MCIMX6D4AVT10AC - i.MX 6Dual 1GHz ARM Cortex-A9 MPU | NXP
부품 번호: MCIMX6D4AVT10AC ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $64.85 | $6,485.00 |
| 500 | $58.4 | $29,200.00 |
| 1,000 | $52.1 | $52,100.00 |
MCIMX6D4AVT10AC 개요
An applications processor is a system-on-chip (SoC) microprocessor IC that integrates CPU cores, graphics accelerators, memory controllers, and a wide range of peripherals onto a single die. Within the broader semiconductor taxonomy, MCIMX6D4AVT10AC sits at: applications processor -> microprocessor IC (MPU) -> integrated circuit (IC) -> semiconductor. Its ARM Cortex-A9 cores execute the ARMv7-A instruction set and are paired with NEON SIMD media engines, hardware VFPv3 floating-point, and a multilevel memory hierarchy (L1 + L2 cache plus external DDR3/LPDDR2 interface).
Key features distinguishing this variant include dual-core 1.0 GHz Cortex-A9, integrated 2D and 3D graphics accelerators (Vivante GC2000 + GC355 + GC320), an LVDS display controller, dual Gigabit Ethernet MACs with hardware acceleration, USB 2.0 with PHY, PCIe Gen 2.0, SATA II, and an automotive-grade operating range. The i.MX6D sub-family targets high-tier portable multimedia and infotainment workloads where MIPS throughput and rich graphics matter more than absolute lowest power. Smart speed technology allows per-core frequency scaling for thermal efficiency.
The architecture uses a 40 nm low-power CMOS process with an asynchronous multi-core fabric that isolates CPU, GPU, and IO voltage/frequency domains. This allows independent power gating of idle blocks, dropping total SoC power well below the sum of its sub-block maximums during typical workloads. External interfaces include 32-bit DDR3/LPDDR2, NAND/NOR flash controllers, multiple SD/MMC, I2C, SPI, UART, I2S, ESAI, and a camera sensor interface (CSI).
Typical applications include automotive infotainment head units, industrial HMI panels, smart energy gateways, point-of-sale terminals, and medical patient-monitoring consoles. The dual-core architecture is well-matched to OS-level multitasking (Linux, Android, QNX) where one core handles UI rendering while the other runs connectivity or control stacks.
When designing with this part, allocate adequate PCB real estate for the 21x21 mm FCBGA and follow NXP's reference design thermal recommendations, including a 4- or 6-layer stack-up with continuous ground planes under the package. Decoupling follows the manufacturer's reference manual; do not omit the DDR3 termination supply (VDD_DRAM) decoupling network.
This page synthesizes NXP datasheet specifications, current distributor stock, drop-in same-family alternatives, and practical design notes - engineering context not found in the datasheet alone.
드롭인 대체품: MCIMX6D4AVT10AC — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MCIMX6D4AVT10AC (동일 폼 팩터 및 풋프린트) — 차이점: Mounting Type, Series, Display Interfaces, Memory Interface, Number of Cores.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MCIMX6Q4AVT10AC
✅ 드롭인✓ 재고 있음
$44.8 / 개
데이터시트 보기 →MCIMX6D6AVT10AC
✅ 드롭인✓ 재고 있음
$47.8 / 개
데이터시트 보기 →MCIMX6D2AVT10AC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCIMX6Q6AVT10AC
✅ 드롭인✓ 재고 있음
$24.1 / 개
데이터시트 보기 →MCIMX6D4AVT10AD
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCIMX6Q5AVT10AC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCIMX6D4AVT10AC 최대 정격 & 전기적 특성
| Product Type | Applications Processor (MPU) |
| Series | i.MX 6 |
| Sub-Family | i.MX 6Dual (i.MX6D) |
| Core Architecture | ARM Cortex-A9 |
| Number of Cores | 2 |
| 데이터 버스 폭 | 32-bit |
| Maximum CPU Clock | 1.0 GHz |
| Graphics Accelerator | Vivante GC2000 + GC355 + GC320 (2D/3D/OpenGL ES) |
| 패키지 | 624-FCBGA (21x21 mm) |
| 실장 유형 | Surface Mount (BGA) |
| 동작 온도 | -40C to +125C (Automotive) |
| Memory Interface | 32-bit DDR3 / LPDDR2 |
| Display Interface | LVDS (dual-channel), parallel RGB, HDMI |
| Connectivity | 2x Gigabit Ethernet, USB 2.0 w/ PHY, PCIe Gen 2.0, SATA II |
| Process Node | 40 nm CMOS |
| Instruction Set | ARMv7-A + NEON + VFPv3 |
| RoHS 상태 | Compliant |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| Supplier Device Package | 624-LFBGA / FCBGA 21x21 |
MCIMX6D4AVT10AC 624-lfbga / fcbga 21x21 핀 구성 가이드
MCIMX6D4AVT10AC(624-lfbga / fcbga 21x21 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MCIMX6D4AVT10AC.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MCIMX6D4AVT10AC 적합 용도: 6 애플리케이션s: Automotive Infotainment Head Unit, Industrial HMI Touch Panel, Medical Patient Monitoring Console, Smart Energy Gateway / IoT Edge, Point-of-Sale / Retail Terminal, Digital Signage / Media Player.
Automotive Infotainment Head Unit
The MCIMX6D4AVT10AC drives next-generation automotive infotainment head units where dual-core Cortex-A9 is horsepower for a Linux/Android/QNX IVI stack. The integrated Vivante GC2000 3D engine accelerates the cluster/center-stack UI rendering, the LVDS controller drives a 1080p center display plus a secondary instrument cluster, and the automotive -40C to +125C qualification allows direct placement behind the dashboard without thermal derating. Two Gigabit Ethernet MACs enable 1000BASE-T1 automotive Ethernet connectivity to ADAS domain controllers.
추천
Industrial HMI Touch Panel
Factory-floor HMI panels with multitouch graphical UIs leverage the MCIMX6D4AVT10AC's dual-core architecture to separate real-time control loops from rich graphics rendering. The 1.0 GHz Cortex-A9 cores comfortably drive a 7- to 15-inch LVDS panel at 60 Hz with WebKit/Chromium-based operator interfaces, while the integrated GC355 2D engine handles vector graphics and font rasterization at industrial frame rates. Dual Gigabit Ethernet supports redundant ring topologies common in industrial automation.
추천
Medical Patient Monitoring Console
Patient monitoring consoles at the bedside or in ambulances use the MCIMX6D4AVT10AC's automotive-grade temperature range and dual-core performance to run the vital-signs waveform display while simultaneously acquiring and processing ECG/SpO2/respiration data streams. The dual-core architecture cleanly partitions the waveform rendering pipeline from the signal-processing kernel, and the hardware crypto accelerators speed up TLS sessions to hospital EMR systems over the integrated Gigabit Ethernet.
추천
Smart Energy Gateway / IoT Edge
Smart energy gateways consolidating multiple HAN/WAN protocols (ZigBee, Thread, Wi-Fi, Ethernet, cellular) run their protocol stacks on one Cortex-A9 core while the second core handles the metering aggregation and local decision logic. The MCIMX6D4AVT10AC's PCIe Gen 2.0 and SATA II interfaces allow a Wi-Fi 6 + 5G modem card plus local SSD logging, and the integrated crypto/trust-zone provides secure boot and DRM for OTA firmware updates.
추천
Point-of-Sale / Retail Terminal
POS terminals benefit from the MCIMX6D4AVT10AC's dual-core horsepower to drive a multi-touch 1080p UI plus a secondary cashier display, while running payment encryption, barcode decoding, and receipt printing concurrently. The integrated hardware crypto block accelerates EMV/PCI transaction encryption, dual Gigabit Ethernet allows segregated payment-vs-store-network VLANs, and the automotive-grade temperature range supports both indoor counters and outdoor kiosk installations.
추천
Digital Signage / Media Player
Multi-display digital signage players running HTML5/WebGL content use the MCIMX6D4AVT10AC's GC2000 3D GPU and dual-core CPU to drive synchronized 4K-capable content across LVDS + HDMI outputs. The 32-bit DDR3 controller with up to 1 GHz memory clock keeps frame buffers fed, and the SATA II allows local SSD media storage. The SoC's hardware video codecs (H.264, MPEG-4, VC-1) offload main CPU load, leaving the second core free for analytics and remote management.
추천
추천 제품 요약
엔지니어링 참조 데이터: MCIMX6D4AVT10AC — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCIMX6Q4AVT10AC | MCIMX6D6AVT10AC | MCIMX6D2AVT10AC | MCIMX6Q6AVT10AC | MCIMX6D4AVT10AD |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 624-FCBGA (21x21 mm) | 624-FCBGA (21x21 mm) - same | 624-FCBGA (21x21 mm) - same | 624-FCBGA (21x21 mm) - same | 624-FCBGA (21x21 mm) - same | 624-FCBGA (21x21 mm) - same |
| Number of Cores | 2 (Dual) | 4 (Quad) | 2 (Dual) | 2 (Dual) | 4 (Quad) | 2 (Dual) |
| Maximum CPU Clock | 1.0 GHz | 1.0 GHz | 1.2 GHz | 800 MHz | 1.2 GHz | 1.0 GHz |
| Sub-Family | i.MX 6Dual | i.MX 6Quad | i.MX 6Dual | i.MX 6Dual | i.MX 6Quad | i.MX 6Dual |
| Operating Temperature | -40C to +125C (Automotive) | -40C to +125C (Automotive) | -40C to +125C (Automotive) | -40C to +125C (Automotive) | -40C to +125C (Automotive) | -40C to +125C (Automotive) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| Integrated GPU | Vivante GC2000 + GC355 + GC320 | Vivante GC2000 + GC355 + GC320 | Vivante GC2000 + GC355 + GC320 | Vivante GC2000 + GC355 + GC320 | Vivante GC2000 + GC355 + GC320 | Vivante GC2000 + GC355 + GC320 |
주요 차별점
- Dual-core Cortex-A9 at 1.0 GHz in automotive grade (vs MCIMX6D2AVT10AC (800 MHz))
- Pin-compatible path to 4-core performance (vs MCIMX6Q4AVT10AC (i.MX6Quad))
- Integrated 3D GPU with hardware video codecs (vs MCIMX6D4AVT10AD (reel variant))
- Dual Gigabit Ethernet MACs integrated (vs Lower-end i.MX 6 variants (e.g., i.MX6S solo))
설계 노트
Estimated: at 1.0 GHz dual-core full CPU utilization plus GPU at 50% load, the SoC dissipates approximately 3.5-4 W continuous. The 624-FCBGA package requires a 4-6 layer PCB with a continuous ground plane directly under the package and thermal vias to inner copper layers for heat spreading. Reference NXP AN4579 for the recommended PCB stackup; do not use a 2-layer board for this part.
The MCIMX6D4AVT10AC requires at least four separate supply rails: VDD_ARM (1.0-1.2 V, up to 3 A continuous with 5 A transient for DVFS), VDD_SOC (1.0-1.2 V, 2 A), VDD_DRAM (1.5 V for DDR3 termination, matched to VTT), and VDD_HIGH (2.5-3.3 V for IO). Use NXP's PF0100/PF0200 PMIC or a discrete TPS54331 + TPS62130 design; do not power VDD_ARM and VDD_SOC from the same rail without separate filtering.
Route all DDR3 signals on the top layer directly under the BGA breakout fan-out using matched-length pairs; reference the NXP i.MX 6 Hardware Design Guide for trace width, spacing, and length matching tolerances. The 0.8 mm ball pitch requires laser-drilled microvias or stacked microvia-in-pad capability on the outer layers. Keep high-speed LVDS and SATA pairs on inner stripline layers with continuous reference ground.
Do not skip the boot configuration resistor strapping on the BOOT_MODE pins - misconfigurations result in the SoC booting from the wrong source (e.g., SD card instead of NAND) and appearing as a no-boot fault. Also verify the POR_B (power-on reset) signal rises monotonically after all rails stabilize; a slow POR rise can cause the internal boot ROM to latch into a debug state. Always connect the JTAG_TDO/TMS/TCK/TDI/TRST pins even if not used in production, to allow boundary-scan test access during board bring-up.
Place the 24 MHz system crystal within 5 mm of the XTAL/XPATH pads and shield it with a ground pour to minimize jitter; the crystal load capacitor values must match the crystal manufacturer's CL specification (typically 12-22 pF total). Route USB 2.0 D+/D- as a 90-ohm differential pair with no more than two vias total, and add the required 15 kohm pull-down on each line per the USB specification.
규정 준수 정보
RoHS compliant per NXP product page. AEC-Q100 not applicable - this is an automotive-temperature-grade MPU but not formally qualified to AEC-Q100; verify with NXP if formal automotive qualification is required for the end application.
