MSC8157ETAG1000A - SC3850 Six-Core DSP 1GHz | NXP Semiconductors
부품 번호: MSC8157ETAG1000A ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $269.5 | $2,695.00 |
| 100 | $252 | $25,200.00 |
| 500 | $238.75 | $119,375.00 |
| 1,000 | $224.5 | $224,500.00 |
MSC8157ETAG1000A 개요
A DSP (digital signal processor) is a specialized microprocessor whose datapath, register file, and instruction set are tuned for numeric-heavy loops typical of baseband, audio, video, and radar processing. Within the processor taxonomy, the MSC8157 sits below application processors and above general-purpose microcontrollers in terms of arithmetic throughput per watt. It belongs to the power-managed multicore DSP sub-category, which uses per-core clock gating, voltage scaling, and hardware accelerators to deliver high MMACS throughput while keeping board-level power dissipation manageable in dense line cards.
Key differentiating features include six SC3850 DSP cores at 1 GHz each, an integrated MAPLE-B (Multi-Accelerator Platform Engine for Baseband) coprocessor for turbo/Viterbi acceleration on LTE and WiMAX paths, dual DDR2/DDR3 memory controllers with ECC, four-lane serial RapidIO, two Gigabit Ethernet MACs (SGMII), and PCI Express Gen 2. The 783-ball FCBGA (29x29 mm) provides the thermal and routing density required for the device's aggregate bandwidth.
Architecturally, the MSC8157ETAG1000A pairs the SC3850 DSP cluster with a shared Level-3 memory subsystem and coherent DMA fabric. Each SC3850 core delivers up to 4000 MMACS at 16-bit fixed point or 2000 MMACS at 32-bit, and the platform targets > 24 GMACS aggregate throughput, sufficient to run a single-sector LTE baseband plus margin for adjacent compute.
Typical applications include LTE and WiMAX baseband processing, 3G/4G channel cards, multi-standard radio network controllers, test and measurement platforms, and military/aerospace signal-intelligence front ends. The -40 to -105 °C operating temperature range supports both controlled-environment base stations and harsher industrial enclosures.
When designing with this device, allocate at least four PCB layers for the FCBGA break-out and provide a continuous thermal copper pour beneath the package to meet the FCBGA's junction-to-ambient thermal envelope. The SC3850 cluster should boot via the integrated boot ROM with an attached NOR/NAND flash and DDR initialized by the DDR controllers, so power-rail sequencing (1.0 V core, 1.5 V DDR, 3.3 V I/O) must follow the manufacturer's power-up order to avoid latch-up.
This page synthesizes distributor pricing, drop-in NXP same-family alternatives, and practical board-level guidance not found in the standalone manufacturer datasheet.
드롭인 대체품: MSC8157ETAG1000A — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MSC8157ETAG1000A (동일 폼 팩터 및 풋프린트) — 차이점: Mounting Type, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MSC8157ESAG1000A
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MSC8157TAG1000A
✅ 드롭인✓ 재고 있음
$178 / 개
데이터시트 보기 →MSC8156ETAG1000A
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MSC8157ETAG1000A 사양
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | StarCore MSC815x |
| Core Architecture | SC3850 (six-core) |
| Number of Cores | 6 |
| Core Clock Frequency | 1 GHz |
| Aggregate Throughput | >24 GMACS (16-bit fixed point) |
| Per-Core MMACS | 4000 MMACS @ 16-bit, 2000 MMACS @ 32-bit |
| Accelerator Engine | MAPLE-B baseband coprocessor (Turbo/Viterbi) |
| Memory Controllers | Dual DDR2/DDR3 with ECC |
| High-Speed I/O | 4x Serial RapidIO, 2x GbE SGMII, PCIe Gen 2 |
| 패키지 | 783-FCBGA (29x29 mm) |
| 실장 유형 | Surface Mount (BGA) |
| 동작 온도 | -40C to +105C |
| Supply Voltages | 1.0 V core, 1.5 V DDR, 3.3 V I/O |
| MSL 레벨 | 4 (per JEDEC J-STD-020 for large FCBGA) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
MSC8157ETAG1000A 783-fcbga (29x29 mm) 핀 구성 가이드
MSC8157ETAG1000A(783-fcbga (29x29 mm) 패키지)의 핀 구성입니다. 핀 번호, 기능, 연결 다이어그램은 제조사 데이터시트에 정의되어 있습니다. 정확한 풋프린트와 솔더링 지침은 해당 문서를 참조하십시오.
다음에 대한 상세 핀아웃 데이터 없음: MSC8157ETAG1000A.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MSC8157ETAG1000A 적합 용도: 6 애플리케이션s: LTE Baseband Channel Card, WiMAX Base Station Line Card, Multi-Standard Radio Network Controller, Test & Measurement DSP Platform, Military / Aerospace Signal Intelligence Front End, Industrial Multi-Channel Audio/Video Processing.
LTE Baseband Channel Card
The MSC8157ETAG1000A fits an LTE channel card because its six SC3850 cores at 1 GHz deliver more than 24 GMACS aggregate, which is sufficient to terminate one LTE sector with margin for PHY, MAC and HARQ feedback. The MAPLE-B Turbo/Viterbi accelerator offloads FEC, freeing cores for FFT, channel estimation and MIMO decoding. Dual DDR2/DDR3 controllers with ECC sustain the memory bandwidth demanded by 20 MHz antenna carriers. Power sequencing of the 1.0 V core, 1.5 V DDR and 3.3 V I/O rails per the reference manual is required to avoid latch-up during boot.
추천
WiMAX Base Station Line Card
The MSC8157ETAG1000A suits a WiMAX line card thanks to the same six-core SC3850 DSP cluster, MAPLE-B Turbo/Viterbi engine and dual GbE SGMII MACs used for backhaul to the radio network controller. The 4-lane Serial RapidIO fabric links adjacent baseband cards for cooperative MIMO while keeping inter-card latency low. The -40 to +105 °C junction envelope matches outdoor/remote-radio-head thermal budgets without derating. Board designers must allocate a thermal copper pour beneath the 783-FCBGA to keep theta-JA within margin at full six-core load.
추천
Multi-Standard Radio Network Controller
The MSC8157ETAG1000A can act as the processing heart of a multi-standard radio network controller, running 3G and 4G PHY stacks concurrently thanks to its high aggregate MMACS budget. The PCIe Gen 2 endpoint lets the DSP cluster pair with a host SoC for control-plane and management tasks while keeping the real-time DSP plane local. Serial RapidIO supports low-latency fabric to neighboring DSP cards. Designers should plan FCBGA break-out on at least four PCB layers plus a continuous thermal copper pad under the package.
추천
Test & Measurement DSP Platform
The MSC8157ETAG1000A fits a test-and-measurement platform where vector signal analysis, arbitrary waveform generation and protocol conformance require dense real-time DSP. The SC3850 cores run custom FFT, channel-emulator and demodulator code, while the GbE SGMII MACs stream sample data to a host PC at line rate. The 783-FCBGA's JTAG and COP debug ports simplify trace and bring-up with the StarCore development tool-chain. The FCBGA's thermal envelope is the main board-level constraint; designers should use a multi-layer PCB with dedicated ground/power planes.
추천
Military / Aerospace Signal Intelligence Front End
The MSC8157ETAG1000A is suited to defense signal-intelligence front-ends thanks to its -40 to +105 °C operating envelope and high aggregate DSP throughput. The SC3850 cluster runs energy-detection, demodulation and direction-finding algorithms in real time, while the MAPLE-B accelerator handles FEC on intercepted streams. The 783-FCBGA package offers the routing density required for compact SWaP-constrained enclosures, but requires controlled-impedance layout and JTAG access for environmental screening. Power-rail sequencing must follow the datasheet to ensure deterministic boot in ruggedized deployments.
추천
Industrial Multi-Channel Audio/Video Processing
The MSC8157ETAG1000A handles industrial multi-channel audio/video processing because each SC3850 core provides enough headroom for FIR/IIR filter banks, beamforming and codec acceleration, while the MAPLE-B engine accelerates convolutional/IFR codec paths. The DDR2/DDR3 controllers sustain the bandwidth needed for synchronized multi-channel capture, and the GbE SGMII MACs stream processed streams to network recorders. The 1.0 V core / 1.5 V DDR / 3.3 V I/O power map simplifies integration with industrial 24 V bus supplies via a 3-stage buck/linear regulator chain. Designers should respect the FCBGA MSL-4 handling window during board assembly.
추천
추천 제품 요약
엔지니어링 참조 데이터: MSC8157ETAG1000A — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MSC8157ESAG1000A | MSC8157TAG1000A | MSC8156ETAG1000A |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29x29) | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same |
| DSP Cores | 6 x SC3850 | 6 x SC3850 | 6 x SC3850 | 4 x SC3850 (-33%) |
| Core Clock | 1 GHz | 1 GHz | 1 GHz | 1 GHz |
| Accelerator | MAPLE-B (Turbo/Viterbi) | MAPLE-B | MAPLE-B | MAPLE-B |
| Memory Controllers | Dual DDR2/DDR3 with ECC | Dual DDR2/DDR3 with ECC | Dual DDR2/DDR3 with ECC | Dual DDR2/DDR3 with ECC |
| Operating Temperature | -40C to +105C | -40C to +105C | 0C to +105C (commercial) | -40C to +105C |
| Lifecycle Status | NRND | NRND | NRND | NRND |
주요 차별점
- Six SC3850 cores versus four on the MSC8156 sibling (vs MSC8156ETAG1000A)
- Identical silicon to MSC8157ESAG1000A with tape-and-reel packing (vs MSC8157ESAG1000A)
- Extended -40 to +105 °C operating temperature (vs MSC8157TAG1000A)
설계 노트
The 783-FCBGA (29x29 mm) footprint requires at least four PCB routing layers plus dedicated ground and power planes to break out the high-density BGA ball field without exceeding manufacturability rules. A continuous thermal copper pour directly beneath the package, stitched to the inner ground plane with a 1.0 mm via array, is required to keep the junction temperature within the -40 to +105 °C envelope at full six-core load. Estimated: assuming a 0.5 oz copper pour and four signal layers, theta-JA is approximately 8-10 C/W. Designers should follow NXP's FCBGA PCB design application note for via-in-pad and microvia rules.
The MSC8157ETAG1000A requires three rails - 1.0 V core, 1.5 V DDR, and 3.3 V I/O - that must power up in the sequence specified in the reference manual to avoid latch-up and bus contention. Use a power management IC with programmable sequencing or a supervisory sequencer; estimate that the core rail can source 6-8 A under peak compute load, so the 1.0 V regulator should be sized for at least 10 A with thermal margin. Add bulk decoupling (e.g., 22 uF polymer) on each rail as close to the FCBGA balls as the breakout allows.
Estimated power dissipation at full six-core SC3850 1 GHz load is in the 8-12 W range, which the 783-FCBGA can dissipate only when paired with a thermal copper pour and adequate airflow. Compute theta-JA = (T_junction_max - T_ambient_max) / P_dissipation; for the 105 °C junction limit at 55 °C ambient, theta-JA must stay below approximately 4-6 C/W. Add a heatsink or forced-air cooling if the board is sealed. Always verify with a thermal probe during bring-up rather than relying on datasheet calculations.
Two recurring mistakes are (1) ignoring the FCBGA MSL-4 floor-life specification and baking the parts for the time specified in JEDEC J-STD-033 before assembly, and (2) failing to initialize DDR2/3 with the correct ZQ calibration sequence, which causes intermittent memory errors under load. Engineers should also confirm that the SerDes reference clock is within ±50 ppm of the device's specification, since a marginal reference clock degrades RapidIO and SGMII link margin. Verify boot mode strap pins before first power-up to avoid an unbootable device.
규정 준수 정보
RoHS and REACH compliance per NXP product declarations. AEC-Q100 not applicable - this is an industrial/telecom DSP, not an automotive-grade part.
