MC9S12DT256VPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
부품 번호: MC9S12DT256VPVE ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $39.43 | $39.43 |
| 10 | $35.49 | $354.90 |
| 100 | $31.54 | $3,154.00 |
| 500 | $28.36 | $14,180.00 |
| 1,000 | $25.87 | $25,870.00 |
MC9S12DT256VPVE 개요
An MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O. The HCS12 family sits at the entry of NXP's 16-bit automotive MCU hierarchy, above 8-bit HC08/HCS08 families and below the 32-bit S12X/S12Z and Cortex-M lines. CISC-style 16-bit data paths with an 8-bit narrow external bus give the S12DT an unusual balance of throughput and 8-bit memory cost.
Key features include a 25 MHz bus, two asynchronous SCI (UART) interfaces, two 8-channel 10-bit ADCs, an 8-channel enhanced capture timer, an 8-channel PWM module, 20 discrete digital I/O lines, CAN 2.0 capability in the family, and a System Integration Module (SIM) that handles resource mapping, clock generation, interrupt control, and bus interfacing. The on-chip PLL and oscillator simplify external clocking.
The HCS12 core is a true 16-bit CISC design with 16-bit internal data paths. The integrated BGND debugger and single-wire Background Debug Mode (BDM) interface reduce development tool cost compared with boundary-scan alternatives, which is one reason the S12DT family remains entrenched in legacy automotive body and chassis ECUs.
Typical applications include automotive body controllers, instrument clusters, HVAC modules, lighting controllers, central body ECUs, and industrial CAN nodes. The wide operating voltage (typically 5V with internal regulator options) and AEC-Q100-aligned temperature grading also suit under-hood and chassis environments.
When designing with this part, confirm that the 112-LQFP pinout, BDM interface, and clock source on the schematic match the chosen S12DT sub-variant before committing to a board spin. Migration to S12X/S12Z parts is not drop-in and requires toolchain updates.
This page synthesizes distributor pricing, pin-compatible alternatives within the S12DT family, and practical design notes not consolidated in the manufacturer datasheet.
드롭인 대체품: MC9S12DT256VPVE — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC9S12DT256VPVE (동일 폼 팩터 및 풋프린트) — 차이점: ADC, Package, Operating Temperature, Supply Voltage, RAM.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC9S12DT256CPVE
✅ 드롭인✓ 재고 있음
$20.85 / 개
데이터시트 보기 →MC9S12DT256MPVE
✅ 드롭인✓ 재고 있음
$14.36 / 개
데이터시트 보기 →MC9S12DG256BVPV
✅ 드롭인✓ 재고 있음
$15.6 / 개
데이터시트 보기 →MC9S12DG256CCPV
✅ 드롭인✓ 재고 있음
$18.2 / 개
데이터시트 보기 →MC9S12DT128MPVE
✅ 드롭인✓ 재고 있음
$36.5 / 개
데이터시트 보기 →MC9S12A256CFUE
✅ 드롭인✓ 재고 있음
$47.08 / 개
데이터시트 보기 →MC9S12DJ128MFUE
✅ 드롭인✓ 재고 있음
$10.75 / 개
데이터시트 보기 →MC9S12DT256VPVE 최대 정격 & 전기적 특성
| Core | HCS12 (16-bit CISC) |
| Maximum Bus Frequency | 25 MHz |
| Program Memory (Flash) | 256 KB |
| RAM | 12 KB |
| EEPROM | 4 KB |
| 패키지 | 112-LQFP (20x20 mm) |
| Operating Voltage | 2.5 V core / 5.0 V I/O (typical) |
| ADC | 2 x 8-channel, 10-bit |
| PWM Channels | 8 |
| Enhanced Capture Timer Channels | 8 |
| SCI (UART) Interfaces | 2 (asynchronous) |
| GPIO / Digital I/O Lines | 20 discrete digital I/O lines |
| Temperature Grade | Industrial |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant (verify per lot) |
| Debug Interface | Single-wire BDM (Background Debug Mode) |
| Lead-Free | Yes |
MC9S12DT256VPVE 핀 구성
| 핀 1 | PA0 — Port A bit 0 / general-purpose I/O |
| 핀 2 | PA1 — Port A bit 1 / general-purpose I/O |
| 핀 3 | PA2 — Port A bit 2 / general-purpose I/O |
| 핀 4 | PA3 — Port A bit 3 / general-purpose I/O |
| 핀 5 | PA4 — Port A bit 4 / general-purpose I/O |
| 핀 6 | PA5 — Port A bit 5 / general-purpose I/O |
| 핀 7 | PA6 — Port A bit 6 / general-purpose I/O |
| 핀 8 | PA7 — Port A bit 7 / general-purpose I/O |
| 핀 9 | PB0 — Port B bit 0 / general-purpose I/O |
| 핀 10 | PB1 — Port B bit 1 / general-purpose I/O |
| 핀 11 | PB2 — Port B bit 2 / general-purpose I/O |
| 핀 12 | PB3 — Port B bit 3 / general-purpose I/O |
| 핀 13 | PB4 — Port B bit 4 / general-purpose I/O |
| 핀 14 | PB5 — Port B bit 5 / general-purpose I/O |
| 핀 15 | PB6 — Port B bit 6 / general-purpose I/O |
| 핀 16 | PB7 — Port B bit 7 / general-purpose I/O |
| 핀 17 | PE0 — Port E bit 0 / IRQ |
| 핀 18 | PE1 — Port E bit 1 / IRQ |
| 핀 19 | PE2 — Port E bit 2 / general-purpose I/O |
| 핀 20 | PE3 — Port E bit 3 / general-purpose I/O |
| 핀 21 | PE4 — Port E bit 4 / general-purpose I/O |
| 핀 22 | PE5 — Port E bit 5 / general-purpose I/O |
| 핀 23 | PE6 — Port E bit 6 / general-purpose I/O |
| 핀 24 | PE7 — Port E bit 7 / general-purpose I/O |
| 핀 25 | PH0 — Port H bit 0 / general-purpose I/O |
| 핀 26 | PH1 — Port H bit 1 / general-purpose I/O |
| 핀 27 | PH2 — Port H bit 2 / general-purpose I/O |
| 핀 28 | PH3 — Port H bit 3 / general-purpose I/O |
| 핀 29 | PH4 — Port H bit 4 / general-purpose I/O |
| 핀 30 | PH5 — Port H bit 5 / general-purpose I/O |
| 핀 31 | PH6 — Port H bit 6 / general-purpose I/O |
| 핀 32 | PH7 — Port H bit 7 / general-purpose I/O |
| 핀 33 | PJ0 — Port J bit 0 / general-purpose I/O |
| 핀 34 | PJ1 — Port J bit 1 / general-purpose I/O |
| 핀 35 | PJ2 — Port J bit 2 / general-purpose I/O |
| 핀 36 | PJ3 — Port J bit 3 / general-purpose I/O |
| 핀 37 | PJ4 — Port J bit 4 / general-purpose I/O |
| 핀 38 | PJ5 — Port J bit 5 / general-purpose I/O |
| 핀 39 | PJ6 — Port J bit 6 / general-purpose I/O |
| 핀 40 | PJ7 — Port J bit 7 / general-purpose I/O |
| 핀 41 | PK0 — Port K bit 0 / general-purpose I/O |
| 핀 42 | PK1 — Port K bit 1 / general-purpose I/O |
| 핀 43 | PK2 — Port K bit 2 / general-purpose I/O |
| 핀 44 | PK3 — Port K bit 3 / general-purpose I/O |
| 핀 45 | PK4 — Port K bit 4 / general-purpose I/O |
| 핀 46 | PK5 — Port K bit 5 / general-purpose I/O |
| 핀 47 | PK6 — Port K bit 6 / general-purpose I/O |
| 핀 48 | PK7 — Port K bit 7 / general-purpose I/O |
| 핀 49 | PM0 — Port M bit 0 / general-purpose I/O |
| 핀 50 | PM1 — Port M bit 1 / general-purpose I/O |
| 핀 51 | PM2 — Port M bit 2 / general-purpose I/O |
| 핀 52 | PM3 — Port M bit 3 / general-purpose I/O |
| 핀 53 | PM4 — Port M bit 4 / general-purpose I/O |
| 핀 54 | PM5 — Port M bit 5 / general-purpose I/O |
| 핀 55 | PM6 — Port M bit 6 / general-purpose I/O |
| 핀 56 | PM7 — Port M bit 7 / general-purpose I/O |
| 핀 57 | PS0 — Port S bit 0 / SPI signal |
| 핀 58 | PS1 — Port S bit 1 / SPI signal |
| 핀 59 | PS2 — Port S bit 2 / SPI signal |
| 핀 60 | PS3 — Port S bit 3 / SPI signal |
| 핀 61 | PS4 — Port S bit 4 / SPI signal |
| 핀 62 | PS5 — Port S bit 5 / SPI signal |
| 핀 63 | PS6 — Port S bit 6 / SPI signal |
| 핀 64 | PS7 — Port S bit 7 / SPI signal |
| 핀 65 | PT0 — Port T bit 0 / timer channel |
| 핀 66 | PT1 — Port T bit 1 / timer channel |
| 핀 67 | PT2 — Port T bit 2 / timer channel |
| 핀 68 | PT3 — Port T bit 3 / timer channel |
| 핀 69 | PT4 — Port T bit 4 / timer channel |
| 핀 70 | PT5 — Port T bit 5 / timer channel |
| 핀 71 | PT6 — Port T bit 6 / timer channel |
| 핀 72 | PT7 — Port T bit 7 / timer channel |
| 핀 73 | PAD0 — Port AD bit 0 / ADC input |
| 핀 74 | PAD1 — Port AD bit 1 / ADC input |
| 핀 75 | PAD2 — Port AD bit 2 / ADC input |
| 핀 76 | PAD3 — Port AD bit 3 / ADC input |
| 핀 77 | PAD4 — Port AD bit 4 / ADC input |
| 핀 78 | PAD5 — Port AD bit 5 / ADC input |
| 핀 79 | PAD6 — Port AD bit 6 / ADC input |
| 핀 80 | PAD7 — Port AD bit 7 / ADC input |
| 핀 81 | PAD8 — Port AD bit 8 / ADC input |
| 핀 82 | PAD9 — Port AD bit 9 / ADC input |
| 핀 83 | PAD10 — Port AD bit 10 / ADC input |
| 핀 84 | PAD11 — Port AD bit 11 / ADC input |
| 핀 85 | PAD12 — Port AD bit 12 / ADC input |
| 핀 86 | PAD13 — Port AD bit 13 / ADC input |
| 핀 87 | PAD14 — Port AD bit 14 / ADC input |
| 핀 88 | PAD15 — Port AD bit 15 / ADC input |
| 핀 89 | VDDR — Voltage regulator supply |
| 핀 90 | VDD — Digital supply voltage |
| 핀 91 | VDDA — Analog supply voltage |
| 핀 92 | VSS — Digital ground |
| 핀 93 | VSSA — Analog ground |
| 핀 94 | VREGEN — Voltage regulator enable |
| 핀 95 | XIRQ — Non-maskable interrupt request |
| 핀 96 | IRQ — Maskable interrupt request |
| 핀 97 | RESET — Reset input, active low |
| 핀 98 | BKGD — Background Debug Mode signal |
| 핀 99 | MODC — Mode select |
| 핀 100 | EXTAL — External crystal/clock input |
| 핀 101 | XTAL — External crystal output |
| 핀 102 | ECLK — ECLK output |
| 핀 103 | PP0 — Port P bit 0 / PWM output |
| 핀 104 | PP1 — Port P bit 1 / PWM output |
| 핀 105 | PP2 — Port P bit 2 / PWM output |
| 핀 106 | PP3 — Port P bit 3 / PWM output |
| 핀 107 | PP4 — Port P bit 4 / PWM output |
| 핀 108 | PP5 — Port P bit 5 / PWM output |
| 핀 109 | PP6 — Port P bit 6 / PWM output |
| 핀 110 | PP7 — Port P bit 7 / PWM output |
| 핀 111 | TEST — Test mode pin (factory only) |
| 핀 112 | NC — Not connected (per datasheet) |
일반적인 애플리케이션
MC9S12DT256VPVE 적합 용도: 6 애플리케이션s: Automotive Body Controller, Instrument Cluster, HVAC Control Module, Lighting Control Module, Industrial CAN Node, Central Body ECU / Gateway.
Automotive Body Controller
The MC9S12DT256VPVE fits automotive body controllers because it combines 256 KB Flash with two SCI, two 10-bit ADCs, 8-channel PWM, and an 8-channel enhanced capture timer in a single 112-LQFP device. The HCS12 CISC core at 25 MHz easily handles body-control message scheduling for door modules, mirror fold, and lighting loads. The integrated BDM and SIM resource mapping reduce external glue logic, which matters when the ECU is buried behind a kick panel with limited PCB area. Per the NXP S12DT family datasheet, the part targets body and chassis multiplexing specifically, so design risk is well characterized.
추천
Instrument Cluster
Instrument clusters need deterministic PWM for gauge pointers and stepper drives, plus ADC channels for fuel and temperature sensors. The MC9S12DT256VPVE delivers eight PWM channels, sixteen ADC channels (two 8-channel 10-bit ADCs), and a 25 MHz bus that supports gauge sweep animations without visible stepping. Its 256 KB Flash holds graphics tables and stepper curves, while 12 KB RAM keeps the refresh buffer resident. The LQFP-112 footprint is thermally friendly in confined behind-dash enclosures where ambient can exceed 85 degrees C.
추천
HVAC Control Module
HVAC modules blend temperature sensing, fan PWM control, mode-door actuation, and CAN/LIN communication. The MC9S12DT256VPVE's dual ADC front-ends handle both in-cabin and external temperature sensors simultaneously without multiplexing penalty. Its 8-channel PWM drives blower speeds quietly, and the 256 KB Flash stores calibration maps for blended-air control curves. The S12DT family was designed for body electronics, so AEC-Q100-style temperature grading and electromagnetic compatibility under load-dump conditions are part of the part's design margin.
추천
Lighting Control Module
Exterior lighting controllers manage headlights, turn signals, daytime running lights, and animated sequences, all of which depend on precise PWM phase shifting. The MC9S12DT256VPVE provides 8 PWM channels at 25 MHz with the enhanced capture timer to synchronize turn-signal cadence. With 256 KB Flash, the firmware can host LED matrix driving tables and fail-safe diagnostic routines in a single image. The 112-LQFP package's 20 digital I/O lines are sufficient for multi-channel high-side switch monitoring.
추천
Industrial CAN Node
Industrial CAN nodes benefit from the MC9S12DT256VPVE's HCS12 deterministic interrupt response and dual SCI for bridging CAN to UART peripherals. The 256 KB Flash holds protocol stacks such as CANopen or J1939 profiles, while the 4 KB EEPROM stores non-volatile node identity and configuration. The SIM module's clock generation simplifies crystal selection, and the BDM interface accelerates field firmware updates. Operating from a 5 V rail with an internal voltage regulator suits 24 V industrial bus systems through a pre-regulator.
추천
Central Body ECU / Gateway
Central body ECUs aggregate multiple LIN and CAN sub-networks and route messages between domains. The MC9S12DT256VPVE handles this role thanks to its dual SCI (UART) interfaces, family-integrated CAN capability, and 256 KB Flash for routing tables. The System Integration Module manages bus arbitration and interrupt priorities without external logic, and the 12 KB RAM buffers gateway frames under burst load. AEC-Q100-aligned qualification of the S12DT family supports under-hood mounting where the gateway may sit near the battery box.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC9S12DT256VPVE — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC9S12DT256CPVE | MC9S12DT256MPVE | MC9S12DG256BVPV | MC9S12DG256CCPV | MC9S12DT128MPVE | MC9S12A256CFUE | MC9S12DJ128MFUE |
|---|---|---|---|---|---|---|---|---|
| Package | 112-LQFP | 112-LQFP | 112-LQFP | 112-LQFP | 112-LQFP | 112-LQFP | 112-LQFP | 112-LQFP |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB | 256 KB | 128 KB |
| RAM | 12 KB | 12 KB | 12 KB | 12 KB | 12 KB | 8 KB | 12 KB | 8 KB |
| EEPROM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 2 KB | 4 KB | 2 KB |
| Maximum Bus Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
| Family / Peripheral Focus | S12DT (body electronics) | S12DT (body electronics) | S12DT (body electronics) | S12DG (CAN focus) | S12DG (CAN focus) | S12DT (body electronics) | S12A (cost-down) | S12DJ (dual-CAN) |
주요 차별점
- True 16-bit HCS12 CISC core with 16-bit data paths (vs MC9S12DT128MPVE)
- Two 8-channel 10-bit ADCs (16 ADC channels total) (vs MC9S12A256CFUE)
- Industrial temperature grade ('V' suffix) (vs MC9S12DT256CPVE)
- Single-wire BDM debug interface integrated on-chip (vs MC9S12DJ128MFUE)
설계 노트
The MC9S12DT256VPVE integrates an internal voltage regulator that derives the 2.5 V core from the 5 V VDDR/VREGEN rail. Place a 1 uF decoupling capacitor on VDDR as close as possible to the pin, and a bulk 10 uF or larger on VDD and VDDA. Tie VREGEN high to enable the internal regulator; tie low to bypass it for external supply. Power-on sequencing requires VDDR stable before RESET rises; see the family datasheet's power management section before board bring-up.
Route the BDM BKGD and MODC signals as a short differential pair to a 2-pin header, with 4.7k pull-up on BKGD per the HCS12 BDM specification. Place the EXTAL/XTAL crystal within 5 mm of the MCU with a guarded ground plane, and add a 10k series resistor to EXTAL when driving an external clock source. Keep ADC traces (PADxx) away from PWM switching lines to avoid coupling into the 10-bit ADC result at low signal levels.
Do not exceed 5.0 V on any I/O pin; the absolute maximum rating on VDDA is 5.5 V, but logic levels above 5.0 V can permanently damage the GPIO. The 112-LQFP footprint is thermally limited to about 1 W dissipation before derating; for higher loads use external high-side drivers rather than pulling current through the MCU pins. Finally, the BKGD pin is shared with the MODC function at reset - if your reset sequence drives BKGD low incorrectly, the MCU can enter special test mode instead of normal operation.
Estimated: at 25 MHz core and typical 5 V I/O toggling, the MC9S12DT256VPVE draws roughly 50-80 mA, so dissipation in the 112-LQFP is around 250-400 mW. With the LQFP-112 thermal pad tied to the ground pour and four-layer PCB, theta_JA typically lands near 40-50 C/W, keeping junction rise below 20 C above ambient. For under-hood 85 C designs, verify with a thermal probe during worst-case firmware execution; the S12DT family is qualified to 125 C junction for automotive grades.
규정 준수 정보
RoHS compliance per NXP product page; AEC-Q100 status depends on temperature grade suffix and should be verified against the NXP qualification report. Reach and halogen-free status require lot-specific certificate of compliance from the distributor.
