RTAX2000SL-1CGS624E - 2M-Gate Rad-Tolerant FPGA CGA624 | Microchip
부품 번호: RTAX2000SL-1CGS624E ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $12950 | $12,950.00 |
| 10 | $12400 | $124,000.00 |
| 100 | $11800 | $1,180,000.00 |
| 500 | $11250 | $5,625,000.00 |
| 1,000 | $10750 | $10,750,000.00 |
RTAX2000SL-1CGS624E 개요
A radiation-tolerant FPGA is a programmable logic device engineered to survive the total ionizing dose (TID), single-event latchup (SEL), and single-event upset (SEU) environment of space. Within the power-management hierarchy of avionics, the RTAX-S/SL family sits alongside onboard computers, payload controllers, and telemetry interfaces, forming the programmable logic layer of satellite and deep-space systems.
Key features include densities up to 4 million equivalent system gates across the family, embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources, chip-wide highway routing, and carry logic for arithmetic. The device is live-at-power-up thanks to its anti-fuse programming technology, which also provides a true single-chip form factor with no external configuration device required, reducing board area and improving reliability in orbit.
Architecturally, RTAX2000SL is based on the commercial Axcelerator family, fabricated on a 0.15 um CMOS process with a 1.5V core supply and a maximum reported combinatorial performance of 649 MHz. This anti-fuse one-time-programmable fabric is inherently immune to configuration memory upsets, a decisive advantage over SRAM-based FPGAs for space missions.
Typical applications include satellite payload data processing, spacecraft bus control, telemetry and telecommand interfaces, and scientific instrument front ends, where low power, single-chip operation, and radiation tolerance are mission-critical.
A key design consideration: RTAX devices are one-time programmable, so full functional simulation and thermal analysis must be completed before programming, and ceramic column packages demand strict PCB assembly qualification.
This page adds value beyond the datasheet by synthesizing distributor stock signals, same-package drop-in variants, and practical design notes for space-flight FPGA selection.
드롭인 대체품: RTAX2000SL-1CGS624E — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: RTAX2000SL-1CGS624E (동일 폼 팩터 및 풋프린트) — 차이점: Package, Equivalent System Gates, Configuration, Technology, Embedded Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
RTAX2000SL-1CGS624EV
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →RTAX2000SL-1CGS624V
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →RTAX2000SL-CGS624E
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →RTAX2000S-1CG624PROTO
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →RTAX250S-CG624E
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →RTAX250SL-CG624B
✅ 드롭인✓ 재고 있음
$3950 / 개
데이터시트 보기 →RTAX2000SL-1CGS624E 최대 정격 & 전기적 특성
| Family | RTAX-S/SL Radiation-Tolerant FPGA |
| Equivalent System Gates | 2000000 |
| Additional ASIC Gates | 250000 |
| Configurable Logic Blocks (CLBs) | 21504 |
| Technology | CMOS, 0.15 um |
| Core Supply Voltage | 1.5 V |
| Maximum Combinatorial Performance | 649 MHz |
| Speed Grade | -1 |
| 패키지 | CBGA624 / CGA-624 Ceramic Column Grid Array |
| Package Material | Ceramic |
| Programming Technology | Anti-fuse, one-time programmable, live at power-up |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Radiation Tolerance | Radiation-tolerant (space-flight qualified family) |
| 실장 유형 | Surface Mount |
RTAX2000SL-1CGS624E ceramic 핀 구성 가이드
RTAX2000SL-1CGS624E(ceramic 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: RTAX2000SL-1CGS624E.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
RTAX2000SL-1CGS624E 적합 용도: 6 애플리케이션s: Satellite Payload Data Processing, Spacecraft Bus Control and Onboard Data Handling, Scientific Instrument Front Ends, Telemetry and Telecommand (TM/TC) Interfaces, Launch Vehicle and Avionics Logic, Deep-Space Probe Instrumentation and Ranging.
Satellite Payload Data Processing
The RTAX2000SL-1CGS624E fits satellite payload data-path processing because it provides 2,000,000 equivalent system gates and 21,504 CLBs of logic with embedded SRAM blocks that include built-in FIFO control logic, letting engineers implement channelizers, encoders, and frame formators in a single chip. Its anti-fuse configuration is immune to single-event upsets in the configuration memory, eliminating the scrubbing overhead that SRAM FPGAs require in orbit. Typical implementations clock the fabric at 100-649 MHz depending on speed grade, with the -1 grade selected for tight timing closure on high-throughput links. Because the device is live-at-power-up with no external configuration PROM, payload cold-start reliability improves and board area shrinks. The trade-off is one-time programmability: the bitstream must be fully verified before programming flight silicon, so reprogrammable prototyping on flash-based devices is standard practice.
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Spacecraft Bus Control and Onboard Data Handling
For spacecraft bus control, the RTAX2000SL-1CGS624E implements housekeeping interfaces, telemetry/telecommand framing, and power-switching sequencers. The chip-wide highway routing and segmentable clock structure simplify the distribution of low-skew clocks across a distributed control logic design spanning the 21,504 CLBs. Radiation tolerance and live-at-power-up behavior mean the bus controller is operational immediately after separation events or reset, with no configuration load time and no configuration memory to corrupt. The 1.5 V core process supports the low-power budget of smallsat and ESPA-class buses, where every watt of housekeeping overhead matters. Designers typically combine the FPGA with rad-tolerant supervisors and watchdog circuits, and reserve the 250,000 additional ASIC gates for future logic growth. One-time programming requires rigorous simulation sign-off, including corner-case reset and safe-mode state machines, before committing flight parts.
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Scientific Instrument Front Ends
Scientific instruments on planetary and Earth-observation missions use the RTAX2000SL-1CGS624E to time-stamp, filter, and packetize detector data. The fabric's carry logic supports pipelined arithmetic for matched filters and correlators, while embedded SRAM with FIFO control buffers burst data between acquisition front ends and downlink formatters. Performance up to 649 MHz combinatorial (family maximum) enables direct processing of high-rate detector streams without external glue logic. Radiation tolerance protects against cumulative total ionizing dose across multi-year missions, and the ceramic CGA-624 package withstands launch vibration and thermal cycling better than plastic packages. The main engineering consideration is pin mapping: the 624-ball ceramic footprint fixes I/O allocation early, so instrument interface definitions must be frozen before board layout. Prototyping on reprogrammable adaptors mitigates the anti-fuse one-shot commitment.
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Telemetry and Telecommand (TM/TC) Interfaces
TM/TC subsystems benefit from the RTAX2000SL-1CGS624E's deterministic, configuration-upset-immune logic implementing CCSDS-style framing, convolutional or LDPC-adjacent lower-complexity coding front ends, and command decoders. With 2M system gates and embedded SRAM FIFOs, the device hosts multiple independent TM/TC channels in one package, reducing component count on the avionics board. Live-at-power-up operation ensures the spacecraft can receive and act upon commands from the moment power is applied, a critical requirement for recovery from safe mode. The -1 speed grade provides timing margin for serial interface bit rates used in command links, which are typically far below the 649 MHz family limit, allowing relaxed pipelining and easier closure. Designers should budget the fixed 1.5 V core supply in the power distribution design and follow Microchip's ceramic CGA assembly guidelines for column solder inspection.
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Launch Vehicle and Avionics Logic
Launch vehicle avionics and flight-termination-adjacent logic use the RTAX2000SL-1CGS624E where programmable flexibility must coexist with configuration integrity under high vibration and radiation exposure. The anti-fuse fabric retains its configuration permanently, and the ceramic column grid array package provides mechanical robustness for the launch environment. The 21,504-CLB capacity accommodates redundant-voter logic, majority-voting protection, and discrete I/O conditioning in a single device, while carry logic accelerates time-tag generation and GNSS-correlated timing distribution. Because the part is one-time programmable, avionics programs typically freeze the functional specification at PDR, verify exhaustively on the RTAX2000S-1CG624PROTO prototyping variant, and then program the final flight lot. The -1 speed grade timing closure with worst-case temperature and radiation corners should be demonstrated in Libero SoC timing reports before commit.
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Deep-Space Probe Instrumentation and Ranging
Deep-space probes employ the RTAX2000SL-1CGS624E for ranging correlators, regenerative ranging modules, and instrument sequencing where mission durations of a decade or more demand high total-ionizing-dose endurance. The 250,000 additional ASIC gates and 2M system gates support DSP-style pre-processing that reduces downlink bandwidth, while embedded FIFO-managed SRAM smooths burst data between instruments and the communications subsystem. Single-chip, live-at-power-up operation removes configuration-read failure modes that cannot be serviced after launch. Radiation-tolerant (not fully rad-hard) qualification makes the part appropriate where program radiation requirements are moderate and system-level mitigation (watchdogs, redundant strings) is applied. Layout should respect the CGA-624 thermal design: the ceramic package conducts heat primarily through its columns, so board-level thermal vias under the footprint are recommended for vacuum operation where convection does not exist.
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추천 제품 요약
엔지니어링 참조 데이터: RTAX2000SL-1CGS624E — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | RTAX2000SL-1CGS624EV | RTAX2000SL-CGS624E | RTAX250S-CG624E |
|---|---|---|---|---|
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | CGA-624 (CBGA624 ceramic) | CGA-624 (CBGA624 ceramic) - same | CGA-624 (CBGA624 ceramic) - same | CGA-624 (CBGA624 ceramic) - same |
| Equivalent System Gates | 2000000 | 2000000 | 2000000 | Lower (RTAX250 density class) |
| CLBs | 21504 | 21504 | 21504 | Lower (RTAX250 density class) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Programming Technology | Anti-fuse OTP, live at power-up | Anti-fuse OTP, live at power-up | Anti-fuse OTP, live at power-up | Anti-fuse OTP, live at power-up |
| Screening / Flow Suffix | S + E (space screening, extended flow) | S + V variant | S + E | S + E |
주요 차별점
- Fastest -1 speed grade in the CGS624E package line (vs RTAX2000SL-CGS624E)
- SEU-immune configuration memory (vs A3PE3000 (ProASIC3E))
- Full 2M-gate density on the shared 624-ball footprint (vs RTAX250S-CG624E)
설계 노트
RTAX2000SL-1CGS624E is a one-time-programmable anti-fuse FPGA: a wrong or unverifiable bitstream permanently consumes a flight device worth thousands of dollars. Complete full functional simulation, timing closure at worst-case corners (voltage, temperature, radiation-induced delay shift), and an independent design review before programming. Use the RTAX2000S-1CG624PROTO prototyping variant or Microchip/Aldec's ProASIC3E-based reprogrammable adaptor board to validate the design in real hardware first.
The CGA-624 ceramic column package requires column-specific assembly: define the land pattern per the Microchip package drawing, use column-appropriate stencil apertures, and qualify X-ray or visual inspection for column solder joints, since columns do not self-align like BGA balls. Provide board support during reflow to prevent column bridging under the heavy ceramic body. Verify solder column versus solder ball variant against the exact ordering code before fabricating the board.
Plan the power tree around a 1.5 V core supply plus the specified I/O bank supplies per the RTAX-S/SL datasheet. Estimate core current from Libero SoC power analysis at maximum utilization and toggle rates; do not size regulators from gate count alone. Implement power-up sequencing per the datasheet's supply ramp requirements to guarantee live-at-power-up configuration integrity, and include radiation-tolerant supervisor devices for brown-out protection in orbit.
With up to 649 MHz combinatorial capability, high fan-out clocks and fast I/O edges demand controlled-impedance routing, series termination on fast single-ended outputs, and careful return-path management on the avionics board. Use the RTAX-S/SL I/O attribute settings to soften slew rates where interface speed allows, reducing EMI and crosstalk on cable harnesses typical of spacecraft integration.
규정 준수 정보
Space-flight ceramic-packaged device qualified per Mil Prf 38535 class Q/V flows per Microchip DLA Cross Reference Guide; RoHS/REACH declarations not present in captured distributor data - request Certificate of Conformance.
