P1022NSE2MHB - QorIQ P1 Dual-Core 1.2GHz SoC | NXP | 689-TEPBGA
부품 번호: P1022NSE2MHB ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $64.95 | $6,495.00 |
| 250 | $60.4 | $15,100.00 |
| 500 | $56.1 | $28,050.00 |
P1022NSE2MHB 개요
A microprocessor (MPU) is a single-chip CPU that integrates core processing units, memory controllers, and peripheral interfaces into one device, forming the central compute element of an embedded system. Within the broader taxonomy, the P1022 belongs to communications processors (a sub-category of microprocessors), which sit between general-purpose application processors and DSP-heavy media processors, and falls under NXP's QorIQ P1 series of Power Architecture SoCs.
Key features include dual 32-bit e500v2 cores with integrated SEC (security engine), hardware ECC support for DDR2/DDR3 memory, a triple-speed Ethernet MAC (GbE), PCIe, USB, and an LCD controller. The device targets low-power embedded applications with operating temperature support from 0C to 105C and a TEPBGA II package that provides excellent thermal dissipation via an exposed die pad.
The architecture is built on a 45 nm CMOS process, with the e500v2 cores featuring dual-issue pipelines, hardware MMU, and a coherent SMP fabric. Integrated peripherals are routed through NXP's Coherent Fabric interconnect, enabling deterministic low-latency DMA between Ethernet, PCIe, and memory subsystems - critical for line-rate packet processing.
Typical applications include industrial networking routers and switches, smart-grid substation gateways, factory automation controllers, single-board computers for edge computing, and embedded media processing nodes. The integrated SEC engine and GbE switch fabric make it suitable for secure VPN terminators and protocol-converters in industrial environments.
When designing with this part, engineers must respect the 689-ball BGA routing complexity, providing at least 6 PCB layers with controlled impedance for DDR3 traces and length-matched Ethernet pairs. The exposed die pad requires thermal vias to inner copper planes for proper heat extraction under sustained load. Firmware should enable SEC early in boot for secure boot chain verification.
This page synthesizes distributor pricing, NXP cross-reference data, and practical board-design notes not found in the manufacturer datasheet alone, enabling rapid sourcing and design-in decisions.
드롭인 대체품: P1022NSE2MHB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: P1022NSE2MHB (동일 폼 팩터 및 풋프린트) — 차이점: LCD Controller, Operating Temperature, Package, USB, Core Architecture.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
P1022NSN2MHB
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$64.2 / 개
데이터시트 보기 →P1013NSE2MHB
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$98.75 / 개
데이터시트 보기 →P1020NSE2MHB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
P2020NSE2MHB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
P1024NSE2MHB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
P1022NSE2MHB 최대 정격 & 전기적 특성
| Processor Type | PowerPC e500v2 |
| Core Count | 2 |
| Core Architecture | 32-bit Power Architecture |
| Core Frequency (max) | 1.055 GHz (Rev 2; listed as 1.2 GHz grade) |
| Series | QorIQ P1 |
| 패키지 | 689-TEPBGA II (31x31 mm) with exposed pad |
| Lead Free Status | Lead Free |
| RoHS 상태 | RoHS Compliant |
| 동작 온도 | 0 C to 105 C (TA) |
| Packaging | Tray |
| Integrated Security Engine (SEC) | Yes |
| Ethernet | GbE (Triple-Speed 10/100/1000 MAC) |
| PCIe Interfaces | Yes |
| USB | Yes |
| Memory Controller | DDR2 / DDR3 with ECC |
| LCD Controller | Yes |
| 실장 유형 | Surface Mount (BGA) |
P1022NSE2MHB 689-tepbga ii (31x31 mm) with exposed pad 핀 구성 가이드
P1022NSE2MHB(689-tepbga ii (31x31 mm) with exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: P1022NSE2MHB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
P1022NSE2MHB 적합 용도: 6 애플리케이션s: Industrial Networking Routers and Gateways, Smart-Grid Substation Communications, Factory Automation Controllers, Edge Computing Single-Board Computers, Embedded Media Processing Nodes, Secure VPN and Firewall Appliances.
Industrial Networking Routers and Gateways
The P1022NSE2MHB is purpose-built for industrial networking routers and gateways, where its triple-speed GbE MACs, PCIe expansion lanes, and SEC-accelerated IPsec deliver line-rate throughput for VPN tunnels and firewall filtering. With 1.055 GHz dual e500v2 cores it can sustain concurrent WAN-edge routing, deep-packet inspection, and IPSec encryption at gigabit rates without CPU saturation. The 689-TEPBGA II exposed-pad package supports sustained 5-8W operation in sealed enclosures, while the 0C-105C range tolerates outdoor cabinet environments. Companion MPNs include the T2080 for higher-throughput aggregation routers and the LS1028A for ARM-based next-gen designs.
추천
Smart-Grid Substation Communications
The P1022NSE2MHB powers IEC 61850 substation routers and protocol gateways, where deterministic low-latency Ethernet and hardware cryptographic acceleration are mandatory. The SEC engine handles IEEE 1613 authentication and MACsec key management at line rate, while the dual e500v2 cores run concurrent GOOSE message handling and SCADA protocol conversion. Hardware ECC on the DDR3 controller mitigates single-event upsets in high-EMI substation environments. The industrial 0C-105C operating range eliminates the need for active cooling in equipment rooms. Companion parts include the P1024NSE2MHB for higher-margin data concentrators.
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Factory Automation Controllers
The P1022NSE2MHB serves as the central compute platform for factory automation controllers, where deterministic real-time response and fieldbus integration are critical. Dual e500v2 cores enable one core to run the Linux-based PLC runtime while the second handles real-time EtherCAT or PROFINET master stacks. The integrated PCIe lanes attach to industrial Ethernet PHYs (EtherCAT, EtherNet/IP) and the USB port supports HMI panel touchscreens. Hardware SEC secures machine-to-cloud telemetry streams, and the 689-TEPBGA II exposed pad simplifies heatsink attachment in IP65 enclosures. Companion MPNs include the P1013NSE2MHB for cost-optimized single-core controllers.
추천
Edge Computing Single-Board Computers
The P1022NSE2MHB powers edge-computing SBCs that aggregate sensor data, run lightweight AI inference, and forward results to cloud backends. Dual 1.055 GHz e500v2 cores provide sufficient throughput for edge filtering, while the LCD controller enables local HMI display integration. DDR3 with ECC ensures data integrity for industrial sensor logs, and the SEC engine secures TLS links to cloud platforms. The compact 689-TEPBGA II package fits standard 100x100 mm SBC form factors. Companion MPNs include the LS1021A for ARM-based edge SBCs with broader Linux support.
추천
Embedded Media Processing Nodes
The P1022NSE2MHB suits embedded media processing nodes such as digital signage players, video surveillance encoders, and HMI controllers, where its LCD controller, USB host ports, and PCIe link to media accelerators deliver balanced I/O. The hardware SEC secures streaming content with DRM and TLS, while the dual e500v2 cores run Linux media frameworks (GStreamer) alongside system management. The exposed-pad TEPBGA II package enables passive heatsink attachment for fanless designs. Companion MPNs include the T1024NSE7MQA for higher-end media gateways.
추천
Secure VPN and Firewall Appliances
The P1022NSE2MHB powers secure VPN concentrators and branch-office firewall appliances, leveraging its hardware SEC engine to accelerate AES-256-GCM and RSA-2048 at multi-gigabit rates. Dual e500v2 cores partition workloads cleanly: one handles the IPsec data plane, the other runs the firewall policy engine and management plane. The triple GbE MACs map directly to WAN, LAN, and DMEM segments without external switch ICs, reducing BOM cost. Hardware ECC on DDR3 prevents silent data corruption in long-lived VPN tunnels. Companion MPNs include the P1022NSN2MHB for higher-speed grade variants.
추천
추천 제품 요약
엔지니어링 참조 데이터: P1022NSE2MHB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | P1022NSN2MHB | P1013NSE2MHB | P1020NSE2MHB | P2020NSE2MHB | P1024NSE2MHB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31) | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same |
| Core Architecture | PowerPC e500v2 dual-core | PowerPC e500v2 dual-core | PowerPC e500v2 single-core | PowerPC e500v2 dual-core | PowerPC e500v2 dual-core | PowerPC e500v2 dual-core |
| Core Frequency (max) | 1.055 GHz | 1.0 GHz (NS grade) | 1.0 GHz | 1.0 GHz | 1.2 GHz | 1.2 GHz |
| Core Count | 2 | 2 | 1 | 2 | 2 | 2 |
| Integrated SEC Engine | Yes | Yes | Yes | No | Yes | Yes |
| DDR Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Operating Temperature | 0 C to 105 C | 0 C to 105 C | 0 C to 105 C | 0 C to 105 C | 0 C to 105 C | 0 C to 105 C |
주요 차별점
- Dual-core SMP e500v2 in a single 689-TEPBGA II package (vs P1013NSE2MHB)
- Integrated SEC engine for hardware-accelerated cryptography (vs P1020NSE2MHB)
- 1.055 GHz Rev 2 silicon with mature QorIQ P1 firmware (vs P2020NSE2MHB)
설계 노트
The 689-ball TEPBGA II package at 31x31 mm requires at least a 6-layer PCB stack-up with 0.5 oz copper on outer layers and 1 oz on inner power planes. Microvia or via-in-pad technology is recommended for the inner signal rings beneath the BGA, and the central exposed die pad must be soldered to a thermal pad that connects to inner copper planes through a thermal via array (typically 0.3 mm pitch, 0.5 mm drill). Controlled-impedance routing is mandatory for DDR3, PCIe, and Ethernet pairs - target 100 ohm differential for PCIe and 50 ohm single-ended for Ethernet.
Estimated: at typical SoC activity (~60% utilization) on a 4-layer PCB with the exposed die pad soldered to a 1 sq-inch thermal copper plane, junction temperature rise above ambient is approximately 25-35 C. For full-load dual-core operation (~8-10W dissipation), attach a passive aluminum heatsink (10x10 mm minimum) with thermal interface material rated for 105 C operation. Always characterize Theta-JA in your specific enclosure; the 689-TEPBGA II exposed pad dramatically reduces thermal resistance compared to a non-exposed BGA.
Do not assume signal integrity without measuring: the 1.055 GHz e500v2 cores and DDR3 controller produce substantial simultaneous switching noise on the power rails. Decouple the core and DDR rails with a combination of 0402 100 nF MLCCs placed within 2 mm of each BGA ball, plus bulk 22 uF ceramic capacitors on the power plane entry points. Sequencing matters: the P1022 requires core voltage (Vdd) before DDR I/O voltage; consult the datasheet power-sequencing diagram before bringing up the board.
규정 준수 정보
Lead Free and RoHS Compliant per NXP product page. AEC-Q100 is not applicable as this is a microprocessor SoC, not an automotive-grade part; for AEC-Q100 automotive networking, evaluate NXP's S32G or MPC56xx families.
