PIC16F18876-I/ML - 32MHz 8-bit MCU 28KB Flash 44-QFN | Microchip
부품 번호: PIC16F18876-I/ML ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3.42 | $3.42 |
| 10 | $3.1 | $31.00 |
| 100 | $2.69 | $269.00 |
| 500 | $2.4 | $1,200.00 |
| 1,000 | $2.15 | $2,150.00 |
PIC16F18876-I/ML 개요
An 8-bit microcontroller (MCU) is a compact, self-contained processor-on-a-chip that integrates a CPU, non-volatile program memory, volatile data RAM, EEPROM, and a rich mix of analog and digital peripherals. It sits below 32-bit Cortex-M MCUs in the embedded hierarchy and above fixed-function logic in design flexibility, making it the workhorse of cost-sensitive, low-power, and battery-friendly applications. PIC microcontrollers are particularly known for deterministic instruction execution and ultra-low standby current.
Key features of this part include 11 timers, 5 CCP modules, 2 PWM modules, 2 comparators, dual I2C and SPI interfaces, 2 EUSART peripherals, a 32MHz internal oscillator, and a wide operating voltage range. The CIP set includes CRC/SCAN, Hardware Limiter (HLT), and Zero-Cross Detection, which offload real-time tasks from the CPU and reduce firmware complexity. XLP technology enables sub-microamp sleep currents, ideal for battery-powered designs.
The architecture combines an enhanced mid-range 16-bit instruction word with 8-bit data path, providing 49 instruction types and a 14-bit program word that allows 16K instruction words to fit into 28KB of FLASH. The 2KB RAM and 256B EEPROM support robust data buffering and non-volatile parameter storage. The 44-QFN package with exposed pad provides efficient thermal dissipation for sustained industrial operation.
Typical applications include industrial sensor nodes, home appliance control, IoT edge devices, low-power wireless sensor hubs, and automotive body/comfort subsystems (where FuSa support helps). The combination of XLP, CIP, and 32MHz performance suits designs that need deterministic behavior without a heavy RTOS.
When designing with this part, ensure the QFN thermal pad is soldered to a sufficient copper pour for heat dissipation. Decouple VDD with a 100nF ceramic capacitor placed as close to the pin as possible, and follow Microchip's recommended programming/debugger pinout for ICSP. Use the MPLAB X IDE with XC8 compiler for code development.
This page synthesizes distributor pricing, drop-in alternatives in the same 44-QFN footprint, and design notes not aggregated in the manufacturer datasheet, supporting faster part selection and PCB layout reuse.
드롭인 대체품: PIC16F18876-I/ML — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC16F18876-I/ML (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Core Architecture, DAC, Program Memory (Flash).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC16F18875-I/ML
✅ 드롭인✓ 재고 있음
$1.55 / 개
데이터시트 보기 →PIC16F18877-I/ML
✅ 드롭인✓ 재고 있음
$2.4 / 개
데이터시트 보기 →PIC16F18876-E/ML
✅ 드롭인✓ 재고 있음
$2.18 / 개
데이터시트 보기 →PIC16F18876T-I/ML
✅ 드롭인✓ 재고 있음
$2.43 / 개
데이터시트 보기 →PIC16F18857-I/ML
✅ 드롭인✓ 재고 있음
$1.39 / 개
데이터시트 보기 →PIC16F18876-I/ML 최대 정격 & 전기적 특성
| Core Architecture | PIC16 (Enhanced Mid-Range) 8-bit RISC |
| CPU Speed | 32 MHz max |
| Program Memory (FLASH) | 28 KB (16K x 14 words) |
| Data RAM | 2 KB |
| Data EEPROM | 256 bytes |
| 패키지 | 44-QFN (8x8 mm) with Exposed Pad (ML) |
| 실장 유형 | Surface Mount |
| 핀 수 | 44 |
| 동작 온도 범위 | -40C to +85C (Industrial, -I suffix) |
| Timers | 11 |
| CCP Modules | 5 |
| PWM Modules | 2 |
| Comparators | 2 |
| EUSART | 2 |
| I2C / SPI | Dual I2C, SPI |
| eXtreme Low Power (XLP) | Yes |
| Functional Safety (FuSa) | Yes |
| Core Independent Peripherals (CIP) | CRC/SCAN, HLT, Zero-Cross Detect |
| RoHS 상태 | Compliant |
PIC16F18876-I/ML 핀 구성
| 핀 1 | RA5 — Bidirectional I/O / input only on RA5 |
| 핀 2 | RA4 — Bidirectional I/O |
| 핀 3 | RA3 — Bidirectional I/O / analog input |
| 핀 4 | RA2 — Bidirectional I/O / analog input |
| 핀 5 | RA1 — Bidirectional I/O / analog input |
| 핀 6 | RA0 — Bidirectional I/O / analog input |
| 핀 7 | VSS — Ground reference |
| 핀 8 | RB7 — Bidirectional I/O |
| 핀 9 | RB6 — Bidirectional I/O / ICSPCLK |
| 핀 10 | RB5 — Bidirectional I/O |
| 핀 11 | RB4 — Bidirectional I/O |
| 핀 12 | RB3 — Bidirectional I/O / ICSPDAT |
| 핀 13 | RB2 — Bidirectional I/O |
| 핀 14 | RB1 — Bidirectional I/O |
| 핀 15 | RB0 — Bidirectional I/O |
| 핀 16 | VDD — Positive supply voltage |
| 핀 17 | RC7 — Bidirectional I/O |
| 핀 18 | RC6 — Bidirectional I/O |
| 핀 19 | RC5 — Bidirectional I/O |
| 핀 20 | RC4 — Bidirectional I/O |
| 핀 21 | RC3 — Bidirectional I/O |
| 핀 22 | RC2 — Bidirectional I/O |
| 핀 23 | RC1 — Bidirectional I/O |
| 핀 24 | RC0 — Bidirectional I/O |
| 핀 25 | RE3 — Bidirectional I/O (input only on RE3) |
| 핀 26 | AVSS — Analog ground |
| 핀 27 | RA7 — Bidirectional I/O / analog input |
| 핀 28 | RA6 — Bidirectional I/O |
| 핀 29 | AVDD — Analog positive supply |
| 핀 30 | RD7 — Bidirectional I/O |
| 핀 31 | RD6 — Bidirectional I/O |
| 핀 32 | RD5 — Bidirectional I/O |
| 핀 33 | RD4 — Bidirectional I/O |
| 핀 34 | RD3 — Bidirectional I/O |
| 핀 35 | RD2 — Bidirectional I/O |
| 핀 36 | RD1 — Bidirectional I/O |
| 핀 37 | RD0 — Bidirectional I/O |
| 핀 38 | VSS — Ground reference |
| 핀 39 | OSC1 — Crystal oscillator input |
| 핀 40 | OSC2 — Crystal oscillator output |
| 핀 41 | MCLR — Master clear reset input |
| 핀 42 | RE2 — Bidirectional I/O |
| 핀 43 | RE1 — Bidirectional I/O |
| 핀 44 | RE0 — Bidirectional I/O |
일반적인 애플리케이션
PIC16F18876-I/ML 적합 용도: 7 애플리케이션s: Industrial Sensor Node, Home Appliance Control, IoT Edge Device, Automotive Body and Comfort Subsystems, Low-Power Wireless Sensor Hub, Consumer Electronics User Interface, Battery-Powered Medical Monitoring.
Industrial Sensor Node
The PIC16F18876-I/ML fits industrial sensor nodes because of its 32 MHz PIC16 core providing 8 MIPS, 28 KB FLASH for protocol stacks like Modbus or IO-Link, and XLP technology drawing sub-microamp currents in sleep. The Core Independent Peripherals (CIP) like CRC/SCAN and HLT autonomously validate sensor data without waking the CPU, drastically reducing average power. Dual I2C and SPI buses allow simultaneous connection to a digital sensor and a radio module. Its 44-QFN package with exposed pad enables compact sensor PCBs. Compared to 32-bit MCUs, this part avoids RTOS overhead and fits deterministic, fixed-function sensor designs in industrial environments.
추천
Home Appliance Control
The PIC16F18876-I/ML is well-matched to home appliances (washing machines, dishwashers, microwave ovens) thanks to its 11 timers, 5 CCP modules, and 2 PWM modules for motor and heater control. The 32 MHz core executes control loops with deterministic timing, and 28 KB FLASH comfortably holds user-interface state machines. The 2 comparators enable zero-cross detection for triac-based AC load switching without external components. The Functional Safety (FuSa) support helps meet IEC 60730 Class B requirements for appliance safety. Operating from -40C to +85C industrial range, it survives kitchen and laundry environments.
추천
IoT Edge Device
The PIC16F18876-I/ML serves IoT edge devices with its combination of XLP low-power sleep modes and CIP peripherals that operate autonomously. Its 32 MHz core, 28 KB FLASH, and 2 KB RAM support wireless stacks like LoRaWAN, Sub-GHz proprietary, or BLE HCI bridges when paired with a radio module over SPI. The dual I2C interfaces allow sensor hub aggregation, while the 2 EUSART peripherals handle legacy RS-485 or RS-232 industrial links. With Core Independent Peripherals performing sensor polling and CRC checking without waking the CPU, battery life extends to years on a single coin cell.
추천
Automotive Body and Comfort Subsystems
The PIC16F18876-I/ML is a fit for automotive body/comfort modules like seat controllers, mirror adjusters, and interior lighting where functional safety and deterministic behavior matter. Its Functional Safety (FuSa) support helps meet ISO 26262 requirements at lower ASIL levels. The 5 CCP modules and 2 PWM outputs drive small DC motors and LED strings, while the 32 MHz core executes LIN protocol stacks. The 44-QFN package supports compact PCB layouts, and CIP peripherals offload repetitive tasks. Note that the -I grade (industrial -40C to +85C) suits cabin-mounted applications; under-hood designs require an -E or AEC-Q100 part.
추천
Low-Power Wireless Sensor Hub
The PIC16F18876-I/ML acts as a low-power wireless sensor hub, aggregating multiple analog and digital sensors and forwarding data over a radio link. Its 32 MHz performance, 2 KB RAM, and dual I2C/SPI allow multiple sensors and a radio module to operate concurrently. The CIP peripherals including CRC/SCAN autonomously validate incoming data, reducing interrupt load and keeping the CPU in sleep longer. The XLP technology typically yields <1 uA sleep current, enabling multi-year battery life for remote deployments. The 28 KB FLASH accommodates a small protocol stack or custom packet format with margin.
추천
Consumer Electronics User Interface
The PIC16F18876-I/ML drives consumer user interfaces such as remote controls, smart-home keypads, and small appliances with displays. Its 5 CCP modules and 2 PWM outputs can drive LEDs, buzzers, and small haptic motors directly without external drivers. The 32 MHz core, 28 KB FLASH, and 2 KB RAM handle state-machine-based UI logic and basic graphics or menu handling. Dual I2C supports displays and capacitive touch controllers, while EUSART links to host MCUs or wireless modules. The 44-QFN package supports slim form factors common in handheld devices.
추천
Battery-Powered Medical Monitoring
The PIC16F18876-I/ML is suitable for battery-powered medical monitoring peripherals like wearable pulse oximeters, portable thermometers, and low-power patient monitors. Its XLP sleep current in the sub-microamp range and CIP peripherals enable continuous monitoring without draining the battery. The 32 MHz core and 28 KB FLASH support simple signal-processing algorithms for heart-rate or SpO2 calculation, while the dual I2C buses connect to biosensors and display modules. The 2 KB RAM accommodates short data buffers for transmission bursts. Designers should validate that the -I industrial grade meets their specific medical device regulatory requirements.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC16F18876-I/ML — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC16F18875-I/ML | PIC16F18877-I/ML | PIC16F18876-E/ML | PIC16F18876T-I/ML | PIC16F18857-I/ML |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) with Exposed Pad | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| FLASH Program Memory | 28 KB | 14 KB | 56 KB | 28 KB | 28 KB | 28 KB |
| Data RAM | 2 KB | 1 KB | 4 KB | 2 KB | 2 KB | 2 KB |
| Data EEPROM | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes |
| Max CPU Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +125C (Extended) | -40C to +85C | -40C to +85C |
| Timers / CCP / PWM | 11 / 5 / 2 | 11 / 5 / 2 | 11 / 5 / 2 | 11 / 5 / 2 | 11 / 5 / 2 | 11 / 5 / 2 |
| EUSART / I2C / SPI | 2 / 2 / 1 | 2 / 2 / 1 | 2 / 2 / 1 | 2 / 2 / 1 | 2 / 2 / 1 | 2 / 2 / 1 |
| Unit Price (qty 1, USD, as of 2026-09-21) | $3.42 | Lower (14 KB FLASH) | Higher (56 KB FLASH) | Similar (extended temp) | Similar (T&R variant) | Similar (same family) |
주요 차별점
- 28 KB FLASH in compact 44-QFN, balanced for mid-complexity firmware (vs PIC16F18875-I/ML)
- Direct upgrade path within same footprint (vs PIC16F18877-I/ML)
- Extended temperature option for harsh environments (vs PIC16F18876-E/ML)
설계 노트
Estimated: The 44-QFN (8x8 mm) exposed thermal pad must be soldered to a copper pour to achieve reliable thermal performance. For industrial temperature operation (-40C to +85C), a minimum 1 square inch of top-layer copper connected to the EP is recommended. Without the EP soldered, the part will derate at lower power dissipation than the datasheet specifies.
Decouple VDD with a 100 nF ceramic capacitor placed within 2 mm of the supply pin; add a bulk capacitor (1-10 uF) at the board entry point. Keep analog VDD/AVSS traces short and isolated from digital switching currents. For ICSP programming, leave RB3 (ICSPDAT), RB6 (ICSPCLK), and MCLR accessible or test-pad accessible, as these are required for in-circuit programming and debugging.
Estimated: Use XLP sleep modes (e.g., SLEEP with peripherals off) to achieve sub-microamp standby currents. Enable Peripheral Module Disable (PMD) bits to gate unused peripherals' clocks. Wakeup via interrupt-on-change (IOC) or watchdog timer keeps average current in the single-digit microamp range for many sensor applications.
Configuration word settings (FOSC, WDTE, etc.) must be programmed correctly or the device will not start. Do not leave MCLR floating - tie to VDD through a 10 kohm pull-up for reliable operation. The internal oscillator requires calibration via OSCTUNE for UART accuracy; expect up to +/- 2% frequency error without calibration.
규정 준수 정보
RoHS and REACH compliant per Microchip product page. The -I grade is industrial temperature (-40C to +85C); not AEC-Q100 qualified. For automotive, designers should select an AEC-Q100 qualified part or implement external safety mechanisms.
