NXP Semiconductors

MC9S12XD256MAG - 16-Bit HCS12X 80MHz 256KB Flash MCU | NXP

부품 번호: MC9S12XD256MAG ✗ 단종
재고 있음 영업일 기준 1~3일 내 발송
2.5 V / 5 V Vdss 144-LQFP (20 x 20 mm) Package 80 MHz Speed 256 KB Flash (256K x 8) Memory
시작가 $17.1 USD / 개
MOQ: 1 |
가격 업데이트: 2026-10-17
볼륨 가격
수량 단가 합계
1 $24.5 $24.50
10 $22.1 $221.00
100 $19.85 $1,985.00
500 $18.2 $9,100.00
1,000 $17.1 $17,100.00
ℹ️ 모든 가격은 USD 기준입니다

MC9S12XD256MAG 개요

The NXP MC9S12XD256MAG is a 16-bit HCS12X family microcontroller featuring an 80 MHz CPU core, 256 KB of on-chip Flash, and a 144-pin LQFP package. According to the NXP product brief, the device integrates the HCS12X CPU with enhanced indexed addressing, an instruction queue, and a richer instruction set, all while remaining upward-compatible with the legacy HCS12 instruction set.

Background: HCS12X is NXP's (formerly Freescale) 16-bit microcontroller architecture, evolved from the HCS12 CISC core. It targets automotive body, chassis, and powertrain applications as well as industrial control. The S12XD sub-family adds the XGATE coprocessor for high-bandwidth peripheral servicing and deterministic interrupt response, and shares its peripheral set, programmer's model, and interrupt stacking with HCS12, simplifying migration of legacy HCS12 code bases.

Key features of the MC9S12XD256MAG include 256 KB (256K x 8) of Flash program memory, 12 KB of RAM, 4 KB of EEPROM, an 80 MHz bus-rated CPU with a 25 MHz bus clock typical, dual CAN (msCAN) controllers, multiple SCI/SPI/PWM/IIC peripherals, an 8-channel 10-bit ADC, and an operating voltage range of 2.5 V/5 V that suits automotive 5 V rails.

Technically, the HCS12X core pairs the main CPU with the XGATE peripheral coprocessor for time-critical I/O offload, allowing interrupt latency below 1 us in many configurations. The 144-LQFP package exposes up to four 8-bit Ports (PJ-PK and PT) plus additional PAD/ADDR/DATA buses that allow external memory expansion.

Typical applications include automotive body control modules, industrial PLCs, HVAC controllers, sensor fusion front-ends, and CAN gateway nodes where the dual msCAN modules and large Flash footprint are decisive.

Design consideration: PCB designers should leave generous copper pour under the exposed thermal pad of the 144-LQFP and keep the analog AVREF/VDDA traces short and decoupled to maximise ADC performance; the HCS12X background-debug-mode (BDM) interface should remain accessible for in-circuit debug.

This page synthesises distributor pricing, same-family LQFP alternatives, and practical design notes not collected on the manufacturer product page.

드롭인 대체품: MC9S12XD256MAG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: MC9S12XD256MAG (동일 폼 팩터 및 풋프린트) — 차이점: ADC, Package, Supply Voltage, Core, Operating Temperature.

NXP Semiconductors
Package: 144-LQFP (20x20 mm)
비교 대상: MC9S12XD256MAG →
NXP Semiconductors
ADC: 16-channel, 10-bit
Package: 144-pin LQFP (20x20 mm)
Core: HCS12X (16-bit CISC with XGATE co-processor)
비교 대상: MC9S12XD256MAG →
NXP Semiconductors
ADC: 10-bit, multiple channels
Supply Voltage: 2.35 V to 2.75 V (digital core), 4.75 V to 5.25 V (I/O)
Core: HCS12X (S12XD family)
비교 대상: MC9S12XD256MAG →
NXP Semiconductors
ADC: 12-bit, 3 us conversion time
Package: 144-pin LQFP (20x20 mm)
Supply Voltage: 1.72 V to 1.98 V (core) / 2.8 V / 5 V I/O
비교 대상: MC9S12XD256MAG →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

MC9S12XDT256CAG

✅ 드롭인
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (16-bit CISC with XGATE co-processor) · 256 KB Flash · 16 KB · 4 KB · 80 MHz · 2.35 V to 2.75 V · 4.5 V to 5.5 V · 119

✓ 재고 있음

$17.4 / 개

데이터시트 보기 →

MC9S12XDT256MAG

✅ 드롭인
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (S12XD family) · 16-bit · 80 MHz · 256 KB (256K x 8) · 12 KB · 144-LQFP (20 x 20 mm) · Surface Mount

✓ 재고 있음

$10.65 / 개

데이터시트 보기 →

MC9S12XDP512MAG

✅ 드롭인
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (16-bit CISC) · 16-bit · 80 MHz · 512 KB (512K x 8) · 2.5 V / 5 V · 144-LQFP (20x20 mm) · Surface Mount · Gull Wing

✓ 재고 있음

가격 문의

데이터시트 보기 →

MC9S12XDP512CAG

✅ 드롭인
📦 144-LQFP (20x20)
same 144-LQFP package; 512 KB Flash (+100%) vs 256 KB; same HCS12X 80 MHz core and peripherals

📋 참조 대체품 (카탈로그에 없음)

MC9S12XEQ512MAG

✅ 드롭인
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (16-bit) · XGATE (RISC peripheral engine) · 50 MHz · 512 KB · Hardware-emulated EEPROM via Flash · 12-bit, 3 us conversion time · ECT, PIT, RTI

✓ 재고 있음

$9.75 / 개

데이터시트 보기 →

MC9S12XA256MAG

✅ 드롭인
📦 144-LQFP (20x20)
same 144-LQFP footprint; Flash 256 KB = identical; XA lacks some XGATE features, ~80% perf on peripheral offload

📋 참조 대체품 (카탈로그에 없음)

MC9S12XD256MAG 최대 정격 & 전기적 특성

Core Architecture HCS12X (S12XD)
데이터 버스 폭 16-bit
CPU Clock (max) 80 MHz
Program Memory 256 KB Flash (256K x 8)
RAM 12 KB
EEPROM 4 KB
공급 전압 2.5 V / 5 V
CAN Controllers 2 x msCAN
SCI Up to 2
SPI Up to 1
ADC 8-channel, 10-bit
PWM Channels 8 (standard S12 PWM)
XGATE Coprocessor Yes
패키지 144-LQFP (20 x 20 mm)
동작 온도 -40C to +125C (Automotive grade)
실장 유형 Surface Mount
RoHS 상태 Compliant

MC9S12XD256MAG 핀 구성

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
핀 1 PE1 — Port E bit 1 (general-purpose I/O, IRQ)
핀 2 PE0 — Port E bit 0 (general-purpose I/O, XIRQ)
핀 3 BKGD — Background Debug Mode
핀 4 RESET — External reset input (active low)
핀 5 VDDR
핀 6 VDD
핀 7 VSS
핀 8 VDDPLL — PLL supply
핀 9 VSSPLL — PLL ground
핀 10 TEST — Test mode (tie to VSS for normal operation)
핀 11 XCLKS — Clock select (configuration)
핀 12 EXTAL — External clock/crystal input
핀 13 XTAL — Crystal output
핀 14 PAD00 — External address/data bus bit 0
핀 15 PAD01 — External address/data bus bit 1
핀 16 PAD02 — External address/data bus bit 2
핀 17 PAD03 — External address/data bus bit 3
핀 18 PAD04 — External address/data bus bit 4
핀 19 PAD05 — External address/data bus bit 5
핀 20 PAD06 — External address/data bus bit 6
핀 21 PAD07 — External address/data bus bit 7
핀 22 PAD08 — External address/data bus bit 8
핀 23 PAD09 — External address/data bus bit 9
핀 24 PAD10 — External address/data bus bit 10
핀 25 PAD11 — External address/data bus bit 11
핀 26 PAD12 — External address/data bus bit 12
핀 27 PAD13 — External address/data bus bit 13
핀 28 PAD14 — External address/data bus bit 14
핀 29 PAD15 — External address/data bus bit 15
핀 30 PAD16 — External address/data bus bit 16
핀 31 PAD17 — External address/data bus bit 17
핀 32 PAD18 — External address/data bus bit 18
핀 33 PAD19 — External address/data bus bit 19
핀 34 PAD20 — External address/data bus bit 20
핀 35 PAD21 — External address/data bus bit 21
핀 36 PAD22 — External address/data bus bit 22
핀 37 PAD23 — External address/data bus bit 23
핀 38 PE2 — Port E bit 2
핀 39 PE3 — Port E bit 3
핀 40 PE4 — Port E bit 4
핀 41 PE5 — Port E bit 5
핀 42 PE6 — Port E bit 6
핀 43 PE7 — Port E bit 7
핀 44 PJ0 — Port J bit 0
핀 45 PJ1 — Port J bit 1
핀 46 PJ2 — Port J bit 2 (XIRQ)
핀 47 PJ3 — Port J bit 3
핀 48 PJ4 — Port J bit 4
핀 49 PJ5 — Port J bit 5
핀 50 PJ6 — Port J bit 6
핀 51 PJ7 — Port J bit 7
핀 52 PK0 — Port K bit 0
핀 53 PK1 — Port K bit 1
핀 54 PK2 — Port K bit 2
핀 55 PK3 — Port K bit 3
핀 56 PK4 — Port K bit 4
핀 57 PK5 — Port K bit 5
핀 58 PK6 — Port K bit 6
핀 59 PK7 — Port K bit 7
핀 60 PA0 — Port A bit 0
핀 61 PA1 — Port A bit 1
핀 62 PA2 — Port A bit 2
핀 63 PA3 — Port A bit 3
핀 64 PA4 — Port A bit 4
핀 65 PA5 — Port A bit 5
핀 66 PA6 — Port A bit 6
핀 67 PA7 — Port A bit 7
핀 68 PB0 — Port B bit 0
핀 69 PB1 — Port B bit 1
핀 70 PB2 — Port B bit 2
핀 71 PB3 — Port B bit 3
핀 72 PB4 — Port B bit 4
핀 73 PB5 — Port B bit 5
핀 74 PB6 — Port B bit 6
핀 75 PB7 — Port B bit 7
핀 76 PC0 — Port C bit 0
핀 77 PC1 — Port C bit 1
핀 78 PC2 — Port C bit 2
핀 79 PC3 — Port C bit 3
핀 80 PC4 — Port C bit 4
핀 81 PC5 — Port C bit 5
핀 82 PC6 — Port C bit 6
핀 83 PC7 — Port C bit 7
핀 84 PD0 — Port D bit 0
핀 85 PD1 — Port D bit 1
핀 86 PD2 — Port D bit 2
핀 87 PD3 — Port D bit 3
핀 88 PD4 — Port D bit 4
핀 89 PD5 — Port D bit 5
핀 90 PD6 — Port D bit 6
핀 91 PD7 — Port D bit 7
핀 92 PP0 — Port P bit 0 (PWM, PWM channel)
핀 93 PP1 — Port P bit 1 (PWM)
핀 94 PP2 — Port P bit 2 (PWM)
핀 95 PP3 — Port P bit 3 (PWM)
핀 96 PP4 — Port P bit 4 (PWM)
핀 97 PP5 — Port P bit 5 (PWM)
핀 98 PP6 — Port P bit 6 (PWM)
핀 99 PP7 — Port P bit 7 (PWM)
핀 100 PT0 — Port T bit 0 (TIM timer input/output)
핀 101 PT1 — Port T bit 1 (TIM timer input/output)
핀 102 PT2 — Port T bit 2 (TIM timer input/output)
핀 103 PT3 — Port T bit 3 (TIM timer input/output)
핀 104 PT4 — Port T bit 4 (TIM timer input/output)
핀 105 PT5 — Port T bit 5 (TIM timer input/output)
핀 106 PT6 — Port T bit 6 (TIM timer input/output)
핀 107 PT7 — Port T bit 7 (TIM timer input/output)
핀 108 CAN0TX — CAN0 transmit
핀 109 CAN0RX — CAN0 receive
핀 110 CAN1TX — CAN1 transmit
핀 111 CAN1RX — CAN1 receive
핀 112 IICSCL — IIC clock
핀 113 IICSDA — IIC data
핀 114 SCIRX — SCI receive
핀 115 SCITX — SCI transmit
핀 116 SPI_SS — SPI slave select (GPIO)
핀 117 SPI_MOSI — SPI master out / slave in
핀 118 SPI_MISO — SPI master in / slave out
핀 119 SPI_SCK — SPI clock
핀 120 VDDA — Analog supply
핀 121 VSSA — Analog ground
핀 122 VRH — ADC high reference voltage
핀 123 VRL — ADC low reference voltage
핀 124 AN0 — ADC analog input 0
핀 125 AN1 — ADC analog input 1
핀 126 AN2 — ADC analog input 2
핀 127 AN3 — ADC analog input 3
핀 128 AN4 — ADC analog input 4
핀 129 AN5 — ADC analog input 5
핀 130 AN6 — ADC analog input 6
핀 131 AN7 — ADC analog input 7
핀 132 PWM0 — PWM channel 0
핀 133 PWM1 — PWM channel 1
핀 134 PWM2 — PWM channel 2
핀 135 PWM3 — PWM channel 3
핀 136 PWM4 — PWM channel 4
핀 137 PWM5 — PWM channel 5
핀 138 PWM6 — PWM channel 6
핀 139 PWM7 — PWM channel 7
핀 140 PE0_XIRQ — XIRQ shared with PE0
핀 141 MODC — Mode control (tie to VDD for normal single-chip mode)
핀 142 TCLK — Timer clock input
핀 143 TEST2 — Test pin (tie to VSS for normal operation)
핀 144 EPAD — Exposed thermal pad (connect to VSS)

일반적인 애플리케이션

MC9S12XD256MAG 적합 용도: 6 애플리케이션s: Automotive Body Control Modules, Industrial HVAC and Climate Controllers, CAN Gateway and Network Bridges, Motor Control and PWM-Driven Loads, Sensor Fusion and Front-End Acquisition, Industrial PLC and Distributed I/O Nodes.

🚗

Automotive Body Control Modules

Why it fits: The MC9S12XD256MAG's dual msCAN controllers and 256 KB Flash deliver the headroom needed for BCMs that juggle comfort, lighting and diagnostics over one CAN channel while leaving the other for service. How it is used: Often paired with LIN transceivers for seat/window control and a high-side driver IC; the HCS12X 80 MHz CPU plus XGATE allows deterministic response to bus errors within about 1 us, which is useful when handling safety-critical loads. AEC-Q100-grade temperature range (-40C to +125C) and 5 V I/O keep the part directly compatible with 12 V automotive rails.

🏭

Industrial HVAC and Climate Controllers

Why it fits: The MC9S12XD256MAG's 8-channel 10-bit ADC and 8 PWM channels map directly to temperature sensors, fan/motor drivers and valve actuators used in HVAC controllers. How it is used: Sits on a 24 V industrial rail with a small switching regulator down to 5 V, drives TRIACs through opto-isolators, and reports status via a single CAN to a central BMS. Reliable 80 MHz operation and 12 KB RAM give enough room for PID tables and fault logging without external SRAM expansion.

🌐

CAN Gateway and Network Bridges

Why it fits: With two independent msCAN controllers and HCS12X instruction queue, MC9S12XD256MAG can route messages between two buses, filter them in RAM, and forward with sub-millisecond latency. How it is used: Typically deployed as a body-to-powertrain or CAN-to-LIN bridge, sitting between a higher-speed powertrain bus and a lower-speed body bus while handling diagnostics over UDS. The 256 KB Flash accommodates large routing tables in automotive-grade firmware.

⚡

Motor Control and PWM-Driven Loads

Why it fits: The 8 PWM channels and 16-bit timers of MC9S12XD256MAG suit small brushless DC and stepper motor controllers for pumps, fans and small actuators. How it is used: Senses phase currents with the on-chip 10-bit ADC and commutates via PWM; HCS12X code runs vector control loops at sub-millisecond rates with XGATE offloading ADC interrupts for cleaner timing margins. The 144-LQFP footprint brings enough I/O to drive multiple half-bridges in parallel.

🧩

Sensor Fusion and Front-End Acquisition

Why it fits: The MC9S12XD256MAG offers enough ADC and digital I/O bandwidth to aggregate inputs from pressure, temperature and position sensors before relaying them over CAN. How it is used: Front-end modules in chassis systems run ADC sampling for shock and yaw sensors, buffer timestamps in RAM, and post-processed frames onto CAN using one of the msCAN peripherals, leaving the main CPU free for diagnostics. AEC-Q100-grade temperature rating is critical for under-hood mounting.

🖥️

Industrial PLC and Distributed I/O Nodes

Why it fits: The 80 MHz HCS12X CPU and large Flash let MC9S12XD256MAG run ladder logic plus diagnostics in a single IC, eliminating a separate communications processor. How it is used: Acts as a CAN-IO node on a factory bus, scanning 8 digital inputs per ADC channel-set and driving 8 PWM outputs back to solenoids. The 4 KB EEPROM stores calibration data that survives flash upgrades, while 5 V-tolerant I/O simplifies industrial wiring without extra level shifters.

추천 제품 요약

MC9S12XDT256CAG NXP Semiconductors 사용처: Automotive Body Control Modules, Motor Control and PWM-Driven Loads TJA1050T High-speed CAN transceiver (companion) 사용처: Automotive Body Control Modules MC33660BEFR2 LIN transceiver for body 사용처: Automotive Body Control Modules MC9S12XDT256MAG NXP Semiconductors 사용처: Industrial HVAC and Climate Controllers, Industrial PLC and Distributed I/O Nodes MC9S12XDP512MAG NXP Semiconductors 사용처: Industrial HVAC and Climate Controllers, Sensor Fusion and Front-End Acquisition TJA1042T Isolated CAN transceiver for gateway 사용처: CAN Gateway and Network Bridges MC9S12XDP512CAG Higher Flash variant for complex routing tables 사용처: CAN Gateway and Network Bridges DRV8301 Three-phase gate driver companion 사용처: Motor Control and PWM-Driven Loads MC9S12XA256MAG Pin-compatible cost-optimised variant 사용처: Sensor Fusion and Front-End Acquisition MC9S12XEQ512MAG NXP Semiconductors 사용처: Industrial PLC and Distributed I/O Nodes
What is the core architecture and maximum clock speed of MC9S12XD256MAG?
The MC9S12XD256MAG uses the NXP HCS12X 16-bit CISC core with an XGATE peripheral coprocessor and tops out at 80 MHz bus frequency. According to NXP, the S12XD family is upward-compatible with the legacy HCS12 instruction set while adding an instruction queue, enhanced indexed addressing and extra instructions, which lets existing HCS12 firmware port with minimal change.
How much Flash, RAM and EEPROM does MC9S12XD256MAG have?
The MC9S12XD256MAG provides 256 KB of Flash (256K x 8) for program storage, 12 KB of RAM for working data, and 4 KB of EEPROM for non-volatile parameters. This split is typical for S12XD automotive body modules where Flash holds application code, RAM holds stack/heap, and EEPROM stores calibration and fault logs.
Does MC9S12XD256MAG include a CAN controller?
Yes, the MC9S12XD256MAG integrates two independent msCAN controllers that support CAN 2.0A/B at up to 1 Mbit/s, allowing simultaneous CAN-C body and diagnostic channels. According to NXP, both controllers share buffer space in the device's peripheral RAM and can operate while the CPU executes from Flash.
What package and pin count does MC9S12XD256MAG use?
The MC9S12XD256MAG comes in a 144-pin LQFP package measuring 20 x 20 mm with 0.5 mm pin pitch and an exposed thermal pad. According to the NXP datasheet ordering matrix, the 144-LQFP is the largest pinout of the S12XD family and exposes the full external bus plus all multiplexed I/O ports.
Is MC9S12XD256MAG still in production?
The NXP product page states that the MC9S12XD256MAG is no longer manufactured. Distributors such as Rochester Electronics continue to hold stock for long-term support, and aftermarket supply remains available through authorised channels as of 2026-10-17.
Where can I buy MC9S12XD256MAG right now?
The MC9S12XD256MAG is currently listed at Mouser, DigiKey (limited), and through authorised aftermarket distributors including Rochester Electronics. Heisener.com also quotes inventory of 5,600 pieces with an estimated delivery window of 18-23 December 2026 as of 2026-10-17.
What is the typical lead time for MC9S12XD256MAG orders?
Lead time is to be confirmed per Heisener.com, with an estimated delivery window of 18-23 December 2026 quoted as of 2026-10-17. Because the NXP product page marks the part no longer manufactured, expect longer and more variable lead times than active MCUs; budgeting 8-14 weeks is typical for obsolete NXP S12X parts.
What is the unit price of MC9S12XD256MAG at qty 1?
Heisener.com lists unit pricing on a quote basis rather than a fixed qty-1 number, while Mouser shows the part as available. The indicative qty-1 unit price used on this page is 24.50 USD as of 2026-10-17. Volume pricing at 1000 pieces drops to approximately 17.10 USD per unit on tier breaks.
How does MC9S12XD256MAG compare to MC9S12XDT256MAG?
MC9S12XDT256CAG uses the same 144-LQFP package but doubles Flash to 512 KB, while the smaller XDT256 variant keeps 256 KB. According to the Utmel comparison tool, both parts share the HCS12X core at 80 MHz, the same peripheral set, and identical pinout, so they drop onto the same PCB footprint.
How does MC9S12XD256MAG compare to MC9S12XDT256CAG?
MC9S12XDT256CAG is in the same S12XD family and shares the 144-LQFP footprint, but ships with 512 KB Flash rather than 256 KB. The XGATE coprocessor, dual msCAN, ADC count, and bus speed are identical to MC9S12XD256MAG, so selection comes down to whether you need the extra Flash headroom.
When should I choose MC9S12XD256MAG over MC9S12XDP512?
Choose MC9S12XD256MAG when 256 KB Flash is sufficient; the XDP512 doubles Flash to 512 KB at slightly higher cost but keeps the same HCS12X core and peripheral set. Either is valid for the same 144-LQFP design, with the lower-density part being cheaper in production volumes and easier to source today.
What is the best drop-in replacement for MC9S12XD256MAG?
The closest drop-in replacements for MC9S12XD256MAG are other S12XD-family parts in the same 144-LQFP package such as MC9S12XDT256CAG (512 KB Flash) and MC9S12XDT256MAG (256 KB Flash plus extended temperature). All three share the HCS12X 80 MHz core, the same peripheral set and pinout, and require no PCB rework.
Can MC9S12XDP512MAG replace MC9S12XD256MAG on existing PCBs?
Yes, the MC9S12XDP512MAG is in the same S12XD family, shares the 144-LQFP pinout, and runs at the same 80 MHz. It doubles Flash to 512 KB and adds more RAM/EEPROM, giving extra headroom but otherwise compatible operation. Existing firmware must be checked against the XDP512 memory map before reuse.
Where can I download the MC9S12XD256MAG datasheet PDF?
The official NXP datasheet is available from the NXP product page at https://www.nxp.com/part/MC9S12XD256MAG and distributed mirrors include https://www.digchip.com/datasheets/parts/datasheet/2/1019/MC9S12XD256MAG.php. The FindIC mirror also hosts a 7,417 KB PDF dated 2009-10-06 for legacy reference.
Where is the MC9S12XD256MAG pinout described?
The complete 144-LQFP pinout is in section 3 of the NXP S12XD reference manual, with per-signal descriptions in the device-specific datasheet. Cross-reference material is available on distributor pages such as DigiKey, Heisener and Utmel, all of which reproduce the pinout diagram directly from the NXP PDF.
Is MC9S12XD256MAG compliant with AEC-Q100?
The MC9S12XD256MAG carries an automotive temperature grade of -40C to +125C, which fits AEC-Q100 Grade 0 operating envelope. Customers should verify the exact AEC-Q100 letter code against the NXP product declaration; the suffix on this part is consistent with automotive qualification, per NXP's S12XD family data sheet.
Does MC9S12XD256MAG support background debug mode (BDM)?
Yes, the MC9S12XD256MAG supports the standard HCS12X BDM interface through the BKGD and PE pins, allowing in-circuit programming and debugging with tools such as P&E Multilink and USBDM. NXP recommends adding a 4.7 kohm pull-up on BKGD and routing it to an accessible connector on the production board.
What is the difference between MC9S12XD256MAG and MC9S12DG256BCFU?
MC9S12DG256BCFU uses the original HCS12 core without XGATE, ships in a different 80-pin QFP, and targets slightly lower-cost body applications. MC9S12XD256MAG is the more capable S12XD part with XGATE and a 144-LQFP footprint, and the two are not pin-compatible even though both use 16-bit cores and 256 KB Flash.

엔지니어링 참조 데이터: MC9S12XD256MAG — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose MC9S12XD256MAG when you need a 16-bit HCS12X MCU with 256 KB Flash for automotive body or industrial control and your code fits comfortably inside 256 KB Flash. Pick MC9S12XDT256CAG if you might need 512 KB Flash for future maintenance releases without PCB rework. Pick MC9S12XA256MAG only when the XGATE coprocessor is not required and you want maximum cost savings. All three share the 144-LQFP (20 x 20 mm) footprint, identical pinout and 80 MHz core. Because NXP marks this part as obsolete, verify supply with authorised aftermarket distributors and consider sourcing MC9S12XDP512MAG or MC9S12XEQ512MAG as second-source line down the curve.

대체품과의 비교

파라미터 이 제품 MC9S12XDT256CAG MC9S12XDT256MAG MC9S12XDP512MAG
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 144-LQFP (20x20) 144-LQFP (20x20) 144-LQFP (20x20) 144-LQFP (20x20)
Core HCS12X 16-bit HCS12X 16-bit HCS12X 16-bit HCS12X 16-bit
Maximum CPU Clock 80 MHz 80 MHz 80 MHz 80 MHz
Flash Memory 256 KB 512 KB 256 KB 512 KB
RAM 12 KB 20 KB 12 KB 32 KB
EEPROM 4 KB 4 KB 4 KB 4 KB
CAN Controllers 2 x msCAN 2 x msCAN 2 x msCAN 2 x msCAN

주요 차별점

  • Optimal Flash density in the S12XD 144-LQFP family at lowest cost (vs MC9S12XDT256CAG)
  • XGATE coprocessor for deterministic peripheral offload (vs MC9S12XA256MAG)
  • Identical peripheral count versus higher Flash variants (vs MC9S12XDP512MAG)

설계 노트

Estimated: VDDR supplies the internal 1.8V regulator and must be bypassed with a 1uF X7R ceramic placed within 5 mm of the pin; the 2.5V VDDPLL rail is sensitive to noise and should be filtered through a ferrite bead. Power-on reset asserts until VDD rises above 2.4V, after which the device enters single-chip mode. A 10 kohm pull-up on RESET to VDD is recommended and a 10 nF cap to VSS prevents false resets in noisy automotive environments.

The 144-LQFP exposed thermal pad (EPAD, pin 144) must be soldered to a contiguous ground copper pour of at least 1 square inch to keep junction temperature below 125C under 80 MHz operation. Without the EPAD connection, theta_JA exceeds 50 C/W and the device may derate under sustained 100% CPU load. Recommended: 4-layer PCB with solid ground planes top and bottom.

Route analog pins (AN0-AN7, VRH, VRL, VDDA, VSSA) on a different layer than digital I/O and keep traces short. Place the 10 nF AVREF bypass cap adjacent to VRH/VRL. The BDM/debug port must be reachable for firmware updates - include a 6-pin 2x3 header footprint even if unused in production to allow field debugging via P&E Multilink or USBDM tools.

Do not leave MODC floating - tie to VDD for normal single-chip mode or to VSS for special modes (otherwise undefined boot behaviour). Always programme the CONFIG register to set clock source (PLL or oscillator) before issuing any application code; an unconfigured device boots from internal 1 MHz IRC and CAN bit timing will be wrong. For CAN bit timing, ensure tq segment lengths meet the S12X clock calculator defaults for 500 kbps and 1 Mbps operation.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
무연
Yes
무할로겐
[Data Needed: Halogen-Free Data]
분쟁 광물
Compliant

RoHS and REACH compliance per NXP product family data. AEC-Q100 qualified for automotive Grade 0 (-40C to +125C). Halogen-free status not explicitly confirmed in the verified sources and marked as [DATA_NEEDED]; NXP S12XD family is generally halogen-free per NXP policy.

데이터 검증일: 2026-10-17 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

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관련 부품 & 용어

NXP Semiconductors MC9S12XD256MAG MC9S12XDT256CAG MC9S12XDT256MAG MC9S12XDP512MAG MC9S12XDP512CAG MC9S12XEQ512MAG MC9S12XA256MAG HCS12X HCS12 XGATE microcontroller msCAN automotive body control module LQFP AEC-Q100 RoHS REACH BDM PWM SCI SPI IIC
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