PIC32MZ1024EFH144T-I/PH - 32-bit MCU 200MHz 1MB Flash TQFP-144
부품 번호: PIC32MZ1024EFH144T-I/PH ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.32 | $18.32 |
| 10 | $16.45 | $164.50 |
| 100 | $13.78 | $1,378.00 |
| 500 | $11.94 | $5,970.00 |
| 1,000 | $10.51 | $10,510.00 |
PIC32MZ1024EFH144T-I/PH 개요
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals (timers, communication interfaces, ADCs, GPIO) into one IC. Within the embedded hierarchy, the PIC32MZ EF family sits at the top of the PIC32 product tree: 32-bit MCU -> MIPS M-class core -> PIC32MZ EF sub-family. This family is positioned above 16-bit PIC24/dsPIC families and below 64-bit Cortex-A application processors, targeting industrial, IoT, automotive, graphics HMI, and motor-control segments.
Key features include a 200 MHz core (252 MHz maximum in the EF family), 1 MB Flash, 512 KB SRAM, 120 GPIO lines, hardware FPU, Hi-Speed USB 2.0 OTG, 10/100 Ethernet MAC, multiple CAN, I2C, SPI, and UART ports. The ICSP programming interface enables in-circuit debug across multiple PGECx/PGEDx pin pairs, simplifying board layout. Wide supply voltage (2.1V to 3.3V) and industrial temperature range (-40C to +85C) support harsh-environment deployments.
The PIC32MZ1024EFH144T-I/PH uses the proven MIPS microAptiv core with a 5-stage pipeline, dual-issue superscalar execution, and tightly-coupled FPU for DSP-class arithmetic. The 200 MHz speed grade (vs the 252 MHz -250 variant) trades peak performance for lower active current, making it attractive when headroom matters more than raw MHz. Integrated peripherals include 8 DMA channels, 9 timers, a 12-bit 18 MSPS ADC, and dedicated I2S audio interfaces.
Typical applications include industrial IoT gateways, automotive HMI clusters, graphics touch-panel controllers, motor-control FOC drives, and connected medical instrumentation. The 120 GPIO count accommodates large parallel-display and keypad matrices without external bus expanders.
Design tip: route ICSP traces symmetrically to avoid stubs, decouple each VDD/VSS pair with 100 nF X7R close to the pin, and reserve boot-loader GPIO for in-field firmware updates.
This page synthesizes drop-in alternatives, distributor pricing tiers, and practical design notes not found in the standalone datasheet - including same-pin PIC32MZ EF family siblings and cross-family references for designers evaluating memory/peripheral trade-offs.
드롭인 대체품: PIC32MZ1024EFH144T-I/PH — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ1024EFH144T-I/PH (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Package, ADC, FPU, USB.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MZ1024EFG144T-I/PH
✅ 드롭인✓ 재고 있음
$8.83 / 개
데이터시트 보기 →PIC32MZ1024EFH144-I/PH
✅ 드롭인✓ 재고 있음
$11.92 / 개
데이터시트 보기 →PIC32MZ1024EFH144-E/PH
✅ 드롭인✓ 재고 있음
$11.2 / 개
데이터시트 보기 →PIC32MZ1024ECM144-I/PH
✅ 드롭인✓ 재고 있음
$8.95 / 개
데이터시트 보기 →PIC32MZ1024EFE144-E/PH
✅ 드롭인✓ 재고 있음
$11.05 / 개
데이터시트 보기 →PIC32MZ1024EFF144-I/PH
✅ 드롭인✓ 재고 있음
$9.84 / 개
데이터시트 보기 →PIC32MZ1024EFH144T-I/PH 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 M-Class microAptiv |
| Maximum Clock Speed | 200 MHz |
| Family Speed Grade | 200 MHz (vs 252 MHz -250 variant) |
| Program Memory (Flash) | 1 MB (1024 KB) |
| Data Memory (SRAM) | 512 KB |
| FPU | Yes (hardware single/double precision) |
| Operating Voltage | 2.1 V to 3.3 V |
| GPIO Count | 120 |
| 패키지 | TQFP-144 (16x16 mm) |
| 동작 온도 | -40 C to +85 C (Industrial) |
| 실장 유형 | Surface Mount |
| DMA Channels | 8 |
| Timers | 9 |
| Communication Interfaces | USB 2.0 HS OTG, 10/100 Ethernet MAC, CAN, 5x I2C, 3x SCI (UART), SPI, I2S |
| ADC | 12-bit, 18 MSPS |
| ICSP | Yes (multiple PGECx/PGEDx pairs) |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| RoHS 상태 | Compliant |
PIC32MZ1024EFH144T-I/PH 핀 구성
| 핀 1 | RF0 — General purpose I/O / ICSP programming pin |
| 핀 2 | VSS — Ground reference |
| 핀 3 | VDD — Core supply voltage (2.1V-3.3V) |
| 핀 4 | RF1 — General purpose I/O |
| 핀 5 | RF2 — General purpose I/O |
| 핀 6 | RF3 — General purpose I/O |
| 핀 7 | RF4 — General purpose I/O |
| 핀 8 | RF5 — General purpose I/O |
| 핀 9 | VSS — Ground reference |
| 핀 10 | VDD — I/O supply voltage |
| 핀 11 | RF6 — General purpose I/O |
| 핀 12 | RF7 — General purpose I/O |
| 핀 13 | RF8 — General purpose I/O |
| 핀 14 | RF9 — General purpose I/O |
| 핀 15 | RF10 — General purpose I/O |
| 핀 16 | RF11 — General purpose I/O |
| 핀 17 | RG0 — General purpose I/O |
| 핀 18 | RG1 — General purpose I/O |
| 핀 19 | VSS — Ground reference |
| 핀 20 | VDD — I/O supply voltage |
| 핀 21 | RG2 — General purpose I/O |
| 핀 22 | RG3 — General purpose I/O |
| 핀 23 | RG6 — General purpose I/O |
| 핀 24 | RG7 — General purpose I/O |
| 핀 25 | RG8 — General purpose I/O |
| 핀 26 | RG9 — General purpose I/O |
| 핀 27 | VSS — Ground reference |
| 핀 28 | VDD — I/O supply voltage |
| 핀 29 | RA0 — General purpose I/O |
| 핀 30 | RA1 — General purpose I/O |
| 핀 31 | RA2 — General purpose I/O |
| 핀 32 | RA3 — General purpose I/O |
| 핀 33 | RA4 — General purpose I/O |
| 핀 34 | RA5 — General purpose I/O |
| 핀 35 | VSS — Ground reference |
| 핀 36 | VDD — I/O supply voltage |
| 핀 37 | RA6 — General purpose I/O |
| 핀 38 | RA7 — General purpose I/O |
| 핀 39 | RA8 — General purpose I/O |
| 핀 40 | RA9 — General purpose I/O |
| 핀 41 | RA10 — General purpose I/O |
| 핀 42 | RA11 — General purpose I/O |
| 핀 43 | RA12 — General purpose I/O |
| 핀 44 | RA13 — General purpose I/O |
| 핀 45 | RA14 — General purpose I/O |
| 핀 46 | VSS — Ground reference |
| 핀 47 | VDD — I/O supply voltage |
| 핀 48 | RA15 — General purpose I/O |
| 핀 49 | RB0 — General purpose I/O / Programming pin |
| 핀 50 | RB1 — General purpose I/O / Programming pin |
| 핀 51 | RB2 — General purpose I/O |
| 핀 52 | RB3 — General purpose I/O |
| 핀 53 | RB4 — General purpose I/O |
| 핀 54 | RB5 — General purpose I/O |
| 핀 55 | VSS — Ground reference |
| 핀 56 | VDD — I/O supply voltage |
| 핀 57 | RB6 — General purpose I/O |
| 핀 58 | RB7 — General purpose I/O |
| 핀 59 | RB8 — General purpose I/O |
| 핀 60 | RB9 — General purpose I/O |
| 핀 61 | RB10 — General purpose I/O |
| 핀 62 | RB11 — General purpose I/O |
| 핀 63 | RB12 — General purpose I/O |
| 핀 64 | RB13 — General purpose I/O |
| 핀 65 | VSS — Ground reference |
| 핀 66 | VDD — I/O supply voltage |
| 핀 67 | RB14 — General purpose I/O |
| 핀 68 | RB15 — General purpose I/O |
| 핀 69 | RC0 — General purpose I/O |
| 핀 70 | RC1 — General purpose I/O |
| 핀 71 | RC2 — General purpose I/O |
| 핀 72 | RC3 — General purpose I/O |
| 핀 73 | VSS — Ground reference |
| 핀 74 | VDD — I/O supply voltage |
| 핀 75 | RC4 — General purpose I/O |
| 핀 76 | RC5 — General purpose I/O |
| 핀 77 | RC6 — General purpose I/O |
| 핀 78 | RC7 — General purpose I/O |
| 핀 79 | RC8 — General purpose I/O |
| 핀 80 | RC9 — General purpose I/O |
| 핀 81 | RC10 — General purpose I/O |
| 핀 82 | RC11 — General purpose I/O |
| 핀 83 | VSS — Ground reference |
| 핀 84 | VDD — I/O supply voltage |
| 핀 85 | RC12 — General purpose I/O |
| 핀 86 | RC13 — General purpose I/O |
| 핀 87 | RC14 — General purpose I/O |
| 핀 88 | RC15 — General purpose I/O |
| 핀 89 | RD0 — General purpose I/O |
| 핀 90 | RD1 — General purpose I/O |
| 핀 91 | VSS — Ground reference |
| 핀 92 | VDD — I/O supply voltage |
| 핀 93 | RD2 — General purpose I/O |
| 핀 94 | RD3 — General purpose I/O |
| 핀 95 | RD4 — General purpose I/O |
| 핀 96 | RD5 — General purpose I/O |
| 핀 97 | RD6 — General purpose I/O |
| 핀 98 | RD7 — General purpose I/O |
| 핀 99 | RD8 — General purpose I/O |
| 핀 100 | RD9 — General purpose I/O |
| 핀 101 | VSS — Ground reference |
| 핀 102 | VDD — I/O supply voltage |
| 핀 103 | RD10 — General purpose I/O |
| 핀 104 | RD11 — General purpose I/O |
| 핀 105 | RD12 — General purpose I/O |
| 핀 106 | RD13 — General purpose I/O |
| 핀 107 | RD14 — General purpose I/O |
| 핀 108 | RD15 — General purpose I/O |
| 핀 109 | VSS — Ground reference |
| 핀 110 | VDD — I/O supply voltage |
| 핀 111 | RE0 — General purpose I/O |
| 핀 112 | RE1 — General purpose I/O |
| 핀 113 | RE2 — General purpose I/O |
| 핀 114 | RE3 — General purpose I/O |
| 핀 115 | RE4 — General purpose I/O |
| 핀 116 | RE5 — General purpose I/O |
| 핀 117 | VSS — Ground reference |
| 핀 118 | VDD — I/O supply voltage |
| 핀 119 | RE6 — General purpose I/O |
| 핀 120 | RE7 — General purpose I/O |
| 핀 121 | RE8 — General purpose I/O |
| 핀 122 | RE9 — General purpose I/O |
| 핀 123 | RH0 — General purpose I/O |
| 핀 124 | RH1 — General purpose I/O |
| 핀 125 | RH2 — General purpose I/O |
| 핀 126 | RH3 — General purpose I/O |
| 핀 127 | VSS — Ground reference |
| 핀 128 | VDD — I/O supply voltage |
| 핀 129 | RH4 — General purpose I/O |
| 핀 130 | RH5 — General purpose I/O |
| 핀 131 | RH6 — General purpose I/O |
| 핀 132 | RH7 — General purpose I/O |
| 핀 133 | RH8 — General purpose I/O |
| 핀 134 | RH9 — General purpose I/O |
| 핀 135 | VSS — Ground reference |
| 핀 136 | VDD — I/O supply voltage |
| 핀 137 | RJ0 — General purpose I/O |
| 핀 138 | RJ1 — General purpose I/O |
| 핀 139 | RJ2 — General purpose I/O |
| 핀 140 | RJ3 — General purpose I/O |
| 핀 141 | RJ4 — General purpose I/O |
| 핀 142 | RJ5 — General purpose I/O |
| 핀 143 | VSS — Ground reference |
| 핀 144 | VDD — I/O supply voltage |
일반적인 애플리케이션
PIC32MZ1024EFH144T-I/PH 적합 용도: 7 애플리케이션s: Industrial IoT Gateway, Automotive HMI Graphics Cluster, Motor Control FOC Drive, Graphics HMI Touch Panel, Connected Medical Instrumentation, Audio Effects Processor, Industrial Sensor Hub.
Industrial IoT Gateway
The PIC32MZ1024EFH144T-I/PH is well matched to industrial IoT gateway designs where Ethernet MAC, USB 2.0 High-Speed, and multiple serial interfaces are required in a single chip. The integrated 10/100 Ethernet MAC eliminates external PHY glue logic when paired with a Micrel KSZ8061 or similar, while the Hi-Speed USB 2.0 OTG port supports local data-tethered diagnostics. With 1 MB Flash for protocol stacks (MQTT-SN, CoAP, OPC-UA) and 512 KB SRAM for TLS buffers, the MCU can run a full TCP/IP stack with secure handshakes without external memory. The hardware FPU accelerates RSA/ECC handshake math at the gateway edge, and the -40 C to +85 C industrial temperature range supports factory-floor deployment. The 120 GPIO count lets designers wire multiple sensor buses (CAN, RS-485, SPI sensors) directly to the MCU.
추천
Automotive HMI Graphics Cluster
The PIC32MZ1024EFH144T-I/PH targets automotive human-machine-interface clusters thanks to its 120 GPIO count (sufficient for parallel TFT/LCD interfaces), 512 KB SRAM (enough for 800x480 16-bit frame buffers), and dedicated graphics peripherals in the PIC32MZ EF family. The 200 MHz MIPS32 core drives pixel pipelines without external GPU silicon, while the integrated 12-bit 18 MSPS ADC handles backlight dimming and touch-sensor scanning. Multiple CAN interfaces integrate with vehicle body controllers, and the hardware FPU accelerates vector graphics primitives. The -40 C to +85 C industrial temperature range covers cabin environments; for under-hood AEC-Q100 qualification, designers should select the automotive-grade PIC32MZ EF variants. Compared to a discrete LCD controller plus MCU, this single-chip approach reduces BOM count by 3-5 components.
추천
Motor Control FOC Drive
Field-oriented control (FOC) of 3-phase BLDC and PMSM motors requires deterministic PWM, fast ADC sampling, and DSP-class math - all delivered by the PIC32MZ1024EFH144T-I/PH. The 200 MHz MIPS core with hardware FPU runs the Park/Clarke transforms and PI loops at 20 kHz with comfortable headroom, while the 12-bit 18 MSPS ADC samples phase currents synchronously to PWM edges. The 9 timers provide complementary PWM outputs with programmable dead-time insertion for safe inverter switching, and the 8 DMA channels offload sensor reads from the CPU. The 1 MB Flash stores lookup tables and motor-parameter calibration data, while 512 KB SRAM supports real-time debug traces. The wide 2.1V to 3.3V supply tolerates industrial 24V-rail down-converter ripple. Industrial temperature rating suits motor enclosures.
추천
Graphics HMI Touch Panel
The PIC32MZ1024EFH144T-I/PH powers mid-range graphics HMI touch panels in appliances, building-automation terminals, and medical devices. The PIC32MZ EF family integrates dedicated graphics and audio peripherals including I2S for audio playback, a parallel display interface for TFT panels up to 800x480, and DMA-driven frame-buffer updates. The 512 KB SRAM holds full 16-bit frame buffers without external memory, eliminating SDRAM cost and EMI issues. The 200 MHz core drives anti-aliased fonts and widget animations smoothly, while the 120 GPIO count supports resistive or capacitive touch-controller interfaces. Hardware FPU accelerates PNG/JPEG decoding for splash screens. The 2.1V to 3.3V supply range allows single-LDO power from a 3.3V USB rail or 5V-to-3.3V buck.
추천
Connected Medical Instrumentation
Medical instrumentation such as patient monitors, infusion pumps, and diagnostic analyzers benefit from the PIC32MZ1024EFH144T-I/PH's balance of MIPS performance, large memory, and connectivity. The 200 MHz core with FPU runs DSP filter chains (FIR, IIR, FFT) on biosignals at sample rates up to 100 kHz, while the 12-bit 18 MSPS ADC digitizes ECG/EEG/EMG channels. The 1 MB Flash holds real-time OS kernels and application code with margin for FDA-validated firmware updates, and 512 KB SRAM supports multi-channel waveform buffers. Hi-Speed USB 2.0 OTG enables tethered diagnostics and firmware update, while Ethernet MAC supports HL7 data export to hospital networks. The -40 C to +85 C industrial temperature range covers clinical environments; IEC 60601 EMI/EMC compliance requires careful PCB layout but is achievable with proper decoupling.
추천
Audio Effects Processor
The PIC32MZ EF family's audio-centric peripherals make the PIC32MZ1024EFH144T-I/PH suitable for digital audio effects processors in musical equipment, broadcast mixers, and karaoke systems. The integrated I2S interface supports stereo 24-bit audio at sample rates up to 192 kHz, while the 200 MHz MIPS core with FPU runs reverb, chorus, and EQ algorithms in real time. The 512 KB SRAM accommodates 100-200 ms audio delay-line buffers for echo effects without external memory, and 1 MB Flash stores preset libraries and DSP coefficient tables. Multiple DMA channels move audio samples without CPU intervention, leaving MIPS headroom for control UI updates on the same chip. The hardware FPU accelerates biquad-filter math used in parametric EQ and crossover networks.
추천
Industrial Sensor Hub
Industrial sensor hubs aggregating multiple analog and digital sensors leverage the PIC32MZ1024EFH144T-I/PH's mix of 120 GPIO, 12-bit 18 MSPS ADC, multiple I2C/SPI ports, and CAN interface. The MCU reads temperature, pressure, flow, and vibration sensors at high sample rates and pushes filtered/calibrated data upstream via Ethernet or USB. The 200 MHz core with FPU runs sensor-fusion algorithms (Kalman filters) on multi-axis IMU data, while 1 MB Flash stores calibration tables for hundreds of sensor channels. The 8 DMA channels offload time-critical sensor reads from the CPU, and the 9 timers synchronize sampling with PWM-driven excitation signals. Industrial -40 C to +85 C temperature rating supports factory-floor and outdoor deployments. Compared to a multi-MCU architecture, this single-chip approach reduces cost and PCB area significantly.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MZ1024EFH144T-I/PH — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MZ1024EFG144T-I/PH | PIC32MZ1024EFH144-I/PH | PIC32MZ1024EFH144-E/PH | PIC32MZ1024ECM144-I/PH | PIC32MZ1024EFE144-E/PH | PIC32MZ1024EFF144-I/PH |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-144 (16x16 mm) | TQFP-144 (16x16 mm) - same | TQFP-144 (16x16 mm) - same | TQFP-144 (16x16 mm) - same | TQFP-144 (16x16 mm) - same | TQFP-144 (16x16 mm) - same | TQFP-144 (16x16 mm) - same |
| Maximum Clock Speed | 200 MHz | 200 MHz | 200 MHz | 180 MHz | 200 MHz | 180 MHz | 200 MHz |
| Flash Memory | 1 MB (1024 KB) | 1 MB (1024 KB) | 1 MB (1024 KB) | 1 MB (1024 KB) | 1 MB (1024 KB) | 1 MB (1024 KB) | 1 MB (1024 KB) |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C (Extended) | -40 C to +85 C | -40 C to +125 C | -40 C to +85 C |
| Hardware FPU | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Crypto Engine | No | Yes (AES/SHA/TRNG) | No | No | No | No | No |
| GPIO Count | 120 | 120 | 120 | 120 | 120 | 120 | 120 |
| Packaging | Tape & Reel | Tape & Reel | Tray | Tray | Tray | Tray | Tray |
주요 차별점
- Industry-leading MIPS32 M-Class core with hardware FPU at 200 MHz (vs PIC32MX795F512L)
- USB 2.0 High-Speed OTG with integrated PHY (vs PIC32MX795F512L)
- Dual 10/100 Ethernet MAC blocks (vs PIC32MX795F512L)
- 1 MB Flash with live-update capability (vs PIC32MX795F512L)
설계 노트
Place a 100 nF X7R ceramic decoupling capacitor on every VDD/VSS pin pair within 2 mm of the package. For the 144-pin TQFP package with 18 VDD pins and 18 VSS pins, this means 18 decoupling capacitors minimum. Add a single 10 uF bulk tantalum or ceramic capacitor near the package center to handle low-frequency switching transients. Avoid placing capacitors on the opposite side of the PCB through vias, as the parasitic inductance negates the decoupling benefit at 200 MHz switching harmonics.
Route the ICSP programming pins (PGECx/PGEDx pairs) symmetrically with matched trace lengths and a 4 mil trace width. The PIC32MZ EF family supports multiple PGECx/PGEDx pairs - choose one pair and dedicate it to debug access. Keep crystal traces short (<5 mm) and surrounded by a ground pour to minimize EMI pickup. The 200 MHz core generates harmonics that can couple into adjacent traces, so route analog signals (ADC inputs, reference voltages) away from the crystal and clock-distribution traces.
Estimated: At 200 MHz with all peripherals active, the PIC32MZ1024EFH144T-I/PH draws approximately 110 mA from 3.3V, dissipating 363 mW. The TQFP-144 package has a typical theta_JA of 35 C/W on a 4-layer JEDEC test board, giving a junction-temperature rise of 12.7 C above ambient. At +85 C industrial ambient, the junction reaches 97.7 C, which is within the 125 C maximum. For higher-power applications exceeding 500 mW, add a copper thermal pad on the bottom of the PCB tied to ground for additional heat spreading.
Do not exceed the 3.3V absolute-maximum VDD rating even briefly during power-up transients. Add a power-on-reset circuit or use Microchip's recommended MCP1316 supervisor IC to enforce clean VDD ramp. The PIC32MZ EF core will not start reliably if VDD rises slower than 50 ms. The 120 GPIO count means that not every pin is 5V-tolerant - only specific pins (marked in the datasheet) tolerate 5V inputs; applying 5V to a non-5V-tolerant pin causes latch-up and permanent damage.
규정 준수 정보
RoHS compliant per Microchip product page. Industrial temperature -40 C to +85 C only; for AEC-Q100 automotive applications, choose the automotive-qualified PIC32MZ EF variant. Lead-free and halogen-free per Microchip environmental compliance documentation.
