PIC16F18313T-E/RFVAO - 8-bit MCU, 3.5KB Flash, 8-UDFN, AEC-Q100 | Microchip
MPN: PIC16F18313T-E/RFVAO ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.62 | $1.62 |
| 10 | $1.46 | $14.60 |
| 100 | $1.28 | $128.00 |
| 500 | $1.12 | $560.00 |
| 1,000 | $0.98 | $980.00 |
PIC16F18313T-E/RFVAO Overview
An 8-bit microcontroller (MCU) is a compact computing engine that integrates a CPU, non-volatile program memory (Flash), volatile working memory (RAM), small EEPROM for persistent storage, plus peripherals such as timers, ADC, comparators, and communication interfaces on a single die. PIC microcontrollers use Microchip's modified Harvard RISC architecture with a 14-bit instruction word optimized for deterministic, low-power embedded control. Within the broader taxonomy, the PIC16F18313 belongs to Microcontrollers -> Integrated Circuits -> Semiconductors, occupying the low-pin-count, ultra-low-power (XLP) niche.
Key features include 3.5KB self-programmable Flash, 256B SRAM, 256B EEPROM, 6 configurable I/O pins via Peripheral Pin Select (PPS), a 10-bit ADC with computation (ADC2), two comparators, a DAC, Configurable Logic Cells (CLC), and eXtreme Low Power (XLP) technology that delivers nanoWatt sleep currents. The part supports in-circuit serial programming and debugging, enabling fast firmware iteration.
The PIC16F18313 implements Microchip's enhanced mid-range core with a 32 MHz internal oscillator, hardware multiply, and a single-cycle instruction path. Core Independent Peripherals (CIPs) such as the CLC and NCO allow hardware state machines to operate without CPU intervention, reducing firmware complexity and power. The PPS block remaps digital peripherals to any I/O pin, simplifying PCB layout for space-limited designs.
Typical applications include automotive body electronics, sensor nodes, LIN slave nodes, LED lighting controllers, battery-powered IoT endpoints, and small motor control. The AEC-Q100 qualification makes the VAO suffix variant specifically suited for under-hood and cabin automotive modules that require ISO 26262 support documentation and PPAP deliverables.
When designing, place a 0.1uF decoupling capacitor adjacent to VDD and verify that the exposed thermal pad is soldered to a ground pad of at least 4 vias to meet the 31 C/W thermal resistance. For automotive designs, follow Microchip AN2370 hardware checklist and validate against AEC-Q100 EMC profiles.
This page synthesizes distributor pricing, drop-in alternative guidance, and automotive-grade design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for PIC16F18313T-E/RFVAO — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16F18313T-E/RFVAO (same form factor and footprint) — differing in Operating Temperature, Package, Program Memory (Flash), ADC, Core.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16F18313-E/RFVAO
✅ Drop-In✓ In Stock
$0.55 / Unit
View Datasheet →PIC16F18313T-I/RF
✅ Drop-In✓ In Stock
$0.72 / Unit
View Datasheet →PIC16F18313-I/RFVAO
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16F18313T-E/RF
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16LF18313T-E/RFVAO
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
PIC16F18313T-E/RFVAO Maximum Ratings & Electrical Characteristics
| Manufacturer | Microchip Technology |
| Series | PIC® XLP™ 16F |
| Core | PIC 8-bit RISC (enhanced mid-range) |
| Program Memory (Flash) | 3.5 KB (2K x 14) |
| SRAM | 256 B |
| EEPROM | 256 B |
| Number of I/O | 6 |
| Supply Voltage (VDD) | 2.5 V to 3.3 V (5.5 V max) |
| Operating Temperature | -40C to +125C (automotive) |
| Package | 8-UDFN Exposed Pad (HVSON) |
| Mounting Type | Surface Mount |
| AEC-Q100 | Qualified |
| Packaging | Tape & Reel |
| MSL Level | 1 (unlimited) |
| RoHS Status | Compliant |
PIC16F18313T-E/RFVAO Pin Configuration
| Pin 1 | RA5/CLKIN — Bidirectional I/O / External clock input |
| Pin 2 | RA4/AN3 — Bidirectional I/O / Analog channel 3 |
| Pin 3 | RA3/MCLR/VPP — Bidirectional I/O / Master clear (reset) / Programming voltage |
| Pin 4 | VDD — Positive supply voltage |
| Pin 5 | VSS — Ground reference |
| Pin 6 | RA0/ICSPDAT — Bidirectional I/O / ICSP data |
| Pin 7 | RA1/ICSPCLK — Bidirectional I/O / ICSP clock |
| Pin 8 | RA2/AN2 — Bidirectional I/O / Analog channel 2 |
Typical Applications
PIC16F18313T-E/RFVAO is suitable for 6 applications: Automotive Body Electronics, Automotive Sensor Interface Nodes, LED Lighting Controllers, Battery-Powered IoT Endpoints, Small DC Motor Control, LIN Slave Nodes.
Automotive Body Electronics
The PIC16F18313T-E/RFVAO fits automotive body electronics - door modules, seat controllers, mirror switches - because its AEC-Q100 grade (-40C to +125C), 6 PPS-remappable I/O, and Core Independent Peripherals (CLC, NCO) handle sensor polling and PWM generation without CPU load. With 3.5KB Flash and 256B EEPROM, it stores calibration and diagnostic trouble codes (DTCs). Its 32 MHz internal oscillator and nanoWatt XLP sleep reduce quiescent draw in always-on nodes to under 1uA, critical for battery-backed body modules during parking. Compared to a 32-bit MCU, the 8-bit PIC delivers deterministic interrupt latency at a fraction of the cost and PCB area, ideal for high-volume automotive builds.
Recommended
Automotive Sensor Interface Nodes
The PIC16F18313T-E/RFVAO is well suited for analog sensor interface nodes - temperature, pressure, position - because its 10-bit ADC2 with hardware averaging delivers accurate conversions while the CPU sleeps in XLP mode. The 6 I/O pins via PPS map cleanly to a sensor, an analog front end, a PWM output to ECU and a LIN/UART diagnostic line. AEC-Q100 qualification and PPAP traceability ensure automotive OEM acceptance. At 3.5KB Flash, the device stores calibration tables and ISO 14229 UDS handlers; 256B EEPROM logs DTCs across power cycles. Its 8-UDFN 3x3 mm footprint fits inside sensor housings where space is critical.
Recommended
LED Lighting Controllers
The PIC16F18313T-E/RFVAO drives automotive interior/exterior LED lighting because its 10-bit PWM, CLC, and NCO peripherals generate flicker-free dimming curves without CPU intervention. The 5-bit DAC enables analog current control loops for constant-current LED drivers, while 6 I/O via PPS allocate pins to RGB channels, enable lines, and fault feedback. AEC-Q100 ensures operation across -40C to +125C in headlamp and tail-light modules. With 3.5KB Flash, color-mixing algorithms and thermal foldback fit easily; nanoWatt XLP sleep extends battery life when parking lights remain dim. The 8-UDFN package fits inside space-constrained lamp housings.
Recommended
Battery-Powered IoT Endpoints
The PIC16F18313T-E/RFVAO supports battery-powered sensor endpoints because XLP technology delivers sub-uA sleep currents, allowing coin-cell nodes to run for years on a single CR2032. The 32 MHz internal oscillator and PPS remap wake-up tasks to GPIO without external components. At 3.5KB Flash and 256B SRAM, the MCU runs lightweight BLE beaconing or LoRaWAN activation via UART. AEC-Q100 grade is overkill for pure consumer IoT but offers robust temperature tolerance for outdoor and industrial deployments. The 8-UDFN exposed pad simplifies thermal management in enclosed sensor housings.
Recommended
Small DC Motor Control
The PIC16F18313T-E/RFVAO drives small brushed DC and stepper motors in automotive HVAC flaps and headlamp levellers because its 10-bit PWM with dead-band control, plus comparators for current sensing, implement closed-loop control without an external driver. AEC-Q100 and -40C to +125C operation suit under-hood and engine-bay environments. The 6 I/O via PPS allocate pins to H-bridge enable, direction, current shunt, and encoder feedback. 3.5KB Flash holds position tables and ramp profiles; nanoWatt XLP sleep reduces quiescent draw when the motor is idle. The 3x3 mm UDFN saves PCB space inside actuator housings.
Recommended
LIN Slave Nodes
The PIC16F18313T-E/RFVAO acts as a LIN slave node in automotive body networks because its EUSART with LIN protocol support handles break-detection and auto-baud without CPU load, freeing the core for application tasks. AEC-Q100 qualification and -40C to +125C temperature grade meet OEM requirements for window lifters, mirror adjusters, and seat positioners. With 6 I/O via PPS, the same silicon drives multiple LIN endpoints across product variants. 3.5KB Flash stores LIN node capability and diagnostic descriptors per LIN 2.x; 256B EEPROM saves last-position memory across battery disconnects. The 8-UDFN saves space in distributed body modules.
Recommended
Recommended Products Summary
Engineering reference data for PIC16F18313T-E/RFVAO — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F18313-E/RFVAO | PIC16F18313T-I/RF | PIC16F18313-I/RFVAO | PIC16F18313T-E/RF | PIC16LF18313T-E/RFVAO |
|---|---|---|---|---|---|---|
| Package | 8-UDFN Exposed Pad | 8-UDFN Exposed Pad - same | 8-UDFN Exposed Pad - same | 8-UDFN Exposed Pad - same | 8-UDFN Exposed Pad - same | 8-UDFN Exposed Pad - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 3.5 KB | 3.5 KB | 3.5 KB | 3.5 KB | 3.5 KB | 3.5 KB |
| Operating Temperature | -40C to +125C (Automotive) | -40C to +125C | -40C to +85C (Industrial) | -40C to +85C | -40C to +125C | -40C to +125C |
| AEC-Q100 Qualified | Yes (VAO) | Yes | No | No | No | Yes |
| Supply Voltage | 2.5V to 3.3V (5.5V max) | 2.5V to 3.3V (5.5V max) | 2.5V to 3.3V (5.5V max) | 2.5V to 3.3V (5.5V max) | 2.5V to 3.3V (5.5V max) | 1.8V to 3.6V (LF variant) |
| Number of I/O | 6 | 6 | 6 | 6 | 6 | 6 |
| Packaging Format | Tape & Reel | Tube | Tape & Reel | Tray | Tape & Reel | Tape & Reel |
Key Differentiators
- Smallest-footprint automotive AEC-Q100 PIC16 in 8-UDFN 3x3mm (vs PIC16F18313T-E/SNVAO (SOIC-8))
- PPAP documentation included with shipment (vs PIC16F18313T-E/RF (no VAO))
- 6 I/O via Peripheral Pin Select versus fixed-pin PIC10/12 (vs PIC12F1822-I/SN (8-SOIC))
Design Notes
Estimated: at 32 MHz active and 3.3V supply, the PIC16F18313T-E/RFVAO draws ~3 mA active (per Microchip datasheet DC characteristics). Place a 0.1 uF ceramic decoupling capacitor within 3 mm of the VDD pin and a 1 uF bulk capacitor on the supply rail. For battery-backed designs, leverage nanoWatt XLP sleep mode (typical <1 uA with WDT disabled) to extend shelf life.
The 8-UDFN package has a center exposed pad that must be soldered to a ground copper pad of at least 4 thermal vias (0.3 mm drill, 0.5 mm pitch) to meet the 31 C/W theta-JA rating. Without proper pad soldering, junction temperature rises 30-40% above spec at full CPU load, threatening AEC-Q100 -40C to +125C compliance in sealed enclosures.
Route ICSPCLK and ICSPDAT (RA1/RA0) to a 6-pin header that supports Microchip's PICkit 4 or MPLAB Snap in-circuit debugger. Include a 10 kohm pull-up on MCLR (RA3) and a 0.1 uF cap to ground for clean reset transitions. Keep analog traces (AN2/AN3) short and guarded with ground pours to minimize ADC2 noise coupling from digital switching.
Do not exceed 5.5V on VDD - the PIC16F18313 is a 3.3V part; applying 5V without a regulator will damage the core. Use ConfigurationWords FIFO not the LF variant for 3.3V designs; the LF variant has different Brown-Out Reset thresholds. For automotive applications, always order the VAO suffix to ensure AEC-Q100 PPAP documentation is included with shipment.
Compliance Information
AEC-Q100 Grade 1 qualified for automotive applications. VAO suffix provides full PPAP, IMDS, and traceability documentation. RoHS and REACH compliant per Microchip material declaration.
