MPC8536EAVTAVLA557 - 1.5GHz PowerQUICC III e500 MPU | NXP
부품 번호: MPC8536EAVTAVLA557 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $168 | $1,680.00 |
| 100 | $152 | $15,200.00 |
| 500 | $138 | $69,000.00 |
| 1,000 | $124 | $124,000.00 |
MPC8536EAVTAVLA557 개요
A PowerQUICC III SoC (system-on-chip) is a NXP-integrated communications processor family that combines a PowerPC-class CPU core with on-chip peripherals (Ethernet MACs, security engines, DDR memory controllers, PCI Express, local bus, UART, I2C, SPI). The MPC8536E is aimed at wired networking, line-card controllers, and industrial control applications where deterministic packet handling and rich I/O are required - historically positioned between a microcontroller and a full application processor.
Key features include 1.5 GHz core clock, Power Architecture e500 core, integrated security engine, DDR2/DDR3 memory controller with ECC, PCI Express interface, multiple Gigabit Ethernet MACs, and a flexible local bus controller. The 783-FCBGA package supplies the high-pin-count I/O needed for parallel and serial high-bandwidth interfaces required in networking line cards.
Architecturally, the MPC8536E pairs an e500 superscalar core with a high-bandwidth system bus and on-chip peripherals, achieving gigahertz-class complex application processing while maintaining advanced feature integration and high-speed connectivity for IP network and advanced media processing applications. The integrated peripherals offload packet handling from the core, making it well-suited to multi-protocol routing and bridging.
Typical applications include IP network routers and switches, line-card controllers, industrial automation controllers, and secure network appliances. It is often paired with external PHYs, DDR memory, and a managed Ethernet switch fabric for line-rate packet processing.
When designing with this part, allocate sufficient PCB layers (typically 8+ layers) to route the 783-ball BGA and controlled-impedance traces for the DDR and SERDES interfaces. Thermal management must account for the FCBGA junction-to-ambient thermal resistance, and a properly designed heat spreader is recommended for continuous 1.5 GHz operation.
This page synthesizes distributor pricing, same-package drop-in alternatives within the MPC85xx family, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: MPC8536EAVTAVLA557 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8536EAVTAVLA557 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Ethernet, Number of Cores, PCI Express, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8536EAVJAVLA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8536EAVTAQLA
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8536EAVTANG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$85.4 / 개
데이터시트 보기 →MPC8536EAVJANG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8536ECVTAVLA
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$112.8 / 개
데이터시트 보기 →P2020NSN2KFC
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$175 / 개
데이터시트 보기 →MPC8536EAVTAVLA557 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Processor Series | PowerQUICC III (MPC85xx) |
| Core Architecture | PowerPC e500 (32-bit Power Architecture) |
| Core Count | 1 |
| Core Frequency (max) | 1.5 GHz |
| 데이터 버스 폭 | 32-bit |
| Physical Address Width | 36-bit |
| FP/SIMD Support | Double-precision embedded FPU (64-bit) and single-precision vector/scalar SIMD |
| Core Voltage | 1.1 V |
| 패키지 / 케이스 | 783-FCBGA (29x29 mm) |
| 실장 유형 | Surface Mount (BGA) |
| 동작 온도 | -40C to +105C (extended industrial grade, per supplier data) |
| Memory Controller | DDR2/DDR3 with ECC (per MPC8536E family documentation) |
| Ethernet MACs | Multiple Gigabit Ethernet MACs (per MPC8536E family documentation) |
| PCI Express | PCIe interface supported (per MPC8536E family documentation) |
| Local Bus Controller | Yes (per MPC8536E family documentation) |
| Security Engine | Integrated (per MPC8536E family documentation) |
| RoHS 상태 | Compliant |
| MSL 레벨 | Per JEDEC J-STD-020 (FCBGA) |
MPC8536EAVTAVLA557 핀 구성
| 핀 A1 | VSS — Ground |
| 핀 GND | GND — [DATA_NEEDED: ball-grid pin map for the 783-FCBGA - full BGA pinout not fully reproduced here due to data sparsity in the verified web sources; refer to the NXP MPC8536E hardware specifications datasheet appendix for the complete 783-ball pinout] |
일반적인 애플리케이션
MPC8536EAVTAVLA557 적합 용도: 7 애플리케이션s: Wired IP Routers and Switches, Industrial Automation Gateways, Secure Network Appliances (Firewall/VPN/UTM), Advanced Media Processing Nodes, Telecom Line-Card Controllers, Edge Routers and Small-Business Networking, Datacenter Top-of-Rack Switching Fabric Controller.
Wired IP Routers and Switches
The MPC8536EAVTAVLA557 is purpose-built for IP routing and switching platforms, where its 1.5 GHz e500 core, integrated multi-Gigabit Ethernet MACs, and high-speed interconnect (PCI Express plus local bus) deliver line-rate packet processing without external ASICs. According to NXP MPC8536E product information, the SoC combines a robust e500 core with enhanced peripherals and interconnect technology to balance processor performance with I/O system throughput. Designers can place the part on a line card with external PHYs and a managed Ethernet switch fabric to offload protocol housekeeping from the CPU, freeing cycles for routing-table maintenance and management-plane tasks.
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Industrial Automation Gateways
Industrial gateways benefit from the MPC8536EAVTAVLA557's deterministic e500 core (up to 1.5 GHz), extended operating temperature grade, and integrated DDR2/DDR3 controller with ECC for reliable memory operation in noisy factory environments. The 783-FCBGA 29x29 mm package with rugged BGA solder joints supports industrial vibration profiles. According to the datasheet hardware specifications, the part's on-chip security engine provides hardware-accelerated cryptographic primitives essential for authenticated industrial protocols (EtherCAT, PROFINET, OPC UA) bridging, while the local-bus controller streamlines integration with legacy industrial I/O peripherals and fieldbus ASICs.
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Secure Network Appliances (Firewall/VPN/UTM)
The MPC8536EAVTAVLA557's integrated security engine (hardware-accelerated crypto) combined with a 1.5 GHz e500 core makes it a strong fit for firewall, VPN, and unified threat management appliances that require on-the-fly encryption/decryption of traffic flows. Per the MPC8536E family datasheet, the embedded floating-point APU and SIMD engine accelerate packet classification and pattern matching. The DDR2/DDR3 controller with ECC ensures non-corrupted security contexts, while the 783-FCBGA package and Power Architecture simplicity allow compact fanless appliance form factors with passive heatsinks, ideal for SMB edge security.
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Advanced Media Processing Nodes
Per the NXP MPC8536E family product description, the part delivers advanced feature integration and high-speed connectivity for advanced media processing applications, leveraging the e500 core's vector and scalar single-precision SIMD capabilities alongside the embedded floating-point APU. The PCI Express interface enables pairing with dedicated media DSPs or hardware codecs, while the local bus can connect to FPGA pre-processors. Designers typically use the MPC8536EAVTAVLA557 in transcoding, streaming server, and broadcast media gateway nodes where deterministic packet handling and parallel SIMD acceleration work in concert.
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Telecom Line-Card Controllers
Telecom line cards require a combination of high-throughput serial interfaces, reliable DDR access, and determinism - exactly what the MPC8536EAVTAVLA557 offers. The integrated Ethernet MACs, PCI Express, and local-bus controller map directly to line-card architectures where the MPC8536E acts as a control-plane processor alongside a network processor or framer. According to the hardware specifications, the 36-bit physical addressing supports large memory maps needed for forwarding tables and buffering, while ECC-protected DDR reduces soft-error risk in always-on telecom installations.
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Edge Routers and Small-Business Networking
The MPC8536EAVTAVLA557 fits cost-sensitive edge routers for small-business and branch-office deployments, where its integrated peripherals eliminate the need for an external Ethernet switch ASIC and the 1.5 GHz e500 core handles NAT, QoS, VPN, and routing protocols simultaneously. The PowerQUICC III architecture balances CPU throughput with I/O bandwidth, simplifying firmware development since the same Linux/PowerPC ecosystem used in larger NXP networking SoCs ports directly to this part. The 783-FCBGA 29x29 mm package footprint also enables layout reuse across the MPC85xx family for product variants.
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Datacenter Top-of-Rack Switching Fabric Controller
Datacenter top-of-rack switches leverage the MPC8536EAVTAVLA557's combination of multiple Gigabit Ethernet interfaces, PCI Express uplink, and the e500 core's deterministic interrupt response for management-plane and control-plane functions. The integrated security engine can accelerate MACsec or IPsec on the management path, while the local bus connects to a managed switch fabric. Using the FCBGA-783 package on a multi-layer PCB with controlled-impedance SERDES traces (per NXP hardware specifications routing guidelines), designers achieve a compact, high-reliability TOR switch controller for hyperscale deployments.
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추천 제품 요약
엔지니어링 참조 데이터: MPC8536EAVTAVLA557 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8536EAVJAVLA | MPC8536EAVTAQLA | MPC8536EAVTANG | MPC8536ECVTAVLA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same |
| Core Architecture | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 |
| Core Frequency (max) | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Data Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Integrated Ethernet MACs | Multi-GbE (MPC8536E family) | Multi-GbE | Multi-GbE | Multi-GbE | Multi-GbE |
| PCI Express | Yes (MPC8536E family) | Yes | Yes | Yes | Yes |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant |
주요 차별점
- Long-term supply continuity via Rochester Electronics distribution (vs MPC8536EAVJAVLA (sibling via-franchise stock))
- Industrial-grade AVT temperature qualification (vs MPC8536ECVTAVLA (security-hardened CVT variant))
- Cost-optimized ordering code within the MPC8536E silicon family (vs MPC8536EAVJAVLA (different speed bin ordering code))
설계 노트
Estimated: the 783-FCBGA 29x29 mm package with typically 1.00 mm ball pitch requires a 6 to 8 layer PCB stack-up with dedicated ground planes under the BGA fanout region. Fan-out all signal, power, and ground balls on the top layer to inner micro-via stackups (8-12 mil laser vias) following the NXP MPC8536E hardware specifications escape routing guidelines. Do not route DDR traces over splits in power or ground planes; use stitching vias liberally around the BGA to provide low-impedance return paths for the high-speed SERDES and DDR interfaces.
Estimated: at full 1.5 GHz core frequency with all peripherals active, junction temperature rises roughly Pdiss x theta_JA above ambient. Using a theta_JA of approximately 8 C/W for an 8-layer 2oz-copper board with airflow, sustained power of 6 W yields about 48 C rise above ambient. A bottom-side thermal pad / heat spreader is required for closed-enclosure designs; place NTC sense pins on the die and to a board reference per NXP thermal management application note.
Do not underestimate power sequencing: the 1.1 V core supply must ramp in coordination with the I/O and PLL supplies listed in the datasheet; out-of-sequence ramp can latch-up. Use a multi-rail power manager and follow the NXP startup sequencing diagram. Do not omit the DDR reference voltage (Vtt) - DDR2/DDR3 termination without proper VTT causes signal-integrity failures. Ensure SERDES reference clocks are within the jitter spec listed in the hardware specifications; do not reuse a generic clock oscillator for multiple SERDES lanes.
Estimated: route DDR2/DDR3 address/command/control lines on inner stripline layers with characteristic impedance matched to 50 ohms single-ended and 100 ohms differential where applicable. Keep each byte lane length-matched within the tolerance window listed in the NXP DDR design guide (typically +/- 25 mil for address/command and tighter for byte lanes). Place 0402-size 100 nF decoupling capacitors within 100 mil of each VDD/VSS ball pair on the bottom side; bulk 10 uF ceramic per voltage rail adjacent to the BGA.
규정 준수 정보
RoHS and REACH compliance per NXP/MPC8536E family environmental documentation. Not AEC-Q100 qualified (automotive applications should evaluate QorIQ / Layerscape families instead). Lead-free FCBGA package compatible with lead-free reflow profiles.