MCF5235CVF150 - ColdFire V2 150MHz 32-bit MPU | NXP | 256-MAPBGA
부품 번호: MCF5235CVF150 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $28.95 | $289.50 |
| 100 | $25.4 | $2,540.00 |
| 250 | $22.1 | $5,525.00 |
| 500 | $19.85 | $9,925.00 |
MCF5235CVF150 개요
What is a ColdFire MPU? ColdFire is a 32-bit microprocessor architecture derived from the Motorola 68000 family, designed by NXP/Freescale as a cost- and power-optimized successor. An MPU (microprocessor unit) differs from an MCU (microcontroller) in that it typically relies on external flash/RAM and external peripherals, targeting systems that need higher CPU performance than integrated MCUs can deliver. The MCF5235 family occupies the middle of the ColdFire V2 lineup and sits within the broader NXP ColdFire hierarchy: ColdFire V2 -> ColdFire -> 32-bit embedded processor -> microprocessor -> integrated circuit.
Key features of the MCF5235CVF150 include a 32-bit ColdFire V2 core with hardware multiply/accumulate (MAC) and divider, an enhanced Multiply Accumulate Unit (EMAC) for DSP-style operations, 64 KB of unified on-chip SRAM, ROMless boot from external flash, four 32-bit timers, an 8-channel DMA controller, and an integrated Fast Ethernet controller (FEC) supporting 10/100 Mbps MII/RMII. External bus interfaces include a 32-bit SDRAM controller, glueless SRAM/ROM/flash interface, and a 16-bit general-purpose bus.
The ColdFire V2 core uses a variable-length RISC-style instruction set with 16-bit, 32-bit, and 48-bit opcodes, executed through a 4-stage pipeline. The integrated EMAC executes two parallel MAC operations per cycle and a barrel shifter, enabling signal-processing workloads (audio codecs, motor control loops, simple FFTs) without an external DSP. Hardware debug is supported through Background Debug Mode (BDM) with on-chip breakpoints.
Typical applications include industrial automation controllers, networked embedded devices leveraging the integrated Fast Ethernet MAC, building automation and HVAC controllers, POS terminals, factory-floor protocol converters, and security/alarm panels where the 113 GPIO, four timers, and 8-channel DMA simplify peripheral integration. The 150 MHz core (144 MIPS Dhrystone 2.1) provides headroom for protocol stacks (TCP/IP, Modbus, BACnet) running alongside application logic.
When designing with the MCF5235CVF150, pay attention to PCB routing of the 256-ball MAPBGA - the 1.0 mm ball pitch requires microvia or HDI stackup for cost-effective fabrication. Place external SDRAM and flash as close as possible to the bus pins to minimize stub lengths and reflections on the 32-bit data bus, and decouple VDD/VCC rails with 100 nF X7R caps at every supply ball group.
This page synthesizes distributor inventory, parametric drop-in alternatives, and application notes that go beyond what the manufacturer datasheet alone provides, helping engineers evaluate, source, and design with the MCF5235CVF150 faster.
드롭인 대체품: MCF5235CVF150 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MCF5235CVF150 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Program Memory Type, Core Architecture, Ethernet, Ethernet MAC.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MCF5235CVM150
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →MCF5235CVM100
✅ 드롭인✓ 재고 있음
$25.4 / 개
데이터시트 보기 →MCF5235CVM80
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCF5234CVM100
✅ 드롭인✓ 재고 있음
$12.1 / 개
데이터시트 보기 →MCF5232CVM66
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCF5235CVF150 최대 정격 & 전기적 특성
| Core Architecture | ColdFire V2 |
| Core Bit Width | 32-bit |
| 최대 클록 주파수 | 150 MHz |
| On-chip SRAM | 64 KB |
| Program Memory Type | ROMless (external boot) |
| Number of I/O Lines | 113 |
| 패키지 | 256-MAPBGA (17x17 mm, 1.0 mm pitch) |
| 실장 유형 | Surface Mount |
| 공급 전압 | 1.5 V core / 3.3 V I/O (see datasheet) |
| Oscillator Type | External |
| DMA Channels | 8 |
| Timers | 4 x 32-bit |
| Ethernet | 10/100 Mbps Fast Ethernet Controller (FEC, MII/RMII) |
| Operating Temperature Grade | Industrial |
| Debug Interface | Background Debug Mode (BDM) |
| External Bus | 32-bit SDRAM controller + glueless SRAM/ROM/Flash |
MCF5235CVF150 256-mapbga (17x17 mm, 1.0 mm pitch) 핀 구성 가이드
MCF5235CVF150(256-mapbga (17x17 mm, 1.0 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MCF5235CVF150.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MCF5235CVF150 적합 용도: 6 애플리케이션s: Industrial Protocol Converter, Building Automation Controller, POS Terminal / Retail Embedded System, Factory Floor Sensor Aggregator, Security / Alarm Panel, Networked Medical Device Controller.
Industrial Protocol Converter
The MCF5235CVF150's 150 MHz ColdFire V2 core (144 MIPS Dhrystone 2.1) plus 113 GPIO slices it ideally for industrial gateways translating between Modbus RTU/TCP, BACnet, Profibus, and Ethernet/IP. The integrated Fast Ethernet Controller (FEC) with MII/RMII supports a single 100BASE-TX PHY with no external MAC, while the 32-bit SDRAM controller with glueless interface allows direct connection to a 32 MB SDRAM for protocol stack buffers. The 8-channel DMA offloads serial-port and Ethernet packet handling from the CPU, and the 64 KB on-chip SRAM holds time-critical state. Placed as the main CPU on a DIN-rail mountable PCB, the MCF5235CVF150 typically sits alongside an RS-485 transceiver (e.g. MAX3485) and a Micrel KSZ8041 PHY. Unlike a Cortex-M4 MCU, the part supports full Linux/uClinux or MQX RTOS deployments when protocol stacks grow complex.
추천
Building Automation Controller
Building automation gateways benefit from the MCF5235CVF150's integrated FEC, 113 GPIO, four 32-bit timers, and mature BACnet/Modbus stack support. At 150 MHz, the ColdFire V2 EMAC executes two MAC operations per cycle, sufficient to run BACnet/IP scheduling alongside HVAC control loops without an external DSP. The ROMless architecture boots from external SPI flash (typically 4-16 MB) for firmware upgradeability in the field. The 256-MAPBGA package's 1.0 mm pitch suits mid-volume HVAC controller PCBs assembled on standard SMT lines. The part's industrial -40C to +85C temperature rating allows deployment in mechanical rooms. Compared with newer Cortex-M7 parts, the MCF5235CVF150 trades raw clock speed for software ecosystem maturity - existing NXP ColdFire BACnet stacks port directly.
추천
POS Terminal / Retail Embedded System
POS terminals and retail kiosks leverage the MCF5235CVF150's 150 MHz ColdFire V2 core, integrated Fast Ethernet MAC, and 113 GPIO for cash drawer, receipt printer, and barcode-scanner integration. The 64 KB on-chip SRAM holds transaction scratch buffers, while an external 32-bit SDRAM (e.g. 32 MB MT48LC16M16A2) provides frame-buffer and TCP/IP socket memory. The four 32-bit timers drive precise polling of peripheral devices, and the 8-channel DMA offloads UART/Ethernet traffic from the CPU. The integrated FEC enables Ethernet connectivity to back-office payment systems without an external MAC, reducing BOM cost. Unlike an ARM Cortex-A application processor, the MCF5235CVF150 boots in <500 ms from SPI flash and runs deterministic MQX RTOS scheduling for PCI-compliant payment workflows.
추천
Factory Floor Sensor Aggregator
Sensor aggregation nodes on the factory floor use the MCF5235CVF150's 8-channel DMA controller to poll multiple SPI/I2C sensor buses simultaneously while the integrated FEC streams aggregated data to a SCADA host over 100BASE-TX. The 150 MHz ColdFire V2 core runs a small RTOS (MQX or uClinux) with TCP/IP, and the 64 KB on-chip SRAM holds the most recent sensor readings for sub-millisecond access. The 113 GPIO simplify parallel interface to legacy industrial sensors, while the four 32-bit timers synchronize sample windows. The part's industrial temperature grade (-40C to +85C) supports deployment in unheated enclosures. Unlike an MCU without Ethernet, the MCF5235CVF150 saves the BOM cost of an external TCP/IP offload chip.
추천
Security / Alarm Panel
Security and intrusion-alarm panels benefit from the MCF5235CVF150's 113 GPIO for zone inputs and siren outputs, plus integrated FEC for IP-based reporting to central stations. The ColdFire V2 EMAC accelerates encryption routines for secure sensor authentication, while the four 32-bit timers drive precise entry/exit delay timing. The 64 KB on-chip SRAM holds the current arm/disarm state and event log buffer. The 256-MAPBGA package's 1.0 mm pitch suits the compact main boards typical of modern alarm panels. The part's industrial -40C to +85C rating supports deployment in unheated closets. Compared with low-power Cortex-M0 MCUs, the MCF5235CVF150 trades standby current for Ethernet-integrated connectivity that simplifies UL-Listed alarm communicator designs.
추천
Networked Medical Device Controller
Non-patient-contact medical device controllers (e.g. laboratory analyzers, sterilizer controllers) use the MCF5235CVF150's 150 MHz core for sequencing and the integrated FEC for hospital-network connectivity. The 64 KB on-chip SRAM supports deterministic response times for safety interlocks, and the four 32-bit timers drive precise sterilization cycle phases. The 113 GPIO interface directly to valves, heaters, and sensors without external expanders. The industrial temperature rating and long-term NXP supply program suit medical equipment with 7-10 year field lifecycles. Unlike a Cortex-M4 MCU, the MCF5235CVF150 supports full TCP/IP and HTTPS stacks via MQX/uClinux, simplifying FDA submission documentation. NOTE: not a patient-contact part, so IEC 60601-1 patient leakage limits do not apply.
추천
추천 제품 요약
엔지니어링 참조 데이터: MCF5235CVF150 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCF5235CVM150 | MCF5235CVM100 | MCF5235CVM80 | MCF5234CVM100 | MCF5232CVM66 |
|---|---|---|---|---|---|---|
| Package | 256-MAPBGA (17x17 mm, 1.0 mm pitch) | 256-MAPBGA - same footprint family | 256-MAPBGA - same footprint family | 256-MAPBGA - same footprint family | 256-MAPBGA - same footprint family | 256-MAPBGA - same footprint family |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | ColdFire V2 | ColdFire V2 (same) | ColdFire V2 (same) | ColdFire V2 (same) | ColdFire V2 (same) | ColdFire V2 (same) |
| Maximum Clock Frequency | 150 MHz | 150 MHz | 100 MHz (-33%) | 80 MHz (-47%) | 100 MHz (-33%) | 66 MHz (-56%) |
| On-chip SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Fast Ethernet Controller (FEC) | Yes (MII/RMII) | Yes | Yes | Yes | No (MCF5234 lacks FEC) | No (MCF5232 lacks FEC) |
| GPIO Count | 113 | 113 | 113 | 113 | ~96 (reduced) | ~85 (reduced) |
| DMA Channels | 8 | 8 | 8 | 8 | 8 | 4 (reduced) |
| Operating Temperature Range | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Program Memory Type | ROMless (external boot) | ROMless (external boot) | ROMless (external boot) | ROMless (external boot) | ROMless (external boot) | ROMless (external boot) |
주요 차별점
- Highest clock speed in the MCF5235 family (vs MCF5235CVM100 / MCF5235CVM80)
- Integrated Fast Ethernet Controller (FEC) (vs MCF5234CVM100 / MCF5232CVM66)
- Full 113 GPIO count versus reduced-pin family members (vs MCF5234CVM100)
- Same ColdFire V2 silicon as MCF5235CVM150 (vs MCF5235CVM150)
설계 노트
The 256-MAPBGA package has a 1.0 mm ball pitch and 17x17 mm body. For cost-effective PCB fabrication, use a 4-layer 1+N+1 microvia stackup rather than a through-hole-only process - the inner pads of the BGA array are not reachable with dogbone fan-out on a 6-mil trace/space process. Place at least 8 via arrays under the package to stitch the ground plane and provide thermal relief. Estimated: each BGA escape route requires a microvia stack on standard 1.6 mm PCB thickness.
The MCF5235CVF150 requires separate core and I/O supply rails (1.5 V core via internal regulator or external switching regulator, 3.3 V I/O) plus PLL analog supply. Place a 100 nF X7R 0402 decoupling cap within 2 mm of every supply ball group, plus a bulk 10 uF tantalum or ceramic cap on each rail at the PCB edge connector. Power-on reset sequence: VDD core must stabilize before VDD I/O rises to avoid latchup - use a power management IC with sequenced outputs (e.g. NCP346 or LP2996).
Route the 32-bit external data bus (D[31:0]) and address bus (A[23:0]) with matched trace lengths within +/- 2.5 mm (about 15 ps skew at 150 MHz) to preserve SDRAM timing margins. Use series 33 ohm damping resistors near the MCF5235 bus pins to suppress ringing. Place external SDRAM on the same PCB side as the MPU, never on the opposite side through-via, to avoid stub-induced reflections. Estimated: a 100 mm trace at 1.6 mm dielectric has ~720 ps delay; route bus as point-to-point daisy-chain only.
Do not leave the RESET and BKPT pins floating; both require external pull-ups to VDD I/O. The XTAL/EXTAL pins need a series resistor and load capacitors matched to the crystal specification (typically 18 pF for an 8 MHz fundamental). The FEC requires a 25 MHz reference clock for MII or 50 MHz for RMII - drive from a low-jitter oscillator, never from a GPIO. Finally, the BDM debug port (BKPT, DSCLK, DSI, DSO, PST[3:0]) must be brought to a 2x5 header or 1.27 mm tag-connect footprint for production diagnostics.
The SDRAM clock (SDCLK) must be length-matched to the address/command traces within +/- 1.0 mm to avoid setup/hold violations at 150 MHz. Use a source-series 22 ohm termination on SDCLK if the SDRAM is more than 50 mm away. For Ethernet MII routing to the PHY, keep traces under 25 mm and maintain 50 ohm single-ended impedance; the RMII signals are particularly sensitive to impedance discontinuities. Estimated: at 150 MHz, every 10 mm of unterminated trace contributes ~5 microstrips of reflection.
규정 준수 정보
Compliance status not explicitly confirmed in the verified web data. AEC-Q100 not applicable - this is an industrial-grade MPU, not an automotive-qualified part. Contact NXP for REACH/RoHS certificates.
