MSC8151SVT1000B - 1GHz SC3850 Single-Core DSP, 783-FCBGA | NXP
부품 번호: MSC8151SVT1000B ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $120.9 | $120.90 |
| 10 | $108.81 | $1,088.10 |
| 100 | $96.72 | $9,672.00 |
| 500 | $84.63 | $42,315.00 |
| 1,000 | $72.54 | $72,540.00 |
MSC8151SVT1000B 개요
What is a Digital Signal Processor (DSP)? A DSP is a specialized microprocessor optimized for high-speed numerical computation on streaming data - typically using Harvard architecture, hardware MAC units, and SIMD extensions. DSPs form a semiconductor category between general-purpose MCUs (focused on control) and ASICs (fixed-function accelerators); they sit alongside microcontrollers and FPGAs in the broader embedded IC hierarchy, and are widely used in baseband processing, voice codecs, and channel aggregation. The MSC8151SVT1000B, as a StarCore SC3850 single-core device, adds a configurable L1/L2 cache hierarchy and rich external memory and serial interfaces for real-time telecom workloads.
Key features include 32 KB L1 instruction cache and 32 KB L1 data cache, a unified 512 KB L2 cache, 576 KB on-chip RAM, and 96 KB on-chip ROM. Communication interfaces include Ethernet, I2C, SPI, TDM, UART, and UTOPIA, enabling direct connection to PHY devices, control peripherals, and legacy telecom TDM backplanes. The single SC3850 core delivers high IPC and SIMD throughput at 1 GHz.
The SC3850 core is a VLIW-style DSP with hardware looping and SIMD ALU support, allowing multiple 16-bit MAC operations per cycle - useful for voice codecs and narrowband channel aggregation. The unified 512 KB L2 cache can be partitioned between instruction and data, allowing the application to tune traffic on a per-channel basis. Ethernet MAC and UTOPIA interfaces offload packet and ATM overhead from the core.
Typical applications include wireless base-station channel cards, voice-over-IP media gateways, narrowband transcoding blades, and industrial signal-processing cards. The combination of 1 GHz StarCore throughput and telecom-class interfaces makes the part well suited to DSP farms where deterministic low latency and protocol density matter more than raw CPU frequency.
When designing with this device, allocate PCB area for the 783-ball FCBGA (29x29 mm) and route high-speed SERDES lanes with controlled impedance. Multi-layer reference designs for the MSC8151/815x platform typically need a 6-8 layer stack-up to maintain DDR/DDR2 SI margins.
This page synthesizes distributor pricing, architectural context, and pin-compatible StarCore-family options that the manufacturer's datasheet alone does not aggregate.
드롭인 대체품: MSC8151SVT1000B — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MSC8152VT1000B
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MSC8154VT1000B
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MSC8156VT1000B
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$162.4 / 개
데이터시트 보기 →MSC8151SVT800B
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MSC8151SAG1000B
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MSC8151SVT1000B 사양
| Core Architecture | StarCore SC3850 (single core) |
| Core Clock Speed | 1 GHz |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| L2 Cache | 512 KB (unified) |
| On-chip RAM | 576 KB |
| Non-volatile Memory (ROM) | 96 KB |
| Interfaces | Ethernet, I2C, SPI, TDM, UART, UTOPIA |
| 패키지 | 783-FCBGA (29x29 mm) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | compliant |
| Packaging Type | Tray |
| Number of Terminals | 783 |
| Package Code | BGA |
MSC8151SVT1000B bga 핀 구성 가이드
MSC8151SVT1000B(bga 패키지)의 핀 구성입니다. 핀 번호, 기능, 연결 다이어그램은 제조사 데이터시트에 정의되어 있습니다. 정확한 풋프린트와 솔더링 지침은 해당 문서를 참조하십시오.
다음에 대한 상세 핀아웃 데이터 없음: MSC8151SVT1000B.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MSC8151SVT1000B 적합 용도: 6 애플리케이션s: Wireless Base-Station Channel Card, VoIP Media Gateway Transcoding, Narrowband Transcoding Blade, Industrial Multi-Channel DSP Card, Telecom Packet Aggregation, Voice-Quality Test Instrumentation.
Wireless Base-Station Channel Card
The MSC8151SVT1000B's SC3850 core delivers 1 GHz of deterministic DSP throughput, which fits LTE/UMTS channel processing where predictable per-packet latency is required. The 32 KB L1 instruction cache plus 32 KB L1 data cache keeps MAC-style loops in fast memory, while the unified 512 KB L2 cache lets base-station firmware stage vocoder and channel state simultaneously. Compared with an MCU-only solution, the SC3850's SIMD MAC units compress more voice channels per MHz of clock, lowering bill-of-materials power on a 19-inch blade. The Ethernet and UTOPIA interfaces attach directly to PHY and ATM backplanes, removing external glue logic from the channel card BOM.
추천
VoIP Media Gateway Transcoding
VoIP media gateways require high-throughput transcoding between G.711, G.729, G.722 and AMR codecs while forwarding RTP streams in real time. The MSC8151SVT1000B's SC3850 SIMD engine runs multiple narrowband vocoders in parallel, with the 576 KB on-chip RAM caching active RTP jitter buffers to avoid DDR round-trips. The Ethernet MAC terminates RTP/UDP traffic directly, while the TDM interface hands calls off to legacy PSTN hardware - an interface mix rarely matched in single-chip MCUs. Compared with a generic ARM Cortex-A core, the SC3850 delivers more channels per watt and deterministic interrupt latency for voice-grade QoS.
추천
Narrowband Transcoding Blade
Carrier-grade transcoding blades for narrowband voice (8 kHz sample rate) push dozens of simultaneous conversions per DSP. The MSC8151SVT1000B's 1 GHz SC3850 core plus SIMD MAC units handle this density with margin, and the 512 KB unified L2 cache amortizes external DDR accesses across many channels. UART and TDM interfaces connect to legacy time-slot switches without external bridge ASICs, which matters in central office hardware where board real estate is limited. Compared with off-the-shelf ARM SoCs, the MSC8151SVT1000B provides more deterministic timing for voice QoS.
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Industrial Multi-Channel DSP Card
Industrial signal-processing cards - vibration analyzers, multi-axis motor controllers, and phased-array instrumentation - benefit from the MSC8151SVT1000B's combination of SIMD compute and telecom interfaces. The 96 KB ROM holds boot code, while 576 KB of on-chip SRAM serves as fast scratch space for streaming analytics. UART/SPI/I2C bring control-plane links to host PLCs and supervisory MCUs. Compared with FPGAs of similar cost, the SC3850 is easier to program in C and provides established compiler toolchains for industrial OEMs.
추천
Telecom Packet Aggregation
The MSC8151SVT1000B's combination of Ethernet MAC and UTOPIA interfaces makes it a good fit for telecom packet aggregation nodes that bridge IP and ATM backplanes. The SC3850 core handles classification, shaping, and deep-packet inspection on the data plane while leaving the 1 GHz budget for housekeeping. The 576 KB on-chip SRAM absorbs micro-bursts, which is important when UTOPIA flows edge up to multi-megabit rates. Compared with general-purpose network processors, the MSC8151SVT1000B trades pure wire-speed for deterministic DSP headroom on the same die.
추천
Voice-Quality Test Instrumentation
Test and measurement platforms for voice-quality (PESQ, POLQA) scoring need deterministic real-time DSP plus clean integration with laboratory test gear. The MSC8151SVT1000B's TDM interface accepts PCM streams directly from instrument front-ends, while UART/SPI bring control links to a host PC. The 512 KB unified L2 cache lets algorithms like PESQ cache reference signals and hypothesis buffers at full clock speed, avoiding DRAM round-trips. Compared with PC-only analysis, the MSC8151SVT1000B enables real-time scoring at line-rate without disturbing the DUT timing.
추천
추천 제품 요약
엔지니어링 참조 데이터: MSC8151SVT1000B — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MSC8152VT1000B | MSC8154VT1000B | MSC8156VT1000B | MSC8151SVT800B | MSC8151SAG1000B | TMS320C6671ACYPA |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Texas Instruments |
| Package | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) | FCBGA-841 (different) |
| Core Architecture | StarCore SC3850 (single core) | StarCore SC3850 (dual core) | StarCore SC3850 (quad core) | StarCore SC3850 (six core) | StarCore SC3850 (single core) | StarCore SC3850 (single core) | TI C66x (single core) |
| Core Clock | 1 GHz | 1 GHz | 1 GHz | 1 GHz | 800 MHz | 1 GHz | up to 1.25 GHz |
| L1 Instruction Cache | 32 KB | 32 KB per core | 32 KB per core | 32 KB per core | 32 KB | 32 KB | 32 KB |
| L1 Data Cache | 32 KB | 32 KB per core | 32 KB per core | 32 KB per core | 32 KB | 32 KB | 32 KB |
| L2 Cache | 512 KB (unified) | 512 KB per core | 512 KB per core | 512 KB per core | 512 KB | 512 KB | 1 MB (shared) |
| Lifecycle | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Single-core 1 GHz SC3850 with 32 KB+32 KB L1 plus 512 KB L2 cache (vs MSC8144ETVT1000B)
- Generous 576 KB on-chip SRAM plus 96 KB on-chip ROM (vs TMS320C6671ACYPA)
- Native telecom interfaces: Ethernet MAC plus UTOPIA (vs TMS320DM8165SCYG)
설계 노트
Estimated: the 783-FCBGA (29x29 mm) at 1.0 mm ball pitch requires a 6 to 8 layer PCB stack-up with continuous reference planes under the BGA. Fan-out routing typically needs micro-via or laser-drilled stacked via technology to break out the inner rows; standard 0.2 mm drilled through-vias cannot capture every ball. Production-floor X-ray inspection is mandatory for first-article verification because the FCBGA joints are hidden under the package.
Estimated: the MSC8151SVT1000B at 1 GHz with a single SC3850 core dissipates approximately 5 to 8 W in typical voice/video workloads, depending on SIMD utilization. Without a heat spreader or top-side heat sink, junction temperatures can rise 30 C above ambient on a 4-layer FR-4 carrier. Reference designs for the MSC815x platform include a copper heat-spreader lid and at least one thermal via array beneath the FCBGA thermal balls.
DDR2 memory interfaces on the MSC8151SVT1000B require length-matched (within 25 mil) address/command/strobe lanes and properly terminated VTT at 0.9 V. Reference designs use fly-by topology for multi-DDR2 ranks rather than T-branch; this matches the MSC8151 hardware reference manual. High-speed SERDES lanes (Ethernet / UTOPIA) need controlled-impedance 100 ohm differential routing with continuous ground reference on adjacent layers.
Estimated: most MSC8151SVT1000B bring-up failures come from incorrect boot-mode configuration (vs. ROM/RAM configuration via pull-ups on the cfg pins) and from missing supply-rail sequencing (1.0 V core before 1.5/1.8 V I/O). Always assert POR for at least 1 ms after the slowest rail settles. JTAG chaining across multi-DSP cards requires unique TAP IDs per device - duplicate IDs lock the scan chain.
규정 준수 정보
RoHS compliance verified per the NXP/Freescale product page header. REACH, halogen-free, and conflict-mineral status were not present in the verified web data and are marked unknown. AEC-Q100 is not applicable - this is a high-performance DSP rather than an automotive-grade component.
