain sensors, and msCAN interface for chassis network integration. The 59 digital I/O lines handle door locks, mirror switches, lighting drivers, and LIN-master coordination, while the 8-channel PWM controls LED dimming and small DC loads. Automotive -40C to +125C temperature grade per the NXP datasheet ensures reliable operation under hood and cabin environments.
Recommended
Instrument Cluster Controller
The MC9S12DG128MPVE drives analog/digital instrument clusters via its dual 10-bit ADC modules for fuel, temperature, and speed signal acquisition, plus the 8-channel PWM for gauge needle control. The 128KB Flash accommodates speedometer/tachometer logic, odometer storage in 2KB EEPROM, and CAN bus reception from the powertrain ECU. With 25MHz CPU and 50MHz bus clock, the part handles refresh rates for 100+ segment LCDs or stepper-motor gauges without CPU bottleneck.
Recommended
HVAC Control Module
The MC9S12DG128MPVE suits HVAC controllers because its 16 ADC channels digitize temperature sensors (in-cabin, ambient, evaporator, blend-door position), while the 8-channel PWM drives blower fans and stepper motors via external drivers. The two SCI channels support LIN bus communication with HVAC remote sensors and the msCAN links to the vehicle network. 128KB Flash stores control algorithms and the 2KB EEPROM retains user setpoints across battery disconnects.
Recommended
Lighting Control Module
The MC9S12DG128MPVE manages automotive lighting via its 8-channel PWM for headlamp leveling, daytime running lights, and interior dimming, plus 59 digital I/O for switch inputs and relay drivers. The 128KB Flash supports adaptive lighting algorithms such as curve-adaptive headlamps and welcome/goodbye sequences. CAN bus integration enables coordination with the body controller for welcome lighting synchronized across multiple lamps.
Recommended
Industrial PLC I/O Expansion
The MC9S12DG128MPVE expands industrial PLCs through its 59 digital I/O lines for 24V industrial signal conditioning, 16 ADC channels for analog sensor reading, and the SPI port for digital isolator coupling. The msCAN module provides industrial CANopen or DeviceNet connectivity. Although NRND, the part remains in service for legacy PLC backplanes where 128KB Flash and the rugged 112-LQFP package meet form-factor and environmental constraints.
Recommended
Motor Control (Small BLDC/PMSM)
The MC9S12DG128MPVE drives small brushless DC motors via the Enhanced Capture Timer for back-EMF sensing, 8-channel PWM for complementary 3-phase switching, and the dual 10-bit ADC for current shunt feedback. The 25MHz CPU and 50MHz bus clock execute field-oriented control (FOC) loops for pumps, fans, and small e-compressors. CAN bus integration enables torque/speed command reception from a higher-level vehicle or industrial controller.
Recommended
Recommended Products Summary
Engineering reference data for MC9S12DG128MPVE — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC9S12DP512MPVE | MC9S12DG128CPVE | MC9S12A256CPVE | MC9S12B128CPVE | MC9S12DG128MPVER |
|---|---|---|---|---|---|---|
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Flash Memory | 128 KB | 512 KB | 128 KB | 256 KB | 128 KB | 128 KB |
| CPU Clock | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Temperature Grade | Automotive (-40C to +125C) | Automotive (-40C to +125C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Automotive (-40C to +125C) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| msCAN Module | 1 | 5 | 1 | 2 | 1 | 1 |
| ADC Channels (10-bit) | 16 (2 x 8-channel) | 24 (3 x 8-channel) | 16 | 16 | 16 | 16 |
Key Differentiators
- Higher Flash density than MC9S12B128CPVE in same 112-LQFP (vs MC9S12B128CPVE)
- 4x Flash memory for firmware-intensive designs (vs MC9S12DP512MPVE)
- Commercial temperature grade option for non-automotive designs (vs MC9S12DG128CPVE)
Design Notes
The MC9S12DG128MPVE integrates an internal 2.5V voltage regulator (VDDR/VSSX). Provide a 100nF decoupling capacitor on VDDX and a 4.7uF bulk capacitor on VDDR as recommended by the NXP datasheet. The regulator can supply up to 80mA; ensure external loads via VDDR do not exceed this. Place all decoupling caps within 5mm of the package pins to minimize inductance.
At -40C to +125C automotive operation, the 112-LQFP package dissipates roughly 1W maximum with theta_JA of approximately 50 C/W on a standard 4-layer PCB. For continuous high-speed CPU operation (50MHz bus clock) at +125C ambient, ensure the PCB copper pour covers at least 50% of the exposed pads and that thermal vias are placed beneath the LQFP thermal pad area to keep junction temperature within the 150C absolute maximum.
Route analog signals (PAD0-PAD15) on a separate inner layer with guard traces tied to analog ground (VSSA). Keep digital traces away from the analog inputs by at least 3mm and place a ferrite bead between VDD and VDDA to isolate analog supply noise. Use a 4-layer PCB stack-up with dedicated ground and power planes for best EMC performance in automotive environments.
When migrating from MC9S12DG128CPVE (commercial grade) to MC9S12DG128MPVE (automotive grade), verify the BDM pull-up resistor configuration per the BDM specification - the automotive variant requires a stronger pull-up on BKGD for reliable debug at low voltages. Also confirm that the 5V-tolerant I/O pins on the automotive grade still meet the 2.5V/5V mixed-voltage specification when connected to 3.3V peripherals.
Compliance Information
RoHS and REACH compliant per NXP product page. AEC-Q100 qualified for automotive temperature grade (suffix M indicates automotive). Lead-free terminations compatible with reflow profiles up to 245C peak.
