MPC857TZQ80B - MPC8xx PowerQUICC 80MHz MPU | NXP | Industrial
부품 번호: MPC857TZQ80B ✗ 단종MPC857TZQ80B 개요
A PowerQUICC MPU is a family of PowerPC-based microprocessors originally designed by Motorola (later Freescale, now NXP) that combine a high-performance CPU core with integrated peripherals such as memory controllers, serial communications controllers, and timers, specifically optimized for embedded networking, industrial control, and telecommunications equipment.
Key features include a single core 32-bit PowerPC architecture, 80 MHz operating frequency, 3.3 V I/O voltage, on-chip instruction and data caches, dual 10/100 Ethernet MAC support via the FCC/FEC, multiple serial communication controllers, and integrated DRAM controller. The part is supplied in a tray packaging format and is specified for industrial temperature grades.
Architecturally, the MPC857T integrates a PowerPC integer unit with separate instruction and data MMUs, a system interface unit that glues external SDRAM, ROM, and peripheral buses together, plus dedicated peripheral channels including SCCs, SMCs, an SPI, and a PCMCIA controller. This integration historically enabled designers to build complete networking routers, bridges, and protocol converters on a single chip with minimal external glue logic.
Typical applications include industrial routers and protocol converters, telecom line cards, embedded control nodes, and legacy PowerQUICC-based designs. Designers typically pair this MPU with synchronous DRAM, Flash memory, and PHY transceivers connected through the on-chip Ethernet MACs.
When designing with this part, ensure the 3.3 V power rail is well decoupled close to the BGA balls and that the JTAG chain is correctly ordered for boundary-scan access during board bring-up. Confirm thermal paths since the 357-BGA package requires a properly designed PCB land pattern and via array for reliability.
This page synthesizes distributor stock data, parametric proximity, drop-in same-package alternatives, and practical thermal/PCB notes that are not collected in the manufacturer datasheet.
드롭인 대체품: MPC857TZQ80B — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC857TZQ80B (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Core Frequency, Series.
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청MPC857TZQ80B 최대 정격 & 전기적 특성
| Processor Type | MPC8xx PowerQUICC, 1 Core, 32-Bit |
| Core Architecture | PowerPC |
| Core Frequency | 80 MHz |
| Supply Voltage (I/O) | 3.3 V |
| Number of Cores | 1 |
| 데이터 버스 폭 | 32-Bit |
| 패키지 / 케이스 | 357-PBGA (25x25 mm) |
| Packaging | Tray |
| Lead Free Status | Contains Lead |
| RoHS 상태 | RoHS (per distributor listing) |
| Series | PowerQUICC, MPC8xx |
| Terminal Form | Ball |
| Number of Terminals | 357 |
| 실장 유형 | Surface Mount |
| Temperature Grade | Other (industrial) |
MPC857TZQ80B 357-pbga (25x25 mm) 핀 구성 가이드
MPC857TZQ80B(357-pbga (25x25 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC857TZQ80B.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC857TZQ80B 적합 용도: 6 애플리케이션s: Industrial Router / Protocol Converter, Telecom Line Card / Access Node, Embedded Industrial Control Node, Legacy PowerQUICC Board Replacement / Field Service, Print Engine / Imaging Controller, Military / Aerospace Embedded Subsystem (legacy).
Industrial Router / Protocol Converter
The MPC857TZQ80B integrates the PowerPC core, dual Ethernet MACs via the FCC, and multiple SCCs - all of which the MPC8xx family was engineered around. In an industrial router, the part terminates Ethernet on the LAN side, converts to RS-232/RS-485 on the field side via SCCs, and runs the routing stack on the 80 MHz core. The on-chip DRAM controller and PCMCIA interface allow direct attachment of compact-flash mass storage for firmware and configuration backup, eliminating an external memory bridge.
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Telecom Line Card / Access Node
Historically, the MPC857T was deployed in telecom line cards where its HDLC controllers (via SCCs) and fast Ethernet MAC handled T1/E1 and IP traffic simultaneously. The 3.3 V I/O and industrial temperature grade let the part sit on the same board as framer ICs and line drivers without level shifting. The 32-bit PowerPC core processes signaling and routing tables at 80 MHz, sufficient for low- to mid-density DSLAM line cards where newer QorIQ parts may be over-spec.
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Embedded Industrial Control Node
In factory-floor controllers the MPC857TZQ80B serves as the master CPU, running a real-time OS and managing serial field-bus interfaces via the SCC/SPI controllers. The 80 MHz PowerPC core handles deterministic loop times well within sub-millisecond windows. The 357-PBGA package provides adequate thermal dissipation when paired with a properly designed PCB ground pad and via array, allowing fanless operation in sealed enclosures.
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Legacy PowerQUICC Board Replacement / Field Service
Service organizations maintaining long-lifecycle MPC8xx-based systems use the MPC857TZQ80B as a form-fit-function replacement when a board-level failure occurs. Because the device shares the same 357-BGA footprint with other MPC857T variants, stocking a single replacement covers a fleet of legacy routers and converters. NXP and Freescale distribution channels support these spare-part purchases even though the part is NRD.
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Print Engine / Imaging Controller
The MPC857TZQ80B's combination of a 32-bit PowerPC core, on-chip peripherals, and PCMCIA controller made it a popular choice for office print engines where it drives the page-description language interpreter, the laser modulator, and the network interface. The 80 MHz clock rate handles 600 dpi rendering without an external accelerator. Modern designs have moved to integrated SoCs, but legacy print engines continue to use this part in service fleets.
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Military / Aerospace Embedded Subsystem (legacy)
Some defense and aerospace programs that originated in the early 2000s standardized on MPC8xx parts including the MPC857T for line-replaceable units requiring proven software baselines. The industrial temperature grade and long-term availability through authorized brokers make it practical for sustainment programs. New defense designs typically select newer NXP QorIQ layerscape processors, but legacy LRUs continue to source this MPN.
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추천 제품 요약
엔지니어링 참조 데이터: MPC857TZQ80B — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC857VR80B | MPC857TVR80B | MPC855TVR80D4 | MPC860DEVR80D4 | MPC850DEZQ50BU |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25) | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same |
| Core Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 50 MHz (-37.5%) |
| Core Architecture | PowerPC, 32-bit, 1 core | PowerPC, 32-bit, 1 core | PowerPC, 32-bit, 1 core | PowerPC, 32-bit, 1 core | PowerPC, 32-bit, 1 core | PowerPC, 32-bit, 1 core |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Peripheral Set | Full MPC857T (FCC, SCCs, PCMCIA) | Same MPC857T peripheral set | Same MPC857T peripheral set | Reduced MPC855T peripheral set | Enhanced MPC860 (HDFC, FCC) | Reduced MPC850 peripheral set |
| Packaging | Tray | Tray | Tape & Reel | Tray | Tray | Tray |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Drop-in pin-compatible across the MPC857T speed grade family (vs MPC857VR80B / MPC857TVR80B)
- Lower peripheral set than the MPC860 family (vs MPC860DEVR80D4)
- Higher core clock than the MPC850 family (vs MPC850DEZQ50BU)
설계 노트
Estimated: at 3.3 V supply and 80 MHz core, the MPC857T draws approximately 0.7-1.0 W typical power in industrial operation. The 357-PBGA package dissipates this via the internal ground balls and PCB copper; an exposed central pad area plus a via array on inner layers is essential for keeping the junction below 125 C. Designers should measure the board with a thermal probe during worst-case bring-up before sealing the enclosure.
Use a 4- or 6-layer PCB with a continuous ground plane directly under the BGA to provide both return-path reference and thermal spreading. BGA fanout should use dog-bone or via-in-pad patterns matched to the 1.27 mm typical ball pitch. Place SDRAM and Flash as close as possible to the SIU bus balls to minimize trace length and avoid impedance discontinuities on the 32-bit data bus.
Because the MPC857TZQ80B is NRD, counterfeit risk from unauthorized brokers is elevated. Always procure through NXP authorized distributors or with a full C-of-C traceable to the original wafer lot. Cross-check the top marking against the NXP product marking convention to detect remarked parts. Avoid parts with lead-bearing ball finish if your assembly line is lead-free reflow only.
규정 준수 정보
Lead-free status listed as 'Contains Lead' in distributor data - ball finish uses lead-bearing solder per NXP legacy product marking. RoHS compliance varies by sub-variant; confirm with order code. AEC-Q100 not applicable - this is an industrial MPU, not an automotive-qualified part.
