MCF5213LCVM66J - 66MHz ColdFire V2 MCU 256KB Flash 81-MAPBGA | NXP
부품 번호: MCF5213LCVM66J ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.75 | $167.50 |
| 100 | $14.95 | $1,495.00 |
| 500 | $13.4 | $6,700.00 |
| 1,000 | $12.2 | $12,200.00 |
MCF5213LCVM66J 개요
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash or ROM), working memory (SRAM), and a configurable set of digital, analog, and communication peripherals on one silicon die. The MCF5213 sits in the taxonomy MCU -> 32-bit MCU -> ColdFire -> ColdFire V2 -> embedded Flash MCU, targeting industrial control, human-machine interface, and connectivity gateway applications where deterministic interrupt response and code security matter.
Key features include three full-duplex UARTs with hardware flow control, a queued SPI peripheral, an I2C bus controller, eight Fast Ethernet-friendly timers including a four-channel 32-bit timer/PWM unit, a 10-bit ADC, four 32-bit DMA channels, and a hardware encryption accelerator for DES/3DES/AES/SHA-1/MD5. The four-channel 32-bit programmable interrupt timer simplifies multi-axis motor control loops. An integrated Phase-Locked Loop generates the system clock from an external crystal or resonator, removing the need for an external clock synthesizer.
The architecture combines ColdFire V2 core (single-issue, Harvard-style) with crossbar switch for parallel bus access across Flash, SRAM, and peripherals, yielding deterministic latency. The interleaved Flash bank supports single-cycle reads in burst mode at 66 MHz, allowing instruction fetches to keep pace with the pipeline without wait-states for sequential code.
Typical applications include industrial control (PLCs, motor drives, sensor hubs), building automation gateways (BACnet, Modbus, LonWorks bridges), point-of-sale terminals, secure access controllers, and medical instrumentation front-ends. The wide 3.0 V to 3.6 V supply range with on-chip voltage regulation supports direct operation from industrial 24 V-referenced rails via a local LDO.
A practical design consideration: place a 0.1 uF ceramic bypass capacitor directly adjacent to every VDD/VSS pin pair to mitigate simultaneous switching noise across the BGA balls. NC pins should remain floating to avoid internal ESD diode forward bias and latch-up.
This page synthesizes distributor pricing, datasheet-derived specifications, drop-in same-family alternatives, and practical design notes that go beyond what the manufacturer datasheet alone provides, including a quantified comparison to MCF52223 and MCF5212.
드롭인 대체품: MCF5213LCVM66J — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MCF5213LCVM66J (동일 폼 팩터 및 풋프린트) — 차이점: Mounting Type, Package, DMA Channels, Supply Voltage, Timers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MCF5213LCVM66
✅ 드롭인✓ 재고 있음
$11.95 / 개
데이터시트 보기 →MCF5212LCVM66
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →MCF5213LCVM100
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCF52223CVM66
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCF5213LCVM66J 최대 정격 & 전기적 특성
| Core Architecture | ColdFire V2 (32-bit Variable-Length RISC) |
| Maximum CPU Frequency | 66 MHz |
| Program Memory (Flash) | 256 KB (256K x 8), interleaved, securable |
| SRAM | 32 KB |
| Supply Voltage Range | 3.0 V to 3.6 V |
| 동작 온도 범위 | -40C to +85C (industrial, J suffix JEDEC) |
| 패키지 | 81-MAPBGA (10 mm x 10 mm) |
| 실장 유형 | Surface Mount (BGA) |
| UART Channels | 3 (with hardware flow control) |
| SPI Channels | 1 (queued SPI, up to 16 queues) |
| I2C Controllers | 1 |
| DMA Channels | 4 (32-bit) |
| Timers | 4 x 32-bit (with capture/compare/PWM) + 2 x 32-bit general-purpose |
| Hardware Crypto Accelerator | DES, 3DES, AES, SHA-1, MD5 |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
| 할로겐 프리 | Yes |
| Compliance Notes | NXP/Freescale ColdFire product family, suitable for industrial environments |
MCF5213LCVM66J 핀 구성
| 핀 A1 | VDD — 3.3 V supply pin |
| 핀 A2 | VSS — Ground |
| 핀 B1 | VDDA — Analog 3.3 V supply for ADC |
| 핀 B2 | VSSA — Analog ground |
| 핀 C10 | RESET — Active-low reset input |
| 핀 D5 | XTAL — Crystal oscillator input |
| 핀 D6 | EXTAL — Crystal oscillator output |
| 핀 E5 | UART0_TX — UART 0 transmit |
| 핀 E6 | UART0_RX — UART 0 receive |
| 핀 F3 | SPI_MOSI — Queued SPI master out, slave in |
| 핀 F8 | I2C_SDA — I2C serial data |
| 핀 G2 | GPIO — General-purpose I/O (multiplexed) |
일반적인 애플리케이션
MCF5213LCVM66J 적합 용도: 6 애플리케이션s: Industrial Motor Control (BLDC / PMSM), Building Automation Gateway, Secure Access Controller, Point-of-Sale Terminal, Medical Instrumentation Front-End, Sensor Hub / IoT Edge Node.
Industrial Motor Control (BLDC / PMSM)
The MCF5213LCVM66J fits industrial motor control because its four-channel 32-bit timer/PWM unit provides precisely timed switching signals for three-phase inverters at up to 66 MHz instruction throughput. Its 256 KB Flash holds sensored and sensorless BLDC/PMSM firmware plus field-oriented control look-up tables, and 32 KB SRAM accommodates the sine/cosine math without external memory. The industrial temperature grade (-40C to +85C) tolerates factory-floor heat, and the 81-MAPBGA package keeps the design compact inside inverter PCBAs. Designers typically route PWM outputs to gate drivers, capture encoder feedback through the same timers, and use the queued SPI to drive isolated gate drivers with deterministic latency.
추천
Building Automation Gateway
In a building automation gateway the MCF5213LCVM66J runs BACnet, Modbus, LonWorks, or KNX protocol stacks concurrently across its three UARTs and queued SPI peripheral. The hardware DES/3DES/AES/SHA-1 crypto accelerator secures IPsec/TLS tunnels for cloud-connected BMS without burdening the 66 MHz ColdFire V2 core. The 32 KB SRAM buffers point lists and trend logs, while 256 KB Flash stores the full protocol stack with room for OEM customization. Operating from a regulated 3.3 V rail sourced from an industrial 24 V supply, the device consumes low power and fits compact wall-mount gateway enclosures built around the 10 mm x 10 mm MAPBGA footprint.
추천
Secure Access Controller
The MCF5213LCVM66J secures door controllers and RFID readers through its hardware crypto accelerator (DES, 3DES, AES, SHA-1, MD5), which offloads credential hashing from the 66 MHz ColdFire V2 core. Three UARTs connect to Wiegand readers, RS-485 multi-drop panels, and a debug console; the queued SPI drives high-speed LCD or OLED keypads. The 256 KB Flash holds access-control firmware with per-door configuration tables, while the securable Flash feature prevents firmware extraction by attackers. Industrial -40C to +85C operation supports outdoor enclosures, and the 81-MAPBGA is small enough for credit-card-size panel boards.
추천
Point-of-Sale Terminal
The MCF5213LCVM66J drives point-of-sale terminals thanks to its 66 MHz ColdFire V2 core, 256 KB Flash for payment terminal firmware (PCI PTS application layer), and three UARTs that connect to magnetic-stripe readers, smart-card couplers, and thermal printers. The hardware AES/SHA-1 accelerator secures PIN entry and transaction signing at line speed without timing leaks. The 32 KB SRAM holds transaction buffers, while the 81-MAPBGA's compact 10 x 10 mm footprint keeps the main board small enough for handheld mPOS designs. The 3.3 V single-supply design simplifies battery and USB-powered architectures.
추천
Medical Instrumentation Front-End
Medical devices such as patient monitors and handheld diagnostic tools benefit from the MCF5213LCVM66J industrial operating temperature range, deterministic ColdFire V2 interrupt response, and integrated 8-channel 10-bit ADC for front-end signal conditioning. The 256 KB Flash stores calibration firmware, and 32 KB SRAM accommodates real-time waveform buffers without off-chip memory. Three UARTs link to bedside displays, central stations, and lab analyzers; the queued SPI drives TFT displays at high refresh rates. The 81-MAPBGA helps designers achieve compact, sterilizable enclosures for handheld medical instruments.
추천
Sensor Hub / IoT Edge Node
The MCF5213LCVM66J makes an effective sensor hub, aggregating data from I2C sensors, SPI peripherals, and UART-connected radios through its 66 MHz ColdFire V2 core. The hardware DES/3DES/AES engine authenticates MQTT payloads over TLS at the edge, and 256 KB Flash accommodates sensor-fusion logic and over-the-air update bootloaders. The DMA engine moves sampled data between the ADC and SRAM without CPU intervention, freeing the core for protocol stack execution. The 81-MAPBGA's small 10 x 10 mm footprint fits dense sensor boards, while industrial temperature grade supports outdoor and factory deployments.
추천
추천 제품 요약
엔지니어링 참조 데이터: MCF5213LCVM66J — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCF5213LCVM66 | MCF5212LCVM66 | MCF5213LCVM100 | MCF52223CVM66 |
|---|---|---|---|---|---|
| Package | 81-MAPBGA (10x10) | 81-MAPBGA (10x10) - same | 81-MAPBGA (10x10) - same | 81-MAPBGA (10x10) - same | 81-MAPBGA (10x10) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) |
| Maximum CPU Frequency | 66 MHz | 66 MHz | 66 MHz | 100 MHz | 66 MHz |
| Operating Temperature | -40C to +85C (J grade) | 0C to +70C (commercial) | 0C to +70C (commercial) | -40C to +85C (industrial) | 0C to +70C (commercial) |
주요 차별점
- Industrial operating temperature range (vs MCF5213LCVM66)
- Higher core clock speed available in same package (vs MCF5213LCVM100)
- On-chip hardware crypto accelerator (vs MCF5212LCVM66)
설계 노트
Place a 0.1 uF X7R ceramic bypass capacitor on every VDD/VSS pin pair, located within 2 mm of each BGA ball to suppress simultaneous switching noise across the 81-ball grid. For the ADC supply (VDDA/VSSA), dedicate a separate filtered 3.3 V rail with its own ferrite bead to keep digital switching noise out of analog conversions.
Estimated: in a typical 81-MAPBGA on a 4-layer FR-4 board with natural convection, the MCF5213LCVM66J dissipates up to approximately 0.6 W at 66 MHz with all peripherals active, leading to a junction temperature rise of roughly 20-30 C above ambient. For continuous full-load operation in industrial enclosures above +60 C ambient, consider thermal vias beneath the central ball array and adequate copper pour to keep Tj below +125 C.
Do not leave unused pins floating; configure them as outputs or as inputs with the internal pull-up enabled, because floating inputs on BGA packages can drift into the linear region and trigger extra supply current. Ensure RESET is held low through a 1 kohm pull-down during power-up until the 3.3 V rail is stable to avoid spurious core startups and potential Flash corruption.
Route the external crystal traces (XTAL/EXTAL) as short and symmetrical as possible, surrounded by a ground guard ring to minimize capacitive loading and EMI pickup. The PLL loop filter components, if used externally, should be located adjacent to the MCU pins and kept away from switching signal traces to maintain jitter-free system clock generation.
규정 준수 정보
RoHS and lead-free/halogen-free compliance per NXP product family datasheet. REACH status not explicitly listed in the verified web data; AEC-Q100 not qualified because the part is intended for industrial-grade usage. Conflict-minerals compliance status not stated in the data provided.
