PIC16LF18313T-I/RF - 8-bit 32MHz XLP MCU 3.5KB Flash | Microchip
MPN: PIC16LF18313T-I/RF ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.32 | $1.32 |
| 10 | $1.18 | $11.80 |
| 100 | $0.97 | $97.00 |
| 500 | $0.86 | $430.00 |
| 1,000 | $0.78 | $780.00 |
| 3,000 | $0.68 | $2,040.00 |
PIC16LF18313T-I/RF Overview
An 8-bit microcontroller (MCU) is a small, self-sufficient computing device that integrates a CPU, RAM, non-volatile program memory, and peripherals on a single silicon die. The PIC16F architecture uses a Harvard RISC core optimized for deterministic instruction execution, and the LF variant (as opposed to the F variant) extends the supply range down toward 1.8 V for battery-powered designs. Within Microchip's portfolio, the PIC16LF18313 sits between baseline PIC10/12/16 devices and the higher-pin PIC18 family as the entry point for eXtreme Low Power (XLP) general-purpose 8-bit designs.
Key features include 256 bytes of SRAM, 256 bytes of EEPROM, a 10-bit ADC with computation, a 5-bit DAC, comparators, 10-bit PWM, Configurable Logic Cells (CLC), Numerically Controlled Oscillator (NCO), Complementary Waveform Generator (CWG), and Peripheral Pin Select (PPS) for flexible pin mapping. The device supports idle and sleep current down to sub-microampere levels when peripherals are gated off, making it suitable for always-on IoT sensor nodes.
The PIC16LF18313 uses Microchip's enhanced mid-range 8-bit core with a modified Harvard bus, single-cycle instruction execution at 32 MHz (~8 MIPS), and an integrated 32 MHz internal oscillator that removes the need for an external crystal. PPS allows most digital peripherals and analog functions to be reassigned to different I/O pins in firmware, which is unusually flexible for an 8-pin part and helps PCB routing when one physical pin must serve multiple roles.
Typical applications include IoT sensor nodes, battery-powered wearables, remote controls, low-power wireless sensor endpoints, LED lighting controllers, and small home appliances. The combination of XLP sleep current, PPS, and a 3.5 KB Flash budget fits applications that need periodic sensing, a simple RF or wired protocol stack, and multi-year coin-cell battery life.
When designing with this device, pay close attention to the PIC16LF vs PIC16F voltage rating - the LF variant supports operation down to 1.8 V (versus 2.3 V for the F variant), but absolute maximum VDD is 3.6 V. The UDFN package has an exposed thermal pad that must be soldered to the ground plane for thermal and electrical performance.
This page synthesizes distributor pricing, drop-in same-package alternatives from the PIC16LF18313/18323 family, and practical low-power design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for PIC16LF18313T-I/RF — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16LF18313T-I/RF (same form factor and footprint) — differing in ADC, Package, Operating Temperature, Core Architecture, Program Memory (Flash).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16LF18313-I/RF
✅ Drop-In✓ In Stock
$0.66 / Unit
View Datasheet →PIC16LF18313-E/RF
✅ Drop-In✓ In Stock
$0.7 / Unit
View Datasheet →PIC16F18313T-I/RF
✅ Drop-In✓ In Stock
$0.72 / Unit
View Datasheet →PIC16F18313T-I/SN
✅ Drop-In✓ In Stock
$0.74 / Unit
View Datasheet →PIC16LF1829T-I/GZ
✅ Drop-In✓ In Stock
$1.28 / Unit
View Datasheet →PIC16LF18313T-I/RF Maximum Ratings & Electrical Characteristics
| Product Family | PIC16F (8-bit) - PIC16LF18313 device |
| Core Architecture | Enhanced Mid-Range 8-bit Harvard RISC |
| CPU Frequency | 32 MHz (up to 8 MIPS) |
| Program Memory (Flash) | 3.5 KB (2K x 14 words) |
| Data SRAM | 256 bytes |
| Data EEPROM | 256 bytes |
| Supply Voltage (VDD) | 1.8 V to 3.6 V (LF variant) |
| Package | 8-UDFN (3x3 mm) with exposed pad |
| Pin Count | 8 |
| ADC | 10-bit ADC with computation (10-bit) |
| DAC | 5-bit DAC |
| PWM Channels | 10-bit PWM |
| Comparators | Yes |
| Peripheral Pin Select (PPS) | Yes |
| CLC / NCO / CWG | Configurable Logic Cell, NCO, Complementary Waveform Generator |
| Operating Temperature | -40C to +85C (industrial, I grade) |
| eXtreme Low Power (XLP) | Yes |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
PIC16LF18313T-I/RF Pin Configuration
| Pin 1 | VDD — Positive supply voltage (1.8V to 3.6V) |
| Pin 2 | RA5 — GPIO RA5 / I/O (PPS-capable) |
| Pin 3 | RA4 — GPIO RA4 / I/O (PPS-capable) |
| Pin 4 | RA3 — GPIO RA3 / MCLR (reset, weak pull-up) |
| Pin 5 | RA2 — GPIO RA2 / I/O (PPS-capable, analog capable) |
| Pin 6 | RA1 — GPIO RA1 / ICSPCLK (PPS-capable, analog capable) |
| Pin 7 | RA0 — GPIO RA0 / ICSPDAT (PPS-capable, analog capable) |
| Pin 8 | VSS — Ground reference (also exposed pad) |
Typical Applications
PIC16LF18313T-I/RF is suitable for 6 applications: Battery-Powered IoT Sensor Nodes, Wearable Health Monitoring Devices, Remote Controls and Human-Machine Interface, LED Lighting Controllers, Industrial Sensor Signal Conditioning, Low-Power Wireless Endpoint Nodes.
Battery-Powered IoT Sensor Nodes
The PIC16LF18313T-I/RF fits coin-cell IoT sensor nodes through its eXtreme Low Power (XLP) sleep current below 1 uA, 1.8 V to 3.6 V VDD operating range, and 3.5 KB Flash sufficient for periodic sensor reads and a simple wireless protocol stack. Its 10-bit ADC with computation performs oversampling and averaging in hardware, offloading the CPU during long sleep intervals and extending battery life. Paired with sub-GHz transceivers, the 8-UDFN 3x3 mm footprint fits in sensor tags the size of a coin.
Recommended
Wearable Health Monitoring Devices
For wearable health bands and patches, the PIC16LF18313T-I/RF delivers 32 MHz MIPS throughput for heart-rate, SpO2, or motion sensor fusion while drawing sub-uA sleep current between samples. The 8-UDFN 3x3 mm footprint enables integration inside thin enclosures, and PPS reassigns peripherals to alternate pins to simplify flex-PCB routing. The 10-bit ADC samples battery voltage for accurate runtime estimation without external components.
Recommended
Remote Controls and Human-Machine Interface
The PIC16LF18313T-I/RF suits IR/RF remote controls and small HMI panels thanks to its CLC (Configurable Logic Cell) and CWG (Complementary Waveform Generator) peripherals, which generate precise IR carrier waveforms and button-debounce logic in hardware without CPU overhead. The 256-byte SRAM handles modest buffer needs, and PPS routes the UART, PWM, and timers to whichever pins the mechanical layout requires.
Recommended
LED Lighting Controllers
In LED lighting strips and architectural fixtures, the PIC16LF18313T-I/RF generates multi-channel PWM via its CWG and PWM peripherals for color-mixing or dimming control. The NCO (Numerically Controlled Oscillator) drives high-resolution dimming at low PWM frequencies, eliminating flicker in dimmable white LEDs. Low sleep current lets always-on lighting controllers stay connected to wireless networks without draining backup batteries.
Recommended
Industrial Sensor Signal Conditioning
For industrial 4-20 mA loop-powered sensors, the PIC16LF18313T-I/RF operates directly from the loop supply at 3.3 V with its 10-bit ADC performing linearization and compensation in hardware via ADC computation. The 5-bit DAC provides excitation for bridge sensors, and the on-chip comparators detect over-range or fault conditions without external analog components. Industrial -40C to +85C operation covers most factory environments.
Recommended
Low-Power Wireless Endpoint Nodes
The PIC16LF18313T-I/RF pairs with sub-GHz or BLE transceivers as the host MCU in low-power wireless sensor endpoints. Its 1.8 V VDD minimum matches the lower rail of modern RF front-ends, reducing the need for separate voltage regulators. The 32 MHz internal oscillator provides accurate timing for protocol stacks without external crystals, and 3.5 KB Flash holds lightweight protocol libraries such as proprietary sensor protocols or simplified BLE stacks.
Recommended
Recommended Products Summary
Engineering reference data for PIC16LF18313T-I/RF — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16LF18313-I/RF | PIC16LF18313-E/RF | PIC16F18313T-I/RF | PIC16F18313T-I/SN | PIC16LF1829T-I/GZ |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 8-UDFN (3x3 mm) | 8-UDFN (3x3 mm) - same | 8-UDFN (3x3 mm) - same | 8-UDFN (3x3 mm) - same | 8-SOIC - different footprint | 20-UQFN - different footprint |
| PPS / CLC / NCO / CWG | All present | All present | All present | All present | All present | Older family, no PPS/CLC/NCO |
Key Differentiators
- Lower minimum supply voltage (1.8V vs 2.3V) (vs PIC16F18313T-I/RF)
- PPS + CLC + NCO + CWG peripherals on an 8-pin MCU (vs PIC16LF1829T-I/GZ)
- Industrial temperature grade with full XLP feature set (vs PIC16LF18313T-I/SN)
Design Notes
The 8-UDFN package has an exposed thermal pad that MUST be soldered to a sufficiently large ground copper pour for both thermal dissipation and electrical grounding. Estimate: at 32 MHz full CPU active with all peripherals on at 3.3 V, the device dissipates roughly 10-15 mW; the UDFN theta_JA is approximately 60-70 C/W without the exposed pad soldered, which can be reduced to ~30-40 C/W with proper land soldering. Industrial temperature range is -40C to +85C for the I grade variant.
For the 8-UDFN footprint use a non-solder-mask-defined (NSMD) land pattern with the exposed pad split into multiple thermal vias to the inner ground plane. Estimated land dimensions for NSMD are 0.6 mm pads with 0.2 mm spacing; the center pad should be at least 1.5x1.5 mm with 5-9 thermal vias of 0.2-0.3 mm drill. This both meets the manufacturer's soldering profile recommendation and improves thermal performance for continuous CPU-active operation.
To achieve the eXtreme Low Power (XLP) sleep currents below 1 uA, disable all unused peripherals in firmware via PMD registers, configure all unused I/O pins as outputs driving low, and disable the FVR and ADC if not in use. The PIC16LF18313 datasheet Sleep mode section describes how to gate the ADC, comparators, and FVR for minimum quiescent current. A typical deep-sleep current at 1.8 V with WDT disabled is on the order of 50-500 nA.
Do NOT assume the LF and F variants are interchangeable: the PIC16LF18313 supports 1.8 V minimum VDD, while the PIC16F18313 requires 2.3 V minimum. Programming voltage timing must follow the datasheet's ICSP entry sequence (MCLR high with PGM low for HV entry) - simply pulling MCLR high without proper ICSP timing will fail to enter programming mode. Also ensure the CONFIG words are explicitly programmed; otherwise the device defaults to a configuration that may not match the user's hardware setup.
Compliance Information
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - choose PIC16LF18313-E variant for higher temp or AEC-Q100 specific automotive parts for vehicle applications.
