PIC16F18313T-I/RF - 8-bit 32MHz XLP MCU 3.5KB Flash | Microchip
부품 번호: PIC16F18313T-I/RF ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1.38 | $1.38 |
| 10 | $1.24 | $12.40 |
| 100 | $1.09 | $109.00 |
| 500 | $0.92 | $460.00 |
| 1,000 | $0.83 | $830.00 |
| 3,000 | $0.72 | $2,160.00 |
PIC16F18313T-I/RF 개요
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory, working RAM, and a set of peripherals (ADC, timers, communication controllers, GPIO) into one package. Within the broader semiconductor hierarchy, an MCU belongs to the digital IC family and is the standard programmable building block for embedded systems, sitting between fixed-function logic ICs and higher-end microprocessors (MPUs). The 'F' suffix denotes Flash-based program memory, allowing in-circuit re-programming, and the 'XLP' badge indicates power-optimized silicon with sub-uA sleep modes aimed at battery-powered products.
Key differentiating features include the Peripheral Pin Select (PPS) function that remaps digital peripheral I/O to most pins, hardware limit timers, signal measurement timers, a 10-bit ADC with computation, two I2C/SPI/EUSART peripherals, and a low-power brown-out reset (BOR). The device operates from 2.3 V to 5.5 V across the full industrial temperature range. Its active current of roughly 1.3 mA at 4 MHz and idle currents below 1 uA in XLP sleep modes allow multi-year coin-cell lifetimes when duty-cycled. The 8-pin UDFN package exposes the bottom pad for thermal and electrical grounding, helping with EMI and stable ADC readings.
Architecturally, the PIC16F18313 implements the enhanced mid-range 16-bit instruction-word core that delivers approximately 8 MIPS at 32 MHz. The Harvard architecture separates program and data buses, and the instruction pipeline overlaps fetch with execute. Internal core-independent peripherals (CIPs) such as CWG, NCO, DSM, and SMT execute without CPU intervention, freeing the core for higher-level application logic and reducing software complexity.
Typical applications include IoT sensor nodes, remote control transmitters, low-end consumer appliances, battery-powered accessories, LED lighting controllers, and small-form-factor industrial sensor interfaces. Designers choose this part when they need a small footprint MCU with EUSART or I2C connectivity and ultra-low sleep current. As a design tip, ensure the UDFN exposed pad is soldered to a sufficiently large copper pour to meet thermal and mechanical reliability requirements and to provide a clean ground reference for the ADC. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: PIC16F18313T-I/RF — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC16F18313T-I/RF (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Operating Temperature, Core Architecture, I/O Pins.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC16F18313T-E/RFVAO
✅ 드롭인✓ 재고 있음
$0.98 / 개
데이터시트 보기 →PIC16F18313-E/RFVAO
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$0.55 / 개
데이터시트 보기 →PIC16LF18313T-I/RF
✅ 드롭인✓ 재고 있음
$0.68 / 개
데이터시트 보기 →PIC16F18313-I/SNVAO
✅ 드롭인✓ 재고 있음
$0.87 / 개
데이터시트 보기 →PIC16F18313T-I/MS
✅ 드롭인✓ 재고 있음
$0.58 / 개
데이터시트 보기 →PIC16F18313T-I/MF
✅ 드롭인✓ 재고 있음
$0.6 / 개
데이터시트 보기 →PIC16F18313T-I/RF 최대 정격 & 전기적 특성
| Product Type | 8-bit Microcontroller (MCU) |
| Core Architecture | PIC16 enhanced mid-range, 8-bit data bus, 14-bit instruction word |
| Family | PIC PIC XLP 16F |
| Maximum CPU Frequency | 32 MHz |
| Program Memory (Flash) | 3.5 KB (2K x 14) |
| Data SRAM | 256 bytes |
| Data EEPROM | 256 bytes |
| Supply Voltage (VDD) | 2.3 V to 5.5 V |
| 동작 온도 | -40 C to +85 C (Industrial) |
| Active Current | 1.3 mA typical at 4 MHz, 3.0 V |
| 패키지 | 8-UDFN (3x3 mm) Exposed Pad |
| 실장 유형 | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| Peripheral Pin Select (PPS) | Yes |
| ADC | 10-bit, multi-channel |
| Communication | EUSART, I2C, SPI |
| RoHS 상태 | Compliant |
PIC16F18313T-I/RF 핀 구성
| 핀 1 | VDD — Positive supply voltage (2.3 V to 5.5 V) |
| 핀 2 | RA5 — Bidirectional I/O with input change interrupt and ADC input |
| 핀 3 | RA4 — Bidirectional I/O with input change interrupt and ADC input |
| 핀 4 | RA3/MCLR — Input only / Master Clear (reset) input, weak pull-up enabled by configuration |
| 핀 5 | RA2 — Bidirectional I/O with input change interrupt and ADC input |
| 핀 6 | RA1 — Bidirectional I/O with input change interrupt and ADC input |
| 핀 7 | RA0 — Bidirectional I/O with input change interrupt and ADC input |
| 핀 8 | VSS — Ground reference (also exposed pad) |
일반적인 애플리케이션
PIC16F18313T-I/RF 적합 용도: 6 애플리케이션s: IoT Sensor Node, Remote Control Transmitter, Battery-Powered Accessory / Wearable, LED Lighting Controller, Industrial Sensor Interface, Low-End Consumer Appliance.
IoT Sensor Node
The PIC16F18313T-I/RF fits IoT sensor nodes because its XLP sleep current sits in the sub-uA range and its 2.3-5.5 V VDD range accepts a single lithium coin cell directly without an LDO. The on-chip 10-bit ADC and EUSART/SPI/I2C peripherals let the same part interface with sensors and low-power radios (LoRa, Sub-GHz, BLE modules), while the 8-UDFN package keeps the node footprint under 9 mm^2. Estimated: at 0.1% active duty cycle (1 mA active, 1 uA sleep), average current is ~1 uA - a 240 mAh coin cell can run for ~27 years at room temperature, so battery replacement is rarely needed.
추천
Remote Control Transmitter
The PIC16F18313T-I/RF is well matched to handheld remote controls because of its tiny 8-UDFN package, integrated PWM peripherals (CWG, NCO) for IR or Sub-GHz modulation, and XLP sleep modes that keep idle current negligible between button presses. The hardware limit timer (HLT) and signal measurement timer (SMT) autonomously decode simple protocols without waking the core, which simplifies firmware and reduces average power. Designers typically connect the UDFN-8 package directly to a CR2032 coin cell via a low-Iq boost regulator, with a button-press interrupt waking the CPU in microseconds.
추천
Battery-Powered Accessory / Wearable
Wearables and battery accessories benefit from the PIC16F18313T-I/RF's 3x3 mm UDFN package that fits inside a watch band, fitness tracker, or wireless earbud case, plus its sub-uA sleep current that preserves charge between events. The Peripheral Pin Select (PPS) function lets designers remap I2C/SPI/EUSART to most pins, simplifying PCB layout when board space is severely constrained. The 256-byte EEPROM stores user preferences across battery swaps, while the 10-bit ADC reads battery voltage or sensor signals without external components.
추천
LED Lighting Controller
The PIC16F18313T-I/RF controls small LED lighting products via its 10-bit PWM peripheral, on-chip NCO (Numerically Controlled Oscillator) for high-resolution dimming, and CWG (Complementary Waveform Generator) for half-bridge LED driver control. Its small 8-UDFN footprint fits inside an MR16 bulb base or a thin LED strip driver. The XLP technology keeps standby power below the 0.5 W EU Ecodesign standby limit, which is mandatory for connected luminaires sold in 2026 in Europe and several US states.
추천
Industrial Sensor Interface
Industrial sensor interfaces use the PIC16F18313T-I/RF as a low-cost protocol converter that reads a 4-20 mA loop sensor or a digital sensor on I2C/SPI, then retransmits the data on EUSART/RS-485. Its -40C to +85C industrial temperature range, 2.3-5.5 V supply, and robust ESD performance on the UDFN-8 footprint meet factory-floor requirements. The CIPs offload pulse counting and frequency measurement, leaving the CPU free to handle the Modbus framing or local HMI driving, which simplifies firmware and accelerates time to market.
추천
Low-End Consumer Appliance
Low-end consumer appliances such as small kitchen gadgets, toys, and personal-care devices adopt the PIC16F18313T-I/RF for its ultra-low BOM cost, integrated 10-bit ADC for sensing temperature or humidity, PWM for motor or buzzer control, and 3x3 mm UDFN that fits even the smallest enclosures. The XLP sleep current keeps standby power below 0.1 W, which simplifies compliance with international standby regulations. Designers use the PPS function to map the EUSART debug interface to the same pins as the application I/O, reducing PCB area.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC16F18313T-I/RF — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC16F18313T-E/RFVAO | PIC16LF18313T-I/RF | PIC16F18313T-I/MS |
|---|---|---|---|---|
| Package | 8-UDFN (3x3 mm) Exposed Pad | 8-UDFN (3x3 mm) Exposed Pad - same | 8-UDFN (3x3 mm) Exposed Pad - same | 8-MSOP (3x3 mm) - different land pattern |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / CPU Speed | 8-bit PIC16 / 32 MHz | 8-bit PIC16 / 32 MHz - same | 8-bit PIC16 / 32 MHz - same | 8-bit PIC16 / 32 MHz - same |
| Flash / SRAM / EEPROM | 3.5 KB / 256 B / 256 B | 3.5 KB / 256 B / 256 B - same | 3.5 KB / 256 B / 256 B - same | 3.5 KB / 256 B / 256 B - same |
| Operating Voltage | 2.3 V to 5.5 V | 2.3 V to 5.5 V - same | 1.8 V to 3.6 V - lower range | 2.3 V to 5.5 V - same |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +125C (Extended) - wider | -40C to +85C (Industrial) - same | -40C to +85C (Industrial) - same |
| Pin Compatible Footprint | Yes (UDFN-8 RF) | Yes - same RF package | Yes - same RF package | No - MSOP-8 vs UDFN-8 |
| XLP Sleep Current | Sub-uA (XLP) | Sub-uA (XLP) - same | Sub-uA (XLP) - same, lower VDD | Sub-uA (XLP) - same |
주요 차별점
- Same die across UDFN-8, DFN-8, MSOP-8 and SOIC-8 packages (vs PIC16F18313T-I/MS)
- Extended-temperature option on the identical UDFN-8 footprint (vs PIC16F18313T-E/RFVAO)
- Lower-voltage variant with the same UDFN-8 footprint (vs PIC16LF18313T-I/RF)
설계 노트
The 8-UDFN (RF) package relies on its bottom exposed pad for mechanical strength, thermal relief, and ground reference. Solder this pad to a contiguous ground copper pour at least as large as the package (3x3 mm minimum, larger preferred). For hand-rework, preheat the board to avoid thermal shock because the exposed pad is the dominant heat path. Without a properly soldered pad, ADC noise rises, oscillator accuracy drifts, and mechanical solder-joint reliability degrades under thermal cycling.
Decouple VDD with a 100 nF X7R ceramic capacitor placed within 2 mm of the VDD pin, plus a bulk 1-10 uF capacitor if the supply is shared with noisy loads. The PIC16F18313T-I/RF brown-out reset (BOR) protects against slow VDD ramps; configure BOR voltage and reset behavior in CONFIG words. For battery-powered designs, route VDD with a star topology to avoid powering the MCU through protection diodes or shunt regulators during deep sleep.
Use Peripheral Pin Select (PPS) to map digital peripherals to any pin, but lock the I2C lines to dedicated pins where possible to keep the firmware readable. Keep the HFINTOSC trace short and away from switching nodes, and place a guard ring around analog inputs (RA0-RA5) connected to a clean analog ground to maximize ADC SNR. The EUSART TX pin benefits from a small series resistor (33-47 ohm) to dampen reflections if the trace exceeds ~30 mm.
Common pitfalls include: (1) forgetting the configuration words for oscillator, watchdog, and code protection - the device ships in an unknown default state; (2) using the RA3/MCLR pin as GPIO without setting the MCLRE config bit, which silently breaks reset; (3) assuming the F device runs at 32 MHz below 3.0 V - it does not; (4) not enabling the weak pull-up on RA3/MCLR when used as a reset button; and (5) using Sleep mode without configuring the wake source in the config words, which causes the part to never wake. Review PIC16F18313 ERRATA and CONFIG word table in the datasheet before locking the layout.
규정 준수 정보
RoHS and lead-free per Microchip product page. Not AEC-Q100 qualified - choose PIC16F18313-E versions for higher temperature grades. Halogen-free status not stated on the web data and is marked 'unknown'.
