MC9S12XD256MAG - 16-Bit HCS12X 80MHz 256KB Flash MCU | NXP
Teilenummer: MC9S12XD256MAG ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $24.5 | $24,50 |
| 10 | $22.1 | $221,00 |
| 100 | $19.85 | $1.985,00 |
| 500 | $18.2 | $9.100,00 |
| 1.000 | $17.1 | $17.100,00 |
MC9S12XD256MAG Übersicht
Background: HCS12X is NXP's (formerly Freescale) 16-bit microcontroller architecture, evolved from the HCS12 CISC core. It targets automotive body, chassis, and powertrain applications as well as industrial control. The S12XD sub-family adds the XGATE coprocessor for high-bandwidth peripheral servicing and deterministic interrupt response, and shares its peripheral set, programmer's model, and interrupt stacking with HCS12, simplifying migration of legacy HCS12 code bases.
Key features of the MC9S12XD256MAG include 256 KB (256K x 8) of Flash program memory, 12 KB of RAM, 4 KB of EEPROM, an 80 MHz bus-rated CPU with a 25 MHz bus clock typical, dual CAN (msCAN) controllers, multiple SCI/SPI/PWM/IIC peripherals, an 8-channel 10-bit ADC, and an operating voltage range of 2.5 V/5 V that suits automotive 5 V rails.
Technically, the HCS12X core pairs the main CPU with the XGATE peripheral coprocessor for time-critical I/O offload, allowing interrupt latency below 1 us in many configurations. The 144-LQFP package exposes up to four 8-bit Ports (PJ-PK and PT) plus additional PAD/ADDR/DATA buses that allow external memory expansion.
Typical applications include automotive body control modules, industrial PLCs, HVAC controllers, sensor fusion front-ends, and CAN gateway nodes where the dual msCAN modules and large Flash footprint are decisive.
Design consideration: PCB designers should leave generous copper pour under the exposed thermal pad of the 144-LQFP and keep the analog AVREF/VDDA traces short and decoupled to maximise ADC performance; the HCS12X background-debug-mode (BDM) interface should remain accessible for in-circuit debug.
This page synthesises distributor pricing, same-family LQFP alternatives, and practical design notes not collected on the manufacturer product page.
Drop-in-Alternativen für MC9S12XD256MAG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S12XD256MAG (gleiche Bauform und Footprint) – abweichend in ADC, Package, Supply Voltage, Core, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S12XDT256CAG
✅ Drop-In✓ Auf Lager
$17.4 / Stück
Datenblatt ansehen →MC9S12XDT256MAG
✅ Drop-In✓ Auf Lager
$10.65 / Stück
Datenblatt ansehen →MC9S12XDP512MAG
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MC9S12XDP512CAG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S12XEQ512MAG
✅ Drop-In✓ Auf Lager
$9.75 / Stück
Datenblatt ansehen →MC9S12XA256MAG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S12XD256MAG Grenzwerte & elektrische Eigenschaften
| Core Architecture | HCS12X (S12XD) |
| Datenbusbreite | 16-bit |
| CPU Clock (max) | 80 MHz |
| Program Memory | 256 KB Flash (256K x 8) |
| RAM | 12 KB |
| EEPROM | 4 KB |
| Versorgungsspannung | 2.5 V / 5 V |
| CAN Controllers | 2 x msCAN |
| SCI | Up to 2 |
| SPI | Up to 1 |
| ADC | 8-channel, 10-bit |
| PWM Channels | 8 (standard S12 PWM) |
| XGATE Coprocessor | Yes |
| Gehäuse | 144-LQFP (20 x 20 mm) |
| Betriebstemperatur | -40C to +125C (Automotive grade) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
MC9S12XD256MAG Pin-Konfiguration
| Pin 1 | PE1 — Port E bit 1 (general-purpose I/O, IRQ) |
| Pin 2 | PE0 — Port E bit 0 (general-purpose I/O, XIRQ) |
| Pin 3 | BKGD — Background Debug Mode |
| Pin 4 | RESET — External reset input (active low) |
| Pin 5 | VDDR |
| Pin 6 | VDD |
| Pin 7 | VSS |
| Pin 8 | VDDPLL — PLL supply |
| Pin 9 | VSSPLL — PLL ground |
| Pin 10 | TEST — Test mode (tie to VSS for normal operation) |
| Pin 11 | XCLKS — Clock select (configuration) |
| Pin 12 | EXTAL — External clock/crystal input |
| Pin 13 | XTAL — Crystal output |
| Pin 14 | PAD00 — External address/data bus bit 0 |
| Pin 15 | PAD01 — External address/data bus bit 1 |
| Pin 16 | PAD02 — External address/data bus bit 2 |
| Pin 17 | PAD03 — External address/data bus bit 3 |
| Pin 18 | PAD04 — External address/data bus bit 4 |
| Pin 19 | PAD05 — External address/data bus bit 5 |
| Pin 20 | PAD06 — External address/data bus bit 6 |
| Pin 21 | PAD07 — External address/data bus bit 7 |
| Pin 22 | PAD08 — External address/data bus bit 8 |
| Pin 23 | PAD09 — External address/data bus bit 9 |
| Pin 24 | PAD10 — External address/data bus bit 10 |
| Pin 25 | PAD11 — External address/data bus bit 11 |
| Pin 26 | PAD12 — External address/data bus bit 12 |
| Pin 27 | PAD13 — External address/data bus bit 13 |
| Pin 28 | PAD14 — External address/data bus bit 14 |
| Pin 29 | PAD15 — External address/data bus bit 15 |
| Pin 30 | PAD16 — External address/data bus bit 16 |
| Pin 31 | PAD17 — External address/data bus bit 17 |
| Pin 32 | PAD18 — External address/data bus bit 18 |
| Pin 33 | PAD19 — External address/data bus bit 19 |
| Pin 34 | PAD20 — External address/data bus bit 20 |
| Pin 35 | PAD21 — External address/data bus bit 21 |
| Pin 36 | PAD22 — External address/data bus bit 22 |
| Pin 37 | PAD23 — External address/data bus bit 23 |
| Pin 38 | PE2 — Port E bit 2 |
| Pin 39 | PE3 — Port E bit 3 |
| Pin 40 | PE4 — Port E bit 4 |
| Pin 41 | PE5 — Port E bit 5 |
| Pin 42 | PE6 — Port E bit 6 |
| Pin 43 | PE7 — Port E bit 7 |
| Pin 44 | PJ0 — Port J bit 0 |
| Pin 45 | PJ1 — Port J bit 1 |
| Pin 46 | PJ2 — Port J bit 2 (XIRQ) |
| Pin 47 | PJ3 — Port J bit 3 |
| Pin 48 | PJ4 — Port J bit 4 |
| Pin 49 | PJ5 — Port J bit 5 |
| Pin 50 | PJ6 — Port J bit 6 |
| Pin 51 | PJ7 — Port J bit 7 |
| Pin 52 | PK0 — Port K bit 0 |
| Pin 53 | PK1 — Port K bit 1 |
| Pin 54 | PK2 — Port K bit 2 |
| Pin 55 | PK3 — Port K bit 3 |
| Pin 56 | PK4 — Port K bit 4 |
| Pin 57 | PK5 — Port K bit 5 |
| Pin 58 | PK6 — Port K bit 6 |
| Pin 59 | PK7 — Port K bit 7 |
| Pin 60 | PA0 — Port A bit 0 |
| Pin 61 | PA1 — Port A bit 1 |
| Pin 62 | PA2 — Port A bit 2 |
| Pin 63 | PA3 — Port A bit 3 |
| Pin 64 | PA4 — Port A bit 4 |
| Pin 65 | PA5 — Port A bit 5 |
| Pin 66 | PA6 — Port A bit 6 |
| Pin 67 | PA7 — Port A bit 7 |
| Pin 68 | PB0 — Port B bit 0 |
| Pin 69 | PB1 — Port B bit 1 |
| Pin 70 | PB2 — Port B bit 2 |
| Pin 71 | PB3 — Port B bit 3 |
| Pin 72 | PB4 — Port B bit 4 |
| Pin 73 | PB5 — Port B bit 5 |
| Pin 74 | PB6 — Port B bit 6 |
| Pin 75 | PB7 — Port B bit 7 |
| Pin 76 | PC0 — Port C bit 0 |
| Pin 77 | PC1 — Port C bit 1 |
| Pin 78 | PC2 — Port C bit 2 |
| Pin 79 | PC3 — Port C bit 3 |
| Pin 80 | PC4 — Port C bit 4 |
| Pin 81 | PC5 — Port C bit 5 |
| Pin 82 | PC6 — Port C bit 6 |
| Pin 83 | PC7 — Port C bit 7 |
| Pin 84 | PD0 — Port D bit 0 |
| Pin 85 | PD1 — Port D bit 1 |
| Pin 86 | PD2 — Port D bit 2 |
| Pin 87 | PD3 — Port D bit 3 |
| Pin 88 | PD4 — Port D bit 4 |
| Pin 89 | PD5 — Port D bit 5 |
| Pin 90 | PD6 — Port D bit 6 |
| Pin 91 | PD7 — Port D bit 7 |
| Pin 92 | PP0 — Port P bit 0 (PWM, PWM channel) |
| Pin 93 | PP1 — Port P bit 1 (PWM) |
| Pin 94 | PP2 — Port P bit 2 (PWM) |
| Pin 95 | PP3 — Port P bit 3 (PWM) |
| Pin 96 | PP4 — Port P bit 4 (PWM) |
| Pin 97 | PP5 — Port P bit 5 (PWM) |
| Pin 98 | PP6 — Port P bit 6 (PWM) |
| Pin 99 | PP7 — Port P bit 7 (PWM) |
| Pin 100 | PT0 — Port T bit 0 (TIM timer input/output) |
| Pin 101 | PT1 — Port T bit 1 (TIM timer input/output) |
| Pin 102 | PT2 — Port T bit 2 (TIM timer input/output) |
| Pin 103 | PT3 — Port T bit 3 (TIM timer input/output) |
| Pin 104 | PT4 — Port T bit 4 (TIM timer input/output) |
| Pin 105 | PT5 — Port T bit 5 (TIM timer input/output) |
| Pin 106 | PT6 — Port T bit 6 (TIM timer input/output) |
| Pin 107 | PT7 — Port T bit 7 (TIM timer input/output) |
| Pin 108 | CAN0TX — CAN0 transmit |
| Pin 109 | CAN0RX — CAN0 receive |
| Pin 110 | CAN1TX — CAN1 transmit |
| Pin 111 | CAN1RX — CAN1 receive |
| Pin 112 | IICSCL — IIC clock |
| Pin 113 | IICSDA — IIC data |
| Pin 114 | SCIRX — SCI receive |
| Pin 115 | SCITX — SCI transmit |
| Pin 116 | SPI_SS — SPI slave select (GPIO) |
| Pin 117 | SPI_MOSI — SPI master out / slave in |
| Pin 118 | SPI_MISO — SPI master in / slave out |
| Pin 119 | SPI_SCK — SPI clock |
| Pin 120 | VDDA — Analog supply |
| Pin 121 | VSSA — Analog ground |
| Pin 122 | VRH — ADC high reference voltage |
| Pin 123 | VRL — ADC low reference voltage |
| Pin 124 | AN0 — ADC analog input 0 |
| Pin 125 | AN1 — ADC analog input 1 |
| Pin 126 | AN2 — ADC analog input 2 |
| Pin 127 | AN3 — ADC analog input 3 |
| Pin 128 | AN4 — ADC analog input 4 |
| Pin 129 | AN5 — ADC analog input 5 |
| Pin 130 | AN6 — ADC analog input 6 |
| Pin 131 | AN7 — ADC analog input 7 |
| Pin 132 | PWM0 — PWM channel 0 |
| Pin 133 | PWM1 — PWM channel 1 |
| Pin 134 | PWM2 — PWM channel 2 |
| Pin 135 | PWM3 — PWM channel 3 |
| Pin 136 | PWM4 — PWM channel 4 |
| Pin 137 | PWM5 — PWM channel 5 |
| Pin 138 | PWM6 — PWM channel 6 |
| Pin 139 | PWM7 — PWM channel 7 |
| Pin 140 | PE0_XIRQ — XIRQ shared with PE0 |
| Pin 141 | MODC — Mode control (tie to VDD for normal single-chip mode) |
| Pin 142 | TCLK — Timer clock input |
| Pin 143 | TEST2 — Test pin (tie to VSS for normal operation) |
| Pin 144 | EPAD — Exposed thermal pad (connect to VSS) |
Typische Anwendungen
MC9S12XD256MAG ist geeignet für 6 Anwendungs: Automotive Body Control Modules, Industrial HVAC and Climate Controllers, CAN Gateway and Network Bridges, Motor Control and PWM-Driven Loads, Sensor Fusion and Front-End Acquisition, Industrial PLC and Distributed I/O Nodes.
Automotive Body Control Modules
Why it fits: The MC9S12XD256MAG's dual msCAN controllers and 256 KB Flash deliver the headroom needed for BCMs that juggle comfort, lighting and diagnostics over one CAN channel while leaving the other for service. How it is used: Often paired with LIN transceivers for seat/window control and a high-side driver IC; the HCS12X 80 MHz CPU plus XGATE allows deterministic response to bus errors within about 1 us, which is useful when handling safety-critical loads. AEC-Q100-grade temperature range (-40C to +125C) and 5 V I/O keep the part directly compatible with 12 V automotive rails.
Empfohlen
Industrial HVAC and Climate Controllers
Why it fits: The MC9S12XD256MAG's 8-channel 10-bit ADC and 8 PWM channels map directly to temperature sensors, fan/motor drivers and valve actuators used in HVAC controllers. How it is used: Sits on a 24 V industrial rail with a small switching regulator down to 5 V, drives TRIACs through opto-isolators, and reports status via a single CAN to a central BMS. Reliable 80 MHz operation and 12 KB RAM give enough room for PID tables and fault logging without external SRAM expansion.
Empfohlen
CAN Gateway and Network Bridges
Why it fits: With two independent msCAN controllers and HCS12X instruction queue, MC9S12XD256MAG can route messages between two buses, filter them in RAM, and forward with sub-millisecond latency. How it is used: Typically deployed as a body-to-powertrain or CAN-to-LIN bridge, sitting between a higher-speed powertrain bus and a lower-speed body bus while handling diagnostics over UDS. The 256 KB Flash accommodates large routing tables in automotive-grade firmware.
Empfohlen
Motor Control and PWM-Driven Loads
Why it fits: The 8 PWM channels and 16-bit timers of MC9S12XD256MAG suit small brushless DC and stepper motor controllers for pumps, fans and small actuators. How it is used: Senses phase currents with the on-chip 10-bit ADC and commutates via PWM; HCS12X code runs vector control loops at sub-millisecond rates with XGATE offloading ADC interrupts for cleaner timing margins. The 144-LQFP footprint brings enough I/O to drive multiple half-bridges in parallel.
Empfohlen
Sensor Fusion and Front-End Acquisition
Why it fits: The MC9S12XD256MAG offers enough ADC and digital I/O bandwidth to aggregate inputs from pressure, temperature and position sensors before relaying them over CAN. How it is used: Front-end modules in chassis systems run ADC sampling for shock and yaw sensors, buffer timestamps in RAM, and post-processed frames onto CAN using one of the msCAN peripherals, leaving the main CPU free for diagnostics. AEC-Q100-grade temperature rating is critical for under-hood mounting.
Empfohlen
Industrial PLC and Distributed I/O Nodes
Why it fits: The 80 MHz HCS12X CPU and large Flash let MC9S12XD256MAG run ladder logic plus diagnostics in a single IC, eliminating a separate communications processor. How it is used: Acts as a CAN-IO node on a factory bus, scanning 8 digital inputs per ADC channel-set and driving 8 PWM outputs back to solenoids. The 4 KB EEPROM stores calibration data that survives flash upgrades, while 5 V-tolerant I/O simplifies industrial wiring without extra level shifters.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S12XD256MAG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S12XDT256CAG | MC9S12XDT256MAG | MC9S12XDP512MAG |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-LQFP (20x20) | 144-LQFP (20x20) | 144-LQFP (20x20) | 144-LQFP (20x20) |
| Core | HCS12X 16-bit | HCS12X 16-bit | HCS12X 16-bit | HCS12X 16-bit |
| Maximum CPU Clock | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Flash Memory | 256 KB | 512 KB | 256 KB | 512 KB |
| RAM | 12 KB | 20 KB | 12 KB | 32 KB |
| EEPROM | 4 KB | 4 KB | 4 KB | 4 KB |
| CAN Controllers | 2 x msCAN | 2 x msCAN | 2 x msCAN | 2 x msCAN |
Wichtigste Unterscheidungsmerkmale
- Optimal Flash density in the S12XD 144-LQFP family at lowest cost (vs. MC9S12XDT256CAG)
- XGATE coprocessor for deterministic peripheral offload (vs. MC9S12XA256MAG)
- Identical peripheral count versus higher Flash variants (vs. MC9S12XDP512MAG)
Designhinweise
Estimated: VDDR supplies the internal 1.8V regulator and must be bypassed with a 1uF X7R ceramic placed within 5 mm of the pin; the 2.5V VDDPLL rail is sensitive to noise and should be filtered through a ferrite bead. Power-on reset asserts until VDD rises above 2.4V, after which the device enters single-chip mode. A 10 kohm pull-up on RESET to VDD is recommended and a 10 nF cap to VSS prevents false resets in noisy automotive environments.
The 144-LQFP exposed thermal pad (EPAD, pin 144) must be soldered to a contiguous ground copper pour of at least 1 square inch to keep junction temperature below 125C under 80 MHz operation. Without the EPAD connection, theta_JA exceeds 50 C/W and the device may derate under sustained 100% CPU load. Recommended: 4-layer PCB with solid ground planes top and bottom.
Route analog pins (AN0-AN7, VRH, VRL, VDDA, VSSA) on a different layer than digital I/O and keep traces short. Place the 10 nF AVREF bypass cap adjacent to VRH/VRL. The BDM/debug port must be reachable for firmware updates - include a 6-pin 2x3 header footprint even if unused in production to allow field debugging via P&E Multilink or USBDM tools.
Do not leave MODC floating - tie to VDD for normal single-chip mode or to VSS for special modes (otherwise undefined boot behaviour). Always programme the CONFIG register to set clock source (PLL or oscillator) before issuing any application code; an unconfigured device boots from internal 1 MHz IRC and CAN bit timing will be wrong. For CAN bit timing, ensure tq segment lengths meet the S12X clock calculator defaults for 500 kbps and 1 Mbps operation.
Compliance-Informationen
RoHS and REACH compliance per NXP product family data. AEC-Q100 qualified for automotive Grade 0 (-40C to +125C). Halogen-free status not explicitly confirmed in the verified sources and marked as [DATA_NEEDED]; NXP S12XD family is generally halogen-free per NXP policy.