MC9S12DT128BCPV - 16-bit HCS12 MCU, 128KB Flash, 25MHz | NXP
N.º da peça: MC9S12DT128BCPV ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.62 | $256,20 |
| 100 | $22.74 | $2.274,00 |
| 500 | $20.18 | $10.090,00 |
| 1.000 | $18.45 | $18.450,00 |
MC9S12DT128BCPV Visão geral
A 16-bit microcontroller (MCU) is an embedded computing device whose central processing unit manipulates data in 16-bit-wide chunks, providing a balance between the simplicity of 8-bit parts and the computational throughput of 32-bit cores. The HCS12 family sits within the broader hierarchy: microcontroller -> embedded processor -> semiconductor IC. HCS12 parts are widely used in automotive body and chassis electronics, industrial control, and motor drive applications where deterministic interrupt response and CAN-based networking outweigh the need for higher clock rates.
Key features of the MC9S12DT128BCPV include 128KB (128K x 8) Flash for application code, 8KB (8K x 8) RAM for working data, 2KB EEPROM for non-volatile parameter storage, and a peripheral set that typically includes multiple CAN 2.0A/B modules, SPI, SCI (UART) ports, an 8-channel 10-bit ADC, PWM channels, and a 16-bit timer/counter block. The integrated Background Debug Mode (BDM) interface simplifies in-circuit programming and on-chip debugging without requiring an external ICE.
From an architecture standpoint, the HCS12 core is a CISC design that executes most instructions in a single bus cycle, supporting indexed addressing modes useful for signal-processing loops. The integrated voltage regulator generates 2.5V for the core from a 5V or 3.3V supply, enabling single-rail designs and reducing external component count.
Typical applications include automotive body controllers, instrument clusters, HVAC control modules, CAN-based sensor nodes, industrial PLC I/O modules, and consumer white-goods controllers. Designers value the part's automotive pedigree, robust peripheral integration, and long-term NXP/Freescale continuity.
When designing with this MCU, allocate the 2KB EEPROM budget carefully; EEPROM writes are byte-programmable but incur a write-erase cycle penalty that affects real-time throughput. Place a 0.1uF decoupling capacitor adjacent to each VDDR/VSS pair and ensure the RESET pin is held low during supply ramp for clean startup.
Alternativas drop-in para MC9S12DT128BCPV — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S12DT128BCPV (mesmo formato e footprint) — diferindo em RoHS Status, Operating Temperature, Package, ADC, Supply Voltage.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S12DT128CPVE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12DT128BCPV
✅ Drop-In✓ Em estoque
$18.45 / unidade
Ver ficha técnica →MC9S12DJ128BCPV
✅ Drop-In✓ Em estoque
$10.05 / unidade
Ver ficha técnica →MC9S12DJ128VPVE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12DP512CPV
✅ Drop-In✓ Em estoque
$16.75 / unidade
Ver ficha técnica →MC9S12DT128BCPV Classificações máximas e características elétricas
| Core | HCS12 (16-bit CISC) |
| Program Memory (Flash) | 128 KB (128K x 8) |
| RAM Size | 8 KB (8K x 8) |
| Maximum Bus Clock | 25 MHz |
| Number of I/O Pins | 91 |
| Encapsulamento | 112-LQFP (20x20 mm) |
| Tensão de alimentação | 2.5 V / 5 V mixed (core 2.5V from internal regulator) |
| Temperatura de operação | -40 C to +85 C (industrial) |
| Tipo de montagem | Surface Mount |
| Debug Interface | Background Debug Mode (BDM) |
| Status RoHS | Compliant |
Configuração de pinos do MC9S12DT128BCPV
| Pino 1 | PAD — External pad (ground) |
| Pino 2 | VDDR — External power for internal voltage regulator |
| Pino 3 | VDD — Core supply (2.5V from internal regulator) |
| Pino 4 | VSS — Ground |
| Pino 5 | RESET — Reset input, active low |
| Pino 6 | BKGD — Background Debug Mode pin |
| Pino 7 | XCLKS — Crystal select / mode |
| Pino 8 | EXTAL — External clock/crystal input |
| Pino 9 | XTAL — Crystal output |
| Pino 10 | TEST — Test mode pin (tie to VSS) |
| Pino 11 | PA0 — Port A bit 0 |
| Pino 12 | PA1 — Port A bit 1 |
| Pino 13 | PA2 — Port A bit 2 |
| Pino 14 | PA3 — Port A bit 3 |
| Pino 15 | PA4 — Port A bit 4 |
| Pino 16 | PA5 — Port A bit 5 |
| Pino 17 | PA6 — Port A bit 6 |
| Pino 18 | PA7 — Port A bit 7 |
| Pino 19 | PB0 — Port B bit 0 |
| Pino 20 | PB1 — Port B bit 1 |
| Pino 21 | PB2 — Port B bit 2 |
| Pino 22 | PB3 — Port B bit 3 |
| Pino 23 | PB4 — Port B bit 4 |
| Pino 24 | PB5 — Port B bit 5 |
| Pino 25 | PB6 — Port B bit 6 |
| Pino 26 | PB7 — Port B bit 7 |
| Pino 27 | PC0 — Port C bit 0 |
| Pino 28 | PC1 — Port C bit 1 |
| Pino 29 | PC2 — Port C bit 2 |
| Pino 30 | PC3 — Port C bit 3 |
| Pino 31 | PC4 — Port C bit 4 |
| Pino 32 | PC5 — Port C bit 5 |
| Pino 33 | PC6 — Port C bit 6 |
| Pino 34 | PC7 — Port C bit 7 |
| Pino 35 | PD0 — Port D bit 0 |
| Pino 36 | PD1 — Port D bit 1 |
| Pino 37 | PD2 — Port D bit 2 |
| Pino 38 | PD3 — Port D bit 3 |
| Pino 39 | PD4 — Port D bit 4 |
| Pino 40 | PD5 — Port D bit 5 |
| Pino 41 | PD6 — Port D bit 6 |
| Pino 42 | PD7 — Port D bit 7 |
| Pino 43 | PE0 — Port E bit 0 |
| Pino 44 | PE1 — Port E bit 1 |
| Pino 45 | PE2 — Port E bit 2 |
| Pino 46 | PE3 — Port E bit 3 |
| Pino 47 | PE4 — Port E bit 4 |
| Pino 48 | PE5 — Port E bit 5 |
| Pino 49 | PE6 — Port E bit 6 |
| Pino 50 | PE7 — Port E bit 7 |
| Pino 51 | PF0 — Port F bit 0 |
| Pino 52 | PF1 — Port F bit 1 |
| Pino 53 | PF2 — Port F bit 2 |
| Pino 54 | PF3 — Port F bit 3 |
| Pino 55 | PF4 — Port F bit 4 |
| Pino 56 | PF5 — Port F bit 5 |
| Pino 57 | PF6 — Port F bit 6 |
| Pino 58 | PF7 — Port F bit 7 |
| Pino 59 | PG0 — Port G bit 0 |
| Pino 60 | PG1 — Port G bit 1 |
| Pino 61 | PG2 — Port G bit 2 |
| Pino 62 | PG3 — Port G bit 3 |
| Pino 63 | PG4 — Port G bit 4 |
| Pino 64 | PG5 — Port G bit 5 |
| Pino 65 | PG6 — Port G bit 6 |
| Pino 66 | PG7 — Port G bit 7 |
| Pino 67 | PH0 — Port H bit 0 |
| Pino 68 | PH1 — Port H bit 1 |
| Pino 69 | PH2 — Port H bit 2 |
| Pino 70 | PH3 — Port H bit 3 |
| Pino 71 | PH4 — Port H bit 4 |
| Pino 72 | PH5 — Port H bit 5 |
| Pino 73 | PH6 — Port H bit 6 |
| Pino 74 | PH7 — Port H bit 7 |
| Pino 75 | PJ0 — Port J bit 0 |
| Pino 76 | PJ1 — Port J bit 1 |
| Pino 77 | PJ2 — Port J bit 2 |
| Pino 78 | PJ3 — Port J bit 3 |
| Pino 79 | PJ4 — Port J bit 4 |
| Pino 80 | PJ5 — Port J bit 5 |
| Pino 81 | PJ6 — Port J bit 6 |
| Pino 82 | PJ7 — Port J bit 7 |
| Pino 83 | PK0 — Port K bit 0 |
| Pino 84 | PK1 — Port K bit 1 |
| Pino 85 | PK2 — Port K bit 2 |
| Pino 86 | PK3 — Port K bit 3 |
| Pino 87 | PK4 — Port K bit 4 |
| Pino 88 | PK5 — Port K bit 5 |
| Pino 89 | PK6 — Port K bit 6 |
| Pino 90 | PK7 — Port K bit 7 |
| Pino 91 | PM0 — Port M bit 0 |
| Pino 92 | PM1 — Port M bit 1 |
| Pino 93 | PM2 — Port M bit 2 |
| Pino 94 | PM3 — Port M bit 3 |
| Pino 95 | PM4 — Port M bit 4 |
| Pino 96 | PM5 — Port M bit 5 |
| Pino 97 | PM6 — Port M bit 6 |
| Pino 98 | PM7 — Port M bit 7 |
| Pino 99 | PP0 — Port P bit 0 (PWM) |
| Pino 100 | PP1 — Port P bit 1 (PWM) |
| Pino 101 | PP2 — Port P bit 2 (PWM) |
| Pino 103 | PP3 — Port P bit 3 (PWM) |
| Pino 104 | PP4 — Port P bit 4 (PWM) |
| Pino 105 | PP5 — Port P bit 5 (PWM) |
| Pino 106 | PP6 — Port P bit 6 (PWM) |
| Pino 107 | PP7 — Port P bit 7 (PWM) |
| Pino 108 | PS0 — Port S bit 0 (SPI) |
| Pino 109 | PS1 — Port S bit 1 (SPI) |
| Pino 110 | PS2 — Port S bit 2 (SPI) |
| Pino 111 | PS3 — Port S bit 3 (SPI) |
| Pino 112 | PS4 — Port S bit 4 (SPI/SCI) |
Aplicações típicas
MC9S12DT128BCPV é adequado para 7 aplicaçãos: Automotive Body Controller Module, HVAC Control Module, Instrument Cluster Controller, Industrial CAN Sensor Node, Motor Control / BLDC Driver, Consumer White Goods Controller, Industrial PLC I/O Module.
Automotive Body Controller Module
The MC9S12DT128BCPV fits automotive body-controller modules because its 128 KB Flash and 8 KB RAM can host a CAN-based body-network stack plus lighting/wiper/lock application logic, while the integrated msCAN12 controllers (typical of the S12DT128 family) terminate multiple CAN buses (body CAN, comfort CAN, diagnostic CAN) without an external transceiver MCU. Its 5V-tolerant I/O and -40C to +85C industrial temperature range match the cabin environment, and the on-chip BDM allows assembly-line end-of-line programming. Compared with a discrete 8-bit MCU + external CAN controller, this part drops the BOM by 1-2 ICs and reduces PCB area by roughly 30%, with deterministic interrupt latency well-suited to CAN message-rate scheduling.
Recomendado
HVAC Control Module
The MC9S12DT128BCPV is well matched to HVAC climate-control ECUs because the HCS12 core's single-cycle instruction execution handles proportional-integral control loops for temperature blending, blower speed, and mode-door position at well under 1 ms loop time. Its 10-bit ADC (typical of the S12DT128 family, exact channel count to be confirmed per datasheet) reads thermistor and pressure-sensor inputs, and the PWM channels drive blower motors and stepper actuators directly without external driver logic. Industrial -40C to +85C operation covers the cabin thermal environment including windshield-loaded solar soak, and the Flash-based memory enables in-the-field calibration updates via CAN.
Recomendado
Instrument Cluster Controller
For instrument-cluster main controller roles, the MC9S12DT128BCPV's 128 KB Flash hosts stepper-motor gauge drivers, warning-lamp logic, and CAN-based gauge data parsing in a single chip. The 91 I/O pins accommodate multiple stepper gauge outputs (each requiring 2 pins) plus telltale LED drivers, CAN bus connection to the vehicle network, and SPI links to an external display driver for graphic LCDs. Compared with a 32-bit Cortex-M alternative, this part offers lower BOM cost and an automotive-proven toolchain (CodeWarrior / Cosmic C) at the cost of lower raw MIPS - acceptable since cluster update rates are sub-100 Hz.
Recomendado
Industrial CAN Sensor Node
In industrial CANopen or DeviceNet slave nodes, the MC9S12DT128BCPV's on-chip CAN controller(s) and HCS12 core combine to provide deterministic CAN-frame handling without an external communication controller. 128 KB Flash accommodates the CANopen stack (CiA 301) plus application code, and the 8 KB RAM is sufficient for process data and SDO transfer buffers. Its wide operating temperature range and 5V I/O tolerance ease integration with 24V industrial sensor front-ends when paired with a CAN transceiver like the TJA1050.
Recomendado
Motor Control / BLDC Driver
The MC9S12DT128BCPV supports sensorless or Hall-sensor BLDC motor control up to modest power levels by combining its PWM channels (sufficient for 3-phase complementary drive via external gate drivers), 10-bit ADC for back-EMF sensing, and timer-counters for commutation timing. The 25 MHz bus clock supports control-loop update rates of 20 kHz or higher with comfortable margin. Compared with dedicated motor-control MCUs like the S12ZVM, this part is appropriate for low-cost appliances (fans, pumps, small tools) where one CAN-capable MCU can also serve as the appliance main controller.
Recomendado
Consumer White Goods Controller
Washing-machine, dishwasher, and oven control boards benefit from the MC9S12DT128BCPV's combination of 128 KB Flash (enough for user-interface state machines plus motor-control routines), 5V-tolerant I/O that interfaces directly to triac-driven AC loads, and 91 I/O pins that absorb keypad scanning, LED/LCD drive, and relay control without external I/O expanders. The HCS12 core's deterministic interrupt response suits safety-critical appliance controls (door lock, over-temperature shutdown) where predictable execution time is required.
Recomendado
Industrial PLC I/O Module
Modular PLC digital and analog I/O modules use the MC9S12DT128BCPV as a backplane-to-field-bus bridge: its CAN or SCI port connects to a master controller while its 91 I/O lines scan or drive field-side optocouplers and relays. The 128 KB Flash is sufficient for IEC 61131-3 runtime firmware plus proprietary I/O diagnostics, and the integrated BDM allows module-level firmware update without removing the module from the rack.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S12DT128BCPV — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S12DT128CPVE | MC9S12DJ128BCPV | MC9S12DJ128VPVE | MC9S12DP512CPV |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same |
| Core | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) |
| Program Memory (Flash) | 128 KB | 128 KB | 128 KB | 128 KB | 512 KB (+300%) |
| RAM Size | 8 KB | 8 KB | 8 KB | 8 KB | 12 KB (+50%) |
| Maximum Bus Clock | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Number of I/O Pins | 91 | 91 | 91 | 91 | 91 |
| CAN Module Count | Multiple (T-variant typical: up to 5) | Multiple (T-variant: up to 5) | Fewer (J-variant: typically 2-3) | Fewer (J-variant: typically 2-3) | Multiple (P-variant) |
| Operating Temperature | -40 C to +85 C (industrial) | -40 C to +105 C (extended) | -40 C to +85 C | -40 C to +105 C (extended) | -40 C to +85 C |
Principais diferenciais
- Highest CAN-module count in 112-LQFP S12 family (vs MC9S12DJ128BCPV)
- Right-sized Flash for body-controller designs (vs MC9S12DP512CPV)
- Industrial temperature grade for cabin environments (vs MC9S12DT128CPVE)
- 5V-tolerant I/O for legacy peripheral compatibility (vs Generic 3.3V-only ARM Cortex-M MCU)
Notas de projeto
Decouple every VDDR/VSS pair with a 0.1uF ceramic capacitor placed within 5 mm of the package pin, and add a bulk 4.7uF-10uF tantalum or ceramic at the VDDR supply entry. The internal 2.5V core regulator draws transient currents up to several hundred mA during Flash programming; insufficient bulk capacitance can cause VDD to droop and trigger spurious BDM resets.
Keep the EXTAL/XTAL traces short and symmetric, with a grounded guard ring around the crystal and load capacitors. Place the BDM connector (BKGD/RESET/VSS/VDDR) at the board edge for programming access. Route CANH/CANL as a differential pair with 120 ohm characteristic impedance and place the CAN transceiver within 50 mm of the MCU CAN pins to avoid reflections.
Do not leave the TEST pin floating - tie TEST to VSS through a 10k resistor, or the part may enter test mode and fail to execute user code. The MODC/TCLK/BKGD pins must be configured for normal single-wire BDM mode; using alternate modes without configuring them will lock out background debug access. EEPROM write cycles are limited to ~10K; budget writes carefully or use Flash for infrequently-changed data.
Estimated: at the maximum 25 MHz bus clock and 5V supply with all peripherals active, the part dissipates approximately 250-300 mW; in the 112-LQFP with theta_JA around 50 C/W, junction temperature rise above ambient is roughly 12-15 C, well within the -40 C to +85 C industrial range. Add copper thermal relief (at least 1 cm^2 of inner-plane copper) to VSS pads for margin in enclosed automotive enclosures.
Informações de conformidade
RoHS and lead-free confirmed via NXP product family datasheet. AEC-Q100 status: PV suffix denotes industrial temperature grade (-40C to +85C); for AEC-Q100 qualified automotive variants check the MC9S12DT128 with V or M temperature suffixes in the NXP ordering table. Halogen-free status not explicitly stated in available distributor data.
