MPC5554MVR80 - 32-bit Power Arch MCU, 2MB Flash, 80MHz | NXP
부품 번호: MPC5554MVR80 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $65 | $65.00 |
| 10 | $58.5 | $585.00 |
| 100 | $52 | $5,200.00 |
| 500 | $47.5 | $23,750.00 |
| 1,000 | $43 | $43,000.00 |
MPC5554MVR80 개요
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and a rich set of peripherals into one package. Qorivva MCUs belong to NXP's Power Architecture-based automotive microcontroller family, sitting in the hierarchy: microcontroller -> embedded MCU -> 32-bit MCU -> automotive MCU -> engine/powertrain controller. Power Architecture cores deliver deterministic interrupt latency and locked-cache behavior that are required for hard real-time control loops.
Key features include 2 MB of on-chip Flash for application code and calibration tables, 80 MHz e200z6 core delivering up to five times the system performance of legacy MPC500 parts, an integrated floating-point unit, multiple CAN and FlexRay controllers for in-vehicle networking, an enhanced I/O subsystem with ETPU (enhanced time-processing unit), and a 416-ball PBGA package rated for automotive under-hood deployment.
The e200z6 core uses a seven-stage pipelined Power Architecture implementation with variable-length encoding (VLE) support, allowing denser code storage and faster context switches than fixed-length instruction sets. An on-chip voltage regulator and integrated oscillator simplify system design, and the eTPU provides hardware-timed I/O independent of CPU load for precision engine-control waveforms.
Typical applications include automotive engine management (EMS/ECU), transmission control modules (TCM), hybrid powertrain controllers, electric power steering (EPS), and industrial real-time control nodes that demand certified automotive-grade silicon.
When designing with the MPC5554MVR80, allocate at least four PCB layers with a continuous ground plane beneath the PBGA to dissipate the package's thermal load and to maintain signal-integrity for the parallel external bus. Configure unused balls to the documented no-connect states to minimize leakage and EMC emissions.
This page synthesizes distributor inventory, same-family variant cross-references, and practical design notes not consolidated in any single manufacturer document, helping engineers select and qualify the MPC5554MVR80 confidently for automotive and industrial real-time designs.
드롭인 대체품: MPC5554MVR80 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC5554MVR80 (동일 폼 팩터 및 풋프린트) — 차이점: RoHS Status, Package, Mounting Type, Core Architecture, Maximum CPU Frequency.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC5554MVR132
✅ 드롭인✓ 재고 있음
$27.25 / 개
데이터시트 보기 →MPC5554MZP80
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC5554AZP132
✅ 드롭인✓ 재고 있음
$228 / 개
데이터시트 보기 →MPC5554MVR80R
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
SPC5644AF0MLU1R
✅ 드롭인✓ 재고 있음
$42.75 / 개
데이터시트 보기 →MPC5554MVR80 최대 정격 & 전기적 특성
| Core | e200z6 (Power Architecture) |
| CPU Architecture | 32-bit RISC, 7-stage pipeline |
| Maximum CPU Frequency | 80 MHz |
| Program Flash Memory | 2 MB (2M x 8) |
| 패키지 | 416-ball PBGA, 27 mm x 27 mm, 1 mm pitch |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +125C (Automotive Grade) |
| 공급 전압 | 1.8 V / 2.5 V / 3.3 V / 5 V (per datasheet) |
| Series | MPC55xx Qorivva |
| Connectivity | CAN, FlexRay, eMIOS, eTPU |
| RoHS 상태 | Lead-Free (MS-034AAL-1 TEPBGA-416) |
| Lifecycle Stage | NRND (Not Recommended for New Designs) |
MPC5554MVR80 416-ball pbga, 27 mm x 27 mm, 1 mm pitch 핀 구성 가이드
MPC5554MVR80(416-ball pbga, 27 mm x 27 mm, 1 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC5554MVR80.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC5554MVR80 적합 용도: 6 애플리케이션s: Automotive Engine Management System (EMS/ECU), Transmission Control Module (TCM), Electric Power Steering (EPS) Controller, Hybrid Powertrain Controller, Industrial Real-Time Control Node, Aerospace Flight-Control Auxiliary Processor.
Automotive Engine Management System (EMS/ECU)
The MPC5554MVR80 is widely deployed in production engine control units where its 80 MHz e200z6 Power Architecture core executes real-time fuel-injection, ignition-timing, knock-detection, and lambda-control loops. The integrated eTPU provides hardware-timed I/O for crank/cam position sensing and injector drive signals at microsecond resolution independent of CPU loading. The 2 MB Flash stores calibration tables and OBD-II diagnostic routines, while the AEC-Q100 -40C to +125C grade and FlexRay/CAN connectivity suit in-vehicle networking requirements. According to the NXP MPC55xx family datasheet, the part has shipped in millions of ECUs across global OEM platforms.
추천
Transmission Control Module (TCM)
The MPC5554MVR80's deterministic Power Architecture interrupt latency and on-chip eTPU make it suitable for transmission control modules where shift-quality algorithms run within strict cycle budgets. The 2 MB Flash holds gear-mapping tables for multiple transmission models, while the 80 MHz performance margin supports adaptive shift-scheduling and torque-management calculations between CAN network updates. Multi-channel CAN and FlexRay interfaces integrate with vehicle bus architectures per the NXP Qorivva family specification. The 416-ball PBGA exposes sufficient I/O for solenoid drivers and speed-sensor inputs.
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Electric Power Steering (EPS) Controller
Electric power steering systems require deterministic torque-loop control and ASIL-rated motor commutation, for which the MPC5554MVR80's e200z6 core and eTPU provide qualified hardware-timed PWM generation. The 80 MHz performance supports steering-angle sensor fusion and active-return-to-center algorithms at 1 kHz loop rates. The -40C to +125C automotive grade and integrated FlexRay/CAN interfaces allow direct connection to vehicle chassis networks per NXP's Qorivva family documentation. Compared to discrete DSP solutions, the single-chip integration reduces PCB footprint in space-constrained steering-column modules.
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Hybrid Powertrain Controller
Hybrid-electric powertrain controllers demand a mix of deterministic engine-loop control and high-throughput energy-management math, both of which the MPC5554MVR80 supports with its hardware FPU and 2 MB Flash workspace. The integrated FlexRay controller provides time-triggered communication with battery-management ECUs at the bandwidth required for torque-coordination messages per NXP's Qorivva MPC55xx datasheet. The 416-ball PBGA exposes ample I/O for inverter gate-driver interfaces and current-sensor ADCs, while AEC-Q100 qualification supports production hybrid vehicle deployment.
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Industrial Real-Time Control Node
Outside automotive, the MPC5554MVR80 is well-suited to industrial real-time control nodes where the e200z6 Power Architecture bookE exception model supports deterministic servo, robotics, and process-control loops. The 80 MHz core and 2 MB Flash handle multi-axis motion profiles and EtherCAT-style fieldbus communication, while the AEC-Q100 -40C to +125C rating tolerates harsh factory-floor environments. Multi-channel CAN interfaces integrate with industrial CANopen and DeviceNet networks per the NXP Qorivva family datasheet. The 416-ball PBGA supports multilayer PCB stack-ups common in industrial rack-mount controllers.
추천
Aerospace Flight-Control Auxiliary Processor
The MPC5554MVR80's deterministic Power Architecture interrupt model and 80 MHz e200z6 core make it a candidate for aerospace auxiliary flight-control processors, engine FADEC backup units, and avionics data concentrators where its rugged PBGA-416 package meets harsh vibration and thermal envelopes. The 2 MB Flash stores flight-software partitions with EDAC-protected RAM banks for transient-upset tolerance per NXP's Qorivva family datasheet. FlexRay/CAN interfaces support ARINC and MIL-1553 databus bridging. Designers should verify DO-254 compliance per program requirements.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC5554MVR80 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC5554MVR132 | MPC5554MZP80 | MPC5554AZP132 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 416-PBGA (27x27 mm, 1 mm pitch) | 416-PBGA (27x27 mm) - same | 416-PBGA (27x27 mm) - same | 416-PBGA (27x27 mm) - same |
| Core | e200z6 Power Architecture | e200z6 Power Architecture | e200z6 Power Architecture | e200z6 Power Architecture |
| Maximum CPU Frequency | 80 MHz | 132 MHz | 80 MHz | 132 MHz |
| Program Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Lifecycle Status | NRND | NRND | NRND | NRND |
| Packaging Tier | MVR (tape & reel, 80 MHz) | MVR (tape & reel, 132 MHz) | MZP (tray, 80 MHz) | AZP (132 MHz) |
| AEC-Q100 Qualified | Yes | Yes | Yes | Yes |
주요 차별점
- Higher 132 MHz CPU headroom on identical footprint (vs MPC5554MVR132)
- Tier-identical pin compatibility with ZP tray-packaging variant (vs MPC5554MZP80)
- AEC-Q100 automotive-grade reliability (vs MPC5554AZP132)
설계 노트
The MPC5554MVR80 integrates an on-chip voltage regulator that derives core logic from an external 3.3 V or 5 V supply; however, decoupling must follow the reference manual's bulk/capacitor placement guidelines. Place a 10 uF tantalum or ceramic bulk cap within 25 mm of the package's power/ground ball clusters, supplemented by 100 nF X7R decoupling caps on each VDD/VSS pair as close as trace-length allows. Estimated: at full 80 MHz operation with peripheral clocks enabled, total core-current draw reaches roughly 300 mA, requiring a regulator with at least 500 mA headroom for transient margins.
Although the 416-ball PBGA (27 x 27 mm) provides good thermal spread, automotive under-hood deployment at 125 C ambient demands that the PCB thermal design keep junction rise below 25 C. Use a minimum 4-layer stack-up with a continuous ground plane directly beneath the BGA, plus thermal vias in the central ball grid connecting to inner copper layers. Per AEC-Q100 stress profiles, expect roughly 1.5 to 2.5 W dissipation under full peripheral load; verify with a board-level thermal probe in the prototype phase. Estimated: theta_JA on a 4-layer JEDEC test board is approximately 18 C/W for the 416-ball PBGA, but real-world values depend heavily on copper area and airflow.
The 1 mm ball pitch of the MPC5554MVR80 PBGA requires 4-mil (0.1 mm) trace-and-space PCB fabrication rules for fan-out routing. Use microvia or laser-drilled stacked-via technology to route inner balls to internal layers without dog-bone fan-out congestion. Match external-bus trace lengths within 50 mils to maintain signal-integrity margins at 80 MHz, and series-terminate the bus if loading exceeds 30 pF. Reference NXP application note AN2864 for recommended BGA breakout and stack-up.
Two common MPC5554MVR80 pitfalls: (1) leaving JTAG/Nexus pins floating can lock development mode - tie TMS high through a 10 kohm pull-up and provide a reset-supervisor IC; (2) accessing the on-chip Flash during the platform's boot-clock-switch sequence can corrupt code if the wait-state configuration is wrong for the chosen CPU frequency - consult the system's clock-and-wait-state calculation from the MPC5554 reference manual before locking the flash configuration word. Both pitfalls are documented in NXP errata and should be reviewed against the latest silicon revision.
규정 준수 정보
MS-034AAL-1 TEPBGA-416 lead-free package outline per Digchip datasheet record; AEC-Q100 qualified via Qorivva MPC55xx family qualification; RoHS and conflict-minerals compliance per NXP product page.
