P1022NSN2MHB - QorIQ P1 Dual-Core SoC, 1.055GHz | NXP
MPN: P1022NSN2MHB ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $82.4 | $824.00 |
| 100 | $74.95 | $7,495.00 |
| 250 | $69.5 | $17,375.00 |
| 500 | $64.2 | $32,100.00 |
P1022NSN2MHB Overview
A QorIQ SoC belongs to the power-architecture communications processor family - an integrated multiprocessor IC that combines CPU cores, memory controllers, and networking/connectivity peripherals on a single die. Within the broader taxonomy, QorIQ P1 sits beneath the QorIQ P-series (communications), below the QorIQ platform tier, and ultimately under the Power Architecture / embedded microprocessor category. The P1 tier targets cost- and power-sensitive networking and industrial applications where a single-chip SoC replaces a CPU plus external chipset.
Key features of the P1022NSN2MHB include dual 1.055 GHz e500v2 cores with integrated FPU/LSU per core, 32 KB I-cache and 32 KB D-cache per core, a DDR2/DDR3 SDRAM controller with ECC support up to 800 MT/s data rate, three 10/100/1000 Mbps enhanced Gigabit Ethernet controllers (eTSECs), two PCIe interfaces (PCIe x4 + PCIe x1 or x4 + x4 configuration), one USB 2.0 controller with ULPI interface, integrated LCD controller supporting up to 1280 x 1024 resolution, SATA 2.0 interface, SD/MMC host controller, two I2C controllers, four UARTs, enhanced SPI, and a security engine supporting DES/3DES, AES, RSA, and ARC4. Power management is provided through a sophisticated voltage and frequency scaling infrastructure. The operating temperature range spans -40C to +125C, indicating the part targets industrial and extended-temperature applications.
Technically, the P1022 implements a hierarchical interconnect with separate CoreNet platform and peripheral bus, enabling concurrent high-bandwidth data movement between cores, memory, and networking engines. This architecture minimizes contention when simultaneously running packet processing, control-plane tasks, and media workloads. ECC on the DDR controller protects against single-bit memory errors critical for network and storage reliability, while the integrated LCD controller eliminates the need for an external graphics chip in HMI applications.
Typical applications for this SoC include industrial networking gateways, factory-automation controllers, multi-port Ethernet switches/routers, network-attached storage (NAS) controllers, industrial IoT edge nodes, secure point-of-sale terminals, and embedded HMI panels. The device is also used in smart-grid substation equipment and other long-lifecycle industrial platforms where its -40C to +125C range is mandatory.
Designers should budget power carefully: at 1.055 GHz the device draws several watts, and a multilayer PCB with continuous ground planes plus thermal vias under the exposed pad is required. The TEPBGA II package has a large ball count (689), so 4-6 layer PCB with 0.8 mm or finer pitch fanout, microvia-in-pad, and controlled-impedance routing for DDR/PCIe/SerDes traces is mandatory for signal integrity.
This page synthesizes NXP part documentation, distributor pricing, and same-family drop-in alternatives - not all of which are aggregated on a single distributor product page.
Drop-in alternatives for P1022NSN2MHB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with P1022NSN2MHB (same form factor and footprint) — differing in Core Architecture, LCD Controller, Operating Temperature, Package, USB.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
P1022NSE2LFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1022NXN2MHB
✅ Drop-In📋 Reference alternative (not in catalog)
P1013NSN2MHB
✅ Drop-In📋 Reference alternative (not in catalog)
P1014NSN2MHB
✅ Drop-In📋 Reference alternative (not in catalog)
P1020NSN2MHB
✅ Drop-In📋 Reference alternative (not in catalog)
P1010NSN2MHB
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
P1022NSN2MHB Maximum Ratings & Electrical Characteristics
| Processor Family | QorIQ P1 (P1022 series) |
| Core Architecture | Power Architecture e500v2, dual-core 32-bit |
| Core Frequency | 1.055 GHz |
| L1 Cache (per core) | 32 KB instruction + 32 KB data |
| DDR Controller | DDR2/DDR3 with ECC, up to 800 MT/s |
| Gigabit Ethernet | 3 x 10/100/1000 Mbps eTSEC |
| PCIe | 2 x PCIe (x4 + x1 or x4 + x4) |
| USB | USB 2.0 with ULPI |
| SATA | SATA 2.0 (1 port) |
| LCD Controller | Yes, up to 1280 x 1024 |
| Security Engine | DES/3DES, AES, RSA, ARC4 |
| Operating Temperature | -40C to +125C |
| Package | 689-TEPBGA II (31 x 31 mm) |
| Pitch | 1.0 mm ball pitch (typical for 689-TEPBGA II) |
| Mounting Type | Surface Mount (BGA) |
| Packaging | Tray |
| RoHS Status | RoHS Compliant |
| Lead Status | Lead Free |
P1022NSN2MHB 689-tepbga ii (31 x 31 mm) Pin Configuration Guide
Pin configuration for P1022NSN2MHB (689-tepbga ii (31 x 31 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for P1022NSN2MHB.
Refer to the datasheet for full pin configuration.
Typical Applications
P1022NSN2MHB is suitable for 6 applications: Industrial Ethernet Gateways, Network-Attached Storage (NAS) Controllers, Industrial IoT Edge Gateways, Multi-Port Routers and Switches, Secure Point-of-Sale (POS) Terminals, Human-Machine Interface (HMI) Panels.
Industrial Ethernet Gateways
The P1022NSN2MHB fits industrial Ethernet gateways because its three integrated 10/100/1000 eTSECs enable multi-port router or gateway designs without an external switch. The dual e500v2 cores run a real-time control-plane OS alongside packet processing. The DDR2/DDR3 controller with ECC provides reliable memory for industrial protocols, while the -40C to +125C range suits cabinet-mounted equipment in factories. A typical BOM pairs this SoC with a managed PHY, SPI-flash for boot, and DDR3 with ECC.
Recommended
Network-Attached Storage (NAS) Controllers
The P1022NSN2MHB suits NAS controller boards thanks to its SATA 2.0 port for HDD connectivity, GbE for LAN, and PCIe for external SAS/SATA expanders. The dual cores manage file-system tasks plus network protocols. ECC on the DDR controller protects against bit-flips that would corrupt stored data. A NAS reference design pairs this SoC with a SATA multiplexer, GbE PHY, and DDR3 with ECC. Power dissipation in this configuration is typically 5-8 W at full load.
Recommended
Industrial IoT Edge Gateways
The P1022NSN2MHB fits IIoT edge gateways because its dual e500v2 cores handle protocol translation (Modbus, OPC-UA, MQTT) plus local analytics. The integrated LCD controller drives a local HMI display. The PCIe interface accommodates wireless modems or additional industrial buses. Operating from -40C to +125C, the SoC deploys in outdoor enclosures and remote cabinets. Typical designs combine this part with a GbE PHY, sub-GHz wireless module, and ruggedized DDR3 with ECC.
Recommended
Multi-Port Routers and Switches
The P1022NSN2MHB's three GbE eTSECs and two PCIe lanes enable compact multi-port routers and Layer 2/3 switches. The dual cores run routing daemons plus packet forwarding tasks. ECC-protected DDR3 keeps route tables reliable over the part's industrial lifetime. A reference BOM includes a GbE PHY array, DDR3 with ECC, SPI flash, and a multi-rail power tree. Power is typically 6-9 W with all Ethernet ports active and forwarding traffic.
Recommended
Secure Point-of-Sale (POS) Terminals
The P1022NSN2MHB fits secure POS terminals because its integrated security engine (DES/3DES, AES, RSA, ARC4) performs PIN encryption and transaction signing on-chip, without exposing keys to external memory. The dual cores separate UI rendering (via LCD controller) from secure payment processing. The operating temperature range supports outdoor or kitchen environments. Typical designs add a touch controller, mag-stripe reader, and secure key-store EEPROM to the SoC.
Recommended
Human-Machine Interface (HMI) Panels
The P1022NSN2MHB suits industrial HMI panels because the integrated LCD controller drives displays up to 1280 x 1024 without an external graphics chip, lowering BOM cost. The dual cores run the HMI application plus fieldbus communication. The -40C to +125C range supports panel-mount factory installations. A typical design combines this SoC with a TFT display, capacitive-touch controller, 256 MB DDR3 with ECC, and SPI boot flash.
Recommended
Recommended Products Summary
Engineering reference data for P1022NSN2MHB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | P1022NSE2LFB | P1022NXN2MHB | P1013NSN2MHB |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31) | 689-TEPBGA II (31x31) | 689-TEPBGA II (31x31) | 689-TEPBGA II (31x31) |
| Core Architecture | Dual e500v2 (PowerPC) | Dual e500v2 (PowerPC) | Dual e500v2 (PowerPC) | Single e500v2 (PowerPC) |
| Core Frequency | 1.055 GHz | 1.055 GHz | 800 MHz | 1.055 GHz |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Gigabit Ethernet | 3 x eTSEC | 3 x eTSEC | 3 x eTSEC | 3 x eTSEC |
| PCIe Lanes | 2 (x4 + x1 or x4 + x4) | 2 (x4 + x1 or x4 + x4) | 2 (x4 + x1 or x4 + x4) | 2 (x4 + x1 or x4 + x4) |
| DDR Controller | DDR2/DDR3 + ECC, 800 MT/s | DDR2/DDR3 + ECC, 800 MT/s | DDR2/DDR3 + ECC, 800 MT/s | DDR2/DDR3 + ECC, 800 MT/s |
| LCD Controller | Yes (up to 1280 x 1024) | Yes (up to 1280 x 1024) | Yes (up to 1280 x 1024) | Yes (up to 1280 x 1024) |
| Lifecycle Status | Last Time Buy | Active/Last Time Buy | Last Time Buy | Last Time Buy |
Key Differentiators
- Dual-core processing at 1.055 GHz (vs P1013NSN2MHB)
- Higher core frequency tier (vs P1022NXN2MHB)
- Industrial extended temperature range (vs Commercial-temperature P1022 variants)
- Integrated security engine (vs External crypto co-processor designs)
Design Notes
The P1022NSN2MHB's 689-TEPBGA II package has an exposed thermal pad directly under the die. PCB layout MUST include a continuous copper pad beneath the BGA with an array of thermal vias (typically 0.3 mm drill, 0.6 mm pitch, 25-30 vias minimum) tied to internal ground planes. Without adequate thermal paths the junction can exceed +125C under sustained compute load. Estimated: at 1.055 GHz with 100% dual-core load, power dissipation is approximately 7-9 W; thermal resistance is reduced from roughly 15 C/W to 5-7 C/W with proper PCB thermal design.
The 689-ball TEPBGA II at 1.0 mm pitch requires a 4-6 layer PCB with 0.8 mm or smaller via pad design. Use laser-drilled microvias or staggered vias for inner-row BGA fanout. DDR2/DDR3 traces must be routed with matched lengths (within 25 mil) and 50 ohm single-ended impedance. PCIe and SerDes traces require 85 ohm differential impedance. Maintain continuous reference planes under all high-speed signals - no plane splits under DDR or PCIe routes.
The SoC requires multiple supply rails - typically 1.0V core, 1.5V/1.8V DDR, 2.5V I/O, 3.3V auxiliary. Use a multi-phase DC-DC controller for the 1.0V core rail with at least 10 A current capability. Decoupling: place 0402 0.1 uF X7R capacitors immediately adjacent to every four BGA balls plus bulk 22 uF tantalum or polymer capacitors near the SoC. Estimated core current at 1.055 GHz dual-core load: 6-8 A peak; add 30% margin for transient events.
Do not skip DDR3 write leveling or read calibration - failed calibration produces intermittent data corruption that escapes bench validation. The boot ROM expects a specific SPI flash layout; follow NXP reference design or use U-Boot/PBL from NXP SDK. The e500v2 cores require cache-coherent memory mapping for SMP operation - misconfiguration silently breaks coherency. JTAG header (14-pin) is mandatory for bring-up; do not omit from prototype builds.
PCIe and SerDes lines need AC-coupling capacitors (0.1 uF 0402) on each transmit pair near the SoC. Reference NXP's hardware design checklist for PCIe Gen1/Gen2 compliance. GbE signals to external PHYs need 100 ohm differential routing and proper center-tap magnetics. DDR address/command lines should be routed on a single layer with fly-by topology if using multiple DDR chips.
Compliance Information
RoHS compliant per NXP product page. Lead-free packaging confirmed by distributor data (DigiChip). AEC-Q100 not applicable - this is a communications processor, not an automotive-qualified IC. Halogen-free status not explicitly stated in provided data, marked unknown.
