MCIMX233CJM4B - i.MX23 ARM926EJ-S 454MHz MPU | NXP
부품 번호: MCIMX233CJM4B ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $7.23 | $7.23 |
| 10 | $6.51 | $65.10 |
| 100 | $5.78 | $578.00 |
| 500 | $5.07 | $2,535.00 |
| 1,000 | $4.45 | $4,450.00 |
MCIMX233CJM4B 개요
An applications processor is a system-on-chip that combines a CPU core with application-specific peripherals and accelerators, sitting above microcontrollers in capability while remaining below full application processors in cost. The i.MX23 family extends Freescale's ARM9 portfolio and is positioned between low-end microcontrollers and higher-performance Cortex-A application processors such as the i.MX6 and i.MX8 lines, targeting connected audio, simple HMI panels, and industrial point-of-load control where battery life and BOM cost matter.
Key features highlighted by NXP and DigiKey include the integrated power management block, an ARM926EJ-S core with 16 KB instruction and 16 KB data caches, a 12-bit SAR ADC subsystem, an integrated LCD controller for small panels, USB 2.0 high-speed OTG, and on-chip audio codec support. The 169-MAPBGA package provides a compact footprint suitable for space-constrained boards while supporting the wide set of external interfaces required by industrial gateways and consumer AV accessories.
Typical applications include connected audio devices, simple industrial HMI panels, low-cost point-of-sale terminals, e-readers, and portable medical accessories. Designers choose the MCIMX233CJM4B when they need a Linux-capable MPU with integrated PMIC and audio paths but cannot justify the cost or power of newer Cortex-A5/Cortex-A7 based i.MX28 or i.MX6 Solo parts.
드롭인 대체품: MCIMX233CJM4B — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MCIMX233CJM4B (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Mounting Type, Package, Data Cache, Integrated ADC.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MCIMX233CJM4C
✅ 드롭인✓ 재고 있음
$9.85 / 개
데이터시트 보기 →MCIMX233DJM4B
✅ 드롭인✓ 재고 있음
$9.85 / 개
데이터시트 보기 →MCIMX233DJM4C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCIMX233CJM4A
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCIMX233DAG4B
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCIMX233CJM4B 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | i.MX23 |
| Core | ARM926EJ-S |
| Core Architecture | ARM9 |
| Number of Cores | 1 |
| 데이터 버스 폭 | 32-bit |
| 최대 클록 주파수 | 454 MHz |
| 패키지 | 169-MAPBGA (11x11 mm) |
| 실장 유형 | Surface Mount |
| On-chip Memory | 16 KB I-cache + 16 KB D-cache (per ARM926EJ-S) |
| Integrated ADC | 12-bit SAR ADC (per Freescale datasheet overview) |
| USB | USB 2.0 High-Speed OTG (per i.MX23 family feature) |
| Audio | Integrated analog audio paths and codec interfaces |
| LCD Controller | Integrated (per i.MX23 family) |
MCIMX233CJM4B 169-mapbga (11x11 mm) 핀 구성 가이드
MCIMX233CJM4B(169-mapbga (11x11 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MCIMX233CJM4B.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MCIMX233CJM4B 적합 용도: 6 애플리케이션s: Connected Audio Devices, Industrial HMI Panels, Point-of-Sale Terminals, Portable Medical Accessories, E-Readers and Simple AV Accessories, Industrial Gateways and Protocol Bridges.
Connected Audio Devices
The MCIMX233CJM4B's integrated analog audio paths, ARM926EJ-S 454 MHz core, and on-chip power management make it well-suited to connected audio docks and streaming speakers. Engineers pair the processor with an external Wi-Fi module and a class-D amplifier; the integrated audio block eliminates a separate codec, shrinking the BOM. The 169-MAPBGA package supports compact enclosures, and the 12-bit ADC handles headphone-jack and button sensing. Software runs on Linux with ALSA, so audio routing and DSP effects stay in user space without taxing the limited MHz budget. Power-management integration lets the device enter low-power standby cleanly when the audio stream pauses, extending battery life in handheld wireless speakers versus designs using a discrete MPU plus external PMIC pair.
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Industrial HMI Panels
The MCIMX233CJM4B drives small industrial HMI panels up to WVGA via its integrated LCD controller while the ARM926EJ-S core runs a Linux or WinCE GUI stack. The integrated 12-bit ADC reads panel-front temperature sensors, button matrices, and 4-20 mA loop monitors through external signal conditioning, reducing component count. The 169-MAPBGA footprint supports sealed front-panel mounting and is paired with industrial-grade DDR/LPDDR memory. Designers leverage the integrated PMIC to meet IEC 61000-4-2 ESD and IEC 61000-4-4 EFT immunity by simplifying the power tree. The 454 MHz ARM9 pipeline is sufficient for static GUI screens, simple animations, and Modbus/Profibus protocol stacks in machine-control cabinets.
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Point-of-Sale Terminals
POS terminals based on the MCIMX233CJM4B leverage the integrated USB 2.0 High-Speed OTG, LCD controller, and 12-bit ADC to drive barcode scanners, thermal printers, and PIN-pad peripherals. The ARM926EJ-S runs a Linux POS application stack with encryption libraries for PCI-PTS-style key handling. The integrated power-management block supports battery-backed operation for mobile POS units, surviving brown-outs while writing to flash. The 169-MAPBGA 11x11 package keeps the motherboard small enough to fit inside handheld POS enclosures. Compared with discrete MPU plus external PMIC designs, the integrated approach lowers the BOM, simplifies FCC/CE pre-compliance testing, and reduces mean-time-to-repair in the field.
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Portable Medical Accessories
The MCIMX233CJM4B powers portable medical accessories such as glucose meters, pulse-oximetry add-on modules, and Bluetooth-connected spirometers where low-power ARM9 compute is enough and integrated analog blocks simplify the analog front end. The integrated 12-bit ADC samples sensor signals directly, the audio block supports tone-generation prompts, and the power-management block lets the device enter deep-sleep between measurements. The 169-MAPBGA 11x11 footprint fits handheld form factors. Designers pair the processor with a BLE module for smartphone pairing; the Linux BSP supports standard Bluetooth stacks. EOL status makes this part best suited to legacy platforms with long lifecycles already deployed in the field.
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E-Readers and Simple AV Accessories
E-readers and simple AV accessories from the i.MX23 era rely on the MCIMX233CJM4B's integrated LCD controller, USB OTG, and audio paths to deliver a low-power reading or media-playback experience. The ARM926EJ-S at 454 MHz drives e-paper refresh via SPI companions and runs a Linux reader stack. The 169-MAPBGA 11x11 package keeps the PCB small enough for thin reader enclosures. Integrated power management handles e-paper discharge waveforms and battery-charging without an external PMIC, lowering the BOM and simplifying FCC/CE certification. Designers favor this part when cost dominates over graphics performance; for richer media, migrate to i.MX6 Solo or i.MX7D designs.
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Industrial Gateways and Protocol Bridges
The MCIMX233CJM4B sits at the heart of industrial protocol-bridge gateways that translate between Modbus, CAN, and serial fieldbuses and an upstream Ethernet or Wi-Fi link. The ARM926EJ-S 454 MHz core runs lightweight TCP/IP stacks and protocol translators; the integrated USB OTG and multiple UARTs expose fieldbus peripherals. The integrated power-management block supports wide-input industrial 24V rails with on-chip DCDC, removing an external PMIC. The 169-MAPBGA package and its high-ball-count periphery fit into compact DIN-rail enclosures. The 12-bit ADC reads supply voltage and chassis temperature for health-monitoring telemetry; designers favor this MPU for cost-sensitive gateways that don't require the graphics or video engine of Cortex-A i.MX6/i.MX8 parts.
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추천 제품 요약
엔지니어링 참조 데이터: MCIMX233CJM4B — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCIMX233CJM4C | MCIMX233DJM4B | MCIMX233DJM4C | MCIMX233CJM4A | MCIMX233DAG4B |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 169-MAPBGA (11x11) | 169-MAPBGA (11x11) | 169-MAPBGA (11x11) | 169-MAPBGA (11x11) | 169-MAPBGA (11x11) | 169-MAPBGA (11x11) |
| Core | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S |
| Maximum Clock Frequency | 454 MHz | 454 MHz | 454 MHz | 454 MHz | 454 MHz | 454 MHz |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Number of Cores | 1 | 1 | 1 | 1 | 1 | 1 |
| Lifecycle Status | End of Life | End of Life | End of Life | End of Life | End of Life | End of Life |
| Integrated Power Management | Yes | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- Drop-in C-revision alternative with same footprint (vs MCIMX233CJM4C)
- Extended temperature option within the same family (vs MCIMX233DJM4B)
- Integrates power management versus discrete MPUs (vs MCIMX283CJM4A (i.MX28 family))
설계 노트
The MCIMX233CJM4B in the 169-MAPBGA package requires careful PCB thermal management. Estimated: with a typical 0.5 W core dissipation at 454 MHz with DDR and peripherals active, the junction-to-ambient thermal resistance (theta_JA) of the 169-MAPBGA on a 4-layer JEDEC board is in the 20-30 C/W range. Apply a solid ground plane under the BGA and stitch vias through the thermal balls to the inner planes; place the device away from board edges to keep case temperature within industrial grade limits. Always consult the NXP hardware reference manual for the latest thermal design rules.
The 169-MAPBGA 11x11 footprint demands a 4-layer (minimum) PCB with microvia-in-pad or via-on-pad technology for clean BGA escape. Estimated: 0.4 mm ball pitch with 0.25 mm drill microvias is typical. Route the DDR/LPDDR signals first with matched lengths and reference to a continuous ground plane to meet timing on the ARM926EJ-S external memory bus. Keep analog audio and ADC traces short and away from switching DCDC nodes to preserve the integrated codec's SNR.
Although the MCIMX233CJM4B integrates a power-management block, several external bulk capacitors are still required on the DCDC outputs and the DDR reference rail. Estimated: 22 uF X5R ceramic plus a 100 nF decoupling cap per power pin pair is a typical starting point. Follow the NXP hardware reference manual's recommended capacitor matrix exactly; deviations can cause brown-out during peak CPU load because the integrated DCDC is sized for steady-state, not transient, conditions.
Do not assume the MCIMX233CJM4B is in production - the NXP product page lists it as End of Life with Discontinuance and Replacement notices. Before committing a new design, validate the BSP against the latest errata document and confirm with NXP that no further PCNs are pending. New designs should target the i.MX28 or i.MX6UL/ULL families, which are pin-compatible at the system level only after board rework and BSP migration.
규정 준수 정보
RoHS, REACH, lead-free, halogen-free and conflict-minerals status not stated in the verified web data. Request the latest material declaration from the distributor or NXP before volume purchase; most NXP BGAs from this era ship RoHS-compliant, but importers should verify.
