MCF5235CVM150 - 150MHz ColdFire V2 MPU | NXP
MPN: MCF5235CVM150 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
MCF5235CVM150 Overview
A microprocessor is the highest-level computing element in an embedded system. It executes instructions, coordinates memory and peripherals, and supports an operating system or real-time control software. The MCF5235 belongs to the ColdFire embedded-processor hierarchy and combines general-purpose processing with Ethernet and time-processing peripherals intended to reduce system complexity in networked industrial, communications, and control equipment. Being ROM-less means the design must provide suitable nonvolatile program memory, while the integrated 64 KB SRAM provides fast on-chip working memory.
The principal verified features are a 150 MHz ColdFire V2 core, 32-bit architecture, 64 KB SRAM, 16-channel eTPU, 10/100 Ethernet MAC, communications peripherals, and hardware-accelerated encryption. The eTPU is useful for deterministic real-time motor, timing, and pulse-processing tasks, while the Ethernet MAC supports connected equipment. Hardware-assisted encryption can offload security-related processing, although the complete security capability and cryptographic implementation must be verified in the manufacturer documentation before security claims are finalized.
The 256-map BGA package is a fine-pitch surface-mount package requiring specialized PCB assembly and inspection. Because pin-level information was not included in the supplied verified extract, engineers must use the official NXP product page or manufacturer datasheet for the complete ball map, exposed-pad treatment, pin multiplexing, voltage limits, clock requirements, and recommended decoupling. The MCF5235 family integrates communications peripherals, but external memory, transceiver magnetics, clocks, power supplies, and interface circuitry remain design-dependent.
Typical uses include industrial Ethernet controllers, motor-control systems, building automation equipment, communications gateways, and embedded network appliances. For new products, the NRND status is a decisive constraint: verify lifecycle notices, sourcing continuity, software support, and migration options with NXP. Existing repairs should match the exact ordering code and validate PCB compatibility rather than relying on a functional or family-level substitute.
The principal design concern is not the 150 MHz clock alone but integration of power, memory, Ethernet, real-time peripherals, and BGA assembly into one reliable system. Review the manufacturer reference design, recommended decoupling, external-memory interface, reset configuration, and operating-voltage limits before schematic sign-off.
This page consolidates the verified NXP and distributor data while distinguishing exact source information from missing engineering details. It also provides lifecycle, sourcing, replacement, package, and design guidance beyond the basic distributor listing.
Drop-in alternatives for MCF5235CVM150 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MCF5235CVM150 (same form factor and footprint) — differing in Package, Core Architecture, Ethernet MAC, DMA Channels, Program Memory Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
No drop-in alternatives available for this product.
Request AlternativesMCF5235CVM150 Maximum Ratings & Electrical Characteristics
| Product Type | 32-bit ColdFire V2 integrated microprocessor |
| Processor Core | ColdFire V2 |
| Maximum Clock Frequency | 150 MHz |
| Architecture Width | 32 bit |
| Internal SRAM | 64 KB |
| Program Memory Type | ROM-less |
| Enhanced Time Processing Unit | 16-channel eTPU |
| Ethernet MAC | 10/100 Ethernet MAC |
| Security Feature | Hardware-accelerated encryption |
| Communications Peripherals | Integrated communications peripherals |
| Package | 256-map BGA, 17 mm x 17 mm |
| Package Family | BGA surface-mount package |
| Mounting Type | Surface mount |
| Product Category | Microcontroller / integrated microprocessor |
| Manufacturer Lifecycle Status | NRND |
MCF5235CVM150 bga surface-mount package Pin Configuration Guide
Pin configuration for MCF5235CVM150 (bga surface-mount package package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MCF5235CVM150.
Refer to the datasheet for full pin configuration.
Typical Applications
MCF5235CVM150 is suitable for 6 applications: Industrial Ethernet Controllers, Motor and Motion Control, Building Automation Equipment, Networked Security Equipment, Communications Gateways, Legacy MC68332 System Migration.
Industrial Ethernet Controllers
The MCF5235CVM150 fits an industrial Ethernet controller because its 150 MHz ColdFire V2 core, 10/100 Ethernet MAC, 64 KB SRAM, and communications peripherals consolidate network-host processing and control into one device. The ROM-less design can place application code in external nonvolatile memory, while the Ethernet MAC handles the digital network interface before connection to a physical-layer transceiver. In a controller, the ColdFire core can manage protocols, diagnostics, configuration, and real-time tasks concurrently. The 16-channel eTPU is particularly valuable when the product also handles periodic motor, pulse, timing, or actuator-control functions. Designers must still verify voltage, temperature, external-interface, and environmental requirements in the manufacturer documentation because they were not included in the verified search extract.
Recommended
Motor and Motion Control
The 16-channel enhanced Time Processing Unit gives MCF5235CVM150 a strong fit for motor and motion-control subsystems that need deterministic peripheral processing alongside a general-purpose CPU. The eTPU can execute timing-sensitive pulse and motor tasks through its dedicated channel architecture, while the 150 MHz ColdFire V2 processor handles supervisory logic, communications, diagnostics, and user interfaces. This division can reduce the burden placed on the main processor when multiple timed channels must operate predictably. The part is especially relevant to networked industrial equipment that coordinates motion with supervisory data exchange. Exact timer routing, clock configuration, memory requirements, and electrical limits must be taken from the official MCF5235 hardware specification before assigning channels or calculating timing margins.
Recommended
Building Automation Equipment
MCF5235CVM150 can serve as the communications and supervisory processor in building-automation equipment that connects sensors, actuators, controllers, and remote management services. Its 10/100 Ethernet MAC supports network communication, the communications peripherals expand interface options, and the 150 MHz ColdFire V2 core can process protocol stacks and application logic. The eTPU can manage periodic tasks associated with lighting, HVAC, access control, or motorized equipment when deterministic timing is useful. The ROM-less architecture allows deployment-specific code and configuration to reside in external memory. Because the verified extract does not provide room-temperature or extended-temperature ratings, the processor should be used only after confirming its electrical and environmental limits against the intended building-control enclosure and operating conditions.
Recommended
Networked Security Equipment
The hardware-accelerated encryption capability makes MCF5235CVM150 relevant to embedded gateways and security appliances that combine network traffic handling with protected control functions. Its 10/100 Ethernet MAC handles wired-network traffic, while the 150 MHz ColdFire V2 core manages protocols, device state, policy logic, and diagnostics. Hardware assistance can improve the suitability of the processor for cryptographic workloads, although it does not replace a full security architecture or establish which algorithms and modes are supported. Firmware, key management, physical network isolation, startup protection, and secure update mechanisms must be designed separately. The verified source does not provide safety, certification, temperature, or cryptographic-detail values, so those claims should be resolved against current NXP documentation before production use.
Recommended
Communications Gateways
A communications gateway benefits from the MCF5235CVM150's combination of a 150 MHz ColdFire V2 core, 64 KB SRAM, 10/100 Ethernet MAC, and communications peripherals. The processor can coordinate protocol conversion, local data buffering, network management, and control-plane functions without requiring a separate general-purpose network interface device. The ROM-less configuration allows gateway software to be stored in external memory and updated according to the product's field-maintenance strategy. The eTPU may additionally handle periodic protocol or interface tasks where precise timing is valuable. A production design must provide suitable external memory, Ethernet physical-layer circuitry, clocking, reset support, and power rails according to the official hardware specification; those implementation details are not supplied in the verified distributor excerpts.
Recommended
Legacy MC68332 System Migration
NXP describes the MCF523x family as offering a migration path for MC68332 users who need higher performance and networking support at a similar product-cost position. MCF5235CVM150 can therefore be evaluated for legacy embedded-control systems moving toward a 150 MHz ColdFire V2 platform with 64 KB SRAM, eTPU, Ethernet MAC, communications peripherals, and hardware-accelerated encryption. Migration is not automatically drop-in: memory architecture, peripherals, package construction, startup code, drivers, and real-time behavior must be reassessed. The verified MCF5235CVM150J result reinforces the MCF523x migration context but does not prove that part is a pin-compatible replacement. Use NXP migration documentation and design reviews rather than treating a family relationship as board-level compatibility.
Recommended
Recommended Products Summary
Engineering reference data for MCF5235CVM150 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product |
|---|---|
| Brand | NXP Semiconductors |
| Package | 256-map BGA, 17 mm x 17 mm |
| Processor Core | ColdFire V2 |
| Maximum Clock Frequency | 150 MHz |
| Architecture Width | 32 bit |
| Internal SRAM | 64 KB |
| Program Memory | ROM-less |
| Enhanced Time Processing Unit | 16-channel eTPU |
| Ethernet MAC | 10/100 Ethernet MAC |
| Lifecycle Status | NRND |
Design Notes
Do not treat related ColdFire processors as automatic replacements. The verified cross-reference results mention MCF5272CVF66, MCF52221CVM66, MCF5212LCVM66, MCF5234CVM150, and MCF5233CVM150, but they do not establish a shared 256-map BGA footprint, exact ballout, electrical limits, or pin-to-pin compatibility. For an existing PCB, compare the manufacturer pin tables, supply rails, clocking, memory interface, multiplexing, and package drawings. If those checks fail, treat the candidate as a redesign rather than a drop-in replacement.
Use the official hardware specification to establish every supply rail, sequencing requirement, decoupling value, and I/O voltage domain before schematic release. The verified extract confirms a ROM-less processor and a 256-map BGA but supplies no operating-voltage values or current limits. Those omissions prevent a safe power-budget calculation. Confirm core and I/O sequencing, external-memory voltage compatibility, Ethernet PHY supply requirements, and cold-start behavior rather than assuming that all domains use one voltage.
The 256-map, 17 mm by 17 mm BGA requires a fine-pitch PCB footprint and assembly process qualified for its ball pitch, solder-mask design, pad geometry, and reflow profile. Follow the official package drawing and land pattern exactly; the package image confirms the BGA form factor but does not expose individual balls. Also verify whether the device has an exposed thermal pad and account for it in the schematic, footprint, assembly stencil, and thermal path. Prototype X-ray inspection is appropriate before a high-volume assembly release.
Place mandatory power bypass components directly at their assigned BGA power balls and route high-current supplies with low-impedance planes or vias distributed around the device. External program memory and the 10/100 Ethernet interface should be placed in accordance with the manufacturer's reference design, with attention to memory-bus timing and high-speed return paths. Keep the Ethernet differential pair away from noisy switching nodes, preserve continuous reference planes, and follow the selected PHY's separation and isolation guidance.
Compliance Information
The verified source extract does not provide exact compliance declarations for MCF5235CVM150. AEC-Q100 is marked not_applicable because the supplied data does not identify this ordering code as an automotive-qualified variant; this is not a negative qualification claim. NXP material and quality documentation should be checked for the exact MPN.
