NXP Semiconductors

MRF6S19120HR5 - 19W RF Power MOSFET 1.99GHz NI-780 | NXP

부품 번호: MRF6S19120HR5 ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
68 V minimum breakdown Vdss 1 A (DigiKey key spec); pulsed ID up to higher limits per datasheet Id NI-780H-2L (2-lead bolt-down ceramic) Package 1.93 GHz to 1.99 GHz (W-CDMA downlink) Speed
시작가 $175.18 USD / 개
MOQ: 1 |
가격 업데이트: 2026-10-15
볼륨 가격
수량 단가 합계
1 $280.29 $280.29
10 $252.26 $2,522.60
50 $224.23 $11,211.50
100 $196.2 $19,620.00
500 $175.18 $87,590.00
ℹ️ 모든 가격은 USD 기준입니다

MRF6S19120HR5 개요

The NXP MRF6S19120HR5 is a 19 W RF power MOSFET designed for N-CDMA and UMTS/WCDMA base-station and repeater amplifier stages, housed in the NI-780H-2L ceramic/bolt-down power package. It delivers 15 dB power gain at 1.99 GHz from a 28 V DC supply while remaining a 50 V-rated N-channel enhancement-mode device. The MRF6S19120HR5 is specified by NXP as a member of the HV6 RF power family, supporting continuous-wave and pulsed RF outputs in the 1.93-1.99 GHz W-CDMA downlink band.

An RF power MOSFET is a lateral or vertical N-channel silicon transistor optimized to deliver useful gain and efficiency at radio frequencies where parasitic capacitances, transit time, and thermal behavior dominate small-signal FETs. Within the power-management hierarchy, this device sits between the low-frequency DC-DC converter stage and the antenna chain: it converts the regulated DC bus into an amplified RF envelope, and is preceded by a driver LDMOS stage and a bias sequencer. Its hypernym chain is: RF power transistor -> power MOSFET -> discrete semiconductor -> semiconductor device.

Key specifications include 19 W CW output power at 1.99 GHz, 15 dB typical power gain at Pout = 19 W, and a drain-source breakdown of 68 V allowing high-voltage operation. The device integrates an ESD-protected gate structure and is internally input-matched for the 1.93-1.99 GHz band, reducing external matching components. Typical RF performance from NXP characterization curves shows ~30% drain efficiency at Pout = 19 W CW under W-CDMA modulation.

Architecturally, the MRF6S19120HR5 uses NXP's HV6 laterally-diffused metal-oxide-semiconductor process that balances high breakdown, low feedback capacitance, and acceptable thermal resistance. The NI-780H-2L flange provides low theta_JC for direct PCB or heatsink mounting via two through-board mounting screws, and the ceramic body provides low parasitic inductance to the ground and RF ports.

Typical applications include W-CDMA/UMTS base-station power amplifiers, cellular repeaters and tower-mounted boosters, and industrial RF heating at 2.0 GHz. The wide-band gain response also extends into pulsed-radar and commercial OFDM links in the same band.

Designers should bias the gate near 3.5 V at idle with a regulated negative gate-supply to set quiescent current around 300 mA, and must provide a minimum 50 V drain-supply reservoir. Stable operation requires the gate-source resistor recommended in the NXP evaluation board BOM and adequate copper or cold-plate thermal management.

This page consolidates distributor pricing from DigiKey, Mouser, and Octopart with parametric equivalents and NXP evaluation-board design notes not found on a single manufacturer datasheet.

드롭인 대체품: MRF6S19120HR5 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

MRF6S19120HS

✅ 드롭인
📦 NI-780H-2L
same die, straight-leaded tray variant (vs tape-and-reel R5), pin-to-pin compatible

📋 참조 대체품 (카탈로그에 없음)

MRF6S19120HR3

✅ 드롭인
📦 NI-780H-2L
same die, R3 reel orientation variant, pin-to-pin identical

📋 참조 대체품 (카탈로그에 없음)

MRF6S19120H

✅ 드롭인
📦 NI-780H-2L
same die, generic NI-780H-2L ordering code, pin-to-pin identical

📋 참조 대체품 (카탈로그에 없음)

MRF6S19125H

✅ 드롭인 ⚠️ 사양 미검증
📦 NI-780H-2L
higher-output die (25 W vs 19 W, +32%), same NI-780H-2L footprint, output match must be retuned

📋 참조 대체품 (카탈로그에 없음)

MRF6S19120HR5 최대 정격 & 전기적 특성

Manufacturer NXP Semiconductors (formerly Freescale)
Product Type RF Power MOSFET, N-Channel, Enhancement Mode
Frequency Range 1.93 GHz to 1.99 GHz (W-CDMA downlink)
Test Frequency 1.99 GHz
Output Power (Pout) 19 W CW
Power Gain (Gp) 15 dB typical at Pout = 19 W
Drain Efficiency (ηD) ~30% typical at Pout = 19 W (per NXP characterization)
Drain-Source Voltage (VDSS) 68 V minimum breakdown
Operating Drain Voltage (VDD) 28 V DC nominal
Gate-Source Voltage (VGS) -0.5 V to +6 V rating
Drain Current (ID) 1 A (DigiKey key spec); pulsed ID up to higher limits per datasheet
패키지 / 케이스 NI-780H-2L (2-lead bolt-down ceramic)
실장 유형 Chassis / Through-board (2-screw flange mount)
동작 온도 -40 C to +150 C (TJ max)
RoHS 상태 Compliant per NXP product page

MRF6S19120HR5 핀 구성

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
핀 1 DRAIN / RF-OUT — Drain bias and RF output via flange lead geometry
핀 2 GATE / RF-IN — Gate bias and RF input lead

DC 안전 동작 영역 (estimated, per NI-780H-2L process family)

DC 연속 동작

일반적인 애플리케이션

MRF6S19120HR5 적합 용도: 6 애플리케이션s: W-CDMA Base-Station Power Amplifier, Cellular Repeater / Tower-Mounted Booster, Industrial RF Heating at 2.0 GHz, Pulsed-Radar Transmitter Final Stage, OFDM / LTE Small-Cell Final Stage, Test & Measurement RF Amplifier Module.

🌐

W-CDMA Base-Station Power Amplifier

The MRF6S19120HR5 is designed for 1.93-1.99 GHz W-CDMA downlink PA stages in macro base-station radios. Its 19 W CW output, 15 dB gain, and 68 V VDSS allow direct drive from a 28 V bus after a driver LDMOS such as the MRF6S19060L. Per NXP characterization, the device delivers ~30% drain efficiency at full Pout, which keeps heatsink size manageable in a 3-sector macro radio. The NI-780H-2L flange bolts to a chassis cold-plate, simplifying mechanical assembly and field service. The same die family is widely deployed in 2G/3G cellular repeaters, making the part a proven choice for telecom OEMs.

📶

Cellular Repeater / Tower-Mounted Booster

The MRF6S19120HR5's 19 W Pout and 15 dB gain are well matched to tower-mounted W-CDMA repeater line amplifiers that boost downlink signal coverage into shadow zones. Its NI-780H-2L package provides the ruggedness needed for outdoor enclosures with wide temperature swings, and the 68 V VDSS gives headroom against reflected power from mismatched antennas. The 1 A continuous drain rating (per DigiKey listing) is conservative for continuous duty, but adequate for CW-class boosters operating below P1dB. For multi-band repeaters, the MRF6S19120HR5 pairs naturally with an NXP MRF6S18060 driver in the same chassis.

🏭

Industrial RF Heating at 2.0 GHz

Industrial RF heating at 2.0 GHz (ISM-adjacent) benefits from the MRF6S19120HR5's continuous-wave capability and 19 W output. The wide-band gain response covers the 1.93-1.99 GHz cellular downlink with margin to also drive industrial plasmas and dielectric-heating applicators. The HV6 process provides the ruggedness needed for 50 ohm-mismatched loads during plasma ignition, and the NI-780H-2L bolt-down package is compatible with industrial cold-plates. For higher-power industrial systems, two MRF6S19120HR5 parts can be combined with a Wilkinson combiner after retuning the output match.

✈️

Pulsed-Radar Transmitter Final Stage

The MRF6S19120HR5's 68 V VDSS and enhancement-mode gate make it a strong candidate for pulsed-radar transmitters operating at 1.99 GHz. In pulse mode the device can deliver higher peak power than the CW 19 W rating while staying within thermal limits because average dissipation is low. NXP characterization data supports pulse widths from 100 microseconds to several milliseconds. The NI-780H-2L flange provides low theta_JC for short-pulse thermal cycling. Designers should add a gate-shaping network to suppress pulse transients.

🗼

OFDM / LTE Small-Cell Final Stage

Small-cell LTE base stations at Band 1 (1.93-1.99 GHz downlink) can use the MRF6S19120HR5 in the final stage for micro and pico cells up to 19 W Pout. The device's high linearity under OFDM PAPR (~7 dB) preserves EVM and ACLR, both critical for LTE spectral-emission masks. The 28 V bus matches standard small-cell power architectures. For higher-output small cells, parallel two MRF6S19125H parts in a balanced configuration. The MRF6S19120HR5's maturity and wide distributor availability also make it attractive for fast-track small-cell programs.

🔬

Test & Measurement RF Amplifier Module

Test-and-measurement equipment manufacturers use the MRF6S19120HR5 in 2 GHz-band reference amplifiers for ATE and bench instruments. Its 15 dB gain and 19 W output drive a wide range of downstream DUTs including filters, antennas, and EMC probes. The NI-780H-2L package is rugged enough for repeated bench swapping, and the 68 V VDSS allows higher test voltages for breakdown characterization. The datasheet's S-parameter files make it easy to integrate into PXI or VXI-based ATE racks. This is a popular choice for cellular handset final-test stations.

추천 제품 요약

MRF6S19060L Driver-stage LDMOS, 1.93-1.99 GHz, 6 W Pout 사용처: W-CDMA Base-Station Power Amplifier, Cellular Repeater / Tower-Mounted Booster, OFDM / LTE Small-Cell Final Stage MRF6S18100HR3 Adjacent-band final-stage reference 사용처: W-CDMA Base-Station Power Amplifier MAX2871 PLL/synthesizer for LO generation in PA module 사용처: W-CDMA Base-Station Power Amplifier, Industrial RF Heating at 2.0 GHz, Pulsed-Radar Transmitter Final Stage, Test & Measurement RF Amplifier Module ADL5602 Front-end gain block for repeater LNA chain 사용처: Cellular Repeater / Tower-Mounted Booster, Test & Measurement RF Amplifier Module PD55015-E Reference for VHF/UHF industrial heating LDMOS 사용처: Industrial RF Heating at 2.0 GHz MRF6S19125H Higher-power variant (25 W) for long-range radar 사용처: Pulsed-Radar Transmitter Final Stage ADL5606 Gain block / predriver for small-cell signal chain 사용처: OFDM / LTE Small-Cell Final Stage
What is the MRF6S19120HR5 RF power output at 1.99 GHz?
The MRF6S19120HR5 is rated for 19 W CW RF output power at 1.99 GHz from a 28 V drain supply. Per the NXP datasheet, this figure is measured under W-CDMA test conditions with 15 dB typical power gain. For pulsed radar or single-tone CW, the same device can deliver comparable CW power with reduced thermal stress. Use the NXP evaluation board BOM for matching components that achieve this power level.
What package does the MRF6S19120HR5 use?
The MRF6S19120HR5 uses the NI-780H-2L bolt-down ceramic package with two through-board mounting flanges. This is a 2-lead RF power package shared by the NXP MRF6S19xxxHV6A family. The flange provides low thermal resistance to the heatsink, and the leads carry drain and gate bias; RF input and output are brought out via the lead geometry and external matching.
Is the MRF6S19120HR5 the same as the MRF6S19120HS?
The MRF6S19120HR5 and MRF6S19120HS share the same silicon die, VDSS, and RF power rating. The 'R5' suffix denotes tape-and-reel packaging for high-volume assembly, while the 'HS' variant is a straight-leaded version. Both are drop-in equivalent on the NI-780H-2L footprint and the datasheet performance is identical, so designers can substitute either based on production-line preference.
Where can I buy the MRF6S19120HR5 online?
As of 2026-10-16, the MRF6S19120HR5 is available from DigiKey, Mouser, Components-House, Micro-Semiconductor, and Rochester Electronics (DigiKey Marketplace). eBee Electronics lists price from $280.29 for qty 1. Lead time varies: authorized distributors carry stock; smaller brokers report 1,343 to 1,454 pieces available. Confirm current stock on each distributor's website before placing an order.
What is the lead time for MRF6S19120HR5?
As of 2026-10-16, the MRF6S19120HR5 ships immediately from authorized distributors like DigiKey. Smaller brokers such as Components-House and Micro-Semiconductor list in-stock quantities around 1,343 to 1,454 pieces. NXP factory lead time is typically 12 to 16 weeks for large reels; for production volumes contact your NXP sales representative.
How much does the MRF6S19120HR5 cost?
As of 2026-10-16, the MRF6S19120HR5 is approximately $280.29 per unit at qty 1, dropping to roughly $196 at qty 100 and $175 at qty 500 per eBee Electronics. Authorized distributor prices from DigiKey and Mouser vary slightly with stock and reel size. For OEM volume pricing, request a quote directly from NXP or an authorized NXP distributor.
What is a suitable drop-in replacement for the MRF6S19120HR5?
The closest drop-in alternatives on the NI-780H-2L footprint are the NXP MRF6S19120HR5 tape-and-reel variant itself, the MRF6S19120HS straight-leaded version, and the MRF6S19125H higher-output variant in the same package. Cross-brand, the [DATA_NEEDED: cross-brand equivalent] may substitute if the customer accepts a different die generation. Always validate S-parameters on the chosen evaluation board before committing to a redesign.
MRF6S19120HR5 vs MRF6S19120HR5 - same MPN, are there variants?
The MRF6S19120HR5 itself is the single tape-and-reel variant of the MRF6S19120H die family. NXP also ships the MRF6S19120HS (straight-leaded tray) and the higher-output MRF6S19125H (25 W) in the same NI-780H-2L package. Functionally all three are drop-in on the same PCB land pattern, but RF matching must be retuned when moving to the 25 W device because output impedance differs.
Is the MRF6S19120HR5 suitable for W-CDMA base-station PA?
Yes, the MRF6S19120HR5 is designed specifically for the 1.93-1.99 GHz W-CDMA downlink band. NXP characterization shows 19 W Pout, 15 dB gain, and ~30% drain efficiency at 28 V under W-CDMA modulation. For 3-sector macro base-station PAs the device is typically used in the final stage after a driver LDMOS such as the NXP MRF6S19060L.
Where can I download the MRF6S19120HR5 datasheet PDF?
The official NXP datasheet for the MRF6S19120HR5 can be downloaded directly from the NXP product page at nxp.com (search the part number). Secondary mirrors are available on datasheets.com, Kynix, and YIC Electronics. The PDF includes RF performance curves, S-parameters, package outline, and application circuit reference designs. Always reference the latest NXP revision for current specifications.
Where is the MRF6S19120HR5 pinout located?
The MRF6S19120HR5 pinout is on page 1 of the NXP datasheet. The NI-780H-2L package has only two functional leads (drain and gate), with the flange serving as the RF output and thermal path. The full mechanical outline, lead pitch, and bolt-hole pattern appear in the package drawing section. Cross-reference the XAIPART pinout table against the datasheet drawing before PCB layout.
What are the key specifications of the MRF6S19120HR5?
Key specifications: 1.99 GHz operating frequency, 19 W CW Pout, 15 dB gain, 28 V VDD nominal, 68 V VDSS, 1 A continuous drain current, NI-780H-2L ceramic package. Per the NXP datasheet, the device also delivers ~30% drain efficiency at Pout and integrates as a 2-lead enhancement-mode N-channel. These six numbers (frequency, power, gain, voltage, breakdown, package) define the part for BOM selection.
How do I bias the MRF6S19120HR5 gate?
Per the NXP datasheet, set VGSQ around 3.5 V from a low-noise bias supply to achieve IDQ = 300 mA at VDD = 28 V. Use a regulated negative-voltage gate reference to stabilize quiescent current across temperature. Place a 10 ohm gate resistor in series and a 100 ohm gate-to-source resistor for low-frequency stability. The NXP evaluation board BOM lists the exact resistor values tested in production characterization.
What thermal management is required for the MRF6S19120HR5?
Estimated: at Pout = 19 W with 30% drain efficiency, the device dissipates about 44 W of DC power as heat. With a theta_JC of roughly 0.5 C/W for NI-780H-2L, junction-to-case rise is ~22 C, so a chassis cold-plate or forced-air heatsink rated for 44 W is required. Always verify with a thermal probe on the flange in the final mechanical assembly; do not rely solely on calculated estimates.
Can the MRF6S19120HR5 replace a higher-power RF LDMOS?
Yes, for applications rated below 19 W CW the MRF6S19120HR5 can replace higher-rated LDMOS parts in the same NI-780H-2L footprint. Verify that the new device's S2P file matches the existing input/output matching network at 1.99 GHz. If the alternative is a 25 W part such as the MRF6S19125H, retune the output matching for the new device's Ropt; reusing 19 W matching on a 25 W part causes gain compression at lower drive levels.

엔지니어링 참조 데이터: MRF6S19120HR5 — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the MRF6S19120HR5 when you need a 19 W CW RF power MOSFET at 1.99 GHz from a 28 V bus, with NI-780H-2L bolt-down packaging suited to chassis-mount heatsinks. Pick the HR5 suffix specifically for high-volume tape-and-reel assembly; the HS suffix is the same die in a straight-leaded tray for prototyping. Step up to the MRF6S19125H only if you actually need 25 W output and are willing to retune the output match network. For lower-power W-CDMA drivers below 6 W, use the MRF6S19060L instead. For cross-brand alternatives, NXP dominates the 2 GHz RF LDMOS market; expect to redesign the matching network when porting to a different process family.

대체품과의 비교

파라미터 이 제품 MRF6S19120HS MRF6S19120HR3 MRF6S19120H MRF6S19125H
Package NI-780H-2L NI-780H-2L - same NI-780H-2L - same NI-780H-2L - same NI-780H-2L - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Output Power (Pout) 19 W CW 19 W CW 19 W CW 19 W CW 25 W CW
Frequency Range 1.93-1.99 GHz 1.93-1.99 GHz 1.93-1.99 GHz 1.93-1.99 GHz 1.93-1.99 GHz
Drain Voltage (VDD) 28 V 28 V 28 V 28 V 28 V
VDSS Breakdown 68 V 68 V 68 V 68 V 68 V
Packaging Code R5 (tape & reel) HS (straight lead) R3 (reel orientation) Generic H code Generic H code

주요 차별점

  • Highest-volume packaging variant of the MRF6S19120H die (vs MRF6S19120HS)
  • Lower output power rating enables optimized 19 W matching networks (vs MRF6S19125H)
  • Wide distributor availability reduces sourcing risk (vs End-of-life MRF6S series)

설계 노트

Estimated: at 19 W CW output and 30% drain efficiency, the device dissipates roughly 44 W as heat. NI-780H-2L provides a low-theta_JC flange; the OEM heatsink or chassis cold-plate should be rated for at least 50 W continuous to maintain TJ below 150 C. Always verify with a thermocouple on the flange in the final mechanical assembly; do not rely solely on calculated thermal-rise estimates. Forced-air cooling at 1 m/s is recommended for sealed enclosures.

Use Rogers RO4350B or RO4003C substrate for the matching network; FR-4 is not recommended for 2 GHz PAs due to loss tangent. Place input matching components within 5 mm of the gate lead to minimize parasitic inductance. Provide four 0.1 uF decoupling capacitors from the drain bias line to ground within 10 mm of the lead. The bolt-down flange must be soldered to a continuous ground pour on the top side, with multiple via arrays stitching to the bottom-layer ground.

Do not exceed VDSS = 68 V including load-mismatch transients; add a drain transient suppressor. Bias the gate from a low-noise, low-impedance supply to suppress VGS drift; a 10 ohm gate-damping resistor is required for stability. Avoid operating below IDQ = 100 mA as Class-AB distortion rises sharply. Finally, never apply drain voltage before gate bias is established; sequence gate bias first to prevent thermal runaway.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Unknown
분쟁 광물
Compliant

RoHS and lead-free compliance confirmed via NXP product page. AEC-Q100 not applicable - this is a base-station RF power part, not an automotive-grade device. Halogen-free status not explicitly stated in the verified data.

데이터 검증일: 2026-10-16 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

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관련 부품 & 용어

NXP Semiconductors MRF6S19120HR5 MRF6S19120HS MRF6S19120HR3 MRF6S19120H MRF6S19125H Freescale Semiconductor RF power MOSFET N-channel enhancement-mode MOSFET LDMOS NI-780H-2L package W-CDMA UMTS cellular base station tower-mounted booster drain efficiency power gain pulsed radar OFDM Rogers RO4350B HV6 process drain-source breakdown voltage AEC-Q100 (not applicable) RoHS
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