PIC16F18857T-I/ML - 8-Bit 32MHz 56KB Flash MCU 28-QFN | Microchip
N.º da peça: PIC16F18857T-I/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3.08 | $3,08 |
| 10 | $2.78 | $27,80 |
| 100 | $2.45 | $245,00 |
| 500 | $2.15 | $1.075,00 |
| 1.000 | $1.88 | $1.880,00 |
PIC16F18857T-I/ML Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU, non-volatile program memory (Flash), volatile working memory (RAM), data EEPROM, and a rich set of peripheral IP blocks (timers, ADC, communication controllers, GPIO). PIC16-family MCUs use a RISC-based 8-bit core optimized for deterministic interrupt response and low active/standby power. This category sits within the broader hierarchy: microcontroller -> embedded processor -> semiconductor device, and PIC16F18857 specifically targets applications where small footprint, low power, and integrated analog/communications reduce external component count.
Key features include 24 analog-capable pins, a 10-bit ADC with computation, multiple PWM/Capture/Compare modules, configurable logic cells (CLC), zero-cross detect (ZCD), complementary waveform generator (CWG), and serial interfaces including I2C, SPI, and EUSART with LIN support. Functional Safety features include hardware windowed watchdog, CRC/SCAN, and HLT (Hardware Limit Timer) for ASIL-ready applications. The eXtreme Low Power (XLP) technology achieves nanoWatt sleep currents with multiple IDLE and DOZE modes for battery-powered duty-cycled designs.
The device combines an enhanced mid-range 8-bit pipeline with hardware multiplier and a 14-bit instruction word. The 56KB Flash is mapped as 32K words of 14-bit instructions, and the memory architecture supports self-programmability, bootloader operation via UPDI, and table read/write. The 28-QFN (6x6 mm) package provides ample GPIO and a low thermal resistance path through the exposed pad.
Typical applications include industrial sensor nodes, home appliance user interfaces, LED lighting controllers, low-power IoT endpoints, automotive body electronics (LIN slaves), and battery-powered instrumentation. The combination of CIPs and integrated 10-bit ADC allows closed-loop control without external analog components.
When designing with this device, ensure the UPDI/debug pin has the correct pull-up configuration for in-circuit programming and that the exposed pad is soldered to the ground plane for thermal and electrical performance. The PIC16F18857T-E/MLVAO is the Extended Temp / VAO variant for harsh environments. This page combines distributor pricing, verified same-package drop-in alternatives, and practical design notes that complement the manufacturer datasheet.
Alternativas drop-in para PIC16F18857T-I/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC16F18857T-I/ML (mesmo formato e footprint) — diferindo em Package, ADC, Program Memory (Flash), Operating Temperature, Communication.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC16F18855-I/ML
✅ Drop-In✓ Em estoque
$1.38 / unidade
Ver ficha técnica →PIC16F18856T-I/SSVAO
✅ Drop-In✓ Em estoque
$2.05 / unidade
Ver ficha técnica →PIC16F18857-I/ML
✅ Drop-In✓ Em estoque
$1.39 / unidade
Ver ficha técnica →PIC16F18855T-I/ML
✅ Drop-In✓ Em estoque
$1.26 / unidade
Ver ficha técnica →PIC16F18857T-I/ML Classificações máximas e características elétricas
| Core Architecture | PIC16 8-bit Enhanced Mid-Range |
| Program Memory (Flash) | 56 KB (32K x 14 words) |
| RAM | 4 KB |
| EEPROM | 256 B |
| Maximum CPU Frequency | 32 MHz |
| Encapsulamento | 28-QFN (6x6 mm) |
| Operating Voltage (VDD) | 1.8 V to 5.5 V |
| Temperatura de operação | -40 C to +85 C (Industrial) |
| ADC | 10-bit with computation |
| Communication | I2C, SPI, EUSART (LIN) |
| Core Independent Peripherals | CLC, ZCD, CWG, CRC/SCAN, HLT |
| Low Power Feature | eXtreme Low Power (XLP) |
| Programming/Debug | UPDI (single-wire) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
Configuração de pinos do PIC16F18857T-I/ML
| Pino 1 | RA5 — Bidirectional I/O, analog-capable, also ICSP/UPDI |
| Pino 2 | RA4 — Bidirectional I/O, analog-capable |
| Pino 3 | RA3 — Bidirectional I/O, analog-capable |
| Pino 4 | RA2 — Bidirectional I/O, analog-capable |
| Pino 5 | RA1 — Bidirectional I/O, analog-capable |
| Pino 6 | RA0 — Bidirectional I/O, analog-capable |
| Pino 7 | VSS — Ground reference |
| Pino 8 | VDD — Positive power supply |
| Pino 9 | RA7 — Bidirectional I/O, analog-capable |
| Pino 10 | RA6 — Bidirectional I/O, analog-capable |
| Pino 11 | RC0 — Bidirectional I/O, analog-capable |
| Pino 12 | RC1 — Bidirectional I/O, analog-capable |
| Pino 13 | RC2 — Bidirectional I/O, analog-capable |
| Pino 14 | RC3 — Bidirectional I/O, analog-capable |
| Pino 15 | RC4 — Bidirectional I/O, analog-capable |
| Pino 16 | RC5 — Bidirectional I/O, analog-capable |
| Pino 17 | RC6 — Bidirectional I/O, analog-capable |
| Pino 18 | RC7 — Bidirectional I/O, analog-capable |
| Pino 19 | VSS — Ground reference |
| Pino 20 | VDD — Positive power supply |
| Pino 21 | RB0 — Bidirectional I/O, analog-capable |
| Pino 22 | RB1 — Bidirectional I/O, analog-capable |
| Pino 23 | RB2 — Bidirectional I/O, analog-capable |
| Pino 24 | RB3 — Bidirectional I/O, analog-capable |
| Pino 25 | RB4 — Bidirectional I/O, analog-capable |
| Pino 26 | RB5 — Bidirectional I/O, analog-capable |
| Pino 27 | RB6 — Bidirectional I/O, analog-capable |
| Pino 28 | RB7 — Bidirectional I/O, analog-capable |
Aplicações típicas
PIC16F18857T-I/ML é adequado para 6 aplicaçãos: Industrial Sensor Node with LIN Bus, Battery-Powered IoT Endpoint, LED Lighting Controller, Home Appliance User Interface, Automotive Body Electronics (LIN Slave), Portable Health / Wellness Device.
Industrial Sensor Node with LIN Bus
The PIC16F18857T-I/ML is well matched to industrial sensor nodes that aggregate analog inputs and report over LIN or UART. Its 10-bit ADC with computation offloads sensor linearization and averaging from the CPU, while the EUSART with LIN auto-baud handles the bus protocol in hardware. With 56 KB Flash it can host a Modbus/LIN slave stack plus calibration tables, and the XLP nanoWatt sleep keeps battery duty-cycled nodes alive for years on a single primary cell.
Recomendado
Battery-Powered IoT Endpoint
For remote IoT endpoints that sleep most of the time, the PIC16F18857T-I/ML's eXtreme Low Power (XLP) technology delivers nanoAmpere-class sleep current, waking on an RTCC or interrupt to read a sensor and transmit. The 32 MHz core provides enough bandwidth for AES-128 firmware and small LoRa-/BLE-passthrough stacks. Its 1.8 V minimum VDD enables direct operation from a single alkaline or primary lithium cell without a boost converter.
Recomendado
LED Lighting Controller
The PIC16F18857T-I/ML drives LED lighting strings with hardware PWM and the Complementary Waveform Generator (CWG), producing center-aligned, dead-band-controlled switching waveforms at frequencies that minimize audible noise. The configurable logic cells (CLC) combine PWM, ZCD, and comparator events in hardware to implement phase-angle dimming without CPU overhead, leaving firmware free for DMX-512 or DALI command parsing.
Recomendado
Home Appliance User Interface
The PIC16F18857T-I/ML integrates the human-machine interface (HMI) of a white-good appliance: capacitive touch via the Peripheral Touch Controller (PTC), 10-bit ADC for thermistor sensing, PWM for buzzer/speaker feedback, and UART for the main controller link. With 4 KB RAM it can hold a full UI state machine and message buffers, and the industrial -40 C to +85 C temperature grade covers the appliance operating envelope.
Recomendado
Automotive Body Electronics (LIN Slave)
For body-electronics modules such as seat controllers, mirror adjusters, or HVAC flaps, the PIC16F18857T-I/ML provides the LIN 2.x slave protocol with auto-baud detection, combined with 56 KB Flash for the LIN 2.x/SAE J2602 stack and application logic. The Functional Safety features (hardware windowed WDT, CRC/SCAN, HLT) support ASIL classification work, and the PIC16F18857-E/MLVAO automotive-qualified variant is the preferred part for under-hood or harsh-environment ECUs.
Recomendado
Portable Health / Wellness Device
The PIC16F18857T-I/ML serves wearable or handheld health/wellness devices that combine a small battery, a single analog sensor (heart-rate, SpO2, temperature), and a low-power display or BLE link. Its nanoAmpere sleep current, fast wake-up from Sleep via peripheral interrupts, and 56 KB Flash let the firmware host a Bluetooth Low Energy GATT profile and a sensor-fusion state machine. The 1.8 V minimum VDD enables direct coin-cell operation.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC16F18857T-I/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC16F18855-I/ML | PIC16F18856T-I/SSVAO | PIC16F18857-I/ML |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Flash | 56 KB | 32 KB | 28 KB | 56 KB |
| RAM | 4 KB | 2 KB | 2 KB | 4 KB |
| EEPROM | 256 B | 256 B | 256 B | 256 B |
| Maximum CPU Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Voltage | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V |
| Temperature Range | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C (VAO) | -40 C to +85 C |
| Core Independent Peripherals | CLC, ZCD, CWG, CRC/SCAN, HLT, NCO, PTC | Same CIPs | Same CIPs | Same CIPs |
Principais diferenciais
- Largest Flash memory in the 28-QFN PIC16F1885X/7X drop-in family (vs PIC16F18855-I/ML)
- Higher RAM headroom for protocol stacks (vs PIC16F18856T-I/SSVAO)
- Industrial grade on tape-and-reel for SMT production (vs PIC16F18857-I/ML)
Notas de projeto
Place a 0.1 µF ceramic decoupling capacitor on each VDD/VSS pin pair within 4 mm of the package, and a bulk 4.7–10 µF tantalum or ceramic capacitor on the main VDD rail. The PIC16F18857T-I/ML has two VDD pins (8 and 20) and two VSS pins (7 and 19) - both pairs must be decoupled. For battery applications, route the UPDI/RA5 programming pin to a test-point or header, and add a 10 kΩ pull-up to VDD to prevent unwanted reset during sleep.
Solder the 28-QFN exposed pad (EP) to a continuous copper ground pour to provide the lowest thermal resistance path. With typical XLP sleep currents in the nanoAmpere range and active currents under 5 mA at 32 MHz / 3.3 V, the die dissipates under 20 mW and thermal rise above ambient is negligible even in fully enclosed plastic enclosures. The exposed pad is the ground reference - avoid using a 'daisy-chain' via pattern that would create ground bounce.
Do not confuse the PIC16F18857T-I/ML (industrial -40 to +85 C, tape-and-reel) with the PIC16F18857T-E/MLVAO (extended -40 to +125 C, Very Automotive Quality). For automotive LIN-sensor applications the VAO variant is mandatory. Also note: PIC16F18855 ('55) has 32 KB Flash / 2 KB RAM and is pin-compatible but NOT firmware-compatible for memory size. Verify that your linker script and ICD file target the correct derivative before mass production.
Route the UPDI/ICSP pin (RA5 on PIC16F18857 in 28-QFN) away from switching signals and PWM outputs to prevent capacitive coupling that breaks in-circuit programming. Keep analog input traces (ADC, comparators) short and guarded with a ground polygon on both sides. The QFN package has an internal die-attached paddle - do not allow signal traces to pass under the package body unless they are part of the ground pour.
Informações de conformidade
RoHS and lead-free per Microchip product page and DigiKey/Mouser listing. The industrial 'I' grade is -40 C to +85 C - not AEC-Q100 qualified; use PIC16F18857-E/MLVAO for automotive.
