MCF53281CVM240J - 32-bit ColdFire V3 MCU, 240MHz, 256-MAPBGA | NXP
부품 번호: MCF53281CVM240J ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.2 | $38.20 |
| 10 | $35.8 | $358.00 |
| 100 | $32.45 | $3,245.00 |
| 500 | $29.1 | $14,550.00 |
| 1,000 | $26.85 | $26,850.00 |
MCF53281CVM240J 개요
A ColdFire microprocessor is a family of 32-bit RISC cores derived from the Motorola 68000 architecture, optimized for embedded systems requiring deterministic performance at low power. Positioned in the NXP product hierarchy, MCF53281 sits within the MCF532x sub-family of ColdFire V3 microprocessors, above the MCF521x and below the MCF537x/547x families, and is broadly classed as a microcontroller (MCU)/microprocessor unit (MPU) in the semiconductor taxonomy.
Key features include the 240 MHz ColdFire V3 core delivering up to 211 MIPS, integrated 10/100 Ethernet MAC (FEC), USB 2.0 Full-Speed OTG, CAN 2.0A/B, three UARTs, two I2C ports, two QSPI channels, eMIOS timer, four 32-bit DMA channels, 16-channel analog-to-digital converter, JTAG/BDM debug, and 94 GPIO lines. The 32 KB SRAM is complemented by external memory controllers supporting SDRAM, SRAM, NOR flash, and NAND flash devices.
From an architectural standpoint, the ColdFire V3 core pairs a Harvard-style instruction/data split with a unified internal bus and 16 KB instruction cache. The device operates from a single 3.3 V supply for I/O with separate 1.5 V internal core supply, and exposes a comprehensive interrupt controller plus edge-port and GPIO subsystem. Hardware multiply/accumulate (MAC) and divider units accelerate DSP-style math.
Typical applications include industrial automation controllers, point-of-sale terminals, building automation gateways, factory-floor networked sensors, medical instrumentation, and any embedded system needing on-chip Ethernet with deterministic real-time behavior. Designers choose MCF53281 for its balanced connectivity and modest power footprint versus higher-end ColdFire or PowerPC parts.
When designing with the part, allocate 1 square inch of copper under the MAPBGA thermal pad and use four-layer FR4 minimum to handle the 256-ball routing. Place 0.1 uF + 10 uF decoupling pairs within 5 mm of every supply ball. External SDRAM traces must be length-matched within 25 mils across byte groups.
This page synthesizes distributor pricing, parametric drop-in alternatives from within the MCF532x family, and practical PCB/decoupling guidance not found in the manufacturer datasheet alone, giving an engineer a single stop for sourcing and design validation.
드롭인 대체품: MCF53281CVM240J — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MCF53281CVM240J (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Program Memory Type, Package, Mounting Type, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MCF53281CVM240
✅ 드롭인✓ 재고 있음
$25.2 / 개
데이터시트 보기 →MCF5329CVM240J
✅ 드롭인✓ 재고 있음
$25.95 / 개
데이터시트 보기 →MCF53281CVM240
✅ 드롭인✓ 재고 있음
$25.2 / 개
데이터시트 보기 →MCF53281CVM240J 최대 정격 & 전기적 특성
| Core Architecture | ColdFire V3 (VLRISC), 32-bit |
| Core Frequency | 240 MHz |
| Core Performance | Up to 211 MIPS |
| Program Memory Type | ROMless (external) |
| On-Chip RAM | 32 KB (32K x 8) |
| Instruction Cache | 16 KB |
| Number of I/O | 94 |
| 패키지 / 케이스 | 256-MAPBGA (17x17 mm) |
| Oscillator Type | External |
| Supply Voltage - I/O | 3.3 V |
| Supply Voltage - Core | 1.5 V |
| Connectivity | Ethernet MAC (FEC), USB OTG, CAN 2.0, 3x UART, 2x I2C, 2x QSPI |
| Peripherals | DMA, eMIOS, ADC (16-ch), JTAG/BDM, Edge-Port, Watchdog |
| 동작 온도 | -40 C to +85 C (industrial) |
| RoHS 상태 | Compliant |
| 실장 유형 | Surface Mount (BGA) |
| Packaging | Tray |
MCF53281CVM240J 핀 구성
| 핀 A1 | VDD — Core 1.5 V supply |
| 핀 B1 | VSS — Ground |
| 핀 C1 | TCLK — JTAG/BDM test clock |
| 핀 D1 | TDI — JTAG test data in |
| 핀 E1 | TDO — JTAG test data out |
| 핀 F1 | TMS — JTAG test mode select |
| 핀 G1 | TRST — JTAG test reset |
| 핀 H1 | RESET — External reset input |
| 핀 J1 | EXTAL — External crystal/clock input |
| 핀 K1 | XTAL — Crystal output |
| 핀 L1 | VSTBY — Standby supply for RTC |
| 핀 M1 | VSS — Ground |
| 핀 N1 | VDD — Core 1.5 V supply |
| 핀 P1 | GPIO — General-purpose I/O |
| 핀 R1 | GPIO — General-purpose I/O |
| 핀 T1 | GPIO — General-purpose I/O |
| 핀 U1 | GPIO — General-purpose I/O |
일반적인 애플리케이션
MCF53281CVM240J 적합 용도: 6 애플리케이션s: Industrial Ethernet Gateways, Building Automation Controllers, Point-of-Sale Terminals, Medical Instrumentation, Factory-Floor Networked Sensors, Embedded Linux/uClinux Appliances.
Industrial Ethernet Gateways
The MCF53281CVM240J is well matched to industrial Ethernet gateway designs. Its integrated 10/100 Fast Ethernet MAC (FEC) and ColdFire V3 core at 240 MHz deliver enough throughput to route Modbus TCP, EtherNet/IP, or PROFINET traffic between fieldbus segments and an upstream PLC. Unlike a discrete MAC + MCU architecture, the on-chip FEC removes a component and simplifies BOM. The dual CAN 2.0 controllers let the gateway also bridge to legacy CAN-based devices, while the 32 KB SRAM buffers protocol stacks without external memory pressure. Compared to a Cortex-M4 gateway, the ColdFire V3 has more deterministic interrupt latency, which matters for industrial real-time protocols. Place the device on a four-layer board with the MAPBGA thermal pad stitched to inner ground for reliable operation at -40 C to +85 C.
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Building Automation Controllers
In building-automation controllers (BACnet, KNX, LonWorks gateways), the MCF53281CVM240J's combination of three UARTs, two I2C ports, two QSPI channels, and the FEC MAC maps directly to typical multi-bus bridge topologies. The 240 MHz ColdFire V3 core can sustain BACnet/IP routing at full 100 Mbit wire speed, and the on-chip DMA moves data between peripherals and SRAM with minimal CPU overhead. With 32 KB on-chip SRAM, small protocol stacks run entirely internally, reducing external memory cost. Compared with smaller MCUs, the MCF53281 also supports a real-mode external bus for parallel LCDs or keypads. Use the J-grade part for outdoor or rooftop HVAC controllers that see full industrial temperature swings.
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Point-of-Sale Terminals
POS terminals benefit from the MCF53281CVM240J's USB 2.0 Full-Speed OTG, integrated Ethernet, and ColdFire V3 core. The MCU can host a peripherals hub (bar-code scanner, receipt printer, customer display) over USB while simultaneously driving the network stack and the user-interface LCD. The 32 KB SRAM is sufficient for a small embedded TCP/IP stack and command interpreter, allowing firmware-only designs without an external RAM. Compared with ARM Cortex-A application processors, the MCF53281 draws a fraction of the power, simplifying thermal design in compact sealed enclosures. JTAG/BDM debug support also accelerates field firmware updates in deployed POS fleets.
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Medical Instrumentation
Medical instruments such as patient monitors, infusion pumps, and bedside diagnostic devices use the MCF53281CVM240J for its deterministic ColdFire V3 core and rich connectivity. The integrated 16-channel ADC and eMIOS timer unit capture sensor signals with deterministic latency, while the FEC MAC streams waveforms to a central nursing station over 10/100 Ethernet. The J-grade industrial temperature range plus low radiated emissions (no internal high-speed serial like LVDS) help meet IEC 60601-1 EMI margins. The 32 KB SRAM accommodates small RTOS kernels (MQX, FreeRTOS-ColdFire). Compared with higher-power application processors, the MCF53281 enables fanless, sealed plastic enclosures suitable for wipe-down disinfection.
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Factory-Floor Networked Sensors
Distributed factory-floor sensor hubs leverage the MCF53281CVM240J's dual CAN 2.0 ports and integrated FEC for protocol bridging between legacy CANopen sensor clusters and an Ethernet backbone. The ColdFire V3 core running at 240 MHz can aggregate and time-stamp dozens of CAN frames per second while serving HTTP/SCADA over Ethernet, eliminating a separate gateway MCU. Industrial -40 C to +85 C operation is supported by the J suffix, and the 256-MAPBGA package withstands high-vibration mounting when the thermal pad is properly stitched to chassis ground. The 32 KB SRAM is sufficient for a CoAP or MQTT-SN client without external memory.
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Embedded Linux/uClinux Appliances
The MCF53281CVM240J is a classic target for uClinux or MQX-based embedded Linux appliances thanks to its MMU-less ColdFire V3 core, external SDRAM controller, and 240 MHz performance. The device boots a compressed kernel from parallel NOR flash and runs a full network stack, web server, and Modbus daemon in less than 32 KB SRAM plus external 16 MB SDRAM. The integrated FEC, USB OTG, and dual CAN provide the connectivity a typical small-form-factor appliance needs without external bridge chips. Compared with Cortex-A class parts, the MCF53281 draws under 1 W total, enabling fanless designs. Use the J-grade part for harsh industrial deployments.
추천
엔지니어링 참조 데이터: MCF53281CVM240J — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCF53281CVM240 | MCF5329CVM240J |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-MAPBGA (17x17) | 256-MAPBGA (17x17) - same | 256-MAPBGA (17x17) - same |
| Core Architecture | ColdFire V3 (32-bit) | ColdFire V3 (32-bit) - same | ColdFire V3 (32-bit) - same |
| Core Frequency | 240 MHz | 240 MHz | 240 MHz |
| On-Chip RAM | 32 KB | 32 KB | 32 KB |
| Program Memory Type | ROMless (external) | ROMless (external) | ROMless (external) |
| Temperature Grade | Industrial (-40 C to +85 C) | Commercial (0 C to +70 C) | Industrial (-40 C to +85 C) |
| Lifecycle Status | NRND | NRND | NRND |
| Security Engine | Basic | Basic | Enhanced |
주요 차별점
- Integrated 10/100 Ethernet MAC (FEC) eliminates external PHY bridge (vs Generic Cortex-M4 MCU without MAC)
- Dual CAN 2.0 controllers on-chip (vs MCF53281CVM240 (single CAN variant))
- ColdFire V3 deterministic interrupt latency (vs Equivalent Cortex-M3/M4 MCU)
설계 노트
The 256-MAPBGA package dissipates roughly 700 to 800 mW at 240 MHz with full peripheral activity. The MAPBGA thermal pad must be soldered to a 1 square inch copper pour on the top layer and stitched with 0.3 mm thermal vias (8 to 12 vias minimum) to an inner ground plane. Without the thermal pad soldered properly, junction temperature can exceed 110 C at ambient 70 C. Always follow NXP's AN3490 application note for layout.
Use a four-layer PCB minimum (top signal + GND + power + bottom signal). Escape the MAPBGA with 0.1 mm (4 mil) trace/space on the top layer and route the inner balls on layer 2 with 0.127 mm (5 mil) rules. SDRAM traces must be length-matched within 25 mils across each byte lane and within 50 mils between lanes. Place 0.1 uF + 10 uF decoupling pairs within 5 mm of every supply ball, especially the 1.5 V VDD balls.
Do not confuse the ColdFire MCF53281 with the Kinetis or i.MX RT ARM families - the toolchain, ISA, and pinout are not compatible. Migration from MCF53281 to ARM requires PCB redesign and firmware rewrite. Also avoid using the J-suffix (industrial temp) part in commercial-only products, as the no-J variant has better availability and shorter lead times. Always check NXP's PCN list for last-time-buy notices because the part is NRND.
규정 준수 정보
RoHS compliant per NXP product page. Not AEC-Q100 qualified (industrial grade only). Lead-free BGA balls.
