MPC8572ECLPXATLE - Dual-Core 1.2GHz PowerQUICC III SoC | NXP
부품 번호: MPC8572ECLPXATLE ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1450 | $1,450.00 |
| 10 | $1395 | $13,950.00 |
| 100 | $1295 | $129,500.00 |
| 250 | $1240 | $310,000.00 |
| 500 | $1185 | $592,500.00 |
MPC8572ECLPXATLE 개요
A SoC (System-on-Chip) is an integrated circuit that consolidates a microprocessor, memory controllers, peripherals, and hardware accelerators onto a single die. The PowerQUICC III architecture belongs to NXP's (formerly Freescale) Power Architecture communications processor lineage, specifically targeting multi-core networking and telecom infrastructure. The MPC8572E variant introduces dual-core symmetric multiprocessing for parallel packet processing workloads, distinguishing it from single-core PowerQUICC predecessors and positioning it as a bridge device between single-core MPC8568/MPC8569 designs and higher-end QorIQ platforms.
Key specifications include dual e500 cores at 1.2 GHz, 32 KB L1 instruction cache and 32 KB L1 data cache per core, integrated DDR2/DDR3 memory controller with ECC, three PCIe interfaces, dual Gigabit Ethernet MACs, Serial RapidIO fabric, and hardware-accelerated SEC for IPSec/SSL/TLS. The high-integration approach reduces BOM count in line cards, routers, and wireless base stations while lowering power per Mbps processed.
Typical applications include multi-service routers, enterprise switches, wireless base station controllers, industrial networking gateways, and secure VPN appliances. The dual-core architecture allows parallel handling of control plane and data plane traffic, while the integrated SEC engine offloads encryption without burdening CPU cycles.
When designing with this processor, allocate adequate PCB layers (typically 8-10) to route the 1023-ball FCBGA and DDR2/DDR3 matched-length traces. Use NXP's reference design and U-Boot for board bring-up, and follow the hardware specifications document for power sequencing.
드롭인 대체품: MPC8572ECLPXATLE — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8572ECLPXATLE (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Memory Controller, Silicon Revision.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8572ELPXATLE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8572ECLPXAUAD
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8572ELPXAUAD
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8572ECLPXAULD
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8572ECLVTAULE
✅ 드롭인✓ 재고 있음
$142.5 / 개
데이터시트 보기 →MPC8572ECLPXATLE 최대 정격 & 전기적 특성
| Core Architecture | PowerPC e500 (dual-core) |
| Number of Cores | 2 |
| 데이터 버스 폭 | 32-bit |
| Maximum Core Frequency | 1.2 GHz |
| Package Type | FCBGA |
| 핀 수 | 1023 |
| Package Size | 33 mm x 33 mm |
| Memory Controller | DDR2/DDR3 with ECC |
| L1 Cache (per core) | 32 KB I-cache + 32 KB D-cache |
| PCIe Interfaces | 3 ports |
| Gigabit Ethernet MACs | 2 (10/100/1000 Mbps) |
| Serial RapidIO | Yes (SRIO fabric) |
| Security Accelerator | SEC (IPSec/SSL/TLS) |
| 동작 온도 범위 | -40C to +105C |
| Silicon Revision | 2.2.1 |
MPC8572ECLPXATLE 33 mm x 33 mm 핀 구성 가이드
MPC8572ECLPXATLE(33 mm x 33 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8572ECLPXATLE.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8572ECLPXATLE 적합 용도: 7 애플리케이션s: Multi-Service Routers, Enterprise Network Switches, Wireless Base Station Controllers, Secure VPN Appliances, Industrial Networking Gateways, Server and Storage Controllers, Carrier-Grade Telecom Equipment.
Multi-Service Routers
The MPC8572ECLPXATLE's dual e500 cores at 1.2 GHz process parallel data-plane and control-plane traffic in branch and edge routers, while the integrated SEC engine offloads IPSec and SSL/TLS at line rate. Its three PCIe links and dual Gigabit Ethernet MACs connect to WAN PHYs, crypto co-processors, and switching fabrics without external glue logic. DDR2/DDR3 with ECC delivers error-free memory for long-lived deployments under -40 to +105C ambient, supporting harsh telecom environments.
추천
Enterprise Network Switches
Switch control planes leverage the MPC8572ECLPXATLE's high-throughput DDR2/DDR3 controller with ECC to manage routing tables and switch fabric state at line rate. The Serial RapidIO port connects to backplane switch ASICS at multi-gigabit rates, while PCIe links interface with PHY cards and management coprocessors. Hardware acceleration in the SEC engine secures management plane traffic, enabling enterprise switches with hardware-rooted trust and audit logging.
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Wireless Base Station Controllers
Base station controllers benefit from the MPC8572ECLPXATLE's dual-core e500 multiprocessing for parallel real-time baseband coordination and backhaul packetization. The integrated SEC engine handles backhaul encryption (IPSec/SSL) without burdening CPU cycles, freeing cores for radio resource management. Industrial -40 to +105C temperature grade supports outdoor cabinet deployments at cell tower base stations where ambient temperature extremes are common.
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Secure VPN Appliances
VPN and SSL gateway appliances exploit the MPC8572ECLPXATLE's SEC hardware engine to accelerate DES, 3DES, AES, SHA-1/256, and Public Key algorithms at multi-gigabit rates. Dual e500 cores handle tunnel encapsulation/decapsulation and key management in parallel, while the three PCIe links connect to multichannel crypto cards and 10 GbE uplinks. The 1.2 GHz clock frequency and ECC memory deliver deterministic latency for jitter-sensitive voice-over-VPN traffic.
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Industrial Networking Gateways
Ruggedized industrial gateways in factory and process automation systems use the MPC8572ECLPXATLE for protocol translation between fieldbuses and Ethernet, leveraging its dual Gigabit Ethernet MACs and Serial RapidIO for deterministic industrial communication. The -40C to +105C industrial temperature range and the integrated SEC engine ensure security and reliability in unattended factory floors and substations. DDR2/DDR3 with ECC prevents downtime from soft memory errors over decades of operation.
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Server and Storage Controllers
Storage area network controllers and RAID-on-chip boards use the MPC8572ECLPXATLE's Serial RapidIO fabric for high-bandwidth coupling to RAID ASICs while the integrated SEC engine secures iSCSI and SMB3 traffic at wire speed. The dual e500 cores at 1.2 GHz provide ample compute for file system metadata and RAID parity calculations. PCIe connectivity enables SAS/SATA HBA cards and 10 GbE NICs without additional glue logic, reducing BOM cost in storage enclosures.
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Carrier-Grade Telecom Equipment
Telecom platforms such as DSLAMs and media gateways require the MPC8572ECLPXATLE's NEBS-style reliability, with ECC memory and industrial -40 to +105C operation per NXP's C-grade temperature classification. Multiple PCIe lanes support TDM fabric interfaces and ATM/PoS cards, while the SEC engine provides MACsec and IPsec offload essential for backhaul security. The 1023-ball FCBGA package integrates enough peripherals for blade-server designs without additional bridge chips.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8572ECLPXATLE — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8572ELPXATLE | MPC8572ECLPXAUAD | MPC8572ELPXAUAD | MPC8572ECLPXAULD | MPC8572ECLVTAULE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | FCBGA-1023 (33x33 mm) | FCBGA-1023 (33x33 mm) - same | FCBGA-1023 (33x33 mm) - same | FCBGA-1023 (33x33 mm) - same | FCBGA-1023 (33x33 mm) - same | FCBGA-1023 (33x33 mm) - same |
| Cores | 2 (e500) | 2 (e500) | 2 (e500) | 2 (e500) | 2 (e500) | 2 (e500) |
| Max Core Frequency | 1.2 GHz | lower speed grade | 1.2 GHz (per ordering info) | lower speed grade | 1.2 GHz (per ordering info) | 1.2 GHz (per ordering info) |
| Silicon Revision | 2.2.1 | 2.2.1 | 2.2.1 | 2.2.1 | 2.2.1 | 2.2.1 |
| Security Accelerator (SEC) | Yes | Yes | Yes | Yes | Yes | Yes |
| Lead-Free Termination | SnPb (per Mouser snippet) | SnPb | SnPb | SnPb | SnPb | Pb-free |
주요 차별점
- Dual-core symmetric multiprocessing on PowerQUICC III (vs MPC8568E (single-core predecessor))
- Integrated SEC hardware crypto engine (vs MPC8572 non-E variant)
- DDR2/DDR3 with ECC vs DDR-only controllers (vs PowerQUICC II family predecessors)
- Industrial -40 to +105C temperature grade (vs Standard-grade MPC8572 suffix parts)
설계 노트
The MPC8572ECLPXATLE's high integration and 1023-ball FCBGA package concentrate significant thermal dissipation in a small footprint area. Although exact theta_JA is not published in the snippets retrieved, NXP application notes recommend a multilayer PCB with dedicated thermal via arrays under the package and, for sustained 1.2 GHz dual-core workloads, a heatsink. Estimate: ensure junction temperature stays below 105C industrial ceiling by sizing copper pour or airflow to land within published thermal design guidelines.
Routing a 1023-ball FCBGA with DDR2/DDR3 ECC, triple PCIe, dual GbE, and Serial RapidIO demands 8 to 10 PCB layers with microvia and HDI stack-up. Maintain differential-length matching on PCIe and SRIO pairs, and follow NXP's length-matching requirements on DDR2/DDR3 byte lanes. Place decoupling capacitors immediately adjacent to each power pin group, and keep the DDR2/DDR3 reference plane solid under the memory area.
Sequence core, DDR I/O, and SERDES supplies per NXP's power-up and power-down requirements to avoid latch-up on the FCBGA. Use a multi-rail controller (such as NXP's MC34711 or similar) to enforce required ordering with the appropriate monotonic ramp time. Validate ramp timing against the silicon revision 2.2.1 errata document before layout finalization.
Serial RapidIO and PCIe SERDES lines are highly sensitive to impedance discontinuities and crosstalk; the FCBGA's 33x33 mm BGA pitch requires careful antipad sizing and ground-via stitching near break-out. Use NXP's reference design stack-up and IBIS-AMI models for channel simulation. For DDR2/DDR3, enable ECC and adhere to JEDEC write/read leveling calibration to ensure reliable operation at full speed.
Do not assume all MPC8572E device suffixes carry identical boot sequences and JTAG IDs - the silicon revision 2.2.1 has its own errata. Confirm using the exact part number on the NXP product page and always program system reset configuration words appropriately. Lifecycle is Last Time Buy, so design new platforms around QorIQ replacements (e.g. LS1024A) which require new PCB layout.
규정 준수 정보
Per Mouser listing, the ATLE suffix denotes SnPb (leaded) termination. RoHS compliance detail not contained in provided web data and should be verified from NXP's environmental quality documentation. AEC-Q100 is not applicable (this is an industrial/communications-grade processor).
