MSC8156ETVT1000B - 6-Core SC3850 DSP 1 GHz 783-FCBGA | NXP
부품 번호: MSC8156ETVT1000B ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245.75 | $24,575.00 |
| 500 | $221 | $110,500.00 |
| 1,000 | $198.4 | $198,400.00 |
MSC8156ETVT1000B 개요
A digital signal processor (DSP) is a specialized microprocessor whose architecture is optimized for numeric-intensive, real-time signal operations such as FIR/FFT convolution, equalization, and codec algorithms. Within the embedded semiconductor hierarchy, DSPs sit alongside microcontrollers and application processors as a distinct category, distinguished by their multiply-accumulate (MAC) units, wide datapaths, deterministic interrupt latency, and zero-overhead looping. The MSC8156 belongs to the high-end multi-core DSP segment used in wireless broadband base stations, transcoders, and radar/sonar front-ends.
Key features include 576 KB on-chip RAM, 96 KB on-chip ROM, an integrated security engine, and a rich peripheral set spanning Ethernet (RGMII), I2C, PCI, Serial RapidIO, and UTOPIA interfaces. The device targets -40C to +105C industrial temperature grade operation and supports advanced power management with clock-gating per subsystem. The 783-ball FCBGA package exposes wide parallel memory buses (DDR2/DDR3 controller) and high-speed serial links (Serial RapidIO) required for line-card backplane connectivity.
Typical applications include 3G/4G LTE baseband processing, software-defined radio (SDR) base stations, voice and video transcoding media gateways, and high-density channel cards in wireless infrastructure. The combination of six SC3850 cores, hardware security, and deterministic I/O makes it well suited for packet-processing line cards.
When designing with this device, allocate dedicated PCB layers for the DDR controller and provide matched-length routing for Serial RapidIO lanes. Thermal management of the FCBGA package requires a heatsink and thermal interface material (TIM) for sustained 1 GHz operation.
드롭인 대체품: MSC8156ETVT1000B — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MSC8156ETVT1000B (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Package, Voltage - Core, Voltage - I/O.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청MSC8156ETVT1000B 사양
| Core Architecture | Six StarCore SC3850 DSP cores |
| Core Frequency | 1 GHz |
| L1 Instruction Cache (per core) | 32 KB |
| L1 Data Cache (per core) | 32 KB |
| L2 Cache (per subsystem) | 512 KB unified |
| On-Chip RAM | 576 KB |
| On-Chip ROM | 96 KB |
| 패키지 | 783-FCBGA (29x29 mm) |
| Interfaces | Ethernet (RGMII), I2C, PCI, Serial RapidIO, UTOPIA |
| Memory Controller | DDR2/DDR3 with ECC |
| 동작 온도 | -40C to +105C (TJ) |
| Security Engine | Integrated hardware security |
| Voltage - I/O | 1.8 V / 2.5 V / 3.3 V |
| Voltage - Core | 1.0 V (typical) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Packaging | Tray |
MSC8156ETVT1000B 783-fcbga (29x29 mm) 핀 구성 가이드
MSC8156ETVT1000B(783-fcbga (29x29 mm) 패키지)의 핀 구성입니다. 핀 번호, 기능, 연결 다이어그램은 제조사 데이터시트에 정의되어 있습니다. 정확한 풋프린트와 솔더링 지침은 해당 문서를 참조하십시오.
다음에 대한 상세 핀아웃 데이터 없음: MSC8156ETVT1000B.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MSC8156ETVT1000B 적합 용도: 7 애플리케이션s: LTE/4G Baseband Processing, Software-Defined Radio (SDR) Baseband, Voice and Video Transcoding Media Gateways, High-Density Channel Cards in Wireless Infrastructure, Radar and Sonar Signal Processing, Industrial Multi-Axis Motor Control, Medical Imaging Front-End DSP.
LTE/4G Baseband Processing
The MSC8156ETVT1000B is engineered for LTE/4G baseband channel cards in wireless base stations, where six StarCore SC3850 cores at 1 GHz deliver the parallel DSP throughput required for uplink/downlink PHY-layer processing. The integrated DDR2/DDR3 controller with ECC streams high-bandwidth baseband samples between memory and the six cores, while the hardware security engine accelerates encryption for backhaul links. Its 1 GHz compute and rich peripheral set (Serial RapidIO, RGMII Ethernet) make it a natural fit for line cards that aggregate multiple LTE sectors and require deterministic, low-jitter DSP latency across all six cores.
추천
Software-Defined Radio (SDR) Baseband
For software-defined radio platforms, the MSC8156ETVT1000B offers six reprogrammable SC3850 cores that can be re-tasked across waveforms (LTE, WiMAX, custom). The 576 KB on-chip RAM and 512 KB-per-subsystem L2 cache enable low-latency sample buffering for wideband FFT/FIR pipelines. Serial RapidIO and UTOPIA interfaces provide high-speed links to RF front-ends and backhaul fabrics, while the -40C to +105C industrial temperature range allows deployment in outdoor base-station enclosures. Designers benefit from deterministic interrupt response, which is critical for time-sensitive protocol stacks.
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Voice and Video Transcoding Media Gateways
The MSC8156ETVT1000B's six SC3850 cores are well suited for multi-channel voice (VoIP) and video transcoding media gateways, where each core can independently process a media stream. The hardware security engine accelerates SRTP/TLS for secure trunking, and the Ethernet RGMII interface aggregates packet traffic at line rate. Designers can load codec firmware into the 96 KB on-chip ROM for fast boot, while the 576 KB RAM buffers transcoded streams. Compared with general-purpose CPUs, the DSP delivers higher channel density per watt for transcoding farms.
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High-Density Channel Cards in Wireless Infrastructure
In high-density channel cards, the MSC8156ETVT1000B provides six compute cores in a single 783-FCBGA package, maximizing channel density per PCB area. Its PCI interface allows pairing with host processors for control-plane tasks, while Serial RapidIO enables chip-to-chip interconnect across the line card backplane. The integrated security engine accelerates key exchange and authentication for encrypted traffic. The 783-ball FCBGA exposes wide parallel buses, so designers must allocate dedicated PCB layers for DDR routing and matched-length Serial RapidIO lanes.
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Radar and Sonar Signal Processing
Although primarily marketed for wireless infrastructure, the MSC8156ETVT1000B's deterministic DSP architecture makes it a candidate for radar and sonar front-end processing. Six SC3850 cores run matched-filter, beamforming, and FFT algorithms in parallel, while the DDR2/DDR3 controller streams ADC samples into and out of the device. The hardware security engine protects classified payload data. Industrial temperature screening (-40C to +105C) supports deployment in marine and vehicular enclosures, where the device's wide peripheral set simplifies integration with RF front-ends.
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Industrial Multi-Axis Motor Control
Beyond communications, the MSC8156ETVT1000B can drive industrial multi-axis motor control loops, where each SC3850 core independently handles a motor axis (current, velocity, position control). The 1 GHz clock rate supports high PWM frequencies with tight control-loop latency, while the hardware security engine can protect proprietary control firmware. Industrial temperature screening and the 783-FCBGA's robust mechanical characteristics suit harsh factory environments. Compared with general-purpose MCUs, the DSP delivers far higher numeric throughput for sensorless FOC algorithms.
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Medical Imaging Front-End DSP
In medical imaging (ultrasound, CT pre-processing), the MSC8156ETVT1000B's six SC3850 cores accelerate beamforming and image-reconstruction pipelines in real time. The DDR2/DDR3 controller with ECC ensures data integrity for diagnostic images, while the integrated security engine can enforce HIPAA-compliant access controls. The wide peripheral set simplifies connection to ultrasound transducers and image-storage networks. Industrial temperature screening supports mobile imaging carts and bedside equipment that must operate in clinical environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: MSC8156ETVT1000B — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MSC8156ESVT1000B | MSC8156ETVT1200B | MSC8156ETVT800B | MSC8154ETVT1000B | MSC8144ETVT1000B |
|---|---|---|---|---|---|---|
| Package | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Number of Cores | 6 SC3850 | 6 SC3850 | 6 SC3850 | 6 SC3850 | 4 SC3850 | 4 SC3400 |
| Core Frequency | 1 GHz | 1 GHz | 1.2 GHz | 800 MHz | 1 GHz | 1 GHz |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 | DDR2/DDR3 |
| Serial RapidIO | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +105C (TJ) | -40C to +105C (TJ) extended screen | -40C to +105C (TJ) | -40C to +105C (TJ) | -40C to +105C (TJ) | -40C to +105C (TJ) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Six SC3850 cores vs 4 cores in the MSC8154 sibling (vs MSC8154ETVT1000B)
- Newer SC3850 DSP core vs older SC3400 in MSC8144 (vs MSC8144ETVT1000B)
- 1.2 GHz speed grade available with same package (vs MSC8156ETVT1200B)
- Integrated hardware security engine (vs MSC8144ETVT1000B)
설계 노트
The MSC8156ETVT1000B in a 783-FCBGA package dissipates significant power at 1 GHz across six cores. Attach a heatsink with thermal interface material (TIM); do not rely on PCB copper alone. Estimate: full-load six-core operation typically requires a heatsink with theta_SA under 1 C/W to keep TJ below 105C. Use multiple thermal vias under the die area to spread heat into inner PCB copper planes.
Route the DDR2/DDR3 controller to a dedicated layer stack with matched-length traces, 50 ohm controlled impedance, and proper termination. The Serial RapidIO lanes require 100 ohm differential routing with intra-pair skew under 5 ps. Estimated: total trace mismatch budget for one RapidIO lane is approximately 0.5 mm over 100 mm length. Use length-tuning meanders near the BGA break-out region.
The MSC8156ETVT1000B uses multiple supply rails (1.0 V core, 1.8 V/2.5 V/3.3 V I/O) that must ramp in a specific sequence per NXP datasheet. Use a multi-rail PMIC with programmable ramp rates; failure to sequence rails can latch-up the device. Place bulk decoupling (10 uF ceramic + 100 uF tantalum) within 25 mm of each BGA power pin pair, and add 0.1 uF + 1 nF high-frequency decoupling as close as possible to each pin.
Place the 783-FCBGA on a high-density interconnect (HDI) PCB with micro-via-in-pad (VIP) for the inner-row balls. Fan-out the outer rows to break-out traces on the top layer; route inner rows through stacked micro-vias to inner layers. Estimated: this requires at least 6 PCB layers for a clean break-out. Avoid routing signal traces under the BGA shadow.
Do not assume the MSC8156 family is hot-swappable; ensure all supplies are off before board insertion. The device's hardware security engine requires firmware initialization - skipping it disables cryptographic accelerators and may flag boot ROM warnings. Always connect unused inputs to defined logic levels (not floating) to avoid shoot-through currents.
규정 준수 정보
RoHS compliance per DigiKey listing. Reach, halogen-free status not explicitly stated in the verified data - flagged as 'unknown'. AEC-Q100 not applicable (industrial-grade DSP, not automotive).
