MPC8250AZQIHBC - PowerQUICC II MPC82xx 200MHz MPU | NXP
부품 번호: MPC8250AZQIHBC ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $90.58 | $90.58 |
| 10 | $78.5 | $785.00 |
| 100 | $65.2 | $6,520.00 |
| 500 | $54.1 | $27,050.00 |
| 1,000 | $47.8 | $47,800.00 |
MPC8250AZQIHBC 개요
A microprocessor (MPU) is the central processing unit of an embedded system, executing instructions fetched from memory and coordinating peripheral traffic. The MPC82xx family sits in the hierarchy of NXP PowerQUICC communications processors: MPU -> embedded microprocessor -> communications processor -> PowerQUICC II -> PowerPC G2 -> 32-bit RISC core -> semiconductor. This positioning makes the part especially suitable for networking, telecom, and industrial control applications where deterministic peripheral behavior matters as much as raw CPU throughput.
Key differentiating features include the integrated communications processor module (CPM) with multiple FCCs (Fast Communications Controllers), MCCs, SCCs, and a 10/100 Ethernet MAC, all sharing DMA access to the host CPU. The part exposes a 32-bit PowerPC data path, 603e-class instruction set, and an external bus width of 64 bits. The 516-pin TEPBGA (Plastic Enhanced BGA) package measures 27 mm x 27 mm and provides extensive I/O and address pins for external SDRAM, Flash, and peripheral expansion. The operating temperature grade marked by the 'Z' suffix is commercial.
Typical applications include routers, LAN/WAN switches, DSLAM line cards, industrial control boards, and legacy telecom backplanes. The combination of on-chip peripherals and PowerPC core reduces board area versus designs that pair a discrete CPU with an external PCI bridge. Designers migrating from earlier PowerQUICC I (MPC860) parts benefit from binary-compatible instruction sets with higher clock rates and additional peripheral channels.
When designing with this part, careful attention to power sequencing and decoupling is mandatory because the MPC8250 has multiple supply rails (core and I/O). The 516-pin BGA requires X-ray inspection and controlled reflow profiles; PCB land pattern and trace routing must follow NXP application note guidelines for high-speed 60x-class buses to avoid signal integrity issues on the memory interface.
드롭인 대체품: MPC8250AZQIHBC — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8250AZQIHBC (동일 폼 팩터 및 풋프린트) — 차이점: Package Type, Data Bus Width, Core, Core Architecture, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8250AVRIHBC
✅ 드롭인✓ 재고 있음
$21.4 / 개
데이터시트 보기 →MPC8250ACZQIHBC
✅ 드롭인✓ 재고 있음
$99.5 / 개
데이터시트 보기 →MPC8250ACVRIHBC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8270CVRMIBA
✅ 드롭인✓ 재고 있음
$88.75 / 개
데이터시트 보기 →MPC8247VRTIEA
✅ 드롭인✓ 재고 있음
$58.25 / 개
데이터시트 보기 →MPC8250AZQIHBC 최대 정격 & 전기적 특성
| Core Architecture | PowerPC G2 (MPC82xx / PowerQUICC II) |
| Number of Cores | 1 |
| 데이터 버스 폭 | 32-bit |
| 최대 클록 주파수 | 200 MHz |
| Process Technology | 0.25 um CMOS |
| 공급 전압 | 3.3 V |
| Package Type | 516-Pin TEPBGA |
| Package Dimensions | 27 mm x 27 mm |
| External Bus Width | 64-bit |
| Operating Temperature Grade | Commercial |
| Integrated Peripherals | CPM (FCC/MCC/SCC), 10/100 Ethernet MAC |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
MPC8250AZQIHBC 27 mm x 27 mm 핀 구성 가이드
MPC8250AZQIHBC(27 mm x 27 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8250AZQIHBC.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8250AZQIHBC 적합 용도: 6 애플리케이션s: Telecom Router Control Plane, LAN/WAN Switch Line Card, DSLAM Line Card Processor, Industrial Control SBC, Legacy Telecom Backplane Interface, Network Print Server and Embedded NAS.
Telecom Router Control Plane
The MPC8250AZQIHBC suits telecom router control plane designs where deterministic peripheral behavior and an integrated CPM reduce BOM cost. Its 200 MHz PowerPC G2 core runs routing protocols while the on-chip FCC and Ethernet MAC terminate multiple WAN links. The 516-pin TEPBGA exposes enough chip-select lines for SDRAM plus Flash plus boot ROM, and the 64-bit external bus sustains high-bandwidth packet forwarding without external bridge silicon.
추천
LAN/WAN Switch Line Card
The MPC8250AZQIHBC integrates a 10/100 Ethernet MAC and multiple SCCs, allowing it to drive Layer 2 switch line cards with on-chip PHY interfaces and serial glue logic. Its 32-bit PowerPC core runs MAC-layer forwarding tables, and the CPM offloads DMA to free CPU cycles. Compared with discrete CPU+ASIC designs, this part shrinks the BOM and consolidates interrupt handling on a single silicon die.
추천
DSLAM Line Card Processor
The MPC8250AZQIHBC handles DSLAM line-card MAC processing at 200 MHz while its CPM terminates ATM AAL and HDLC traffic to the uplink. The 516-TEPBGA 27x27 mm footprint fits standard ATCA line-card geometries and exposes sufficient GPIO for line-card management I2C and SPI buses. Using the same part across line-card and uplink-card slots simplifies firmware reuse and maintenance across the DSLAM chassis.
추천
Industrial Control SBC
The MPC8250AZQIHBC powers industrial single-board computers by combining a 200 MHz PowerPC host CPU with deterministic DMA-driven peripherals. Designers use the SCCs for RS-485 field-bus, the Ethernet MAC for management, and the FCCs for high-speed synchronous links to FPGA co-processors. The commercial temperature grade suits factory-floor enclosures, while the same package supports industrial screens via the 'V' suffix variant.
추천
Legacy Telecom Backplane Interface
The MPC8250AZQIHBC serves legacy backplane interface cards in telecom racks that need HDLC, UART, and TDM traffic aggregation. The CPM arbitrates DMA for multiple channels without burdening the CPU, and the 64-bit external memory bus sustains aggregate throughput across all channels. Engineers maintaining installed base equipment can sustain production using Rochester Electronics inventory and same-family NXP drop-in upgrades.
추천
Network Print Server and Embedded NAS
The MPC8250AZQIHBC fits embedded NAS and print-server appliances by combining a PowerPC core with on-chip Ethernet, serial, and parallel DMA. The 200 MHz clock runs lightweight TCP/IP stacks while the FCC handles high-throughput data pipes to the storage controller. Designers leverage the 64-bit SDRAM bus to buffer large I/O streams without external bridge logic, reducing board area versus discrete CPU designs.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8250AZQIHBC — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8250AVRIHBC | MPC8250ACZQIHBC | MPC8250ACVRIHBC | MPC8270CVRMIBA | MPC8247VRTIEA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-TEPBGA (27x27) | 516-TEPBGA (27x27) - same | 516-TEPBGA (27x27) - same | 516-TEPBGA (27x27) - same | 516-TEPBGA - same family package | 516-TEPBGA - same family package |
| Maximum Clock Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 266-450 MHz | 266 MHz |
| Core Architecture | PowerPC G2 (MPC82xx) | PowerPC G2 (MPC82xx) | PowerPC G2 (MPC82xx) | PowerPC G2 (MPC82xx) | PowerPC G2 (MPC82xx HiPerMOS7) | PowerPC G2 (MPC82xx) |
| Process Technology | 0.25 um CMOS | 0.25 um CMOS | 0.25 um CMOS | 0.25 um CMOS | 0.13 um HiPerMOS7 | 0.13 um HiPerMOS7 |
| Temperature Grade | Commercial (Z suffix) | Industrial (V suffix) | Commercial (Z suffix) | Industrial (V suffix) | Industrial (V suffix) | Industrial (V suffix) |
| External Bus Width | 64-bit | 64-bit | 64-bit | 64-bit | 64-bit | 64-bit |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 1.8 V core / 3.3 V I/O | 1.8 V core / 3.3 V I/O |
주요 차별점
- Same-family industrial-temperature drop-in (vs MPC8250AVRIHBC)
- Higher clock speed options in same package (vs MPC8270CVRMIBA)
- Lower-power HiPerMOS7 successor available (vs MPC8270CVRMIBA)
설계 노트
The MPC8250AZQIHBC requires multiple supply rails: a 3.3 V I/O rail, a separate 1.5-1.8 V core rail, and PLL analog supplies. Power sequencing mandates core voltage rise before or simultaneously with I/O voltage to avoid latch-up. Use a sequencer IC such as the NMC TPS3808 or similar supervisor with adjustable delay to enforce the required turn-on order. Place bulk ceramic and tantalum capacitors within 1 inch of each BGA power pin pair to suppress transient di/dt loads during CPM DMA bursts.
Estimated: at core voltage 1.8 V and 200 MHz with all CPM channels active, worst-case core power reaches roughly 2.5-3.5 W for this 0.25 um part. The TEPBGA 27x27 mm substrate offers a moderate theta_JA of about 12-15 C/W on a 4-layer JEDEC test board, yielding a junction temperature rise of 30-50 C above ambient. Provide a thermal pad stitched with a via array and at least 4 inner copper planes for thermal spreading in production designs.
Route the 64-bit external memory bus on the top or second layer with 50-ohm controlled impedance and length matching within 100 mil across byte lanes. Use 1.0 mm-pitch microvia stack-ups because standard 1.6 mm 4-layer boards cannot escape the 516-TEPBGA at 1.27 mm pitch without dog-bone fanouts that exceed acceptable stub length. Keep clock traces shorter than address and data traces, and guard the SDRAM clock with ground-side reference to minimize crosstalk.
The MPC8250AZQIHBC memory bus runs at up to 100 MHz externally, so apply series termination near the driver side and place SDRAM DIMMs/SODIMMs within 2 inches of the BGA. Verify SI with TDR measurements after PCB fab to ensure impedance stays within 50 +/- 10 percent. For long backplane interfaces through the FCCs, use AC-coupled differential pairs with matched-length routing.
Avoid using the MPC8250AZQIHBC on new designs in 2026 because the part is in obsolete or last-time-buy status per NXP lifecycle. Engineers maintaining installed base should specify Rochester Electronics or other authorized-channel stock and verify date codes. Mixing different silicon revisions in the same chassis can cause JTAG ID mismatch and break firmware update paths; keep a single revision per board SKU.
규정 준수 정보
RoHS and lead-free status confirmed by Rochester Electronics product listings; AEC-Q100 not applicable for non-automotive MPU; halogen-free status not explicitly stated in available datasheet sources.
