PIC32MZ1024EFK100-I/GJX - 200MHz 32-bit MCU 1MB Flash TFBGA-100
부품 번호: PIC32MZ1024EFK100-I/GJX ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $8.45 | $8.45 |
| 10 | $7.61 | $76.10 |
| 100 | $6.76 | $676.00 |
| 500 | $6.08 | $3,040.00 |
| 1,000 | $5.41 | $5,410.00 |
PIC32MZ1024EFK100-I/GJX 개요
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory, data memory, and peripherals on one die. The PIC32MZ EF family sits within Microchip's 32-bit PIC32 portfolio and uses a MIPS32 M-class core with DSP extensions, a hardware IEEE 754 floating-point unit, and dual-panel Flash supporting live update field upgrades. This combination places the part in the high-performance segment of Microchip's line-up above PIC32MX and below the company's Cortex-M7 based SAME70/SAMS70 families.
Key features include 200 MHz / 330 DMIPS core throughput, hardware crypto accelerator, 10/100 Ethernet MAC, HS USB 2.0 with integrated PHY option, CAN-FD, 12-bit ADC at up to 18 MSPS, and a dedicated graphics interface supporting parallel RGB displays. The 1 MB dual-panel Flash allows live firmware updates without downtime, a critical capability for connected industrial equipment that cannot tolerate maintenance windows. The device also exposes multiple SPI, I2C, UART, and PMP interfaces for peripheral expansion.
Typical applications span industrial automation, IoT gateways with TLS security, automotive infotainment HMI panels, brushless motor drives, audio processing with DSP, and Graphical HMI panels driven by the integrated GPU-friendly peripherals. The wide -40C to +85C industrial temperature range makes it suitable for harsh factory and outdoor environments where consumer-grade parts would fail.
When designing with this device, plan for a clean 3.3 V supply with low-noise LDO on AVDD/AVSS lines for ADC accuracy, and follow Microchip's TFBGA routing guidelines for fanout to inner balls. The Crypto engine and integrated security features mean developers should reserve flash and SRAM for TLS stacks and consider using the dual-panel feature for failsafe OTA updates.
드롭인 대체품: PIC32MZ1024EFK100-I/GJX — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ1024EFK100-I/GJX (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Core Architecture, FPU, Operating Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MZ1024EFG100-I/GJX
✅ 드롭인✓ 재고 있음
$12.5 / 개
데이터시트 보기 →PIC32MZ1024EFF100-I/GJX
✅ 드롭인✓ 재고 있음
$10.05 / 개
데이터시트 보기 →PIC32MZ1024EFH100-E/GJX
✅ 드롭인✓ 재고 있음
$7.65 / 개
데이터시트 보기 →PIC32MZ1024EFE100-E/GJX
✅ 드롭인✓ 재고 있음
$5.38 / 개
데이터시트 보기 →PIC32MZ0512EFK100-I/GJX
✅ 드롭인✓ 재고 있음
$7.61 / 개
데이터시트 보기 →PIC32MZ1024EFK100-I/GJX 최대 정격 & 전기적 특성
| Core | MIPS32 M-Class PIC32MZ |
| Core Architecture | 32-bit RISC with DSP and FPU |
| Maximum CPU Frequency | 200 MHz (330 DMIPS) |
| FPU | IEEE 754 hardware single/double precision |
| Program Flash | 1 MB (1M x 8) dual-panel |
| SRAM | 256 KB |
| Crypto Engine | Yes (hardware AES, etc.) |
| CAN Module | Yes (CAN-FD capable) |
| Ethernet | 10/100 MAC with RMII/MII interface |
| USB | HS USB 2.0 |
| Operating Voltage | 2.3 V to 3.6 V (typical 3.3 V) |
| 동작 온도 | -40 C to +85 C (industrial grade -I) |
| 패키지 | 100-ball TFBGA (GJX) 7x7 mm |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| ADC | 12-bit, up to 18 MSPS |
| Live Update Flash | Dual-panel supported |
PIC32MZ1024EFK100-I/GJX 핀 구성
| 핀 A1 | VSS — Ground |
| 핀 A2 | OSC1 — Primary oscillator input |
| 핀 B1 | VDD — Digital supply 3.3 V |
| 핀 B2 | OSC2 — Primary oscillator output |
| 핀 C12 | RPF0/EBIRDY0 — GPIO/EBI ready |
| 핀 D11 | AN0 — Analog input 0 |
| 핀 E1 | AVDD — Analog supply 3.3 V |
| 핀 E12 | VDD — Digital supply 3.3 V |
| 핀 F2 | AVSS — Analog ground |
| 핀 G11 | VSS — Ground |
| 핀 J1 | TMS — JTAG test mode select |
| 핀 K12 | TCK — JTAG test clock |
| 핀 L1 | TRST — JTAG test reset |
일반적인 애플리케이션
PIC32MZ1024EFK100-I/GJX 적합 용도: 6 애플리케이션s: Industrial IoT Gateway, Automotive HMI / Infotainment, Brushless Motor Control (FOC), Graphical HMI / Touch Display, Audio Processing / DSP Front-End, Connected Medical Device.
Industrial IoT Gateway
The PIC32MZ1024EFK100-I/GJX is well matched for industrial IoT gateways because its 200 MHz MIPS core, hardware crypto engine, and 10/100 Ethernet MAC deliver the throughput and TLS acceleration required for protocols like MQTT and OPC-UA. The 1 MB dual-panel Flash supports fail-safe OTA firmware updates across hundreds of field-deployed units without downtime. Designers benefit from the -40C to +85C industrial temperature range that withstands factory cabinet heat, and the 256 KB SRAM accommodates TLS handshake buffers and small graphics overlays for status displays.
추천
Automotive HMI / Infotainment
The PIC32MZ1024EFK100-I/GJX powers automotive HMI panels by combining its high-speed CPU with parallel display interfaces that drive RGB TFT-LCD panels up to WVGA resolution. CAN-FD connectivity integrates seamlessly with vehicle body controllers, while the 12-bit 18 MSPS ADC handles resistive touch-screen scanning and ambient light sensing in real time. The hardware crypto engine secures diagnostic sessions and firmware authentication, and dual-panel Flash permits in-field feature rollouts during dealership service windows without bricking the head unit.
추천
Brushless Motor Control (FOC)
Field-oriented control of brushless DC and permanent-magnet motors benefits from the PIC32MZ1024EFK100-I/GJX's hardware FPU and DSP extensions, which execute Clarke-Park transforms and SVPWM modulation within microseconds. Its 200 MHz clock supports multi-axis servo loops running in parallel, and the 12-bit 18 MSPS ADC samples phase currents with sub-microsecond latency. CAN-FD on-chip enables multi-axis coordination over a robust industrial bus, while the 100-ball TFBGA package keeps the BOM small for compact motor-drive PCBs.
추천
Graphical HMI / Touch Display
The PIC32MZ1024EFK100-I/GJX drives parallel RGB graphical HMI panels through its dedicated PMP and EBI interfaces, with sufficient SRAM for partial framebuffers and double-buffered screen transitions. Its 200 MHz core renders microchip Graphics Library widgets with smooth animations while leaving headroom for touch-screen handling and serial communication to a host PLC. The integrated crypto engine supports signed firmware verification, important for industrial HMIs controlling machinery where unauthorized code replacement poses safety hazards.
추천
Audio Processing / DSP Front-End
The hardware DSP extensions and FPU of the PIC32MZ1024EFK100-I/GJX accelerate audio processing chains such as parametric EQ, dynamics compression, and FFT analysis at low CPU overhead. I2S and dedicated audio interfaces connect to external CODECs for multi-channel capture, while the 256 KB SRAM buffers several seconds of compressed audio streams. Designers can implement active noise cancellation or beam-forming algorithms in industrial audio monitoring equipment where commercial DSP chips would add unnecessary cost.
추천
Connected Medical Device
Although the -I variant is industrial not medical-rated, the PIC32MZ1024EFK100-I/GJX still serves connected medical peripherals where its hardware crypto engine secures patient data transmission over Ethernet or USB. The DSP extensions handle real-time ECG and pulse-oximetry signal filtering, while the 12-bit ADC digitizes analog front-end outputs at sample rates sufficient for heart-rate variability analysis. Wide operating temperature and reliable dual-panel OTA updates are valuable for clinical equipment that must remain in service for years.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MZ1024EFK100-I/GJX — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MZ1024EFG100-I/GJX | PIC32MZ1024EFF100-I/GJX | PIC32MZ1024EFH100-E/GJX | PIC32MZ1024EFE100-E/GJX | PIC32MZ0512EFK100-I/GJX |
|---|---|---|---|---|---|---|
| Package | 100-ball TFBGA (GJX) 7x7 mm | 100-ball TFBGA (GJX) 7x7 mm - same | 100-ball TFBGA (GJX) 7x7 mm - same | 100-ball TFBGA (GJX) 7x7 mm - same | 100-ball TFBGA (GJX) 7x7 mm - same | 100-ball TFBGA (GJX) 7x7 mm - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 512 KB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Hardware Crypto | Yes | No | No | No | No | Yes |
| CAN-FD | Yes | Yes | No | Yes | No | Yes |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Extended -40C to +125C | Extended -40C to +125C | Industrial -40C to +85C |
주요 차별점
- Crypto + CAN in same K variant package (vs PIC32MZ1024EFG100-I/GJX)
- 1 MB Flash for full TLS + OTA staging (vs PIC32MZ0512EFK100-I/GJX)
- Industrial temperature vs extended-grade parts (vs PIC32MZ1024EFH100-E/GJX)
설계 노트
Place a dedicated ferrite bead and 100 nF + 10 uF ceramic bypass on each AVDD pin within 5 mm of the package. AVDD noise above 10 mVrms will couple into the 12-bit ADC and reduce effective ENOB by 1-2 bits; use a low-noise LDO such as the AP2112 or MCP1700 for the analog rail rather than sharing it with switching converters.
The 100-ball TFBGA uses 0.5 mm pitch with non-grid-aligned depopulated corners; follow Microchip's reference layout in the PIC32MZ EF family datasheet. Use microvia-in-pad or dogbone fanout with 50 ohm controlled-impedance for high-speed traces. Avoid routing any signal traces through the inner ball rows; route outer escape first, then stitch ground vias around the BGA perimeter for return-path integrity.
When using the dual-panel Flash for live updates, ensure your linker script places the new firmware in the inactive panel and that interrupts can be safely serviced from either panel during the switch. Programming the panel swap with caches still enabled will cause code-fetch from a stale address; flush and disable the prefetch module before panel switch and re-enable after. Reference Microchip AN1388 'Live Update for PIC32MZ EF' for the validated sequence.
Estimated: at 200 MHz with all peripherals active and 3.3 V supply, core current is roughly 90-110 mA, dissipating about 0.3-0.36 W into the TFBGA package which has theta_JA near 30 C/W on a standard 4-layer JEDEC test board. Junction temperature rise is therefore 9-11 C above ambient; an explicit heatsink is unnecessary, but ensure the PCB ground pour under the BGA is uninterrupted for spreading.
규정 준수 정보
RoHS and lead-free confirmed via Microchip product page. -I grade is industrial temp not AEC-Q100 automotive qualified; AEC-Q100 qualification requires the PIC32MZxxxxxxx-V variant suffix. Halogen-free status not explicitly stated in the verified web data.
